TWI234205B - Thin film forming apparatus, film supplier, film cassette, transport mechanism, process device and transport method - Google Patents

Thin film forming apparatus, film supplier, film cassette, transport mechanism, process device and transport method Download PDF

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Publication number
TWI234205B
TWI234205B TW92103759A TW92103759A TWI234205B TW I234205 B TWI234205 B TW I234205B TW 92103759 A TW92103759 A TW 92103759A TW 92103759 A TW92103759 A TW 92103759A TW I234205 B TWI234205 B TW I234205B
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Taiwan
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film
substrate
sheet
plate
arm
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TW92103759A
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Chinese (zh)
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TW200416882A (en
Inventor
Hideki Adachi
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Dainippon Screen Mfg
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Priority claimed from JP2001347427A external-priority patent/JP3751246B2/en
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Publication of TWI234205B publication Critical patent/TWI234205B/en

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Abstract

The present invention provides a compact thin film forming apparatus that is capable of efficiently forming a thin film onto a substrate adopting a sheet film, wherein within a process portion PP, a center robot 2 transports a sheet film F and/or a substrate W among a coating unit 3, a drying unit 4, a transfer printing unit 5 and a film-supplying unit 7, and a thin film is formed onto the substrate W adopting the sheet film F. As a result, forming a thin film by adopting the sheet film F is feasible without using an operator. In addition, the sheet film F is supplied to the process portion PP directly by disposing the film-supplying unit 7 onto the process portion PP, and whereby transportation efficiency of the sheet film F and throughput of the device are both capable of being enhanced.

Description

1234205 ” __Ά 92103759 年w 月 / 日 ^ 五、發明說明(1) 【發明所屬之技術領域】 本發明有關一種使用片膜在基板上形成薄膜之薄膜形 成裝置、可使用於該裝置之膜供給機構、膜收容g、搬運 機構、配置複數個處理單元之處理裝置及搬運方法。 【先前技術】 近年來’隨著使用於製造大型積體電路之晶圓之大口 徑化或液晶面板等之大面積化,而需要一種適合於大面積 之薄膜形成方法。再者,在大型積體電路製造技術中之多 層配線技術之領域,為實現多層配線,需要以高精密度將 絕緣膜之表面予以平坦化,所以,除了大面積化需求之 外’對於薄膜形成時之表面之平坦化技術之需求亦增高。 為了滿足此等需求,乃提案有一種以加壓轉印方法在基板 形成薄膜之薄膜形成技術。 此薄膜形成裝置,例如有日本專利特開2 〇 〇 1 - 1 3 5 6 3 4 號公報所公開之裝置。在該裝置中,以第1 8圖所示之薄膜 形成順序在基板上形成薄膜。首先,如第1 8圖(a )所示, 使形成於半導體晶圓或液晶面板用玻璃基板等之基板W表 面之電極配線1 1 1以面向上之方式載置於試料台。此處, 形成有電極配線1 1 1之表面1 1 2係作為以下述說明程序形成 薄膜之薄膜形成面。 其次,如第1 8圖(b )所示,在試料台上方相對向配置 之轉印板上裝設其表面預先形成有銀緣膜1 2 1之片膜F。在 此,絕緣膜1 2 1為用以轉印於基板狄义薄膜,此絕緣膜1 2 1 係對向配置在載置於試料台之基板W之薄膜形成面11 2。然1234205 ”__Ά 92103759 w month / day ^ V. Description of the invention (1) [Technical field to which the invention belongs] The present invention relates to a thin film forming device that uses a sheet film to form a thin film on a substrate, and a film supply mechanism that can be used in the device. , Film storage g, conveying mechanism, processing device with a plurality of processing units, and conveying method. [Previous technology] In recent years, with the increase in the diameter of wafers used for manufacturing large-scale integrated circuits or the large area of liquid crystal panels, etc. In order to realize multilayer wiring, it is necessary to flatten the surface of the insulating film with high precision in the field of multilayer wiring technology in large-scale integrated circuit manufacturing technology. Therefore, in addition to the need for large area, 'the demand for the planarization technology of the surface when the film is formed is also increasing. In order to meet these needs, a film formation technology for forming a film on a substrate by a pressure transfer method has been proposed This thin film forming apparatus is, for example, the apparatus disclosed in Japanese Patent Laid-Open No. 2000-1 3 5 6 34 In this device, a thin film is formed on a substrate in the thin film formation sequence shown in Fig. 18. First, as shown in Fig. 18 (a), a substrate formed on a semiconductor wafer or a glass substrate for a liquid crystal panel is used. The electrode wiring 1 1 1 on the W surface is placed on the sample table so as to face upward. Here, the surface 1 1 2 on which the electrode wiring 1 1 1 is formed is a film forming surface on which a thin film is formed by the procedure described below. Next, as As shown in FIG. 18 (b), a film F having a silver edge film 1 2 1 formed on the surface is mounted on a transfer plate disposed opposite to the sample table. Here, the insulating film 1 2 1 is used The film is transferred to the substrate, and the insulating film 1 2 1 is opposite to the film formation surface 11 2 of the substrate W placed on the sample table.

