TWI235393B - Silver contact fixing structure for conductive sheet and its manufacturing method - Google Patents

Abstract

The present invention provides a silver contact fixing structure for conductive sheet and its manufacturing method. The object is to provide an abutting force, when the silver contact is knocked and conducted, to make the silver contact securer without the possibility of falling off. An installation part is arranged on the conductive sheet at a position corresponding to the silver contact, and at least two position fixing regions conducted with each other are formed in the installation part. The adjacent position fixing regions have abutting terminals therebetween, so as to increase the abutting force between the silver contact and the conductive sheet to prevent the silver contact from falling off, thereby achieving the effect of increasing the lifetime of the silver contact.

Description

1235393 V. Description of the invention (1) [Technical field to which the invention belongs] The present invention is related to a woman's, a, +, and γ-a silver contact fixing structure of a conductive sheet and a solid line of a manufacturing line thereof. The structural shape of the conductive sheet and its silver 彳: Γ to achieve the technology of increasing the strength of the silver contact. Provide test: The use of contact manufacturing technology will cause some problems. The following can be used, so: ^ = Warp is used in the design of the switch to provide the power of the switch. Switch: silver stroke to achieve the contact. And the production of long-term knocking contacts is opened; only early pure coupling in the accommodating space, so in addition, there is an oblique 4 = easy to make the silver contacts out of the conductive sheet. The Republic of China Patent Princess 1 lacks improved silver contact making technology, as in the law. "The case uses: conductive η" the silver contact of the conductive sheet is fixed to the side and the excess material of the conductive sheet is pressed down and convexed. " Retaining hole 'The retaining hole is provided with a thread to lift it to form a protruding fitting gap'. It is not easy to fall off with force. Finally, it has a horizontal protruding friction against the top gap when it is used. Another upper die formed the top of the silver wire into an abutment, and forced the retention hole =: The lower die pushed the fitting edge toward the retention hole, although the silver could be surely connected ?: Compacted in the retention hole. The above-mentioned outstanding abutment is used for the effect that the gate μ 0 is consistent and difficult to escape, but it must be kept in a proper position: the second guard, because the movable contact and the closed contact 3_ space), ㈣ Impact: For example, in Europe, it is necessary to design the distance between the tongue and the closed circuit of the relative position inside the switch, and I $ new configuration 1235393 V. Description of the invention (2) Please refer to the "Figure 1" stem & ^ injection molding Way, in the conductive sheet, in order to change the above problem, You can avoid the above mentioned problems: the silver contacts are buried at the same time. The problem of the new configuration occurs, but: the body; in the middle, to avoid the internal position of the switch needs to be various: off; the point size is different: two The production method must cooperate with the modularization, which will inevitably increase the production cost. This method cannot make the process. [Abstract] The main purpose of $ Mao Ming is to solve the existence of ups and downs, and propose a more = two missing, avoiding the method and structure of the corresponding silver contact on the conductive sheet. Vertical: forming at least two interconnected parts, the abutting ends of the corresponding areas of the assembling parts have abutting ends, and the stomach reaches silver; = while the adjacent fixed silver contacts' when the pins strike the silver contacts, ': Provide two sections to form:, ::: The horizontal section of the assembly is designed to be non-circular, and the combination of the two can make the silver contacts difficult to come off. $ 则 之 样 [Implementation] I 1 mouth for several months See "Figures 2,3-1 ~ 3-6, 13", the first aspect of the present invention-each of its production steps is A punch embryo, B secondary punching embryos and c planting solid silver. If the detailed description and technical details of the present invention are included, the example line will be described with reference to the diagram. In step A, the embryos are first placed on the conductive sheet 10. The punching end 201 of the first upper die is used for punching to form the _retaining area 15. The punching end 201 is a cylindrical shape which is tapered downward, and the side end of the first retaining area 5 has an abutment. end

1235393 V. Description of the invention (3) 121 '4 The guilty end 121 is a leading oblique angle; then step B is used to punch the embryo a second time, and the second upper die 22 is used to punch the conductive sheet 10 to form the second retention area 19, the first The retention region 15 is larger than the second retention% region 19, and the side of the first retention region 15 has an abutment end 121, and the abutment end 121 is a leading oblique angle; "The final third step is the C-implanted silver wire. First, the conductive sheet 丨 〇 is placed on the first lower mold 21, and the silver wire 丨 6 is compacted and filled in the assembly part ^ by the third upper mold 23 to form a silver contact 17, and the silver contact 17 and The joints 丨 丨 are of equal shape, and the abutting end 121 provides a stop and strengthen fixing effect.

