TWI235387B - Electrically conductive composite particle and method for forming the same and application - Google Patents

Abstract

This invention discloses an electrically conductive composite particle which comprises a first structure with at least one non-conductive polymer, a second structure with at least one conductive polymer and at least one ionic stabilizer. The ionic stabilizer further comprises an ionic surfactant and a polyelectrolyte. This invention also discloses a method for forming the electrically conductive composite particle. This invention can be applied to fabricating conductive or metallic or anti-electromagnetic or antistatic materials/elements such as light emitting diodes, electrodes, anticorrosive paints, smart windows and capacitors.

Description

1235387 发明 Description of the invention: [Technical field to which the invention belongs] The present invention relates to—insulating conductive composite particles and methods and applications for forming the same, and particularly to one or more conductive composite particles having an ionic stabilizer. And its formation method and application. [Previous technology] Conjugated conductive polymers have conductive properties between semiconductors and metal conductors, and their potential applications are quite wide, such as: light-emitting diodes, conductive electrodes, anti-corrosion Tumen, speculative earth coat, k color ® households, capacitors, etc. Therefore, in recent years, many scholars have devoted great efforts to development and research. ', And * Yu: ^ member knife has a conjugated main chain structure, which causes its solubility in ordinary organic solvents to be very low and the melting temperature, which also makes its processing and mold production extremely difficult, so Limits the practical application range of co-conductive conductive polymers. In order to solve the above processing problems, an effective method is to prepare conductive polymers as stable colloids, especially using water as a continuous phase dispersion. Moon Dagger further reduces the use of organic solvents and reduces environmental pollution. Since the conductive polymer is a hard and brittle material, its film-forming properties and mechanical strength are usually poor. The most commonly used improvement method is to conjugate these The sex molecule is mixed with a general polymer. European patent application EP0589529 # shows a conductive core-shell latex and a preparation method thereof. The method is to adsorb a layer of a nonionic 13 1235387 type stabilizer on the surface of a polymer latex particle, and then, The outer shell absorbs another layer of conductive polymer to stabilize the polymer colloid and prevent coagulation from occurring, which can lead to the formation of Shen β. Sub-type stabilizers include pOlyOXyalkyi esters and polyoxyalkyl ethers, with molecular weights ranging from 500 to 5000 g / mol. However, the thickness of the conductive polymer in the shell needs to be between that of the non-ionic stabilizer stretched in the medium. In the length, if the content ratio of this conductive core-shell latex shell is too large, the thickness of the conductive polymer exceeds the non-ionic stabilizer layer, which will cause the latex particles to be unstable and coagulate. Relatively, if this conductivity The content ratio of the core-shell latex shell is too small, and the conductive layer is too thin, and the desired conductivity may not be obtained. The uncovered conductive latex is used for electromagnetic wave shields, antistatic coatings, etc. 0 In addition, French patents Application FR 2616790 describes a polymer core particle surrounded by a conductive polymer shell.

The daughter core ~ includes alkyd resin, acrylate resin, polyurethane, etc. The conductive core-shell particle dispersion disclosed therein is used for conductive coating, but the doping group exists on the surface of the polymer core particle, and the latex particles are extremely easy Agglomeration and sedimentation under the influence of reaction conditions, such as during the oxidative polymerization of shell monomers or the addition of ionic compounds such as oxidants, can easily cause system instability. In view of this, it is still necessary to develop new manufacturing methods of conductive composite particles to form more stable conductive composite particles and provide a simpler 14 1235387 process' to meet the needs of the industry. [Summary of the Invention] In the above background of the invention, in order to provide a simpler process disc to form more stable conductive composite particles, the present invention provides a new type: conductive composite particles and methods and applications for forming the same, in order to meet the industrial requirements = = Find. One object of the present invention is to produce a stable conductive composite particle. The present invention can use at least one water-soluble ionic stabilizer in an aqueous phase system to stabilize the first structure of at least one non-conductive polymer. It can also be polymerized in an aqueous medium to form a polymer with one of the following: one of the least conductive polymers—the first structure. This process is relatively simple and can be performed in an aqueous system. Therefore, there are no shortcomings such as volatile agents and pollution. ° Another object of the present invention is to form a basic conductive material, for example, a conductive thin film made by a solution front method or a molten aluminum method or directly coated on a non-conductive substrate to manufacture a conductive substrate #. The technology can be applied to the manufacture of disc components with materials such as conductivity, metallization, anti-electromagnetic interference, and antistatic properties, such as: light-emitting diodes, conductive electrodes, anti-corrosion coating , Color-changing windows, and capacitors. Therefore, the present invention can meet economic benefits and industrial applicability. According to the above-mentioned purpose, the present invention does not disclose a conductive composite particle, a method for forming the composite particle, and an application thereof. The V composite particle includes a 15 