314408(修正版).ptc314408 (revised version) .ptc

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Mlt 92103759 1234205 五、發明說明(2) -- 往轉印板移•,使基板W與片膜F相抵接之後, Ϊ力乂至i )中之箭頭所示,相互施加負载-定時間,同 令力…、到基板職〗達預定之溫度。如此,挾 i2i並 使片膜F與基板w相密接而形成密接物。 、、’、巴、、’、 將如此形成之密接物從薄膜形成室取 圖(c)所示將片膜F予以剝離,則獲得如第 成有絕緣膜1 2 1之基板W。 【發明内容】 (發明所欲解決之課題) 然而,為了利用上述装置形成薄祺 An 1 v-r-i - — _. 曰 出,然後如第1 8 1 8圖(d)所示形 之基板從基板用!!取勝,需將轉印處理前 片膜F從膜用…,以塗於试二台,且需將未使用之 台。而且,於轉印處理後, 成裝置之轉印 絕f膜121將基板w與片膜F予以貼合之轉/ $密接物(藉由 取出,並藉由剝離裝置將片膜F從密 缚膜形成裝置 雖係在各裝置之間搬運、 以剝離。如此 業者手工搬運片膜F或基片板 情形成為生產量降低之主 一里效率不佳,而此 之片膜供給或操作(保持·搬運:::而期待-種有效率 膜之熱經散熱而造:Ϊ ^ : 則有片膜附著微粒塵埃或片 薄膜品質之降低以理等問題發生,更導致 設備需要廣大地板面積’亦有裝設相關 貝 < 問碭存在。為解決此等問題,片Mlt 92103759 1234205 V. Description of the invention (2)-After moving to the transfer plate, the substrate W and the film F are brought into contact with each other, as shown by the arrows in i). Order power ..., to the board position to reach the predetermined temperature. In this way, 挟 i2i brings the sheet film F into close contact with the substrate w to form an adherend. ",", ",", "", And taking the thus-formed adherend from the film forming chamber and removing the sheet film F as shown in Fig. (C), the substrate W having the insulating film 1 2 1 formed thereon is obtained. [Summary of the Invention] (Problems to be Solved by the Invention) However, in order to use the above-mentioned device to form a thin plate An 1 vri-— _. Name it, and then use the substrate from the substrate as shown in Fig. 1 (8) !! !! To win, the film F before the transfer process should be used from the film ... to apply to two test stations, and the unused station should be used. In addition, after the transfer process, the transfer insulation film 121 of the device converts the substrate w and the sheet film F into a tightly sealed object (by taking it out, and the sheet film F is tightly bound by the peeling device) Although the film forming device is transported between the various devices to be peeled off. Such a situation in which the operator manually transports the film F or the substrate board becomes the main cause of reduced production efficiency, and the film supply or operation (maintaining · Handling ::: And expecting-the heat of an efficient film is created by heat dissipation: Ϊ ^: Some problems such as the adhesion of particles to the film or the reduction of the quality of the film occur, and it also causes the equipment to require a large floor area. Installation related problems exist. To solve these problems,

1234205 卞 修正 案號 92103759 五、發明說明(3) 膜搬運之自動化為不可或缺’但以往並沒有適合於此自動 化之操作技術。 本發明有鑑於上述標題而研發者’其第丨目的在於提 供一種使用片膜而可有效率地將薄膜形成於基板之 之薄膜形成裝置。 再者’本發明之第2目的在於提供一種在使用片膜將 薄膜形成於基板之薄膜形成裝置中,無需藉由人工作即 可有效率地供給片膜之膜供給機構及膜收容g。 再者,本發明之第3目的在於提供一種在 將=形成於基板之薄膜形成裝置中,可用片膜而 板或片膜之搬運機構以及搬運方法。 M 4 (用以解決課題之手段) Μ 之薄膜形成裝置係具備有:於使用片膜而在基 u,工序部;#給基板至工序部之標引部;而為 達t上述弟1目的,工序部包括有··用以供給片膜之膜供 給裝置,在膜供給裝置所供认 g ' it二之塗布裝置;使已形成薄膜之片膜與標引 密接而形成密接物,以將薄膜轉印於基 置;將片膜從密接物予以剝離之剝離裝置,以 搬運片膜;裝/、塗布裝置、轉印裝置、及剝離裝置之間 、及/或基板之搬運裝置(申請專利範圍第1項)。 ,構成之發明,由標引部對於工序部供給基板之同 ^精搬運裴置而從設於工序部之膜供給裝置供給片 \ 而且在工序部中,片膜及/或基板係藉由搬運裝置1234205 卞 Amendment No. 92103759 V. Explanation of the invention (3) Automation of membrane handling is indispensable ', but there is no operation technology suitable for this automation in the past. The present invention has been developed in view of the above-mentioned subject, and its first object is to provide a thin film forming apparatus that can efficiently form a thin film on a substrate using a sheet film. Furthermore, a second object of the present invention is to provide a film supply mechanism and a film storage unit capable of efficiently supplying a sheet film without using a person's work in a film forming apparatus for forming a film on a substrate using a sheet film. Furthermore, a third object of the present invention is to provide a transport mechanism and a transport method for a sheet or a sheet that can be used in a thin film forming apparatus to be formed on a substrate. M 4 (means to solve the problem) The thin film forming device of M is provided with: a substrate and a process section in the use of a sheet film; a indexing section for the substrate to the process section; The process section includes a film supply device for supplying a sheet film, and a coating device recognized by the film supply device. The film film and the index are formed in close contact with each other to form a seal to form a film. Transfer on the base; peeling device that peels off the film from the adherend to carry the film; transfer device between the coating device, the coating device, the transfer device, and the peeling device, and / or the substrate (patent application scope Item 1). The invention of the constitution is that the indexing unit supplies the substrates to the process unit in the same manner as the substrates, and the wafers are supplied from the film supply device provided in the process unit. In the process unit, the film and / or substrate is transported by Device

第8頁 IVI1 314408(修正版)· ptc 1234205 五、發明說明(4) 在塗布裝置、轉印裝置、及剝離裝置之間進行搬運,以使 用片膜而將薄膜形成於基板。亦即,片膜會被搬運到塗布 裝置,而在片膜之表面形成薄膜之後,再搬運到轉印裝 置。在此轉印裝置中,除了片膜之外基板亦被搬送’且將 薄膜轉印於基板。最後,藉由剝離裝置將片膜予以剝離, 即完成將薄膜形成於基板。如此,在本發明中無需藉由人 工操作,即可進行使用片膜之薄膜形成。而且,在本發明 中,膜供給裝置係設置於工序部,而^膜係直接供給至工 序部,所以搬運效率高,可提升生產里。Page 8 IVI1 314408 (revised edition) · ptc 1234205 V. Description of the invention (4) Transfer between the coating device, transfer device, and peeling device to form a thin film on the substrate using a sheet film. That is, the film is transported to the coating device, and after the film is formed on the surface of the film, it is transported to the transfer device. In this transfer device, in addition to the sheet film, the substrate is also conveyed 'and the film is transferred to the substrate. Finally, the sheet film is peeled by a peeling device, and the film is formed on the substrate. As described above, in the present invention, a thin film can be formed without using a manual operation. Moreover, in the present invention, the film supply device is provided in the process section, and the film supply device is directly supplied to the process section, so the transportation efficiency is high and production can be improved.

