TWI237353B - Substrate strip for increasing yield and method for fabricating the same - Google Patents

Abstract

A substrate strip for increasing yield and method for fabricating the same are proposed, wherein the substrate strip includes a plurality of substrate units and the method involves the following steps: checking each substrate unit included in the substrate strip and cutting a poor-quality substrate unit determined at the checking step, thereby forming a first cutting opening in the substrate strip. Meanwhile, cut at least a region adjacent to the poor-quality substrate unit to form at least a second cutting opening communicating with the first cutting opening in the substrate strip, and choose a separate good-quality substrate unit having the same shape and size as the first cutting opening. Then, fit the good-quality substrate unit in the first cutting opening and allow the fitting stress to be released by the second cutting opening.

Description

1237353

V. Description of the invention (1) [Technical field to which the invention belongs] and its extrusion, this month, there is more about the substrate strip method of a semiconductor package " going by the sheep 'is about improving production The substrate strip and its manufacturing method without causing deformation. [Previous technology] The entire surface area of the wafer, the wafer, and the wafer are covered with a whole package. The packaging technology of the 100-ball grid array semiconductor package is an advanced diagram shown in the figure. The substrate 21 is used as the core of the semiconductor wafer. The upper and lower surfaces are laid with a conductive trace layer 4, and 2 is connected to the conductive trace layer on the upper surface with a detailed wire 3 to transmit the telecommunication signal to the outside by recovering the implanted zinc alloy 6. An encapsulant 5 of the chip 2 and the bonding wire 3 protects the package. This is a ball grid array package. In order to take into account the cost of the manufacturing method, it is produced in a batch method (that is, batch type), that is: 1. A number of packaging boundaries are defined in advance. After packaging, sheet bonding, die bonding, wire bonding, and glue I #, etc., Singulation is applied to remove the connection and σ 'of the neighboring seal gates to make The single semiconductor package shown in FIG. 1 is shown in FIG. 2. The ball grid array substrate unit 22 is constructed in a batch manner on a substrate strip μ (substrate Strip). • Female * = The linden wood chips 21 each include a plurality of rectangular substrate units 22 divided by a package line 24 (Package Une) and the substrates connecting the adjacent substrate units 22 and the connecting portions 21, and the substrate units 22 are connected to each other. Adjacent to each other, a substrate release portion 2 10 between adjacent substrate units 22 is provided for releasing.

175] 3 Shi Xipin. Mouth soil (1 Page 10 1237353 V. Description of the invention (2) Stress hole 2 3 Γ ς 1 i ^ Warpage deformation. 10t) to prevent the substrate strip 21 from being packaged In the manufacturing process, the biggest disadvantage of the substrate strip 21 is that the space disk = =, but on this type of substrate strip 21, the number of substrate units 22 on the substrate strip 21 is difficult to go up. …, Too much waste will be wasted = ': Κ ί 利 5' 65 2 '185 Case, as shown in Figure 3 slabs ... It is to reduce the aforementioned substrate strips 2! The space of the substrate connection portion 2 between the early stages 22 and the phase = force release the slot 2 "can greatly improve the utilization rate of the two spaces on the substrate strip 11 'to solve the aforementioned problem of the substrate strip 21 and improve the early position. The density of the substrate units 22 in the space improves the overall production capacity. However, for the two types of substrate strips described above, it is difficult to avoid defective substrate units during the manufacturing process. Generally, each substrate strip is often There are one to two bad substrate units (commonly referred to as ^ 〇ut 2-X out substrate), and when the A good substrate unit is too expensive. However, at this time, the packaging industry will not buy it, which will result in a loss of substrate manufacturing cost and it will be in the automated overall process of sealing. It is also difficult to stop the process in the subsequent molding (Moidmg) process. The filling of the defective substrate unit will reduce the production efficiency and increase the material cost of the packaging colloid. It is conventionally known to solve this problem of the defective substrate element by an embedded replacement method to increase the output of the package and reduce the production cost. , The method is

