TWI236750B - Ball grid array package with heat sink device - Google Patents

Abstract

The present invention provides the heat sink device for the ball grid array package to improve the heat dissipation. The heat sink device includes a first part of heat sink assembly, which comprises a heat dissipating element above the heat sink body and is used to increase the heat dissipating area; and at least two conductive pillars on the backside of the heat sink body, which is used to fix the heat sink assembly with PC board and also conducting the heat flux from thermal source to heat dissipation element; a conductive protruding block on the backside of the heat sink body, wherein the conductive protruding block used to associate with the cavity of the ball grid array package to increase the heat conductivity. In addition, the second part of the heat sink assembly comprises a bottom plate used to contact with the backside of the PC board, so as to increase the heat dissipation to remove the heat that is generated from the PC board, and to join the at least two conductive pillars of the heat sink body to fix heat sink assembly on the PC board.

Description

1236750 V. Description of the invention (1) ------ 1. The technical field to which the invention belongs] The present invention relates to providing a ball for dissipating heat in an integrated circuit, and more particularly a ball having a heat dissipating device. The format array is robust, reduces thermal resistance, and improves heat dissipation efficiency. [Previous Technology] In the electronics and computer industries, various types of electronic components and integrated circuit chips are used, for example, the PENTIUM central processing unit, (CPU 泮 central processing unit) manufactured by Intel, and ^ The left machine accesses δ random access memory. . This circuit chip has a pin grid array structure (? (^ 姅 piri Gr id integrated package) and is usually mounted on a socket. The pin grid is structured to be soldered to the computer by soldering. Circuit board. These ^ 1 = circuit components, especially the central processing unit chip, will generate a large amount of heat during operation, so this heat must be removed to prevent unfavorable operation of the microprocessor. Because the PENTIUM microprocessor contains millions of transistors, it will have high sensitivity to overheating operations. When overheated, it will damage the 7L of the microprocessor itself, or other components near the microprocessor. In addition to microprocessors, there are many types of semiconductor component packaging. These are usually used in computer equipment. For example, resistors and thermistors generate a lot of heat during normal operation. And there is no timely removal of heat to reduce operation

Page 6 1236750 V. Description of the invention (2) At temperature ‘These heat may cause component failure or damage.

Similarly, the fixing components are usually installed in the circuit board, or sequentially installed on the motherboard or other major circuit boards. For example, microprocessors such as PENTIUM II manufactured by Intel Corporation and Ce ^ eron processors are called processor cards. These microprocessors are installed on the motherboard of a computer system. The modem is a modem (Modem) installed on the motherboard. The known processing card is a typical semiconductor processing element, which is one of the necessary components for the operation of the interface card, such as a cache chip or other chips with similar functions. The processor package can be implemented through a pin grid array structure A), a ball format array structure (BGA), a substrate grid array ("M array") and a chip (ZifserInsertion Force) located on a socket. Or a ball grid socket (baU grid = a traditional semiconductor device with a core-type theory). Many of the 70 different pieces that ca n’t withstand overheating cause problems. The package has overheating. Bran σ, the electronics can reduce the temperature. To # 彦 味 、 夕 二 f, the electronic parts of Zhongxi need to be cooled with these electrons; the heat causes overheating. However, metal heat sinks: move this: so that: traditional tapes cannot be provided and accommodated directly. ΪΪ Γ Γ Metal cymbals are generally used on spring cH ^, or 例如 on mechanical structures such as springs. Further aligned and mounted on electronic device packaging gap pads are usually used in electrical

Page 7 1236750 V. Description of the invention (3) Outside of the interface surface between the sub-component package and the heat dissipation mechanism in order to obtain a suitable heat conduction effect. Referring to the problems previously generated with these electronic components, it is difficult and costly to provide a heat sink fin located above the heat sink or other components that can increase the heat sink area. In the foregoing description, conventional heat sinks suffer from the disadvantage of many components and the high cost of combining many components together. These components with heat sinks include more expensive machinery or thermally conductive metals that can be extruded like aluminum. As for the other parts, for the manufacturing process, such as impeachment or additional elastic clamps, separate mechanical steps and / or laminations are required. Therefore, these components and methods are not completely appropriate for most electronic components. Referring to the first and second figures, there are shown a side view and a side view of a conventional ball format array structure 100 having a heat sink, and the ball format array structure having a heat sink includes a ball format array substrate 1 0 2. A wafer 104 is located above the ball format array structure substrate 102, and an improved embedded heat sink 106 is located above the wafer 104 and the ball format array structure substrate 102. Molding compound 108 is then injected to complete a ball format array fabrication process. It can be seen from the side view (the first B figure) that in the conventional ball format array structure 100, the wafer 104 is covered with a molding compound 108, and its heat dissipation path is limited. Compound 108 has a low thermal conductivity and cannot dissipate large heating power. The general solution to this problem is to add an embedded heat sink above the chip