1235387 structure having at least one non-conductive polymer, having The second structure of at least one conductive polymer and at least one ionic stabilizer. The ionic stabilizer further includes an ionic surfactant and a polyelectrolyte. In addition, the present invention also discloses a method for forming conductive composite particles and its application. [Embodiment] The direction explored by the present invention is a kind of conductive composite particles, and its formation method and application. In order to fully understand the present invention, detailed process steps or groups will be proposed in the following description. The implementation of the present invention is not limited to the field of conductive composite particles. The steps are not described in fine iridium, chopped from the 4th King of Spears, and · Tian Jizhong to avoid causing this system. The preferred embodiment of the present invention is described in detail in addition to the unnecessary filial piety and good consistency. 'The present invention can also be used in this embodiment, and the r of the present invention is not "^" The actual circumference shall prevail. The dry circumference is not limited. The following patents are in the present invention-the first embodiment, the main composite particle, which is to provide a conductive b conductive composite particle including :, conductive The first structure of the polymer has a second structure with up to / and at least one species. This second structure is formed from two or more highly conductive structures on the surface. Ionic eight-type surface active agent 4 ά f " Surface active agent, this ion is stabilized by static bond ㈣L 16 1235387 The structure of the conductive composite particle, wherein the surface and at least one ion _ a 孓 第 —structure table As for the surface of an ionic surfactant, the conductive composite particles can be expected in one solvent and two liquid solutions. Among them, the above-mentioned solvent further includes an aqueous solution. :: One: The liquid dispersion can be processed by a film-forming process. In order to form-conductive thin; people: the dispersion range is more inclusive-soluble Liquid coating method. In addition, the conductive complex process is used to form a conductive thin film, and the film-forming process here is even more! Contains one: = method. The above-mentioned manufacturing method of the conductive composite particles includes a combination process to mix the first structure And at least one ionic interface active in a solvent and make the ionic interface active _ the surface of the first structure is bonded by electrostatic attractive force, thereby stabilizing the first structure and forming a stable night-medium The absolute range of the tower potential is greater than about 10 mV, its preferred range is greater than about 20 mV, and its optimal range is greater than about 30 mV. In this embodiment, the first structure described above is implemented by at least one type of aggregation unit. Polymerized, wherein at least one of the above-mentioned polymerization units includes one of the following groups: alkyl acrylates, alkyl methacrylates, ethylene monomers (eg, styrene, α-alkylstyrene, ethyl acetate Esters, ethylene gas, digas ethylene, acrylonitrile, methacrylonitrile, divinyl) and unsaturated compounds containing a radical (such as Lu-Ethyl Acrylic Acid) Propylpropene g purpose, via propylmethacrylic acid vinegar), and at least one of the above-mentioned polymerized units further comprises a polymer. 17 1235387 On the other hand, the above-mentioned second structure is polymerized by at least one polymerized unit, wherein At least one of the above-mentioned polymerization units includes one of the following groups: aniline (-), pyrrO10, UhiOphene, furan, acetyiene, benzyl sulfur (Phenylene sulfide) and its derivatives and at least one of the above-mentioned polymerization units further include an agglomerate. In this embodiment, when the above-mentioned ionic surfactant is a reduced-type surfactant, its hydrophobic end is It is from C2 to C2. One of the group consisting of courtyard, burned aryl and alkenyl, and anionic interface: The hydrophilic end of the agent is sulfate, continuous acid, Wei root, polyethylene oxide sulfate, Polyoxyethylene phosphate and _ with an anionic group:-Group:-Among the above, the above-mentioned salts are one of the group consisting of cardiophosphine and secondary amine salts ; Report the above ionic interface activity It is a cationic surfactant, and the 2 water end is the one of the group consisting of c4 to p I we, a C20 alkyl group, an alkyl group, and an alkenyl group, and the parent group of the cationic surfactant and The above-mentioned ionic surfactants in the group consisting of cationic groups and salts further include an amphoteric 2 On the other hand, if the conductive composite particles produced include the first structure of polyethylene, one and /, There is a kind of ionic interface. The structure and at least the ionic interface = the thickness of the second structure will increase as the chain length of the hydrophobic end of the surfactant increases. 18 1235387 In this embodiment, the first junction-type mesostructure of this conductive proton, and the activity of the exon-type meso-type interface are further supported in this embodiment—a better conductive composite particle. A better conductive composite particle includes: A first parlor with at least one non-polymer. A second structure is formed by a polymerization reaction on the surface of the structure with an at least one highly conductive-,-structure. The hydrophilic end of the first off-surface active U is The first measure is bonded by electrostatic attraction, the first ion

The hydrophobic end of t " surfactant is extended to the first junction side of the diionic surfactant, and the hydrophobic end of the second off-surface surfactant is formed by the "water" of the ionic interface. And the hydrophilic end of the second ionic surfactant is extended to the outside of the first structure to stabilize the structure of the conductive composite particles. The above-mentioned first ionic surfactant may be equivalent to the second ionic surfactant.