17513 Shi Xipin. Mouth (] f 11 pages 1237353 5. Explanation of the invention (3) Figures 4A to 4C (take the substrate strip 1 1 shown in Figure 3 as an example), first as shown in Figure 4 A As shown in the figure, the plurality of substrate units 12 on the substrate strip 11 are respectively detected, and the defective substrate units 1 2 b on the substrate strip 11 are selected based on the detection results; The bad substrate unit 1 2 b is cut out on the sheet 11 to leave a hollowed-out area 15 on the substrate strip 11 while retaining the remaining good substrate units 1 2 a; then, as shown in FIG. 4C As shown, another good substrate unit 14 is selected, and is the same as the hollow area 15, and in the hollow area 13, for example, a similar embedding method is specially developed in the United States for the bad substrate unit on the seal sheet to avoid this. Although the method can improve the overall productivity by this method, the good substrate unit 14 will have the same size, so when the good substrate unit strip 11 is used, the substrate strip force will be caused and the substrate strip 1 1 will be caused. Problems such as jamming during the deformation feeding process, plus a trimming and shaping process, leading to the system. It is a problem to provide a method to solve the embedded sequence of the substrate strip to improve the process efficiency. [Summary] The shape and size of the good substrate unit 14 fit the good substrate unit 14 into the lidi. Case No. 5, 8 9 7, 3 34 is to replace the substrate in advance before the lifting process to avoid waste of production capacity. The bad yield of the defective substrate unit 12b is selected in advance. The reason is that the shape is related to the hollowed out area. 1 5 phase 1 4 is inserted into the extrusion of the substrate sheet 1 as shown in FIG. 4C, and because of the extrusion and flatness of the extrusion, it is often necessary to increase the step after the fitting step for automation reasons. Increase and decrease in production capacity. Increasing the production of substrate strips and their deformation problems, while eliminating the need for urgent repair in the research area

17513 Shi Xipin. Oral (1

Page 12 1237353 V. Description of the invention (4) In view of the problems of the above-mentioned conventional technology, the main object of the present invention is to provide a substrate strip which can increase the yield and is not easily deformed during fitting, and a manufacturing method thereof. Another object of the present invention is to provide a substrate strip which can reduce cost and is not easily deformed during fitting, and a manufacturing method thereof. Still another object of the present invention is to provide a substrate strip without a trimming process and a method for manufacturing the same. Still another object of the present invention is to provide a base strip and a method for manufacturing the same, which can improve the process efficiency. To achieve the above object, the present invention provides a substrate strip manufacturing method capable of improving yield. The substrate strip includes a plurality of substrate units adjacent to each other. The manufacturing method includes: detecting a plurality of substrate units on the substrate strip, and Based on the test results, the defective substrate unit on the substrate strip is selected; the defective substrate unit is cut from the substrate strip to leave a first hollow area on the substrate strip, and at the same time, the substrate strip is cut from the substrate strip. An area adjacent to at least one edge of the defective substrate unit is cut to leave at least one second hollowed area on the substrate strip that communicates with the first hollowed out area, and a good substrate unit that has been tested is selected, and The shape and size of the good substrate unit are the same as the first hollowed-out area; and the good substrate unit is fitted into the first hollowed-out area to prevent the substrate strip from being deformed by the at least second hollowed-out area. In addition, the present invention further provides a substrate strip capable of improving yield, including a frame and a plurality of good substrate units adjacent to each other, and the plurality of good substrate units are respectively formed in a plurality of regions surrounded by the frame.

175] 3 Shi Xipin. Ptd Page 13 1237353 V. Description of the invention (5) ~~ ------ Less—I want to focus on the middle of the border surrounded by the border. J: ”At least-edge of a good substrate unit: Lί! L t Hollow out area $, meanwhile, the desired good == size is the same as the plurality of good substrate units. Then, the adjacent substrates on the substrate strip are described, and the holes and grooves can be used separately. @ — 你 开 e 又有 牙

Lin ^ n ps 4 // Hai two substrates early packaging line (Package 'Λ 可 ^ and the two substrate unit packaging line weight: the domain system and the first area is not connected with the hole slot of the "": : Γ Therefore, this method is to use the leaves in the hollowed area to release the stress in the hollowing out process in the hollowed area = 1 to reduce the defect and reduce the trimming step; the substrate yield and Saves the cost of the substrate and other effects. [Embodiment] [Embodiment] The following is to match the cymbals and the system of each embodiment with a pattern " The core of each pattern; It is shown that the physical structure and actual appearance of the strip according to the actual number of miles and the structure should not be more than the figure: ::: The substrate The strip of the substrate of the present invention is provided for at least half of the gorge: ^ = pieces For subsequent use, the film, bonding wire, and glue are used.] = = The component is molded on the substrate strip #. This substrate strip is used for soap sealing to make a plurality of ball grid array semiconductor sealers. · Examples:, pieces.

