TWI238030B - Fabrication for high density printed circuit board with liquid dielectric layer - Google Patents

Abstract

A fabrication for a high density printed circuit board (PCB) with a liquid dielectric layer is disclosed. The steps are as follows. A first circuit pattern is etched on a thin sheet metal of a PCB substrate in advance. An organic material which can dissolve into oxidizer is uniformly coated on the substrate to form a first dielectric layer. The first dielectric layer is then baked and hardened to form a first insulation layer. A plurality of blind vias are drilled on the first insulation layer to the first circuit pattern. Smear removal and metallization techniques are performed for a surface of the first insulation layer and the blind vias. A second circuit pattern is formed on the surface of the first insulation layer and the blind vias. A multilayer PCB is then formed gradually through the aforesaid ways.

Description

1238030 Fifth invention description ()) [Field of the invention The present invention relates to a liquid energy eight dry, which is particularly good at the process of manufacturing high-density printed circuit boards, organic materials to enhance the insulation layer. Yu: Frequency-transmitting electronic products: Reliability, making the circuit board suitable for [prior art], first setting up the printed circuit board to turn on the power supply to form I daughter-in-law # thousand pieces (such as integrated circuit components), which consists of Organic materials or benefits ... 1 Printed circuit boards are connected by multilayer boards.丄: Appropriate mechanical support of components and electrical connection technology development of thin, short, and circuit board technology tends to high-speed transmission and accustomed to the use of eve, to meet the market trend of electronic products. _ Eleven: Two: The printed circuit board manufacturing method, published in the eighty-nineth year of the Republic of China, recitation of two: D of the Republic of China Patent Gazette Bulletin No. 41 1 733 "Manufacturing method of interlayer guide field j-fired multilayer printed circuit board" The invention patent includes: coating a dielectric material with a dry film or ink on a copper foil with a copper surface], and b) baking it to polymerize / open the dielectric material. Above the substrate; [c] Then, a laser beam is used to fuse holes at the connection point on the dielectric material layer to expose the copper surface circuit on the substrate; [d] Finally, the dielectric material layer The surface is metallized and electroplated, and the car is engraved to form the upper layer copper circuit, so that the upper layer copper circuit can be conducted with the copper circuit on the substrate. This No. 4 1 1 733 does not disclose how to properly process the material layer to reduce the thickness of the printed circuit board, making it suitable for high-frequency transmission electronic products.

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1238030 V. Description of the invention (3) The thickness of the insulation layer of the printed circuit board with a small number of layers is bound to be multi-layered: the brushed circuit board also has high-speed transmission between the circuit layers. In addition, the insulation of the multi-layered printed circuit board No. 323432 ;,demand. However, once the insulation layer and the conductor layer [circuit layer]: Calcium carbonate powder is left to increase the layer density of the insulation layer and the conductor layer. When the thickness is small, the final influence, drop, the accuracy of the thickness of the conductor layer and the transmission date ± acid word powder, and the method meets the demand trend of high-speed transmission. 1st, 3rd, 3rd, 2nd, 4th, 3rd, and 2nd additions. Because of the multi-functionality of the two-layer printed circuit boards with electronic products, the degree of aggregation must be relatively increased. However, due to the increase in wiring density or residual calcium carbonate powder at the 32nd day, when the denier conductor ::::::: is the insulation layer of the circuit board, the plane spacing is reduced to about 2 s, the line density, or the degree of aggregation. When the increase is about 25 m or less, it decreases. When the plane distance of the conductor is lowered. The accurate evidence of the plane pattern of the conductor is carved 1: :: or the roughness is reduced. Straight;: ;; The vertical interlayer insulation of this layer interferes with the multiple acoustic input signals of No. 323432, due to the electronic output. Θ P brushes are not particularly suitable for high frequency transmission clocks. This private note [Traditionally added organic machine filling ^ printed ^ circuit board insulation layer manufacturing without using organic rhenium, using no fillers and soluble in oxidation suitable for high frequency transmission Ϊ: Inorganic filling with different roughness The degree of need to mock the SP board circuit board, and work according to the roughness of the surface of the insulation layer of organic materials to improve the adjustment of the surface roughness of the insulation layer