In a second embodiment of the present invention, a conductive composite particle is mainly provided. The conductive composite particle includes: a first structure having at least one non-conductive H-knife; one having at least one conductive high score ... The second structure is formed on the surface of the first structure by a polymerization reaction with at least one polyelectrolyte. The polyelectrolyte is bonded to the first structure by electrostatic attraction to stabilize the conductive composite particles. On the other hand, the conductive composite particles can be suspended in a solvent to form a liquid. The above-mentioned solvent further includes an aqueous solution. Secondly, the dispersion liquid can be formed into a conductive thin film by a film forming process, and the film forming process here includes a solution coating method. In addition, the conductive composite particles can be formed into a conductive thin film by a film-forming process, and the film-forming process here further includes a melt die-casting method. In the present embodiment, the above-mentioned first structure is formed by polymerization of at least one polymerization unit, wherein the at least one polymerization described above includes one of the following groups: Acrylic acid purpose, ethylene monomers (such as styrene ethyl roast, alpha-ethyl styrene, ethyl acetate, vinyl chloride, digas, acrylonitrile, methacrylonitrile, divinyl) and hydrocarbon groups Unsaturated compounds (such as f via ethyl acrylate, H via ethyl methyl acrylate, via propyl acrylate, via propyl methacrylate), and at least one of the above-mentioned polymerization units further includes a compound: . In another aspect, the above-mentioned second structure is formed by polymerizing at least one polymerization unit, wherein the at least one polymerization unit includes one of the following groups: aniline, pyrrole, and thiophene. ), Furan, acetyiene, phenylene sulfide, and derivatives thereof. Furthermore, at least one of the above-mentioned polymerization units further comprises an oligomer. In this embodiment, when the above-mentioned polyelectrolyte is an anionic polyelectrolyte, it is one of the group consisting of polymers including amidine, sulfonate, phosphate, and organic phosphate; when the above-mentioned The polyelectrolyte is a cationic polyelectrolyte, which is a polyamine, a cationic modified polypropylene containing amines 20 1235387, and a cationic modified containing qUaternized amines. One of the groups consisting of propane, polyethylenimine and poly (diallyl dimethyl ammonium chloride). In a third embodiment of the present invention, a material f having at least one non-conductive polymer is first provided, and then, a mixing process is performed to mix the material having at least one non-conductive polymer with at least one ion. The surface-active agent is in a solvent, and the solvent further includes an aqueous solution. The purpose of the above mixing procedure is to bond the surface of a material having at least one non-conductive polymer by the electrostatic attractive force of the ionic surface active agent, and thereby stabilize the material having at least one non-conductive polymer. And a forming-stabilizing solution, wherein the surface of the above-mentioned material having at least one non-conductive polymer is opposite to that of at least one ionic surfactant. Moreover, the concentration range of the at least one ionic surfactant in the above-mentioned stabilizing solution is about L to five times the critical micelle concentration of at least one ionic surfactant. The absolute value of the Jetta potential of the above-mentioned stabilizing solution is greater than about 1 OmV, which is about 20 mV larger than that of Ququanjiaquan, and the optimal range is about 30 mV. After the mixing process is completed, at least one conductive polymer polymerization unit and at least one green chemical assistant are added to the stabilization solution so that at least one conductive polymer polymerization unit 7L flatly undergoes a polymerization reaction and forms conductive composite particles. 21 1235387 In this embodiment, when D. + · —— 7 ionic surface active agent, ... ΓΓ sub-type surface active agent is Yin Guan feces, and /, water end system is C4 to c20 alkyl, One of the eighty-two groups consisting of stilbene and alkenyl. The above anionic type: the hydrophilic end of the active agent is one of the group consisting of sulfate, dibasic acid, discic acid, polyvinyl sulfate, polyethylene oxide phosphate, and salts having anionic groups. The eight dry salts mentioned above are tested in a group consisting of metal rhenium, ammonium salts and tertiary amine salts. If the above-mentioned ionic surfactant is a cationic surfactant, its hydrophobic end is For those who belong to the courtyard group, burned aryl group and dilute base group. The hydrophilic end of the above-mentioned cationic surfactant is one of the EG group composed of a cationic group and a salt of the cationic group. In addition, the above-mentioned ionic surfactant further includes an amphoteric interface activity. Agent. In this embodiment, the at least one conductive polymer polymerization unit includes one of the following groups: aniline, pyrrole, thiophene, furan (such as buckle), acetylene, phenyl Sulfur (phenylene sulfide) and its derivatives, in which at least one of the above-mentioned conductive polymer polymerization units further comprises a ~ polymer. In addition, at least one of the above-mentioned chemical additives is one of the following groups: potassium persulfate (K2S208), ammonium persulfate [(NH4) 208], sodium persulfate (Na2S208), Other persulfates, sodium perborate (NaB〇3), hydrogen peroxide (h2O2), NOBF4, NO2BF4, 22 1235387 NO2PF6, NOC104, NOAsF6, NO2PF6, bromine 4 iron (FeBr3) , Iron hexahydrate gas (FeCIs · 6H2O), copper sulfate (CuSCU), iron nitrate nonahydrate [Fe (N〇3) 3. 9H2〇], copper hydrate gas (CuCl2 · 2H2O), potassium ferricyanide [K3Fe (CN} 6], copper nitrate [Cu (N03) 2], Fe (BF4) 3, ferric acid nonahydrate [Fe (Cl〇4) 3 · 9H2〇], pentahydrate

Ferric sulfate [Fe2 (S04) 3 · 5H2〇], Fe2 (SiF6) 3, Perchloric acid steel [Cu (C104) 2], Cu (bf4) 2, CuSiF6. The molar ratio of the amount of the at least one chemical additive mentioned above to the amount of at least one conductive polymer polymerization unit ranges from about 1:10 to 10.0 · 1, and the optimal ratio ranges from about 1: 3 to 3 : 1, and the excess of at least one chemical assistant can be removed by a procedure such as centrifugation after the polymerization reaction. In a fourth embodiment of the present invention, a material having at least one non-conductive polymer is first provided.