Page 8 1236750 V. Description of the invention (4) (embedded heat slug), the disadvantage of this technology is that due to the larger heat dissipation requirements, it will face the inability to timely remove a large amount of heat generated by the chip to the surrounding environment, resulting in overheating. , Making the chip inoperable. 3. Summary of the Invention The main object of the present invention is to provide a cast-type integrated heat-dissipating mechanism main body having a heat-dissipating device, wherein the main system of the heat-dissipating mechanism is formed by casting to increase heat-dissipating efficiency. Another object of the present invention is to provide a thermally conductive bump located on the back of the heat dissipation mechanism body and connected to a groove on a ball format array structure with an improved embedded heat sink to improve the heat conduction effect. Yet another object of the present invention is to provide at least two thermally conductive pillars located on both sides of the main body of the heat dissipation mechanism for connecting the openings located on both sides of the lower fixing piece. A secondary object of the present invention is to provide a fixing sheet to connect a first heat dissipation component having at least two thermally conductive pillars to contact the back side of the printed circuit board to guide the heat generated by the wafer, so that the heat can be transferred from the printed circuit board. The back side transmits heat to the heat sink fins located above the first heat sink component via the lower fixing sheet to the conductor pillars on both sides of the first heat sink component. According to the above purposes, the present invention provides a method that can be used to improve

Page 9 1236750 V. Description of the invention (5) A good-type embedded heat sink in a ball format array is constructed to increase heat dissipation efficiency. The heat dissipating device includes a first heat dissipating component and a second heat dissipating component. The first heat dissipating component includes a heat dissipating fin located above the main body of the heat dissipating mechanism and at least two thermally conductive pillars on both sides below the main body of the heat dissipating mechanism to increase the heat dissipating mechanism. The heat dissipation area of the main body; a thermally conductive bump is located on the back of the main body of the heat dissipation mechanism, and the thermally conductive bump is used to connect the groove in the U-shaped heat sink on the ball format array structure with the improved embedded heat sink to Increase the effect of heat conduction. In addition, the second heat dissipating component is a lower fixing piece, which has a protruding portion in the middle and openings on both sides. The middle protruding portion is used to contact the back side of the printed circuit board to remove the generated by the chip. Heat is used to increase the heat dissipation effect, and is connected to at least two thermally conductive pillars of the main body of the heat dissipation mechanism to fix the first and second heat dissipation components and a printed circuit board with a ball format array structure located between the first and second heat dissipation components. -[Embodiments] Some embodiments of the present invention will be described in detail as follows. However, in addition to the detailed description, the present invention can be widely implemented in other embodiments, and the scope of the present invention is not limited, which is subject to the scope of subsequent patents. The invention provides a heat dissipation device for a ball format array structure with an improved embedded heat sink to reduce thermal resistance and increase heat dissipation efficiency. The third to seventh series illustrate each structure, function, and mutual connection relationship of the heat sink, and the eighth series illustrate heat dissipation paths of the heat sink according to the present invention. The third figure illustrates the first heat dissipating component 1 A in the heat dissipating device.

Page 10 1236750 V. Description of the invention (6) " ~~ 一 '—-:: 2: There are ancient first heat-dissipating heat sinks 4, for example, the fins are located in the body of the heat-dissipating heat mechanism,' Pot No. 2 \ 一 埶 散 ^ Element 2 is the dispersion of the first heat dissipation component 1 A: two heat areas and simultaneously improve heat dissipation efficiency. Here, the first heat dissipation element Λ to / two thermally conductive pillars 6 are used to connect and have a modified «Λ:?; \ ^,] # ^^^^^ ). The feature of the body i = Γ exposure technology is that the first heat dissipation element 1A is formed by casting = casting, and its purpose is to dissipate the heat sink element I ,,,,,,, and, in addition, another feature of the present invention is that The first plastic ^ Φ 4 and the following thermal conductive pillar 6 replace the traditional function of only supporting and improve the thermal conductivity and increase the heat dissipation efficiency of the entire heat sink. ^ Progress: Referring also to the third figure, in the preferred embodiment 2 of the present invention, a heat sink 7 ^ 2 further includes a thermally conductive bump 8 located on the first heat dissipation element, 邕: surface. When the integrated circuit generates a lot of heat during operation ..., the bump 8 is used to contact the groove 12 (such as the fifth figure) of the heat sink located above the ball grid with the improved embedded heat sink (Shown) Adding rumors In another preferred embodiment of the present invention, as shown in the fourth figure, a V thermal adhesive tape (10) is applied on