1238030 V. Description of the invention (4) [Summary of the invention] The main board process of the present invention, which insulates the high-frequency transmission of the insulating layer of the present invention. The board process, which is based on the i The invention includes the following steps: a circuit pattern; a substrate forming a first insulating layer; a road pattern; and then the upper surface of the first edge layer is formed in the first step [invention: the first organic material Description of the number of two dielectric drill holes and the blind insulation of two layers] Let the purpose of the present invention be to provide a high-definition liquid dielectric layer. The marginal layer uses a soluble oxidizing agent of 2 = 2 degree printing density and insulation reliability. Make Too M Sub Product ... The purpose of the present invention is to provide a liquid dielectric layer high-density acoustic edge layer by adjusting the surface of an insulating layer that is soluble in oxidants, so that the present invention has a margin effect. ^ The liquid dielectric layer Nan Lidu printed circuit board is formed on the metal foil of the pcb substrate to form a pre-coat. V-The oxidant-soluble organic material is evenly coated with a dielectric layer; the first dielectric Electric layer baking hardening. Drill several blind holes on the first insulating layer to the surface of the first insulating layer and the blind holes to remove the slag. Formed on the substrate formation—the second dielectric layer layer is baked and hardened to form a second insulation;. = To the second circuit diagram · “Two suitable holes and jumper holes] for removing glue residue and metal layer surface and blind holes Reshape _ Chu — Printed Circuit: A "Circuit pattern, circuit promotion is used for circuit, layering table and its package, and then it is a line.% Sample: Second insulation and so on; so clearly the above and other purposes, characteristics, And advantages can be more

C: \ Logo-5 \ Five Continents \ PK8203.ptd Page 7 1238030 V. Description of the invention (5) It is understood that the following will give details of the preferred embodiment of the invention as follows. In combination with the attached drawings, the liquid dielectric layer high-density printed circuit of the present invention. The steps are as follows: coat the metal sheet of the PCB substrate with a main circuit pattern; and dissolve one of the soluble oxidants: forming a preset-the first substrate to form a dielectric layer [without filler material coated on the baking Hardened to form a first insulating layer; in the first hole, a dielectric layer blind hole to the first 'circuit pattern, · the first-insulation: K 5 slag removal [rough] and metallization; in the first ; = And the eye hole to perform two; = so that a multilayer printed circuit board is gradually formed. The main technical content described in this month will be appropriately implemented in the preferred embodiments, and implemented using the main technical inner valleys of the months listed below. The first to seventh figures reveal the preferred embodiment of the present invention. The schematic diagram of the process of brushing the circuit board and sequentially manufacturing steps are U layer ^ printed PCB 凊 / two V mesh, the manufacturing method of the preferred embodiment of the present invention. First, -PCB substrate 10-metal sheet [not shown] :: road pattern u, its distribution extends to the PCB substrate 10 and; surface 0 =, the different roughness requirements of the surface of the insulating layer of the substrate 10, will be Can = Di Er crude two bis organic material [liquid dielectric] is properly prepared to form a 1258 ϋ 该 This dielectric material uses oxidant to remove rubber, the surface = = soluble in oxidant to remove, leaving other Not dissolved in oxygen

C: \ Logo-5 \ Five Corninents \ PK8203 Page 8 1238030 V. Description of the invention (6) Please refer to the first 3 of the method for manufacturing the organic material according to the preferred embodiment of the present invention. Next: liquid ::; layer First] 'The third dielectric layer covers the first circuit pattern / edge characteristics, and its energy; ϊ!;: 1 "is formed to a predetermined thickness [to make it have an absolute dielectric layer direction density.荽: shown in the second figure, 'The manufacturing method of the preferred embodiment of the present invention is connected to the ^. A m electric layer [liquid dielectric layer] baked and cured at an appropriate temperature = insulating layer 12, so that the first circuit pattern 11 is embedded As shown in the second figure, the manufacturing method of the preferred embodiment of the present invention is followed by the following steps: A few holes are formed on the edge layer 12 by laser or development, and blind holes 1 3 are formed. A portion connected to the first circuit pattern 11 exposes a portion of the first circuit pattern u. _ Once again, as shown in the second figure, the manufacturer of the preferred embodiment of the present invention strives to remove the slag from the surface of the first insulating layer 12 and the blind hole 3, so that the first insulating layer The surface 12 and the blind hole 13 have a degree of roughness, which shows a different roughness after dissolving and removing part of the organic material of the dielectric material according to the oxidant. It not only forms a high density of the dielectric layer, but also can improve the insulation. Metallization is performed on the surface of the insulating layer b 12 and the blind hole 13 to make it well bonded with gold. Referring to the fourth figure, the manufacturing method of the preferred embodiment of the present invention then forms a second circuit pattern 21 on the surface of the first insulating layer 12 and the blind hole 13. At this time, the conductor on the inner wall of the blind hole 13 will The first circuit pattern 掾 丨 丨 and the second circuit pattern 21 are connected and conducted.