此處,在工序部中之膜供給裝置、塗布裝置、轉印裝 置、及剝離裝置之配設佈局可為任思’例如可將上述處理 裝置(膜供給裝置、塗布裝置、轉印裝置、及剝離裝置)配 設在搬運裝置之周圍(申請專利範圍第2項),亦可將上述 處理裝置沿搬運裝置之搬運路徑配設在搬運路徑之兩側或 单側(申請專利範圍第3、4項)。在此配设佈局中,將上述 處理裝置配設在搬運裝置之周圍時,則無需設置搬運路 徑’而使裳置可更加小型化。 為搬運基板而在搬運裝置設置基板用保持部, 用保持部可由以手臂本體、 行#,该基 之上方側保持機構、以及 本-上面側保持基Here, the arrangement layout of the film supply device, the coating device, the transfer device, and the peeling device in the process section may be arbitrary. For example, the above-mentioned processing devices (film supply device, coating device, transfer device, and The peeling device) is arranged around the conveying device (item 2 of the scope of the patent application), and the processing device can be arranged along the conveying path of the conveying device on both sides or one side of the conveying path (the scope of the patent application is 3, 4) item). In this arrangement layout, when the above-mentioned processing device is arranged around the conveying device, it is not necessary to provide a conveying path 'and the size of the clothes can be further reduced. A substrate holding portion is provided in the conveying device for transferring the substrate. The holding portion includes an arm body, a row #, an upper side holding mechanism, and a main-upper side holding base.

下方側支撐機構所構成 手著本體之下面側保持基板 保持態樣保持基板,同時^,情形下,搬運裝置可以兩 之狀態切換保持態樣,=基板進行搬運,且可根 地進行基板之搬運(申請Q此可適應於基板之狀態根 專利範圍第5項有The lower side support mechanism is used to hold the substrate and hold the substrate in the lower side of the body. At the same time, in the case, the conveying device can switch between the two states to hold the substrate, = the substrate is transported, and the substrate can be transported in the root. (Application Q This can be adapted to the state of the substrate. Item 5 of the patent scope has

12342051234205

案號 921037M 乙 / :: 年Case No. 921037M B /: Year

五、發明說明(5) 為使塗布於片膜表面之薄膜用塗敷液乾燥而追 乾燥裝置時,最好將該乾燥裝置與塗布裝置、轉^,設置 及剝離裝置中之一個裝置在上下方向重疊配置。^攻置、ώ |、, 方式配置乾燥裝置,則可降低設置裝置所需之佔地 乂此 亦即可減低所占空間(申請專利範圍第6、7項)。 面積, 以下述方式構成轉印裝置時,則可使轉印駿置 方向之尺寸小型化,所以為使裝置小型化,最奸將f上下 置與該轉印裝置在上下方向重疊配置(申請專利範燥裝 9項)。亦即,可滿足如此要求之轉印裝置,係可^ 第8、 向互相相對移動自如地相對向配設,並在其中〜方上下方 之對向面裝設基板,而且具備有:將具有薄膜之 之板圭鬼 、〈片祺裝 於另一方之板塊之對向面之第1及第2板塊;將第丨及、展毁 塊中之至少一方沿移動方向移往另一方側,以將我昂2板 膜推壓預定時間,以使薄膜轉印於基板之加重機^ ^ &與片 具有以下之第1及第2支撐體,並相對於移動方向可’以及 如地支撐第1板塊,以自動修正相對於第2板墙> 1 _斜自尼之相對傾 度之傾斜修正機構;並將乾燥裝置與轉印裝置在I 重疊配置。第1支撐體係以圍繞第1板塊之外周之=下方向 以朝與移動方向大致垂直之第1方向延伸之裳式配 斜 置’奶π穴π私々八—土且〜不丄々心1甲之第 為中心,將第1板塊予以可旋轉自如地支撐,另—疋轉軸 第2支撐體係配設於第1支撐體之外周,以朝與移動#面’ 第1方向大致垂直之第2方向延伸之第2旋轉軸為中、、方向及 第1支撐體可旋轉自如地予以支撐。 本發明係一種使用在使用片膜而在基板形成薄膜之薄V. Description of the invention (5) When the drying device is used to dry the coating liquid for the film applied on the surface of the film, it is best to place the drying device with one of the coating device, the transfer device, the setting device and the peeling device. Direction overlap configuration. ^ If you install the drying device in the way of attack, purchase, and use, you can reduce the area required to set up the device. This also reduces the occupied space (items 6 and 7 of the scope of patent applications). When the transfer device is constructed in the following manner, the size of the transfer device can be miniaturized. Therefore, in order to reduce the size of the device, the upper and lower positions of f and the transfer device are overlapped with each other (application for a patent) Fan dry equipment 9 items). That is, a transfer device that can meet such a requirement can be arranged in a mutually opposite direction, and a substrate can be installed on the opposite side of the upper and lower directions, and has: The plate of the film, Gui Gui, "the first and second plates on the opposite side of the plate installed on the other side; move at least one of the first and second pieces in the direction of movement to the other side, and The weighting machine for pressing the Ang 2 sheet film for a predetermined time to transfer the film to the substrate ^ ^ & and the sheet has the following first and second support bodies, and can support the first and second sections relative to the direction of movement 1 plate to automatically correct the inclination correction mechanism of the relative inclination with respect to the second plate wall > 1 _ obliqueness; and the drying device and the transfer device are arranged to overlap with each other. The first support system is arranged obliquely with a milk-like hole π 々 土-soil and ~ not 丄 々 心 1, which is arranged obliquely around the outer periphery of the first plate = downward direction and extends in the first direction substantially perpendicular to the moving direction. The first is the center, and the first plate is rotatably supported, and the second support system of the rotary shaft is arranged on the outer periphery of the first support so as to be the second which is substantially perpendicular to the first direction of the movement # 面 ' The second rotation axis extending in the direction is supported in the middle, the direction, and the first support body can be rotated freely. The present invention is a thin film used to form a thin film on a substrate using a sheet film.