1236750 V. Description of the invention (7) Coated on the whole part. This feature is a hole, which must be constructed by a guide ball format array. It is embedded in a groove 1 2 (not shown in the figure) with an improved thermal plate. One of the features is that the first heat sink 2 is added to the first heat sink. The vest of the heat-dissipating element 2 of the first heat-dissipating element 2 is a surface, and the ^ adhesive tape 10 is due to the thermal adhesive tape 10 on the printed circuit board connected to the thermal bump 8 as the surface of the stamping compound for the thermal conductive pillar to pass through. Bonding :, the embedded heat sink type of the embedded heat sink ^ sleep and heat conduction bumps 8, and the page part access ^ type car train structure I as a dispersion between the two "to: can Adding a heat-conducting substance to the first heat-dissipating element at the same time as the present invention, it can be integrated into one body by casting, and the guide 8 can be integrated with the back of the part 2. Ai or after the molding, refer to the fifth figure, copy one, embedded type The format of the ball of the heat sink is a printed circuit board with an improved internal structure of 20, an embedded structure of 1H9Q, and its structure includes a substrate with a fin 22 on the right side, and 2 above the substrate 20. In which a recess 24 is embedded, and this recess 24 can reduce the pressure of the compound outside the mold. In the embedded heat sink 22, there is a stamping compound 26, and the other 12 I / solder ball 28 is located below the substrate 2 to connect the printed circuit board ^ Among them, the heat sink WI type heat dissipation in the ball format array structure Sheet 2 2 and ^ concave only 24 is located above the wafer (not shown in the figure) for bonding heat conduction, and the thickness of the die compound 26 can be reduced to increase heat dissipation. In addition, 'the printed circuit board 12 has at least two Holes 1 4 for lifting

I236750 V. Description of the invention (8) ___ ‘The thermal pillar passes through; in another embodiment, the existence of the one-to-one = can make the guide on the second heat dissipation element = the key hole. , And the two can also be joined through a thermally conductive substance. The dragon 8-person groove 24 is connected with the second heat-dissipating at least two open structures, and is fixed by using. In addition, the board fixing plate of the circuit board 12 is transmitted to the space under the printed circuit 12 by means of B transfer, and the heat is removed whether it is. In addition the ball format array thermal device. The six pictures show that the component 1 B is the port 34, and the upper and lower parts of the opening 3 4 are in contact with each other. The plate sent to the heat-conducting first heat-dissipating plate 12 is insufficient for heat transfer and is transmitted upward. -Now-next fixed month 〔Hot 70 pieces of 1β, u 疋 片. The lower fin of the lower fixing piece 1β-the heat dissipation component " ::, with the thermal support = 6, the middle protruding part 3 of the shim 1β is convenient to disperse ^ f 2 with the printed electrical pillar 6 and Λ outside the plate The heat is lowered by -1, and then wrong by the thermal conductive pillar 6 ;: not =. The advantage of this method is poor), especially effective for printed circuit boards. Therefore, the four conventional ball-shaped arrays that pass down will transfer the heat f, the two J-frames or the thermally-enhanced type, except for the thermally conductive bumps 8, which can be used with reference to the seventh figure. The printed circuit board 2 is reserved to the back of the board through which the thermally conductive pillars 6 of 2 are worn to achieve the purpose of fixing. = Hole 14 to printed circuit board 12 Hole wall of pillar 6 and hole 14 (not in): angle of mechanical design, thermal support _ middle table is not allowed to maintain tolerances and will not connect to page 13 1267050 V. Description of the invention (9 ) Touch. However, the purpose of the technology disclosed in the present invention is to improve the heat dissipation characteristics. Therefore, the hole 14 is connected to the ground layer (gr0Und Plane) 12A of the printed circuit board 12, and the conductive pillar 6 penetrates the printed circuit board. After the hole 14 of 12, the thermally conductive substance 42 is filled into the hole wall and the guide pillar 6 2 :: The gap, so the ground layer of the printed circuit board 12 can be used. The heat is conducted to the air to dissipate the heat from the ball format array, the heat sink 22, and the second heat dissipation; to the air] the column 6 and the ground layer of the printed circuit board touch the heat. Such a heat sink structure is still applicable without the lower fixing piece 1B, and the structure having the heat conducting pillar 6 and the spring 40. One of the features of the present invention is that it has a fixing piece 1 B below the middle protrusion 34, which is made of a guide material, wounds, and the thermal efficiency of Kai Ling Zhi. In addition, the second loose ... Bring the speaker 卩 Hi 丨 dry λ ", ... and the piece 1B further includes at least two u # on the tooth through the printed circuit board 12 for tightening the first heat-dissipating element 2 and the lower fixing piece 1B; The pillar 6 and the lower fixing sheet 1B form a conduction mechanism. Then, the guide ..., support Next, the eighth figure is a schematic cross-sectional view showing a right-hand structure. When the computer's ::-ball format array is constructed, so the heat is generated: its heat will be produced by the stability of the wafer operation. Its heat can be known as low temperature to maintain the computer to conduct upward to the ball format array dream hf / ·, its path 1 is the heat and heat bump 8, the first-heat sink = = sheet 2], and conducted to the first The government heats 7L pieces 4 and removes the heat.