1237353 V. Description of the invention (6) The first embodiment of the substrate strip manufacturing method of the present invention will be described below with reference to FIGS. 5A to 5E. This embodiment is directed to the conventional substrate strip shown in FIG. To solve the problems of the conventional technology. First, as shown in FIG. 5A, a substrate strip 31 is prepared, which is a long substrate strip cut from a whole substrate, and the substrate strip 3 1 is a single layer. , Double-layer or multi-layer printed circuit board 1? _4 Resin, BT (Bismaleimide Triazine) resin, polyurethane resin and other plastic materials, at least one surface of the core layer is provided with a plurality of conductive traces (Conductive Traces), and has a pair of long sides 31 2 and A pair of short sides 3 1 3 perpendicular to the two long sides 3 1 2. The surface of the substrate strip 3 1 is divided in advance by a plurality of vertical packaging lines 3 2 2, 3 2 3 (Package Line). A square substrate unit 3 2 is provided with a hole slot 3 3 parallel to the short side 3 1 3 between adjacent substrate units 3 2. At the same time, the edge of the hole slot 3 3 is adjacent to two adjacent substrate units 3 2 The packaging lines 3 2 2 and 3 2 3 on the vertical side are overlapped to serve as stress relief holes 33 shared by the two adjacent substrate units 32. Next, referring to FIG. 5B, the plurality of substrate units 32 on the substrate strip 31 are tested separately, for example, a short-circuit test is performed on the conductive traces on the substrate unit 32 to distinguish them by the test results. The defective substrate unit 32b and the good substrate unit 32a on the substrate strip 3; then, as shown in FIG. 5C, 'the defective substrate unit 3 2b is cut from the substrate strip 31 along the cutting line' Also, two relatively rectangular long regions 3 3 adjacent to the upper and lower edges of the defective substrate unit 3 2 b are cut from the substrate strip 31 to form a hollow area on the substrate strip 31. Wherein, the hollowed-out area includes a first hollowed-out area 34 relative to the position of the defective substrate unit 32b,

] 7513 石 夕 品 .ptd Page 151237353 V. Description of the invention (7) and the two second hollow first hollowed areas 3 6 communicating with the first hollowed area 34, that is, the two rectangular long areas 3 3 The long sides of the first hollowed-out area 36 are parallel to each other, and the length of the edges of the first hollowed-out area 34 adjacent to the length of the second hollowed-out area 36; The stress relief holes 3 3 on the two sides of the two hollowed-out areas 36 are in communication. Next, as shown in FIG. 5D, cut out other substrate strips: a good substrate unit 37, which is the same as the first hollowed area 34, so as to base the good into the first hollowed area 34 In the original substrate, the structure after the mating is as shown in Fig. 5; a good substrate unit 37 is connected to the substrate strip 31 by the left of the substrate strip 3 丨. They are joined and coplanar, and since the substrate strip 3 1 is in advance the two hollowed areas 36 in the first hollowed area 36, it is possible to release the fitting with the one-hollowed area 3 6 ′ of the good base brother. The stress applied to the substrate during the process, so as to avoid the substrate strip 3 丨 from being subjected to broadcast pressure and the quality yield of the substrate strip 31 and exert the effect of the present invention. Therefore, the first embodiment of the present invention can be made as As shown in FIG. 5E, 'including a frame and a plurality of mutual plate units 3 2 a', and the plurality of good substrate units 3 2 a are surrounded by a plurality of areas surrounded by a frame; and a mosaic element 37, It is fitted in one of the empty areas 36, surrounded by the frame, at this position; ， —The side of the hollowed out area 34 is slightly shorter than its side. The first hollowed out area is a part of the shape and size plate unit 3 7 fitted on the strip 3 (not shown). The right and left sides 3 and 8 are fitted, and during the fitting process, the plate units 3 7 around 3 4 are deformed adjacent to the substrate strip 3 1, and the good substrates adjacent to the substrate strip 3 1 that promotes 0 are formed in the Good substrate in a single domain, and the edge