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1234205 η H _案號92103759 /〜年(月日 修正_ 五、發明說明(6) 膜形成裝置且用以供給片膜之膜供給機構,為達成上述第 2目的,具備有:在片膜之間介有脫離片之狀態下收容片 膜之膜收容匣,以及藉由將位於膜收容匣最上部之脫離片 從膜收容匣去除,以使片膜位於膜收容E之最上部之脫離 片去除裝置(申請專利範圍第1 0項)。 如此構成之發明,以在片膜之間介有脫離片之狀態, 在膜收容匣收容有複數個片膜。在膜收容匣中,由於使脫 離片位於最上部,因此可有效防止片膜被污染。而且,當 最上部之脫離片藉由脫離片去除裝置而從膜收容匣去除 時,片膜係位於膜收容匣之最上部,因而可將片膜從膜收 容匣取出。如此,無需藉由操作員,即可依所需供給片 膜,可有效率地供給片膜。 在此,為保護所收容之片膜,在膜收容匣設置可開閉 自如之保護蓋,亦可設置用以開閉保護蓋之蓋開閉裝置。 藉此,可更加確實地防止片膜受污染(申請專利範圍第1 1 項)。 再者,藉由設置用以回收從膜收容匣所去除之脫離片 之脫離片回收裝置,可確實回收脫離片,而可防止脫離片 散亂於膜收容匣周圍(申請專利範圍第1 2項)。 本發明係一種使用在將薄膜形成於基板之薄膜形成裝 置且用以收容片膜之膜收容匣,為達成上述第2目的,具 備有:在片膜之間介有脫離片之狀態下可收容複數個片膜 之匣本體;以及與收容於匣本體之片膜及脫離片之周緣部 扣合,以使片膜及脫離片相對於匣本體進行定位之定位構1234205 η H _ Case No. 92103759 / ~ (Month and Day Amendment _ V. Description of the invention (6) The film supply device and the film supply mechanism for supplying the film, in order to achieve the above-mentioned second purpose, there are: There is a film storage box for storing the film in the state of the release film, and the release film located at the uppermost part of the film storage box is removed from the film storage box so that the release film located at the uppermost part of the film storage E is removed. Device (item 10 of the scope of patent application). In the invention thus constructed, a plurality of sheet films are housed in a film storage cassette in a state in which a release sheet is interposed between the film and the film. It is located at the uppermost part, so it can effectively prevent the film from being contaminated. Moreover, when the uppermost release sheet is removed from the film storage box by the release sheet removal device, the film film is located at the uppermost part of the film storage box, so the film can be removed. The film is taken out from the film storage box. In this way, the film can be supplied as needed without the operator, and the film can be efficiently supplied. Here, in order to protect the stored film, the film storage box can be opened and closed. Free protective cover A cover opening and closing device for opening and closing the protective cover can also be provided. This can more reliably prevent the film from being contaminated (the scope of patent application is item 11). Furthermore, it can be removed from the film storage box by being provided for recycling. The release sheet recovery device of the release sheet can reliably recover the release sheet, and can prevent the release sheet from being scattered around the film storage box (the scope of application for patent No. 12). The present invention is a film used for forming a film on a substrate A film storage cassette for forming a device and used to store a sheet film, in order to achieve the above-mentioned second object, includes: a cassette body capable of storing a plurality of sheet films in a state in which detached sheets are interposed between the sheet films; and The positioning structure of the body film and the peripheral edge of the release sheet is engaged so that the film and the release sheet are positioned relative to the box body.

314408(修正版).ptc 第11頁 1234205 … v _案號92103759 年/ 月 日 修正_ 五、發明說明(7) 件(申請專利範圍第13項)。 在如此構成之膜收容S中,以在片膜之間介有脫離片 之狀態將複數個片膜收容於匣本體。並藉由定位構件使片 膜及脫離片相對於匣本體進行定位,藉此使片膜可由匣本 體確實地取出供給。 再者,對於匣本體亦可設置可開閉自如之保護蓋,如 此即可關閉此保護蓋,以從上方覆蓋收容於匣本體之片膜 及脫離片並加以保護,而可確實地防止片膜受污染(申請 專利範圍第1 4項)。 再者,以相對於薄膜形成裝置可裝卸自如之方式構成 上述膜收容E時,則可預先準備收容有片膜之膜收容匣, 且依照需要將膜收容匣安裝於裝置即可補給片膜,可使片 膜供給之效率更為良好(申請專利範圍第1 5項)。 再者,本發明係一種使用在使用片膜以形成薄膜之薄 膜形成裝置且用以搬運上述片膜之搬運機構,為達成上述 第3目的,具備有:在與片膜抵接之抵接領域設有吸附孔 之膜用手臂;藉由形成在膜用手臂内部之内部空間與吸附 孔相連通,並將内部空間之内部予以鼓風排氣,以使片膜 吸附保持於膜用手臂之鼓風機,以及在藉由鼓風機將片膜 吸附保持於膜用手臂之狀態下,使膜用手臂移動以搬運片 膜之驅動部(申請專利範圍第1 6項)。 如此構成之發明,由於内部空間内進行鼓風排氣,因 此片膜被會吸附保持於膜用手臂之吸附孔。而且,片膜係 以此吸附保持之狀態進行搬運。如此,以鼓風排氣予以吸314408 (revised version) .ptc page 11 1234205… v _ case number 92103759 year / month day amendment _ five, description of the invention (7) (the scope of application for patent 13). In the film storage S thus constituted, a plurality of film films are stored in the cassette body in a state in which a release sheet is interposed between the film films. The film and the release sheet are positioned relative to the cassette body by the positioning member, so that the film can be reliably taken out and supplied from the cassette body. Furthermore, a protective cover that can be opened and closed can also be provided for the box body, so that the protective cover can be closed to cover and protect the film and the release film contained in the box body from above, and can reliably prevent the film from being affected by the film. Pollution (item 14 of the scope of patent application). Furthermore, when the film storage E is configured in a detachable manner with respect to the thin film forming device, a film storage box containing a film can be prepared in advance, and the film storage box can be replenished by installing the film storage box on the device as needed. Can make the film and film supply more efficient (application patent scope 15). Furthermore, the present invention relates to a film-forming device that uses a sheet film to form a film, and a transport mechanism for transporting the sheet film. In order to achieve the third object, the present invention includes: A film arm provided with an adsorption hole; the internal space formed inside the film arm communicates with the adsorption hole, and the interior of the internal space is blown and exhausted, so that the film is adsorbed and held on the film arm by a blower And a driving unit for moving the film arm to carry the film under a state in which the film is adsorbed and held on the film arm by a blower (item 16 of the scope of patent application). In the invention thus constituted, since the blast is exhausted in the internal space, the film is adsorbed and held in the suction hole of the arm for the film. The sheet is transported in such a state that it is held by suction. In this way, it is sucked by blast air