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On the other hand, the heat dissipation path 2 is the one that transfers heat to the back of the two-way board 12 via the thermal conductive pillar 6 as well. The person who conducts heat is transferred down through the printed electrical heat dissipation module (A, or mass) to the bottom. Fix the core, and then fill the layer m of the heat-conducting filler after iron, or conduct it to the printed circuit board in an amount of 1 敎 to the middle protruding part 32 of the lower fixing piece 1B, and then transfer the heat conduction to the printed circuit board ground layer 1 2 A dissipates heat outwards. The above are merely preferred embodiments of the present invention, and are not intended to limit the scope of patent application for the present invention; all other equivalent changes or modifications made without departing from the spirit disclosed by the present invention should be included in the following Within the scope of the patent application. 1236750 Schematic description V. [Schematic description] The first image is a side view of the traditionally disclosed ball format of the heat sink exposed ^ _ L, without a modified embedded 4-type queue configuration side view; Gan Ufi According to the traditionally disclosed technology, it shows that ...] Cross-section schematic diagram of the ball format array configuration of the government-heated film. Improved built-in embedded mechanism. The second: According to the technology disclosed in the present invention, there are 1 phase ... The upper salmon salmon T does not have two thermally conductive branches located on it; li W and: t are structural diagrams of the heat dissipation mechanism body T; and the fourth picture of the thermally conductive bumps on the back of the mechanism body is based on this The commanding cloth on the main body of the heat-dissipating mechanism :: The technology 'I shows the schematic diagram of the wearing surface of the thermal conductive tape; in order to achieve the fixed purpose and increase the heat dissipation; On the board, the technology with the improved internal I j unveiled the road, which is located on the printed magic surface; the internal twisted heat sink of the sincere twist Lu Yi .., p brush electric power six pictures are rooted in Taiyi second Cooling component = hair: the disclosed technology, in 4 Early not intended; Technique of the seventh line of FIG exposing the heat dissipating apparatus according to the invention in the month, indicating that the heat dissipation mechanism

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1236750 Brief description of the drawing 32 34 36 40 42 Opening in the middle of the projecting latch Spring # Thermally conductive material 1 0 0 Ball format array structure 1 0 2 Substrate 1 0 4 Wafer 1 0 6 Heat sink 1 0 8 Molding compound «

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Claims (1)