The polyelectrolyte is in -solvent +, and the solvent further comprises -aqueous solution. The purpose of this sequence is to bond the surface of a material with at least one non-conductive polymer by the electrostatic attractive force of the polyelectrolyte, and thereby stabilize the material with at least one non-conductive polymer f and Formation-stabilizing solution. The person adds at least one conductive polymer polymerization unit and at least one chemical aid to the stabilization liquid. The reaction solution is formed by at least one conductive polymer polymerization unit and forms conductive composite particles. In this example, the above-mentioned polyelectrolyte of Biata is anionic 23 1235387

"Electrolyte" is one of the group consisting of polymers containing ammonium amine, sulfonate, phosphate, and organic vinegar; when the above polyelectrolyte is also a cationic polyelectrolyte, it is a polyfluorene Polyamines, cationic modified polypropylene containing amines, modified cationic containing polyamines (qUat; ernized amines), polyethyieneimine and polydiamine One of the groups consisting of poly (diallyl dimethyl ammonium chloride). Second, the at least one conductive polymer polymerization unit includes one of the following groups: aniline, pyrrole, thiophene, fur an, ace tylene, phenyl Sulfur (phenylene sulfide) and its derivatives. At least one of the above-mentioned conductive polymer polymerization units further includes an oligomer. In addition, at least one of the aforementioned chemical additives is one of the following groups: potassium persulfate (K2S2O8), ammonium persulfate [(NHU) 2S2〇8], sodium persulfate (Na2S208), other persulfates, Sodium perborate (NaB〇3), hydrogen peroxide (H2O2), NOBF4, NO2BF4, No2PF6, NOC104, NOAsF6, No2PF6, iron bromide (FeBr3), iron hexahydrate gaseous iron (FeCl3 · 6H2O ), Copper sulfate (CuS〇4), iron nitrate nonahydrate [Fe (N03) 3 · 9H2〇], gasified copper dihydrate (CuCl2 · 2H2〇), potassium ferricyanide [K3Fe (CN) 6], nitric acid Copper [Cu (N03) 2], Fe (BF4) 3, iron peroxahydrate [Fe (Cl〇4) 3 · 9H2O], five 24 I235387 iron sulfate hydrate [Fe2 (S〇4) 3 · 5H2〇 ], Fe2 (SiF6) 3, peroxy acid surface 1 [Cu (Cl〇4) 2], Cu (BF4) 2, CuSiF6. The amount of the at least one chemical additive mentioned above and the summer mole ratio of the at least one conductive polymer polymerization unit range from about 1:10 to 10: 1, and the optimal ratio is about 1: 3 to 3: 1, and the excess of at least one chemical assistant can be removed by a procedure such as centrifugation after the polymerization reaction. In a fifth embodiment of the present invention, first, 10 ml of a polystyrene latex aqueous solution containing a 3 w 1: 0 / 〇 volume content is provided. Next, it was diluted to 20 ml with deionized water and the above diluted solution was acidified by adding an aqueous hydrochloric acid solution to a pH of about 0.7 to form a starting solution. Then, 20 ml of an aqueous solution of anionic surfactant containing 0.115 g of sodium dodecyl sulfonate (SDS) was added to the above-mentioned starting solution and a mixing procedure was performed. The mixing process is performed in a first temperature range, the first temperature range is about 0 to 10 ° c, and the preferred temperature range is it to 5 t. The above mixing process is performed for about 12 hours to form a Stabilizing fluid. After the mixing procedure is complete, add the 1.53 / z 1 aniline monomer solution to the above-mentioned stabilization solution and mix in the small-day temple. Finally, a solution containing 0.043 g of ammonium persulfate ^ was added to 10 mi to perform a polymerization reaction. The above-mentioned polymerization reaction is more inclusive.-The first step and the second step, the first step is performed within a first temperature range, and the second step is performed within a second temperature range. The temperature is approximately higher than the first temperature range. While 1, the first 25 1235387 step takes about 6 hours, and the first-Niu Le-step takes about 18 hours. After completing the above procedures, conductive composite particles can be manufactured. The conductive composite particles include: a first structure having polystyrene and a second structure having polyaniline. This second structure is formed by a polymerization reaction. On the surface of the first structure, it is combined with sodium dodecyl sulfonate (SDS), jl raft and y; and the first structure is bonded to the first structure by electrostatic attraction to stabilize the conductivity. The structure of the composite particles. In one sixth embodiment of the present invention, the aniline monomer solution was changed to an aqueous solution containing 0.1 g of ammonium persulfate aqueous solution. Under the conditions, the obtained conductive composite particle powder was ground and pressed into a tablet, and the measured conductivity was 209 x 60 ss / cm. In the seventh embodiment of the present invention, the anionic surfactant was changed to contain t 0.055g of water soluble sodium tetradec ^ sulfonate> 20min at night, aniline monomer solution of 15.3 / ^ and 0.0430g of persulfuric acid aqueous solution ιOMm other than the fifth embodiment Operating conditions, resulting conductivity The composite particle powder was ground and pressed into tablets, and the measured conductivity was 0%% S / cm. In