Please refer to / figure 4, 5, 6-bu 6-6, 13 ", which is the manufacturing process of the second embodiment of the silver contact 1 7a. The steps of ... For: A punch embryo, β one. Human punched embryos and C-implanted silver thread. The second step A punching system uses the first upper die 20a to form the first retention area 15a on the conductive sheet 10 and the electric sheet 10a. The first guide system has an extension angle 18a. 〇a's stamped end 201 a shrinks H々 "W The extension angle 18a in the book is-downward Jin ^ and the outer end is jagged; ~ Γ boundary Next, the step β secondary punching is less than 2 ... The sheet 10a is punched so that it is conducted on the first sheet: the upper part of the second sheet.

The second retention area 19a of the potential area ... and m X is equal to the-solid; the upper plate 2 2 a is a cylindrical lower mold 2 = the third step C is to fix the silver wire, and the conductive sheet is set ... The silver wire 16 in the first place is placed in the first and second retention areas 15a and 1 丨 Wingcheng's assembly section J ^, and the method is as follows: The second upper die 2 3 presses the silver wire 1 6 | and fills it in the assembling portion 11a, and completes the silver contact 17a 1235393 according to the above steps ^ "/ step 'V. Description of the invention (4) The production of the second embodiment. The first solid 1. 10 0 bit area 15a side end is abutting end 121, and the abutting end 121 is a leading oblique angle. Please refer to Figures 7 and 8 for low crime. Figure 2 shows the fourth and fourth embodiment of the conductive sheet i Ob, J 0c, 7 and 8 are the third and punching embryos, B secondary punching embryos and C plant solids, respectively = manufacturing step A described in the previous paragraph. (In the third embodiment (not shown in the first embodiment)) a solid column groove, the second retention area 19b of the towel is a circle with a downward tapering L… — D ^ the inner edge is a zigzag circle形 槽。 Shaped groove. In addition, the first and the first of the fourth embodiment-.UL ^ α ^ The C-terminus of the first retention region 15 c and 19 c are jagged, and the first retention region 15 c is a downwardly tapered cylinder. The grooves are shown in Figure 9-Bu 9-3, 13, which is the embodiment of the present invention, and the steps are: A punching embryo, B punching embryo, and c planting silver wire; Wherein, the blank punching step A uses the first upper die 20d and the second lower die 24 to punch and form the first and third retention areas 15d and Hd on the conductive sheet 10d and the lower side; then, the second blank punching step B is performed. The second upper mold 22d is used to form a second retention region 19d smaller than the first and third retention regions 15d and Ud in the conductive sheet 10d. The first and third retention regions 15d and 14d The horizontal center of the conductive sheet 10 d is a tapered cylindrical groove. In this embodiment, only the side of the first retention area 15 d is jagged. In the last step C, the silver-implanted wire is silver. The line (not shown) is placed in the assembly portion 1 1 d formed by the first, second, and third retention areas 1 5 d, 19 d, and 1 4 d, and finally a third upper mold is used (in the figure) Not shown) Compact and fill silver wires (not shown) in the assembly Part 1 1 d. Please refer to "Figures 10 to 12", the sixth embodiment (such as Figure 10), the seventh embodiment (such as Figure 11) and the eighth embodiment (such as Figure 12)

Page 8 1235393 V. Description of the invention (5) The manufacturing steps are substantially the same as the above. In the sixth embodiment, the first, second, and third retention areas 15e, 19e, and 14e are only the second retention area 19e (Figure 10). ) Is a zigzag pattern, and in the seventh embodiment, the first, second, and third retention regions 15 f, 19 f, 1 4 f, and only the third retention region 14 f (FIG. 11) are Jagged appearance. In addition, the first, second, and third retention regions 15g, 19g, and 14g of the eighth embodiment (such as FIG. 12) are all formed into a sawtooth state. However, the above are only the preferred embodiments of the present invention. When the scope of implementation of the present invention cannot be limited, that is, all equal changes and modifications made in accordance with the scope of the patent application of the present invention shall still belong to the patent of the present invention Covered.