17513 硅 品 .ptd Page 16 1237353 V. Description of the invention (8) A ~ A rectangular long hollow area 36 is provided on the frame adjacent to the upper and lower edges of the well-fitted substrate unit 37. At the same time, the embedded The shape and size of the good substrate unit 37 are the same as those of the plurality of good substrate units 32a. The first embodiment: _ The second embodiment of the present invention is shown in Figs. 6A and 6B, which is directed to the conventional substrate strips not shown in Fig. 2 to solve the problems of the conventional technology, and for the convenience of explanation, Elements having the same or similar structure still use the reference numerals of the foregoing embodiments, and the same or similar structures will not be described repeatedly. First, as shown in FIG. 6A, the second embodiment detects a plurality of substrate units on the substrate strip 31 and selects a defective substrate unit 32b, and then cuts a predetermined cut from the substrate strip 31. Cut the defective substrate unit 3 2 b with a tangent line to form a first hollow area 34 and a rectangular strip area 3 3 ′ adjacent to the four sides of the defective substrate unit 32 b together on the substrate strip 31. Among them, the four rectangular long strip areas 3 3 will leave four second hollow areas 3 6 corresponding to the first hollow area ^ at the corresponding positions on the substrate strip 3 1, and this is the second The embodiment is different from the first embodiment in that the two sides of the second hollowed-out area 36 can release the fitting stress on both sides. At the same time, the long side of the second hollowed-out area 36 is adjacent to it. The edges of the first hollowed-out area 34 are parallel to each other, and the long sides of the second hollowed-out area ^ are slightly shorter; the edge of the neighboring brother Yizhongkong area 34 is long. Second, as shown in FIG. 6B In addition, a good substrate unit 37 is selected, and the shape and dimensions of the good substrate unit 37 are selected. Same as the first hollowed-out area 34, to fit the good substrate unit 37 into the first hollowed-out area 34, and to use the four second clock-empty areas 36 to avoid the substrate strip during the disengagement process 3 1 due to various directions

] 7513 石 夕 品 .ptd Page 17 1237353 V. Description of the invention (9) Extrusion deformation caused by stress. Third embodiment: In addition, the shape, number, and distribution of the second hollowed-out areas 36 of the present invention can also be changed and adjusted differently according to actual needs, not limited to those disclosed in the foregoing two embodiments. The third embodiment of the present invention shown in FIG. 7 is also directed to the conventional substrate strip shown in FIG. 2. When the defective substrate unit is cut, two pieces are cut on each side together. The rectangular area, so that each side of the first hollowed-out area is adjacent to two second hollowed-out areas 36, respectively, and the eight second hollowed-out areas 36 can be used to release the fitting stress in each direction; In addition to the changes, the shape and size of the second hollowed area 36 is not limited to a rectangle, but may be other embodiments such as a triangle, a square, a semicircle, and the like, and can also exert the effect of the present invention. Therefore, by the cutting and the second hollowed-out area design of the present invention, the defects of deformation and flatness of the substrate strip during the fitting process can be avoided, so as to eliminate the trimming step, and also improve the Substrate yield and save substrate cost. The above-mentioned embodiments merely illustrate the principle of the present invention and its effects, but are not intended to limit the present invention. Any person skilled in the art can modify and change the above embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the rights of the present invention should be listed in the scope of patent application mentioned later.

] 75] 3 石 夕 品 .ptd Page 18 1237353 Brief Description of Drawings [Simplified Description of Drawings] Figure 1 is a cross-sectional view of a conventional ball grid array semiconductor package; Figure 2 is a top view of a conventional substrate strip Figure 3 is a top view of another conventional substrate strip; Figures 4A to 4C are schematic diagrams of a conventional method for manufacturing a substrate strip (Figure 3) to replace a defective substrate unit; Figures 5 A to 5 E FIG. 6 is a schematic flow chart of a substrate strip manufacturing method according to the first embodiment of the present invention; FIGS. 6A and 6B are not intended to illustrate the flow of the substrate strip manufacturing method according to the second embodiment of the present invention, and FIG. 7 is the third embodiment of the present invention. Top view of the substrate strip of the embodiment. 10 Semiconductor package 11 Substrate strip 112 Long side 113 Short side 12 Substrate unit 12a Good substrate unit 12b Bad substrate unit 122 Packaging line 123 Packaging line 13 Hole slot 14 Good substrate unit 15 Hollow area 2 Wafer 21 Substrate strip 210 Substrate connection Section 22 Substrate unit 23 Slot 24 Encapsulation line 3 Welding wire 31 Substrate strip 312 Long side 313 Short side 32 Substrate unit 32a Good substrate unit

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Claims (1)