the first embodiment of the present invention, the aniline monomer solution was changed to a solution containing 0.0215 g of ammonium persulfate in water. iomi, other operating conditions similar to those in the fifth embodiment, the obtained conductive composite particle powder was ground and pressed into a tablet, and the measured conductivity was 0i26 s / cm. 26 l235387 In the ninth implementation of one of the present invention In the example, the aniline monomer solution was changed to 9 · 18 // 1 and the aqueous solution containing 00258 g of persulfuric acid solution iomi, and other operating conditions were the same as those in the fifth embodiment. The obtained conductive composite particle powder was ground and pressed. The measured conductivity was 0.157 s / cm. In one tenth embodiment of the present invention, the aniline monomer solution was changed to 10 ml with an aqueous solution containing 0.043 g of ammonium persulfate, and the others were the same as the fifth embodiment. The operating conditions of the example, the obtained conductive composite particle powder was ground and pressed into a tablet, and the measured conductivity was 0162 s / cm. In an eleventh embodiment of the present invention, the aniline monomer solution was changed to 24.8 // 1 and an aqueous solution containing 0.0688 g of ammonium persulfate 1〇 1. Other operating conditions are the same as those in the fifth embodiment. The obtained conductive composite particle powder is ground and pressed into a tablet, and the measured conductivity is Q145 S / cm. In a twelfth embodiment of the present invention, the change is changed. The aniline monomer solution was 30.6 // 1 and 0.086 g of an ammonium persulfate aqueous solution 1 (3 guab. The other operating conditions were the same as those in the fifth embodiment. The conductive composite particle powder obtained was ground and pressed into tablets. The electrical conductivity is 0 115 s / cm. In a twelfth embodiment of the present invention, the anionic surfactant is changed to an aqueous solution containing 0.055 g of sodium tetradecyi sUlfonate. Mi, aniline monomer solution is 9 · 18 / ^ and 0. 0258 grams of ammonium persulfate aqueous solution ι〇m Bu other operating conditions as in the fifth embodiment, the resulting conductivity is 27! 235387 particles of powder after grinding After being thinned, the tablet was measured to have a conductivity of 1,0 6 S / cm. In a fourteenth embodiment of the present invention, the aniline monomer solution * is changed to 6.12 "; and the aqueous solution containing 0.0172 g of an ammonium persulfate solution is 0 'ml, and other operating conditions are the same as those of the fifth embodiment. The obtained conductive composite particle powder was ground and pressed into a tablet, and the measured conductivity was 2.69x1 ()-2 S / cm. In the above-mentioned embodiments of the present invention, the present invention discloses a kind of stable electrical conductivity. ± Composite particles and the method for forming the same, the present invention can use at least one water-soluble ionic stabilizer to stabilize the first structure having at least one non-conductive polymer in an aqueous phase system, and can also perform a polymerization reaction in an aqueous phase medium. To form a second sigma structure with at least one conductive polymer, this process step is quite simple and can be performed in an aqueous phase system, so there are no disadvantages such as solvent-free volatile and pollution. In addition, the present invention opens the way to solution Casting method or molten die-casting method is used to make conductive films or directly coated on non-conductive substrates to make conductive substrates. It can be seen that this technology can be applied to conductive, metallized, anti-electromagnetic interference, Manufacture of materials and components with antistatic properties, such as: light-emitting diodes, conductive electrodes, anti-corrosive coatings, discolored windows, capacitors, etc. Therefore, the invention can meet economic benefits and industrial applicability. As mentioned above, the present invention discloses a conductive composite particle, a method for forming the same, and an application thereof. The conductive composite particle includes a first structure having 28 to 235 387, a non-conductive polymer, and a vibrating ancient eight, The second structure of the W-guided knife and at least one ionic component refers to a μ. This ionizer further includes an ionic surfactant and a polyelectrolyte. In addition, the present invention also discloses a method for forming conductive composite particles. And: Application. Obviously, according to the description in the above embodiment, the present invention. + The amendments and differences of the evening. Therefore, it needs to be understood within the scope of the appended claims. In addition to the above detailed description, the present invention It can also be widely implemented in other embodiments. The above are only the present invention, and the preferred embodiments are not used to limit the patent application of the present invention. Scope: Any other equivalent changes or modifications made without departing from the spirit of the invention disclosed in the present invention should be included in the scope of the patent application described below.