Page 9 1235393 Simple illustration of the drawing [Simplified illustration of the drawing] Figure 1 is a schematic cross-sectional view of the conventional silver contact technology. FIG. 2 is a perspective view of the appearance of the conductive sheet according to the first embodiment of the present invention. Figures 3-; 1 to 3-6 are schematic diagrams of the manufacturing steps of the first embodiment of the present invention. FIG. 4 is a perspective view showing the appearance of a conductive sheet according to a second embodiment of the present invention. FIG. 5 is a schematic plan view of a second embodiment of the present invention. 6-; 1 ~ 6-6 are schematic diagrams of the manufacturing steps of the second embodiment of the present invention. FIG. 7 is a schematic sectional view of a third embodiment of the present invention. FIG. 8 is a schematic sectional view of a fourth embodiment of the present invention. Figures 9-; 1-9-3 are schematic cross-sectional views of a fifth embodiment of the present invention. Fig. 10 is a schematic sectional view of a sixth embodiment of the present invention. FIG. 11 is a schematic sectional view of a seventh embodiment of the present invention. Fig. 12 is a schematic sectional view of an eighth embodiment of the present invention. FIG. 13 is a block flow diagram of the first to eighth embodiments of the present invention. [Illustration of Symbols] 10, 10a, 10b, 10c, 10d, 10e, 10f, 10g · Conductive sheet 11, 11 a, 11 d ......... Assembly section 121 .. ... but the abutment end 14d, 1 4e, 1 4f, 1 4g ......... the third retention zone 15, 15a, 15b, 15c, 15d, 15e, 15f, 15gThe first retention area 16 ........ Silver wire 17, 17a ... ..... silver contacts 18, 18a ... extension angles 19, 19a, 19b, 19c, 19d, 19e, 19f, 19g

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Claims (1)

1235393 VI. Application for patent scope 1. A vertical surface of a conductive installation position ^ a large end of a retention area, borrowed by the silver assembly junction, etc. 2.-a kind of fixed silver contacts for the production of a fixed structure The structure is connected to the conductive sheet with a set of joints corresponding to the silver contacts, which is characterized in that: the set of joints corresponds to the conductive sheet to form a first and a second retention area connected to each other, so that the first and second retention areas are connected to each other; And the first and second retention areas are connected by an abutment line to be compacted and filled in the assembling portion to form a silver contact, and the silver contact and the abutting end provide a stop and strengthen the fixing effect. According to the method for solidifying a silver contact of a conductive sheet as described in item 1 of the scope of the patent application, the steps include: A. punching the blank, punching the conductive sheet by a first upper die to form the conductive sheet into a first retention position Area B. Secondary pressing to make conductive C. Implanting on the first and compacting the silver wire 3. If applying for the first of which 4. If applying for the second of which 5. If applying for the second and its manufacturing square . 6. If the application and its manufacturer are used to punch the blank, a second upper die smaller than the first upper die punches the conductive sheet to form a second retaining area smaller than the first retaining area; the silver wire, the conductive piece It is placed on a first lower mold, and then the silver wire is placed in an assembly portion formed by the second retention area, and the third upper mold is used to fill the assembly portion. In the method for fixing the silver contact of the conductive sheet described in the second item of the benefit range, the horizontal section of the retention area is non-circular. In the method for fixing the silver contact of the conductive sheet described in the second item of the benefit range, the horizontal section of the retention area is non-circular. The method for fixing the silver contact of the conductive sheet according to item 1 or 2 of the profit range, wherein the horizontal cut planes of the first and second retention areas are all the silver of the conductive sheet described in item 1 or 2 of the non-circular range. Contact fixing construction method, wherein the second retention area of the set of joints is opposite to the first retention area Page 121235393 6. The other surface of the scope of patent application has a third retaining area that is connected, and the third retaining area is larger than the second retaining area and the junction of the third and second retaining areas is Another abutting end. 7. —A method for manufacturing a silver contact fixing structure for a conductive sheet as described in item 1 of the scope of the patent application, the steps include: 2 A. punching the blank, borrowing a first upper die and a second lower die Punching the upper and lower ends of the conductive sheet to form the conductive sheet into a first and a third retention area;-B · Secondary punching, using a second upper die smaller than the first upper die and the third upper die to conduct electricity Sheet stamping to form the conductive sheet into a second retention area smaller than the first and third retention areas; C. Plant the silver wire, place the conductive sheet on a first lower mold, and place the silver wire in the The assembly portion formed by the first, second and third retention areas is compacted and filled with the silver wire by a third upper die. 8. The manufacturing method of the silver contact fixing structure of the conductive sheet according to item 7 of the scope of the patent application, wherein the horizontal section of the first retention area is non-circular. ‘9. The manufacturing method of the silver contact fixing structure of the conductive sheet as described in item 7 of the scope of the patent application, wherein the horizontal section of the second retention area is non-circular. 10. The manufacturing method of the silver contact fixing structure of the conductive sheet according to item 7 of the scope of the patent application, wherein the horizontal section of the third retention area is non-circular. 1 1. The φ manufacturing method of the silver contact fixing structure of the conductive sheet according to item 7 of the scope of the patent application, wherein the horizontal cut planes of the first, second and third retention areas are all non-circular. 0 Page 13