1237353 VI. Application for Patent Scope 1. A substrate strip manufacturing method capable of increasing yield. The substrate strip includes a plurality of substrate units adjacent to each other. The manufacturing method includes the following steps: · Detecting a plurality of substrates on the substrate strip. Unit to select the defective substrate unit on the substrate strip based on the test result; cut out the defective substrate unit from the substrate strip to leave a first hollowed-out area on the substrate strip, and simultaneously from the substrate An area adjacent to at least one edge of the defective substrate unit is cut out from the strip to leave at least one second hollowed area on the substrate strip that communicates with the first hollowed out area; in addition, a good substrate that has been tested is selected And the shape and size of the good substrate unit are the same as the first hollowed-out area; and the good substrate unit is fitted into the first hollowed-out area to prevent the substrate strip from being deformed by the second hollowed-out area. 2. For example, a method for manufacturing a substrate strip that can increase the yield of the first patent application, wherein adjacent substrate units on the substrate strip have a hole slot, and the hole slot is respectively packaged with the two substrate units. Lines (Package Line) are separated by a distance. 3. The method of manufacturing a substrate strip that can increase the yield, as described in the first item of the patent application scope, wherein adjacent substrate units on the substrate strip have a hole slot, and the hole slot is respectively packaged with the two substrate units. Line (Package Line) coincides 4. If the method of manufacturing a substrate strip that can increase the yield, as described in item 3 of the patent application scope, wherein the second hollowed out area and the first hollowed out area are not connected with the ] 7513 Shi Xipin. (1 Page 21 1237353 VI. The adjacent edges of the holes and grooves in the scope of the patent application are connected. 5. For the method of manufacturing a substrate strip that can increase the yield in the first scope of the patent application, where the first The second hollowed-out area is a rectangular hollowed-out area. 6. If the method of manufacturing a substrate strip for improving the yield of the patent application No. 5 is adopted, wherein the long side of the second hollowed-out area is adjacent to the first hollowed-out area adjacent to it. The edges are parallel to each other. 7. According to the method of increasing the yield of the substrate strip manufacturing method according to item 6 of the patent application, the long side of the second hollowed-out area is slightly shorter than the edge length of the adjacent first hollowed-out area. 8. If the method of manufacturing a substrate strip for improving the yield of the scope of the patent application item 1, wherein the second hollowed area is cut on each side of the first hollowed area. 9. If the patented scope of the first item A method for manufacturing a substrate strip capable of improving yield, wherein the substrate unit is provided with at least one conductive trace layer. 10. A substrate strip capable of improving yield, comprising: a frame and a plurality of adjacent to each other Good base Unit, and the plurality of good substrate units are respectively formed in a plurality of regions surrounded by the frame; and at least one well-fitted substrate unit is fitted in one of the regions surrounded by the frame, In addition, a hollowed-out area is provided on an area adjacent to at least one edge of the well-fitted substrate unit on the frame, and the shape and dimensions of the well-fitted substrate unit are the same as the plurality of good substrate units. For example, if the number of substrate strips that can increase the output of the scope of patent application is 10, the 175] 3 Shi Xipin. Mouth (1 Page 22 1237353 6. In the scope of patent application, there is a hole slot between adjacent good substrate units on the substrate strip, and the hole slot is respectively connected with the two good substrates. The packaging lines of the units are separated by a distance. 1 2. The substrate strips that can increase the yield, such as the scope of patent application No. 10, wherein adjacent good substrate units on the substrate strips have a space between them. A hole slot, and the hole slot is respectively overlapped with the package line of the two good substrate units, and there is also a hole slot between the fitting good substrate unit and the good substrate unit. Item 12 can increase the yield of the substrate strip, wherein the hollowed out area is in communication with the edge of the well-fitted substrate unit that is not adjacent to the hole and slot. 1 4. Such as the scope of patent application No. 10 The second hollowed-out area is a rectangular hollowed-out area, such as the second hollowed-out area, and the second hollowed-out area is a rectangular hollow-out area. Long side The edges of adjacent first hollowed-out areas are parallel to each other. 16. For example, the substrate strips that can increase the yield can be obtained from the scope of patent application No. 15, wherein the long side of the second hollowed-out area is slightly shorter than the adjacent one. The length of the edge of the first hollowed-out area. 1 7. The substrate strips that can increase the yield, such as item 10 of the patent application scope, wherein each side of the first hollowed-out area is cut with the second hollowed-out area. 1. According to the patent application scope of item 10, which can increase the yield of the substrate strip, wherein the substrate unit is provided with at least one conductive trace layer. 175] 3 Shi Xipin. Mouth (1 page 23