29

Claims (1)

1235387 Patent application scope: A kind of conductive composite particles including:. = A first structure having at least one non-conductive polymer;-a second structure having at least one conductive polymer, The first structure is formed on the surface of the _th structure through a polymerization reaction; and ^ to ^ an ionic interface active agent, the ionic interface activity ... Second, the first structure is bonded by a static attractive bond In order to stabilize the structure of the conductive φ composite particles. The conductive composite particle according to claim 1 of the patent scope, wherein the surface of the first structure is opposite to the electrical property of the at least one ionic surfactant. 3. The conductive composite particles as described in item 1 of the patent scope, wherein the conductive composite particles of and can be suspended in a solvent to form a dispersion. Call 4-The conductive composite particles as described in item 3 of the scope of patent application, wherein the above-mentioned solvent further comprises a water phase solution. 5. The conductive composite particle according to item 3 of the scope of the patent application, wherein the dispersion liquid can be formed into a conductive thin film by a film forming process, and the 'the forming process further includes a solution coating method. 6 · The conductive composite particles according to item 1 of the scope of the patent application, wherein the above-mentioned conductive composite particles can be formed into a conductive 30 1235387 electrical thin film by a film forming process, wherein # & 7 如 Π * 丨The r " film process further includes a melt die casting method. For example, the conductive composite particles described in item 1 of the scope of interest, wherein the above-mentioned conductive composite particles include a mixing procedure to ... the first structure and the at least one ionic surfactant in a / In the medium, the ionic surface active agent is bonded to the surface of the first structure by electrostatic attraction, thereby stabilizing the first structure and forming a stable liquid. 8 As described in the seventh item of the patent scope of Shenying The conductive composite particles, in which the absolute value of the Jetta potential of the above-mentioned stabilizing liquid is greater than about 1 OmV 〇9. The conductive composite particles according to item 8 of the patent application range, wherein the absolute value of the above-mentioned Jetta potential The range of the fan garden is greater than 2OmV. 10. The conductive composite particles as described in item 1 of the patent application range, wherein the first structure described above is polymerized by at least one kind of polymerization unit. · 1 1 · As applied for patent The conductive composite particle according to the range of item 10, wherein the at least one polymerized unit further includes one of the following groups: an alkyl acrylate, an alkyl methyl dienoate, an ethylene monomer (such as Ethylene, α-alkylstyrene, ethyl acetate, ethylene gas, ethylene glycol, acrylonitrile, methacrylonitrile, divinylbenzene, and unsaturated compounds containing hydrocarbon groups (such as / 3-hydroxyethylpropane Dilute Sour Vinegar, Cold-Ethyl Methyl 31 1235387 Acrylic Tortoise, Ethyl Acrylate, Ethyl Acrylate, Ethyl Acrylic Acid). Application: As mentioned in item i 0 of the patent For conductive composite particles, the polymer units of v to evening include a polymerizer. 13. The conductive composite particles according to item i of the patent application, wherein the second structure described above uses at least one polymer unit 14. The conductive composite particle as described in item 13 of the Uli range, wherein at least one of the above-mentioned polymerization units includes one of the following groups: aniline (aniHne), .pyrroie , ThioPhene, fUran, aCetylene, Phenylene sulfide and their derivatives. The conductive composite particles as described in item 13 of the patent application scope, wherein At least one of the above polymerization units further comprises an oligomer. For the conductive composite particles described in paragraph ㈣i, the above-mentioned ionic surfactants are anionic surfactants. 17. The conductive composite particles according to item 16 of the patent application scope, wherein the above-mentioned anions The hydrophobic end of the surface-type surfactant is one of the group consisting of alkyl group, alkyl group, aryl group and alkenyl group. 18. The conductive composite particle according to item 16 of the patent application scope, wherein The hydrophilic end system of anionic surfactants is sulfate :, transacid, linate, polyoxyethylene thiosulfate, polyethylene oxide scale 32 1235387, and sulphonate with anionic groups. Among the groups 0 19. The conductive composite particle according to item 18 of the scope of application for a patent, wherein the above-mentioned salt is one of the group consisting of an alkali metal salt, an ammonium salt, and a tertiary amine salt. 2. The conductive composite particle according to item 1 of the Chinese Patent Application, wherein the ionic surfactant is a cationic surfactant. 21. The conductive composite particle according to item 20 of the patent application scope, wherein the hydrophobic end of the above-mentioned cationic surfactant is. 4 to. 2. One of the group consisting of alkyl, alkaryl and alkenyl. 22. The conductive composite particle according to item 20 of the scope of the patent application, wherein the hydrophilic end of the cationic surfactant is one of the group consisting of a cationic group and a salt of a cationic group. By. 23. The conductive composite particle according to item 1 of the scope of the patent application, wherein the ionic surfactant is an amphoteric surfactant. 24. A conductive composite particle, the conductive composite particle comprising: a first structure having at least one non-conductive polymer; a second structure having at least one conductive polymer; A polymerization reaction is formed on the surface of the first structure; a first ionic surface-active agent 'a hydrophilic end of the first ionic surface-active agent is bonded to the first structure by electrostatic attraction, so by 33 1235387, The hydrophobic end of the first-manifold-thousand-mile interface active agent extends to the outer side of the first place; and $ ,,,. A second ionic surfactant is constructed, the second ionic interface is active, the hydrophobic end connects the first ionic interface 'tongue = hydrophobic end' of the first ionic interface with affinity and the hydrophilic end of the second ionic surfactant向 《海 苐 一 社 M + / 丨 ,,. The structure extends outside to stabilize the conductive composite structure. 