1235240 捌、發明說明： 【發明所屬之技術領域】 本發明係有關一種瞬時耦合感測板偵測電路板電路狀態之方法， 尤指一種可偵測細小電路板上之電路狀態之方法，其主要係在感測板 表面依據電路板上分佈之待測端點位置製作成一相對應之感應線圈囷 形而可有效偵測該細小電路板上之線路狀態是否正常之方法。 【先前技術】 在現今邁入電子科技的時代中，各種電子元件的應用已越來越廣 泛，其中印刷電路板可說是任何電腦或自動控制機械上所不可或缺的 元件。然而隨著科技的日新月異，現今的電路板製作已有越來越小的 鲁 趨勢，由於大部份電路板上都有許多複雜的電路，因此在針對這些電 之狀態進行偵測其是否有斷路或損壞時，常會發生操作上的困難。 以往電路板之偵測主要係利用探針直接插入電路板之待測點以進行摘 測，然而，在偵測極細小之電路板線路時，因為電路板待測點上之電 路及其間隙過於微小，因此無法直接將探針插入電路板之待測端點内 偵測，又如果要製造足以插入該種細小電路板上線路之探針，不但造 價昂貴費時，而且探針内部之元件(例如彈簧）也有製造上的困難。意 即傳統電路板之偵測方式並無法解決現今極細小電路板之測試問題。 中華民國公告第357265號發明專利揭示一種專門針對半導體測試而研 發之探針測試卡，如第一圖（A)(B)所示者，其主要係在一氧化鋁或環 · 氧,脂製成之基板(a)上形成凹狀部份(ai)，一探針膜(b)黏附於基板 (a)底面，該探針膜係由樹脂膜(bl)及導電膜(b2)組成，且由銅或鎳製 成之導電膜(b2)係疊置於樹脂膜(bl)上而形成探針圖形。將探針圖形 導電膜(b2)圖形化形成複數細長線延伸至樹脂膜(μ)底面，探針囷形 (b2)頂部藉由軟焊形成一隆起部(b3)以便與待測半導體元件之電極接 觸，該隆起部(b3)以外之探針圖形(b2)表面上係塗覆一絕緣樹脂膜(c) 者。又基板(a)内設有貫穿孔⑷，探針圖形⑽)藉由該貫穿孔⑷導通 並連接至基板頂面之互接圖形(e),而互接圖形(e)則連接至外部之量 測設備者。此種探針測試卡雖可測試諸如半導體元件上之細小電路， 1235240 惟其將探針圖形製作成複數細長延伸線而形成探針功效之方式極為複 雜’製造不易，無形中增加了製造成本及時間，因此仍有進一步改良 之空間。 【發明内容】 本發明「瞬時耦合感測板偵測電路板電路狀態之方法」之主要設 計目的係在提供一種可偵測極細小電路板上電路狀態之方法，其主要 係在感測板表面依據電路板上分佈之待測端點位置製作成相對應之感 應線圈圖形，將電路板之待測端點置於該相對應之感應線圈圖形上， 藉由探針將一信號經待測電路板傳至其與感測板相接合處而產生一微 小電容值，再藉由輸出端探針緩衝放大並傳送至偵測機器判讀而可精 確偵測細小電路板電路狀態之方法。 · 【實施方式】 請參閱第二圖及第三圖，本發明係有關一種「瞬時耦合感測板偵 測電路板電路狀態之方法」，該感測板(1)係由一印刷電路板製成，其 表面先依據待測電路板(2)上分佈之待測端點（21)位置設製一感應線 圈焊接區（11)，然後在該感應線圈焊接區（11)内依照該待測電路板(2) 上分佈之待測端點（21)位置製成相對應之感應線圈圖形（12)，而感測 板(1)表面其餘部份則塗敷一絕緣膠膜(13)或防焊漆以便絕緣者。該感 ^應線圈圖形（12)上相對於電路板(2)上待測端點（21)處係設有導通孔 (14)，感測板(1)背面則設有與該導通孔(14)連接之觸點（15)，又電路 鲁 板(2)之待測端點（21)處亦設有導通孔(22)，其背面則設有與該導通孔 (22)連接之觸點(23)者。 :本發明之實施方式及步驟，請參閱第四圈及第五圊之實施例及流 程圖。首先將電路板(2)上之待測端點（21)置於感測板（1)上相對應之 感應線圈圖形（12)上’再將感測板(1)藉由其固定孔（ΐβ)定位於機台 上，利用電容原理，藉由輸入端之探針(3)接觸電路板(2)背面與待測 端點（21)相導通之觸點（23)，將一信號經該待測電路板(2)傳至其與感 測板(1)之接合處而產生一微小電容值，再經由與感測板（1)背面之觸 點（15)接觸之探針(3)緩衝放大並傳至輸出端機器判讀，如此即可精確 1235240 偵測細小電路板上之線路是否正常。第六圖所示係本發明之感測板〇) 與偵測主機連接後，偵測電路板電路所顯示之比較圖，在顯示圖上方 之線條表示標準值，下方線條代表測試值，若兩線條平行或在容許範 圍内略為波動則發出信號表示電路正常，反之，若測試值超過容許範 圍，則表示電路板上之電路不良或損壞。 在進行偵測之前，需檢查感測板(1)上之絕緣薄膜(13)或防焊漆是 否刮損，並確定電路板（2)及感應線圈圖形（12)之尺寸不可小於 70Xl00/zm ’以避免>(貞測層發生變化而產生錯誤憤側，且感應線圈圖 形尺寸S電路板上之待測端點分佈尺寸^感測板感應線圈焊接區尺 寸。 綜上所述，本發明「瞬時耦合感測板偵測電路板電路狀態之方法」 可解決傳統電路板測試方法無法有效偵測細小電路板之缺點，且其操 作方式簡易確實，實為一結合新穎性與實用性之發明，並可有效應用 於產業上，故爰依法向鈞局提出發明申請，盼審查委員能早曰審理本 案並賜准專利為禱。 【圖式簡單說明】 第一圖（A)(B)係一半導體探針測試卡之剖視及平面圖； 第二圖係本發明「瞬時耦合感測板偵測電路板電路狀態之方法」 ，之感測板立艘圖； 第三囷係本發明之感測板偵測電路板電路狀態之側面剖視圖； 第四圖係應用本發明之感測板偵測電路電路狀態之實施例示意 圖；， .第五圖係本發明偵測電蹲板電路狀態之流程圖； 第六圖係本發明之感測板與偵測判讀主機連接後偵測電路板電路 狀態所顯示之比較圖。1235240 发明 Description of the invention: [Technical field to which the invention belongs] The present invention relates to a method for detecting a circuit state of a circuit board by a momentarily coupled sensing board, and particularly to a method for detecting a circuit state of a small circuit board. It is a method of making a corresponding inductive coil shape on the surface of the sensing board according to the positions of the tested endpoints distributed on the circuit board, which can effectively detect whether the state of the circuit on the small circuit board is normal. [Previous technology] In the era of electronic technology, the application of various electronic components has become more and more widespread. Among them, printed circuit boards can be said to be indispensable components of any computer or automatic control machinery. However, with the rapid development of technology, today's circuit board manufacturing has become smaller and smaller. Because most of the circuit boards have many complicated circuits, it is necessary to detect whether there is a circuit break in the state of these electricity. When damaged or damaged, operational difficulties often occur. In the past, the detection of circuit boards mainly used probes to directly insert the points to be tested on the circuit board for testing. However, when detecting very small circuit boards, the circuit and the gap at the points to be tested on the circuit board were too large. It is