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. Yueling, as shown in the fifth figure, the present invention is compared with the manufacturing method of every other embodiment in which a PCB is added by adding layers, followed by a high-density multilayer printed circuit board, G. Please refer to the fifth figure to form a dielectric layer and a circuit layer. This is the same as the previous steps, and then connect the organic material manufacturing method to the example 10 to form a second dielectric layer. Talking about the uniform coating on the PCB substrate pattern 21, the second circuit has an insulating property when the second dielectric layer covers the second circuit. ^ Pattern 21 is formed-pre ^ thickness, so that it has the

Following the steps described above, the first:, ;;;: made by: method to form-the second insulation layer 22, so that the second "hard baking into the second insulation" using a suitable temperature "second"-circuit pattern U And the second% according to the sixth figure & 'The preferred embodiment of the present invention is the same as the previous steps, which will benefit the second insulating layer 22]: = :; type drilling to form several stacked holes 23 and several Jumper hole 24,:; two = '1 connection; part of the first circuit pattern U, so that part of the pattern 11 is exposed. # 请 再 = As shown in the sixth figure, the manufacturing method of the preferred embodiment of the present invention is the same as the previous steps. The surface of the second insulating layer 22, the stacking hole 23, and the jumper 24 are degreased to make the second The surface of the insulating layer 22, the stacking hole 23, and the jumper 24 have roughness. Metallization is performed on the surface of the second insulating layer 22, the stacking hole 23, and the jumper 24 to make it have a good combination with the metal. As shown in FIG. 7, the manufacturing method of the preferred embodiment of the present invention is the same as the foregoing steps. On the surface of the cable insulation layer 22, the stacking hole 23, and the jumper,

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Like 31. At this time, the conductors on the inner wall of the stacking hole 23 have the second circuit pattern 21 and the third circuit pattern 31. The conductors on the wall of the stacking hole 23 connect the first circuit pattern 11 to the first. As required by the previous steps to add another PCB, it completes a multilayer printed circuit board. Compared with No. 3234 32: The liquid medium of the present invention uses no filler and is soluble in oxidant =], the organic material replaces the traditional inorganic =, a multilayer printed circuit board for transmission, and a 5-week system is required. Organic materials to improve the adjustment II. In contrast, "The 323432 uses an inorganic edge layer" which has a line with respect to the present invention. V. Description of the invention (8) 24, and then a first line is connected in series to conduct; Figure other insulation layers The electrical layer of the present invention has a high-density organic material filling, which makes the surface of the insulation layer rough and the carbon filling pattern of the insulation layer is imperfect. Although the present invention is within the scope of the present invention, a third circuit is attached after viewing Figure road pattern 1 1, g-hatch jumper 2 4 internal sample 3 1 connection conductor and circuit layer, manufacturing method phase printed circuit board [liquid dielectric, which is suitable for working with calcium carbonate powder of different thicknesses, and Insulation can clearly be used for any of the aforementioned shortcomings. I face = 2 males, the example reveals, but it is not used ^,, ’without departing from the spirit and modifications of the present invention, so the definition of the scope of protection of the present invention shall prevail.

1238030 Brief description of the drawings [Illustration of the drawings] The first diagram of the liquid dielectric layer high-density printed circuit board of the present invention in the process of forming the first circuit pattern is a schematic cross-section. 0 The second diagram of the liquid dielectric layer bifurcation printed circuit of the present invention Sectional schematic diagram of forming the first insulating layer in the board manufacturing process. 3rd Fig. 2 Sectional schematic diagram of the drilling process of the liquid dielectric layer high-density printed circuit board of the present invention to form a blind hole. 4th Fig. 2 The high-density of the liquid dielectric layer of the present invention. Cross-sectional schematic diagram of the second circuit pattern formed by the printed circuit board process 0 5th diagram The cross-sectional schematic diagram of the second dielectric layer formed by the liquid dielectric layer South Germany and the printed circuit board of the present invention 6th diagram • Liquid dielectric of the present invention Cross-section schematic diagram of the drilling process for forming a stacked hole and a jumper hole in a printed circuit boardFigure 7 • Cross-sectional schematic diagram of the second circuit pattern formed by the liquid dielectric layer high-density printed circuit board manufacturing process of the present invention 〇Series-sai [illustration of drawing number] 1 multilayer printed circuit board 10 PCB substrate 1 1 first line pattern 12 First insulation layer 13 Blind L 21 Second circuit pattern 22 Second insulation layer 23 Stacking hole 24 Jumper hole 31 Second circuit pattern

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Claims (1)

1238030 Case No. 90124470 Amendment, patent application scope 3, liquid dielectric layer high-density printed circuit board manufacturing process according to item 2 of the patent application scope, wherein the blind hole is a stacking hole that combines the first circuit pattern, the second circuit pattern and The third line pattern is connected in series. 4. According to the liquid dielectric layer high-density printed circuit board manufacturing process according to item 2 of the patent application scope, the blind hole is a jumper hole that connects and connects the first circuit pattern and the third circuit pattern. 5. The manufacturing process of the liquid dielectric layer high-density printed circuit board according to item 1 of the scope of patent application, wherein the process uses a developing method to set the blind hole. 6. The liquid dielectric layer high-density printed circuit board manufacturing process according to item 1 of the scope of patent application, wherein the process uses laser to set the blind hole. C: \ Logo-5 \ Fi ve Cont inents \ PK8203a.ptc Page 14 2002. 10.09.014