25. The conductive complex particles according to item 24 of the Chinese Patent Application, wherein the above-mentioned first ionic surfactant can be equivalent to the second ionic surfactant. 26. A conductive composite particle comprising: a first structure having at least one non-conductive polymer; a second structure having at least one conductive polymer, the first -The structure is formed on the surface of the first structure by a polymerization reaction, and at least one polyelectrolyte is bonded to the first structure by electrostatic attraction to stabilize the conductive composite particles. 2 7 4hi • The conductive composite particles described in item 26 of the scope of patent application, which can be suspended in a solvent to form a dispersion. 28. The conductive composite particle according to item 27 of the scope of the patent application, wherein the above-mentioned solvent further comprises an aqueous solution. 29. The conductive composite particle as described in item 27 of the scope of the patent application, the 34 1235387 dispersion can be formed into a conductive thin film by a film forming process, wherein the film forming process further includes a solution coating method. 30. According to the conductive composite particles described in the patent application No. 26, the conductive composite particles can be formed into a conductive film by a film forming process, wherein the film forming process further includes a melt die-casting method. . / 3 1 · The conductive composite particle according to item 26 of the scope of patent application, wherein the first structure described above is polymerized by at least one polymerization unit 0 to 32. The conductive composite particle according to item 31 of the scope of the patent application, wherein the at least one polymerized unit further includes one of the following groups: alkyl acrylate, alkyl methacrylate, ethylene monomer (Such as styrene, alkylstyrene, vinyl acetate, ethylene gas, digas ethylene, acrylonitrile, fluorenyl acrylonitrile, divinylbenzene) and unsaturated compounds containing hydrocarbon groups (such as hydroxyethyl acrylate, Call a hydroxyethylmethacrylate φ acrylate, hydroxypropyl acrylate, hydroxypropyl fluorenyl acrylate 33. The conductive composite particle according to item 31 of the patent application scope, in which at least one of the above polymerized units is more Contains a polymer. 34. The conductive composite particle according to item 26 of the patent application, wherein the second structure is polymerized by at least one kind of polymerization unit.-35. The conductive composite particle according to the item, wherein at least one of the above-mentioned polymerized units in 35 1235387 includes one of the following groups: aniline, pyrrole, and thiophene (thiophene), furan, acetylene hydrazone, phenylene sulfide, and derivatives thereof. 36. The conductive composite particle according to item 34 of the scope of patent application, wherein the at least one polymerized unit further includes One polymer. 37. The conductive composite particle according to item 26 of the patent application, wherein the polyelectrolyte is an anionic polyelectrolyte. 38. The conductive composite particle according to item 37 of the patent application. Among them, the above-mentioned anionic polyelectrolyte is one of the group consisting of polymers including ammonium amine, sulfonate, phosphate and organic phosphate esters. 39. Conductive composite as described in item 26 of the scope of patent application Particles, in which the above-mentioned polyelectrolyte is a cationic polyelectrolyte. 40. The conductive composite particle according to item 39 in the scope of the patent application, wherein the above-mentioned cationic polyelectrolyte is polyamine and contains an amine group (Amines) cationic modified polypropylene, quaternized amines containing cationic modified polypropylene, polyethyleneimine (polyol neirnine) and one of the groups consisting of poly (allyl dimethyl ammonium chloride). 4 1 · A method for forming conductive composite particles, the conductive composite The method for forming the particle 36 1235387 includes: k for a material having at least one kind of non-conductive polymer; and performing a mixing procedure to mix the material disc having the road + polymer to # kinds of non-conductive properties mountain-¾ ionic interface The active agent makes the ionic interface active agent attract by static electricity; has: at least-the surface of a material of non-conductive polymer, and two: the stable has a non-stable liquid; Material and formation — At least one conductive polymer polymerization unit and at least one chemical polymer are added to the stabilization liquid so that at least one of the conductive polymer polymerization precursors is polymerized and reacted to form the conductive composite particles. 42. The method for forming conductive composite particles according to item 41, Jg, and ㈤ of item 41 of the patent application scope, wherein the surface of the above-mentioned material and a non-conductive polymer is + The electrical properties of the at least one ionic surfactant are opposite. 43. The method for forming conductive composite particles according to item M in the scope of the patent application, wherein the above-mentioned solvent further comprises an aqueous solution. 44. The method for forming conductive composite particles as described in item 41 of the scope of the patent application, wherein the concentration range of the at least one ionic surfactant in the stabilizer solution is about the same as that of the at least one ionic surfactant Critical micelle concentration is one to five times. 37 1235387 4 5. According to the method for forming the conductive composite particles described in item 41 of the scope of the patent application, _ 甘!-'J.' V ，, the absolute value of the Jetta potential of the stable liquid is greater than about 10 mV. * The method for forming conductive composite particles as described in item 45 of the scope of patent application, wherein the absolute value of the above-mentioned Jetta potential is 20 mV. 47. The method for forming conductive composite particles according to item 41 of the scope of the patent application, wherein the above-mentioned ionic surfactant is an anionic surfactant. 