small, so you cannot directly insert the probe into the test endpoint of the circuit board for detection. If you want to make a probe that is enough to insert the circuit on the small circuit board, it is not only expensive and time-consuming, but also the components inside the probe (such as (Spring) also has manufacturing difficulties. This means that traditional circuit board detection methods cannot solve today's very small circuit board testing problems. Republic of China Announcement Patent No. 357265 discloses a probe test card specially developed for semiconductor testing, as shown in the first figure (A) (B), which is mainly made of alumina or epoxy A concave portion (ai) is formed on the completed substrate (a), and a probe film (b) is adhered to the bottom surface of the substrate (a). The probe film is composed of a resin film (bl) and a conductive film (b2). The conductive film (b2) made of copper or nickel is stacked on the resin film (bl) to form a probe pattern. The probe pattern conductive film (b2) is patterned to form a plurality of elongated lines extending to the bottom surface of the resin film (μ), and the top of the probe pin (b2) is soldered to form a bump (b3) so as to communicate with the semiconductor device to be tested. The electrodes are in contact, and the surface of the probe pattern (b2) other than the raised portion (b3) is coated with an insulating resin film (c). The substrate (a) is provided with a through hole ⑷, and the probe pattern ⑽) is connected through the through hole ⑷ to the interconnection pattern (e) on the top surface of the substrate, and the interconnection pattern (e) is connected to the outside. Measuring equipment. Although this type of probe test card can test small circuits such as semiconductor devices, 1235240, but the method of making the probe pattern into a plurality of elongated extension lines to form the function of the probe is extremely complicated. 'It is not easy to manufacture, which increases the manufacturing cost and time. , So there is still room for further improvement. [Summary of the Invention] The main design purpose of the "method for instantaneously coupling a sensing board to detect the circuit state of a circuit board" is to provide a method that can detect the circuit state of a very small circuit board, which is mainly on the surface of the sensing board. A corresponding induction coil pattern is made according to the position of the end point to be tested distributed on the circuit board, and the end point to be tested of the circuit board is placed on the corresponding induction coil pattern, and a signal is passed through the circuit under test by a probe. The board transmits a small capacitance value to the junction between the board and the sensing board, and then the output terminal probe is buffered to amplify and sent to the detection machine for interpretation to accurately detect the circuit state of the small circuit board. · [Embodiment] Please refer to the second and third figures. The present invention relates to a "method for detecting the circuit state of a circuit board by a momentarily coupled sensing board". The sensing board (1) is made of a printed circuit board. The surface of the induction coil is firstly provided with an induction coil welding area (11) according to the positions of the end points (21) distributed on the circuit board (2) to be tested, and then the induction coil welding area (11) is formed according to the test area. The positions of the tested endpoints (21) distributed on the circuit board (2) are made into corresponding induction coil patterns (12), and the rest of the surface of the sensing board (1) is coated with an insulating rubber film (13) or Solder paint for insulation. A through hole (14) is provided on the sensing coil pattern (12) relative to the