314408(修正版).ptc 第12頁 1234205 _案號 92103759 >>:年(月日___^___ 五、發明說明(8) 附保持’亦即提高排氣流量而對吸附孔施加負壓,所以, 即使攸吸附孔至鼓風機之排氣路径之某一部分發生、;电露’ 負壓雖僅會減少對應於洩露量的量,但仍可產生足夠之負 壓將片膜予以吸附保持。作為吸附保持之裝置,以往已有 利用真空泵或吸氣器等之真空吸附裝置對吸附孔施加負壓 並進行真空吸附之方法,但此等方法一旦排氣路徑之一部 分產生洩漏時,對吸附孔將不會施加負壓,就連片膜亦無 法進行真空吸附。而本構成之鼓風排氣的吸附保持為最適 合於吸附保持比基板更輕量之片膜。所以,採用此構成之 搬運機構,可穩定性高地搬運片模,使片膜之搬運獲致良 好效率。 再者,用於薄膜形成裝置時,在片膜表面中的中央部 形成薄膜,而在其表面周緣部則未形成薄膜,亦即使表面 露出較多。在此情形下,最好利用搬運機構使膜用手臂之 抵接領域抵接於薄膜之非形成領域之表面周緣部,以進行 吸附支撐。藉此,可防止雜質附著於薄膜且可有效防止膜 厚不均勻所產生之問題,並且可防止膜用手臂受污染(申 請專利範圍第17項)。 '、 一再者,本發明係一種處理裝置,配置有複數個處理單 元,為了達成前述第3目的,該裝置具備:標引部,配置 收容基板之基板收容匣,並從基板收容匣將基板取出 容;以及工序部,配置複數個處理單元,並具有一 來自標引部之基板,一面予以搬運至複數個處理夕、伽 運機構,其中,搬運機構係且備:手臂本體· 早兀之搬 機構,於手臂本體的上面側保持基板=側==持 314408(修正版).ptc314408 (revised version) .ptc Page 12 1234205 _ Case No. 92103759 > >: Year (month day ___ ^ ___ V. Description of the invention (8) Attached maintenance ', that is, to increase the exhaust gas flow and impose negative pressure on the adsorption hole Therefore, even if a certain part of the exhaust path from the suction hole to the blower occurs, the electric dew's negative pressure will only reduce the amount corresponding to the leakage amount, but it can still generate enough negative pressure to adsorb and maintain the film. As a device for adsorption and holding, there have been conventional methods of applying a negative pressure to the adsorption hole and performing vacuum adsorption by using a vacuum adsorption device such as a vacuum pump or an aspirator. However, when a leakage occurs in a part of the exhaust path in these methods, the adsorption is carried out. The hole will not apply negative pressure, and even the film cannot be vacuum-adsorbed. The adsorption and holding of the blast air of this structure is the most suitable for the adsorption and holding of a film that is lighter than the substrate. Therefore, this structure is adopted. The conveying mechanism can convey the film mold with high stability, so that the film can be conveyed with good efficiency. Furthermore, when it is used in a film forming device, a film is formed at the central portion of the surface of the film, and at the peripheral portion of the surface. No film is formed, even if the surface is exposed a lot. In this case, it is best to use a transport mechanism to bring the contact area of the film arm against the peripheral edge portion of the surface of the non-formed area of the film for adsorption support. It can prevent impurities from adhering to the film, can effectively prevent problems caused by uneven film thickness, and can prevent the film arm from being contaminated (application patent scope item 17). '、 Again, the present invention is a processing device configured with For the plurality of processing units, in order to achieve the third object described above, the device includes: a indexing unit configured to receive a substrate from a substrate storage cassette configured to receive a substrate; and a process unit configured to be provided with a plurality of processing units. A substrate from the indexing part is transported to a plurality of processing and transportation mechanisms on one side. Among them, the transportation mechanism is prepared: the arm body and the early movement mechanism, which holds the substrate on the upper side of the arm body = side == Support 314408 (revised version) .ptc

imnwE 第13頁 1234205 ϋ正imnwE Page 13 1234205 ϋ 正

SS_J2103751 五、發明說明(9) 於手臂本體的下面側保持基板;以及驅動部, 移動而搬運基板,㈤時,搬運機構係在工序部m體 :保持基板之形態以及在下面側保持基板之形態加以切面 ’而且’一面保持2片基板並同時予以搬運(申喑專 圍第18項)。 丈、甲明寻利乾 〜在如此構成之發明中,搬運裝置可將基板以兩種保持 =予以保持,同時搬運純,且依基板之狀態替換保持 -怨所以可適應於基板之狀態,有效率地搬運基板。在 此’可將下方侧支撐機構構成為利用形成於手臂本體之下 之吸附孔來吸附保持基板之架構(申請專利範圍第U 、’或將上方側支撐機構構成為利用設於手臂本體之上 ^側之基板支撐構件來支摟基板以進行機械性支撐之架 (申請專利範圍第20項)亦可。 太μ再者,本發明為達成上述第3目的,具備有:在手臂 丰劈之上面側保持基板以搬運該基板之第1搬運模式;在 •本體之下面側保持基板以搬運該基板之第2搬運模 I二ί依照基板之狀態以第1及第2搬運模式之其中一搬運 ^ L :運基板(申請專利範圍第2 1項)。因而,與上述搬運 =相同:可依基板之狀態替換保持樣態,不但可適應於 土板之狀悲,且可有效率地搬運基板。 ^使用片膜在基板形成薄膜之薄膜形成裝置中,以轉 衣將形成於片膜表面之薄膜轉印於基板之薄膜形成 =以ί藉由薄膜形成片膜與基板一體化之密接物之後,利 1广裝置將片膜從密接物剝離之方法為一般所周知,但 溽膜升y成裝置中為了搬運基板,亦可採用上述搬運方SS_J2103751 V. Description of the invention (9) Hold the substrate on the lower side of the arm body; and the driving part moves and transports the substrate. In a moment, the conveying mechanism is in the process part m: the form of holding the substrate and the form of holding the substrate on the lower side Cut two sides of the substrate, and carry them at the same time (Shen Yunzhuan No. 18). Zhang and Jiaming pursue profit-making ~ In the invention thus constituted, the conveying device can hold the substrate in two ways = to be held, and at the same time, it can be handled purely, and it can be replaced according to the state of the substrate-so it can be adapted to the state of the substrate. Efficiently transport substrates. Here, 'the lower side support mechanism can be configured to use a suction hole formed under the arm body to suck and hold the substrate structure (application patent scope U,' or the upper side support mechanism can be configured to be provided on the arm body It is also possible to use a substrate supporting member on the side to support the substrate for mechanical support (item 20 of the scope of patent application). Too much, and furthermore, in order to achieve the third object described above, the present invention includes: The first conveying mode for holding the substrate on the upper side to carry the substrate; the second conveying mold for holding the substrate on the lower side of the body to carry the substrate; the second conveying mode according to the state of the substrate, and conveying in one of the first and second conveying modes. ^ L: substrate transportation (No. 21 in the scope of patent application). Therefore, the same as the above-mentioned transportation =: can be replaced and maintained according to the state of the substrate, not only can adapt to the shape of the soil plate, and can efficiently transfer the substrate ^ In the thin film forming apparatus for forming a thin film on a substrate using a sheet film, the film formed on the surface of the sheet film is transferred to the substrate by a transfer coat, and the film is formed by integrating the sheet film with the substrate through thin film formation. After the sealed object, the method of peeling the sheet film from the sealed object by the Lee equipment is generally known, but in order to transport the substrate in the film-forming device, the above-mentioned conveying method can also be used.