/ ^ 6750 6. Scope of patent application ^ A heat sink for 苻 ^ ^, Erliang-type embedded heat sink ball 袼 々 Land-mounted heat sink ~ Two improved embedded heat sink ball 2 ^ Construction—The second one contains: a clothing format array member and a first ~ ρ, and pieces; the first heat dissipation component contains _ and the heat management element is located in a private device-the first heat sink has- Lin Zhuan is located above the first heat sink;-the second one: And what? Mounting a printed circuit board; and wound and at least two doors; the second heat dissipating component has an intermediate protrusion format array structure; a mouth, wherein the first heat dissipating component is located on the printed circuit board The top of the board and the No.- 鸯 & Γ table has a 4-ball format array of the printed circuit board. The printed circuit board is in the ball format of the thermal module position, such as the array application. The first item of the scope of profit is for the improved type. The built-in heat sink is cast into a heat sink device, in which the first heat sink element is in a 3-ball format, such as Zhenshen / Hibiscus, "item 1 is used for improved heat sink fins." The heat dissipating device, in which the second heat dissipating element is a ball 4 Lin + such as ^ the scope of the patent application, the first item is for a heat dissipating device with an improved embedded heat sink-^ 1-row structure, in which a thermally conductive bump is located The rear side of the 7L piece of this heat. For example, the fourth item in the scope of patent application is for an improved embedded heat sink. Page 19 1236750 VI. Scope of patent application The looseness of a format array structure The back of a rose thermal element. …, Set, one of the thermally conductive tapes is located in the 6th, such as the _read patent # ® format array structure of the loose enclosure 々 for improved heat sink-one of the slots embedded heat sink, where: The ball-shaped array structure of the ball forest Λ application for the scope of the patent application of the first heat-receiving device Γί: ... embedded heat sink ... 7 "pieces and the ball-format array structure" is used to connect The first scattered ball 8 Gurley range of the first item is used in the improved type # t ^ H in the first-: 1 structured heat sink, 1 medium to + L-type government heat sink heat sink element and located Two: to) The ball grid of the two thermally conductive pillars is the first item in the lunar and patented rail fence. It is used to change the thermal conductivity of the θ penalty. The heat dissipation device is arranged in a row. 3 to; two springs are located at C 'oxygen; ΐ used for balls with improved embedded heat sink * ... 骏骏 之 散 ΐ' for different modified embedded heat sink structure 1 = cooked device contains · · The gate ball format array rose "piece, the heat dissipation component contains the first-thermal conductive tape page 1236750 6. Application for patent The ____ heat sink element, which Xi Road # and the second heat sink element position: = the back side of the heat sink element has a ball-shaped array ^ 1 above the factory; the array structure includes a groove = two: The ball grid, a thermally conductive bump, the guide plate, the internal heat sink in the circuit board 1, and the grooves inside the U-shaped array of the printed circuit board. = ,,,,, and the thermally conductive bumps located in the grooves with the ball-shaped array structure are bonded to the back of the heat-dissipating 7G component configured by the ball-type array. 11 · For the patent application, the ball format array builders use :: Improved built-in heat dissipation method. Thermal device ', in which the above-mentioned heat-dissipating component is formed in a well-formed ... heat as a heat-dissipating fin. …, 4 sets of the above-mentioned second heat-dissipating element: 袼 Improved embedded heat-dissipating 5th heat-dissipating element; 2:,:-t contains-the heat-conducting substance is located between the 10-three-dimensional ball-shaped array structure . Pian Xi: p / from the female 2 t patent scope item 10 is used for the star A A w /, there is a ball format with the ^ first heat sink assembly type array under the printed circuit board. The ball format of the heat-dissipating heat piece; used for the improved embedded parts with-middle protrusion: Ui, where the first ... and at least two openings are located on both sides. The heat dissipating device package includes a first heat dissipating element, the first heat dissipating element includes a first heat dissipating element, s 2 2 :: τ, and a second heat dissipating element is located under the first heat dissipating element having one thermally conductive bump; at least two A thermally conductive pillar is located in the first body with a heat sink: one of the printed arrays with a ball-shaped array structure. The printed circuit board has at least two holes; The right part of the second heat dissipation component and the openings on both sides, wherein the two thermally conductive pillars of the first middle protrusion portion pass through the printed circuit board to 1 = M m at least the openings on both sides of the second heat dissipation component. Join. Μ Λ holes and the ball type located in the device 17 · such as the item No. 16 of the scope of patent application, wherein the above-mentioned heat-dissipating pieces of the first heat-dissipating array structure having the heat-conducting bumps are arrayed in a casting manner Heat dissipation 18. For example, the ball grid 1236750 of the 16th in the scope of patent application 6. The device in the scope of patent application, wherein the second heat dissipation element is a heat dissipation fin. 19. For example, the heat dissipation device constructed by the ball format array of item 16 of the scope of patent application, further comprises a thermally conductive substance filled in the hole to join at least the two holes with at least the two thermally conductive pillars. 20. For example, the heat dissipation device constructed by the ball format array of item 16 of the patent application scope further includes at least two springs located in at least the two thermally conductive pillars. 1 I p. 23