end point (21) to be measured on the circuit board (2), and the back of the sensing board (1) is provided with the through hole ( 14) The connecting contact (15), and the test terminal (21) of the circuit board (2) are also provided with a via (22), and the back is provided with a contact connected to the via (22) Click (23). : For the implementation and steps of the present invention, please refer to the examples and flowcharts of the fourth and fifth circles. First place the end point (21) to be tested on the circuit board (2) on the corresponding induction coil pattern (12) on the sensing board (1), and then place the sensing board (1) through its fixing hole ( ΐβ) is positioned on the machine, using the principle of capacitance, the probe (3) at the input end contacts the contact (23) on the back of the circuit board (2) and the end point (21) to be tested, passing a signal through The circuit board to be tested (2) is transmitted to the junction between the circuit board (2) and the sensing board (1) to generate a small capacitance value, and then the probe (3) is in contact with the contact (15) on the back of the sensing board (1). ) The buffer is amplified and transmitted to the output machine for interpretation, so that the 1235240 can accurately detect whether the circuit on the small circuit board is normal. The sixth figure shows the sensing board of the present invention. 0) After connecting with the detection host, the comparison chart displayed by the detection circuit board circuit. The upper line of the display indicates the standard value, and the lower line represents the test value. If the lines are parallel or slightly fluctuate within the allowable range, a signal is issued to indicate that the circuit is normal. Conversely, if the test value exceeds the allowable range, the circuit on the circuit board is defective or damaged. Before detection, check whether the insulation film (13) or solder mask on the sensor board (1) is scratched, and make sure that the size of the circuit board (2) and the induction coil pattern (12) is not less than 70Xl00 / zm 'To avoid > (The measurement layer changes to cause false side, and the size of the induction coil pattern S is the size of the end point distribution on the circuit board ^ the size of the induction coil welding area of the sensing board. In summary, the present invention "The method of detecting the circuit state of the circuit board by the instantaneous coupling sensing board" can solve the shortcomings of traditional circuit board testing methods that cannot effectively detect small circuit boards, and its operation method is simple and reliable, which is an invention combining novelty and practicality It can be effectively applied to the industry. Therefore, you have filed an application for invention with the Bureau in accordance with the law. I hope that the reviewing committee can hear the case and grant a patent as a prayer. [Simplified illustration of the drawing] The first picture (A) (B) is A sectional view and a plan view of a semiconductor probe test card; the second figure is a diagram of the method for detecting the circuit state of a circuit board by the instantaneous coupling sensing board of the present invention; the third is the sense of the present invention Test board detection circuit board power A cross-sectional side view of the state; the fourth diagram is a schematic diagram of an embodiment of a circuit state detection circuit using the sensing board of the present invention; the fifth diagram is a flowchart of detecting the circuit state of the electric squat board according to the present invention; the sixth diagram is this A comparison chart of the circuit state of the detection circuit board after the invention's sensing board is connected to the detection and interpretation host.