314408(修正版).pt 第14頁 1234205 案號 92103759 曰 五、發明說明(10) 法。在此裝置中,為防止或減低對於基板或薄興 最好以第2搬運模式將密接物從轉印裝置搬運到 之 韌離 傷 置,並以第1搬運模式將已形成薄膜之基板從剝離:巢 出(申請專利範圍第2 2項)。 凌置 撖 【實施方式】 A ·裝置配置: 第1圖係顯示本發明之薄膜形成裝置之一實施 置圖。在此薄膜形成裝置中,如第1圖所示,在2例之配 1圖之左側)配置標引部I D,而在標引部! 〇之下方傾方匈(第 之右手側)配置使用片膜在基板形成薄膜之工序部則(第1圖 在此標引部I D中,將用以收容基板之基板收办P。 4個X方向上配置成一列,並且沿著排列方向幻吏匣1以 採用之基板搬運機器人丨2移動,將收容於一個基住緩常 11之薄膜形成前之基板取出並搬運到工序部pp,^收容匣 =序部PP將已形成薄膜之基板,並將該基板收容=接收由 容匣11。以下,為方便說明,於各圖中,標示將j基板收 Z、與基板收容匣丨丨之排列方向X垂直之方向設 下方向 向」之XYZ直角座標軸。 為Γ ¥方 配置於標引部I D之(+ Υ )側之工序部Ρ Ρ,在中… 2之周圍配没有:塗布單元3、乾燥單元4、轉印單、、-機器人 i6、膜供給單元7、及反轉單元8。在本實制 為使轉印早兀5之轉印處理一併施行而設有2台轉印單元, 5。如後所述,由標引部ID所接收之基板,在反轉單元反 轉之^ ’為搬運到其中之一台轉印單元5,而在工序部PP 中之郑接於標引部I D之領域,藉由2台轉印單元5以將反轉314408 (Revised Edition) .pt Page 14 1234205 Case No. 92103759 5th, the invention description (10) method. In this device, in order to prevent or reduce substrates or thin parts, it is best to transport the sealed object from the transfer device to the substrate in the second transport mode, and peel the substrate on which the film has been formed from the first transport mode. : Nest out (No. 22 in the scope of patent application). Ling Zhi 实施 [Embodiment] A · Device configuration: Fig. 1 is a view showing an implementation of a thin film forming apparatus of the present invention. In this thin film forming apparatus, as shown in Fig. 1, the indexing section I D is arranged on the left side of the figure of 2 cases (1), and in the indexing section! Below the square, Hung (the right-hand side) is equipped with a process part that uses a film to form a thin film on the substrate (Figure 1 in this indexing part ID, the substrate for housing the substrate is received P. 4 X It is arranged in a row in the direction, and the magic box 1 is moved along the array direction by the substrate transfer robot 丨 2 adopted, and the substrate stored in a film that is based on the normal 11 is formed and taken to the process department pp. Cassette = sequence part PP will form a thin-film substrate, and receive the substrate = receive by container 11. Below, for convenience of explanation, in each figure, the arrangement of the j substrate Z and the substrate storage box 丨 丨The direction X is perpendicular, and the direction XYZ is a right-angled coordinate axis. It is Γ ¥ square and is arranged on the (+ Υ) side of the indexing part ID. The process part P P is arranged around the middle of 2: coating unit 3, Drying unit 4, transfer sheet,-robot i6, film supply unit 7, and reversing unit 8. In the present system, two transfer units are provided in order to perform the transfer process of the transfer premature unit 5 together. , 5. As described later, the substrate received by the indexing unit ID is reversed in the reversing unit. "^" Is conveyed to one of the transfer units 5, and Zheng in the process section PP is connected to the area of the indexing section ID, and the two transfer units 5 are used to reverse the