48. The method for forming the conductive composite particles as described in the bamboo item in the patent application, wherein the hydrophobic end of the above-mentioned anionic surfactant is. 4 to. 2. One of the groups consisting of alkyl, alkaryl, and alkenyl. 49. The method for forming conductive composite particles as described in item 47 of the patent, 'wherein the hydrophilic end of the above-mentioned anionic surfactant is a sulfate', a continuous acid, a phosphate, a polyoxyethylene sulfate, One of a group consisting of polyoxyethylene phosphate and a salt having an anionic radical. 50. The method for forming the conductive composite particles according to item 49 of the scope of the patent application, wherein the above-mentioned salts are one of a group consisting of an alkali metal salt, an ammonium salt, and a tertiary amine salt. 51. The shape of the conductive composite particles as described in item 41 of the scope of application for a patent 38 I235387 ::: Sex: a ... • If you apply for a special guide to escape, Bu 4, human-made method, wherein the above cationic type C4 to c20 alkyl, alkaryl groups of the particles are combined at the interface. 3 and & Guided M & Humans, Uniform Composite Particles Method, wherein the above-mentioned positive ion is limited to the hydrophilic end of the surfactant being one of the group T consisting of a% ionic group and a cationic group φ 1 head. The surface active agent of the conductive composite particles is an amphoteric mesial surface. 54. The method according to item 41 of the application for a patent, wherein the above-mentioned ionic surfactant. 5. The shape of the conductive composite particles as described in item 41 of the scope of patent application A method in which at least one of the above-mentioned conductive polymer polymerization units includes one of the following groups: aniline. Pyrrole, thiophene, furan, acetylene, phenylene sulfide, and derivatives thereof. 56. The method for forming conductive composite particles according to item 41 of the scope of the patent application, wherein the at least one conductive polymer polymerization unit further includes an oligomer. 39 1235387 57. The method for forming conductive composite particles as described in item 41 of the scope of patent application, wherein at least one of the above chemical additives is one of the following groups: * Persulfate discharge (K2S2O8), ammonium persulfate [ (ΝΗ4) 2S2〇8], sodium persulfate (Na2S2 0), other persulfates, sodium persulfate (NaB〇3), hydrogen peroxide (H2O2), NOBF4, NO2BF4, No. 2PF6, NOCl〇4, NOAsF6, no2pf6, iron desertification (FeBr3), iron hexahydrate gasification (FeCl3 · 6H2〇), steel sulfate (CuS04), iron nitrate nonahydrate [Fe (N〇3) 3 · 9H20 ], Copper dihydrate gaseous (CuCl2 · 2H2〇), potassium ferricyanide [K3Fe (CN) 6], copper lithiarate [Cu (N03) 2], Fe (BF4) 3, ferric acid nonahydrate, [Fe (Cl〇4) 3 · 9H20], iron sulfate pentahydrate [Fe2 (s〇4) 3 · 5H20], Fe2 (SiF6) 3, copper perchlorate [Cu (Cl〇4) 2], Cu ( BF4) 2, CuSiF6 〇5 8 · A method for forming conductive composite particles, the method for forming conductive composite particles H includes: providing a material having at least one non-conductive polymer; performing a mixing procedure to Combine the material with at least one non-conductive south molecule and at least one polyelectrolyte in a solvent so that the polyelectrolyte bonds the surface of the material with at least one non-conductive polymer by electrostatic attraction, and thereby Stabilize the material with at least one non-conductive polymer and form a stabilizing liquid; and 40 1235387 add at least one conductive polymer polymerization unit and at least one chemical assistant to the stabilizing liquid to make at least one conductive polymer polymerize The unit a undergoes a polymerization reaction to form the conductive composite particles. • The method for forming conductive composite particles according to item 58 of the scope of the patent application, wherein the above-mentioned solvent further includes an aqueous solution. 60. The method for forming conductive composite particles according to item 58 of the patent application, wherein the polyelectrolyte is an anionic polyelectrolyte. 6 1 · The method for forming conductive composite particles according to item 60 of the scope of the patent application, wherein the above-mentioned anionic polyelectrolyte is composed of a polymer having amidine, sulfonate, phosphate, and organic phosphate One of the ethnic groups. 62. The method for forming conductive composite particles according to item 58 in the scope of the patent application, wherein the polyelectrolyte is a cationic polyelectrolyte. 63. The method for forming conductive composite particles according to item 62 of the scope of the patent application, wherein the above-mentioned cationic polyelectrolyte is polyamine, and a cationic modified polypropylene containing amines , A group consisting of cationic modified polyacrylamide containing quaternized amines, polyethyleneimine and poly (dialyl ammonium chloride) One of them. 64. The method for forming conductive composite particles according to item 58 in the scope of the patent application, wherein the at least one conductive polymer polymerization unit package 41 1235387 includes one of the following groups: aniline (aniHne (thiophene), .furan ), Pyrrole, furari, acetylene, phenylene sulfide and derivatives thereof. 65. The method for forming conductive composite particles according to item 58 in the scope of the patent application, wherein the at least one conductive polymer polymerization unit further includes an oligomer. 66 · The method for forming conductive composite particles as described in item 58 of the scope of the patent application, wherein at least one of the above chemical additives is one of the following groups: · Persulfuric acid (K2S2O8), ammonium persulfate [(NH4 ) 2S2〇8], sodium persulfate (Na: 2S208), other persulfates, sodium peroxidase (NaB03), hydrogen peroxide (H2O2), NOBF4, N02BF4, NO2PF6, NOCIO4, NOAsFe'NO2PF6, desert Iron (FeBf3), iron hexahydrate (FeCl3 · 6H20), copper sulfate (CuS〇4), iron nitrate nonahydrate [Fe (N〇3) 3 · 9H20], copper dihydrate gas (CuCh · 2H2) 〇), potassium ferricyanide [K3Fe (CN) 6], copper nitrate [Cu (N03) 2], Fe (BF4) 3, iron peroxyacid nonahydrate [Fe (Cl〇4) 3 · 9H2〇], Ferric sulfate pentahydrate [Fe2 (S〇4) 3 · 5H20], Fe2 (SiF6) 3, copper peroxyacid [Cu (Cl〇4) 2], C ι (BF 4) 2, C u S i F 6 0 42