314408(修正版)ptc 第15頁 1234205 ?…v _案號92103759 7…年1月z日 修正_ 五、發明說明(11) 單元8挾住之方式排列於X方向。而且,將乾燥單元4與各 轉印單元5重疊配置,以減低裝置之佔用面積。又,在工 序部PP中之標引部I D之相反側,配置有塗布單元3及剝離 單元6。在塗布單元3與轉印單元5之間,介插有用以供給 片膜之膜供給單元7。如此,在工序部PP中,以中心機器 人2為中心以放射狀配置各處理單元3至8,且中心機器人2 固定於工序部PP之大致中央位置之狀態下,使基板用手臂 伸縮,可在轉印單元5、剝離單元6及反轉單元8之間搬運 基板,另一方面使膜用手臂伸縮,並且可在塗布單元3、 乾燥單元4、轉印單元5及膜供給單元之間搬運片膜。 B ·中心機器人(搬運機構)2 : 第2圖顯示中心機器人,而第2圖(a)為由上方俯視之 俯視圖,第2圖(b)為側視圖。此中心機器人2係相當本發 明之搬運機構之多關節機器人,其具有機器人本體2 1,以 及安裝於此機器人本體2 1之頂部的2支多關節手臂2 2、 2 3。此機器人本體2 1係在固定配置於工序部PP之中央部之 狀態下,可在旋轉軸ΑΧ 1周圍旋轉,且可往Z方向伸縮自 如0 在多關節手臂2 2之頂端部,安裝有用以支撐基板W之 具有基板保持部功能之基板用手臂2 4,並依照用以控制裝 置整體之控制單元(後述之第1 2圖中之符號9 )之動作指 令,藉由控制多關節手臂2 2之伸縮驅動及機器人本體2 1之 旋轉軸ΑΧ 1周圍之旋轉以及Z方向驅動,將基板W由各單元 5、6、8搬出,或相反地將由基板用手臂2 4所保持之基板W 搬入至各單元5、6、8。如此,在本實施例中,機器人本314408 (revised version) ptc page 15 1234205? ... v _ case number 92103759 7 ... January z z amendment _ V. Description of the invention (11) The way in which the unit 8 is held is arranged in the X direction. In addition, the drying unit 4 and the transfer units 5 are arranged in an overlapping manner to reduce the area occupied by the device. A coating unit 3 and a peeling unit 6 are arranged on the opposite side of the index portion ID in the process portion PP. A film supply unit 7 for supplying a film is interposed between the coating unit 3 and the transfer unit 5. In this way, in the process section PP, the processing units 3 to 8 are arranged radially with the central robot 2 as the center, and the central robot 2 is fixed to the approximate central position of the process section PP. The substrate is transported between the transfer unit 5, the peeling unit 6, and the reversing unit 8, while the film arm is retracted, and the sheet can be transported between the coating unit 3, the drying unit 4, the transfer unit 5, and the film supply unit. membrane. B · Central robot (conveying mechanism) 2: Figure 2 shows the central robot, while Figure 2 (a) is a plan view from above, and Figure 2 (b) is a side view. This central robot 2 is a multi-joint robot equivalent to the carrying mechanism of the present invention, which has a robot body 2 1 and two multi-joint arms 2 2, 2 3 mounted on top of the robot body 21. The robot body 21 is fixedly arranged in the central part of the process part PP, and can rotate around the rotation axis AX 1 and can be extended and retracted in the Z direction. The multi-joint arm 2 2 is used to support the substrate arm 2 4 having the function of a substrate holding portion of the substrate W, and according to an operation command of a control unit (symbol 9 in FIG. 12 described later) for controlling the entire device. The telescopic drive and the rotation around the rotation axis AX 1 of the robot body 21 and the Z-direction drive move the substrate W from each unit 5, 6, 8 or vice versa, and move the substrate W held by the substrate arm 2 4 to Each unit 5, 6, 8. As such, in this embodiment, the robot

314408(修正版).ptc 第16頁314408 (revised) .ptc Page 16

1234205 _案號 92103759 五、發明說明(12) 體2 1及多關節手臂2 2係使相當於本發明之「基板用保持 部」之基板用手臂2 4移動,以發揮搬運基板W之驅動部之 功能。 第3圖係顯示基板用手臂之構成之圖,而第3圖(a )為 由上方俯視基板用手臂之俯視圖,第3圖(b)為第3圖(a)中 A - A線之剖視圖。此基板用手臂24係如第3圖所示,具備有 由上下2牧之板塊241、242重豐所成之手臂本體243。在此 手臂本體2 4 3之前端部與中央部形成有朝與手臂本體2 4 3之 長度方向大致垂直之方向延伸之翼部244。而各翼部24 4之 上面部固定有基板支撐塊2 4 5,於是如第3圖中之2點虛線 所示,藉由將基板W之外側面予以扣止,即可在手臂本體 2 4 3之上面側將基板W予以機械性保持。如此,於本實施例 中,基板支撐塊2 4 5將發揮本發明之「上方側保持機構」 之功能。 在下板塊2 4 2之中央部設有3個吸附孔2 4 6至2 4 8,且在 上板塊2 4 1之下面側形成有溝部2 4 9,藉由使上下板塊 2 4卜2 4 2—體化,而利用溝部2 4 9使3個吸附孔2 4 6至2 4 8相 連通。此溝部2 4 9係與未圖示之真空泵等真空吸附機構相 連接,藉由使真空吸附機構作動,以對溝部施加負壓,如 第3圖(b)中之1點虛線所示,可在手臂本體243之下面側將 基板W予以吸附支樓。如此,於本實施例中,設於手臂本 體2 4 3之吸附孔2 4 6至2 4 8及溝部2 4 9、以及真空吸附機構可 發揮本發明之「下方側保持機構」的功能。 如此,於本實施例中,中心機器人2能夠以2個保持樣 態,亦即在上方側以機械性保持之樣態,及在下方側吸附1234205 _ Case No. 92103759 V. Description of the invention (12) The body 21 and the multi-joint arm 2 2 move the substrate arm 2 4 which is equivalent to the “substrate holding portion” of the present invention, so as to exert the driving portion for transporting the substrate W. Its function. Fig. 3 is a diagram showing the structure of the arm for the substrate, and Fig. 3 (a) is a plan view of the arm for the substrate viewed from above, and Fig. 3 (b) is a cross-sectional view taken along line A-A in Fig. 3 (a). . As shown in Fig. 3, this substrate arm 24 is provided with an arm body 243 formed by the upper and lower plates 241 and 242. Here, wing portions 244 extending in a direction substantially perpendicular to the longitudinal direction of the arm body 2 4 3 are formed at the front end portion and the central portion of the arm body 2 4 3. And the substrate support block 2 4 5 is fixed on the upper surface of each wing 24 4, so as shown by the two dotted lines in FIG. 3, the outer side of the substrate W can be locked to the arm body 2 4 The upper surface of 3 holds the substrate W mechanically. Thus, in this embodiment, the substrate supporting block 2 4 5 will function as the "upper-side holding mechanism" of the present invention. Three suction holes 2 4 6 to 2 4 8 are provided in the central portion of the lower plate 2 4 2, and a groove portion 2 4 9 is formed on the lower side of the upper plate 2 4 1. The upper and lower plates 2 4 2 2 4 2 The body is integrated, and the three suction holes 2 4 6 to 2 4 8 are connected by the groove portion 2 4 9. This groove portion 2 4 9 is connected to a vacuum suction mechanism such as a vacuum pump (not shown), and the vacuum suction mechanism is operated to apply negative pressure to the groove portion, as shown by a dotted line in FIG. 3 (b). The substrate W is sucked on the lower side of the arm body 243. Thus, in this embodiment, the suction holes 2 46 to 2 48 and the groove portion 2 4 9 provided in the arm body 2 4 3 and the vacuum suction mechanism can function as the "lower-side holding mechanism" of the present invention. As such, in this embodiment, the center robot 2 can be held in two states, that is, mechanically held on the upper side, and adsorbed on the lower side.

314408(修正版).ptc 第17頁 1234205 Γ >, ---案號 92103759 年-月 Z 日一-^--~~-- 五、發明說明(13) 保持之樣態保持基板W同時搬運基板,因而可依基板W之狀 態而替換支撐樣態,且適應於該基板W之狀態’有效率地 實施基板搬運。而且,亦可同時將2牧基板W予以搬運。 在另一方之多關節手臂2 3之前端部安裝有用以吸附保 持片膜F之表面周緣部之膜用手臂2 5,依照來自控制單元 之動作指令,控制多關節手臂2 3之伸縮驅動及機器人本體314408 (revised version) .ptc Page 17 1234205 Γ >, --- Case No. 92103759-Month Z Day 1-^-~~-V. Description of the invention (13) Keep the substrate while keeping the substrate W at the same time Since the substrate is transported, the support state can be replaced depending on the state of the substrate W, and the substrate W can be efficiently transported in accordance with the state of the substrate W. In addition, the two substrates W may be transported at the same time. At the front end of the other multi-joint arm 2 3, a film arm 25 for attaching and holding the surface peripheral portion of the sheet F is attached to control the telescopic drive and robot of the multi-joint arm 23 according to the operation instruction from the control unit. Ontology

2 1之旋轉軸ΑΧ 1周圍之旋轉以及z方向驅動,藉此將片膜F 由各單元3至5及7搬出,或相反地將由膜用手臂2 5所保持 之片膜F搬入至各單元3至5。如此,在本實施例中,機器 人本體2 1及多關節手臂2 3係使相當於本發明之「膜用保持 部」之膜用手臂2 5移動,以發揮搬運片膜F之驅動部之功 能。 第4圖係顯示膜用手臂之構成之圖,而第4圖(a)為由 下方俯視膜用手臂之底視圖,第4圖(b)為第4圖(a)中B-B 線之剖視圖。此膜用手臂2 5係在手臂本體2 5 1之下面前端 部女裝有具有與片膜F相同程度外徑之環構件2 5 2,且在此 環構件、2 52之下面側安裝與片膜F大致相同形狀之板塊構件 2 5 3 ’以手臂本體2 5 1與環構件2 5 2而形成内部空間2 5 4。而 且,為補強手臂本體251及板塊構件2 53之各中央部而在内 部空間2 5 4裝有6個支柱構件2 5 5。 在板塊M3之周緣部,形成有18個貫穿孔253a,且藉 樹脂所形成之襯墊2 5 6在板塊構件2 5 3安裝具有 相,外徑之環板塊2 5 7。襯墊256係與板塊構 ϋ ? 9夂牙孔2 53雜對應而形成有貫穿孔256a,其係與 貝牙孔253抓1對1相對應配置,且在環板塊257形成有橫2 1's rotation axis AX 1 is rotated around and driven in the z direction, thereby moving the film F from each unit 3 to 5 and 7, or vice versa, moving the film F held by the film arm 2 5 into each unit 3 to 5. As such, in this embodiment, the robot body 21 and the multi-joint arm 2 3 move the film arm 25 corresponding to the “film holding portion” of the present invention to perform the function of a driving unit that transports the film F . Fig. 4 is a diagram showing the structure of the arm for the membrane, and Fig. 4 (a) is a bottom view of the arm for the membrane viewed from below, and Fig. 4 (b) is a sectional view taken along line B-B in Fig. 4 (a). This film arm 2 5 is attached to the front end of the arm body 2 5 1 at the front end of the film. The woman has a ring member 2 5 2 having the same outer diameter as the film film F, and the ring member 2 5 is attached to the lower side of the ring member 2 52. The plate member 2 5 3 ′ of the membrane F having substantially the same shape forms an internal space 2 5 4 with the arm body 2 5 1 and the ring member 2 5 2. In addition, six pillar members 2 5 5 are installed in the inner space 2 5 4 to reinforce the central portions of the arm body 251 and the plate member 2 53. In the peripheral portion of the plate M3, 18 through-holes 253a are formed, and a ring plate 2 5 7 having a phase and an outer diameter is attached to the plate member 2 5 3 by a gasket 2 5 6 formed of a resin. The pad 256 is formed corresponding to the plate structure 对应 9 dent holes 2 53 and formed with a through hole 256a, which is arranged corresponding to the bayonet hole 253 and 1 to 1 and is formed in the ring plate 257.

1234205 _ 案號 92103759 五、發明說明(14) #- 年' 月 修正 跨3個貫穿孔2 5 3 a之6個吸糾》丨? R 〇 及附孔」57a,而母3個貫穿孔25 3a 相對應配置有1個吸附孔2 5 7 如h,茲 I * Z b,a如此糟由吸附孔2 5 7a、 貝牙孔2 5 6a及2 5 3a而使環杯挣?夕下;乂 \衣槪塊^〖之下面側與内部空間2 5 4 另一方面’在手臂本體251之上面’如第4圖(b)所 不三設有連通孔251a’藉由排氣管258而連接於未圖示之 排氣鼓風機。因而,藉由使排氣鼓風機作動對内部空間 2 54施加負壓,則如第4圖(b)所示,環板塊2 5 7之整個下面 將形成本發明之「抵接領域」而抵接於片膜F之表面周緣 部,可將該表面周緣部予以吸附保持。 C ·膜供給單元(膜供給機構)7及膜收容匣7 1 : 第5圖係顯示設於薄膜供給裝置之膜供給單元之構成 圖。此膜供給單元7係使收容有片膜F之膜收容!^ 7丨可相對 於匣載置台72裝卸自如。而且,匣載置台72可藉由未圖示 之昇降機構而在上下方向Z昇降,以使裝載於匣載置台72 之膜收容匣7 1可在上下方向Z進行定位。於本實施例中, 如第5圖所示,設有3個匣載置台72’最多可同時載置3個 膜收容匣7 1,但匣載置台7 2之設置個數並非受限於r 3 個」,可任意設定。 第6圖係設於第1圖之薄膜形成裝置之膜收容匣之分解 組裝斜視圖。各膜收容1E 7 1可以在片膜F之間介有脫離片 SH之狀態,將複數個片膜F收容於匣本體7 1 1。在此匣本體 7 1 1中立設有3支定位銷7 1 2,且與收容於匣本體7 1 1之片膜 F及脫離片SH之周緣部相扣合,以將片膜F及脫離片SH相對 於匣本體7 11進行定位。藉此,在匣本體711内,片膜F及1234205 _ Case number 92103759 V. Description of the invention (14) #-year 'month Amendment 6 suction corrections across 3 through holes 2 5 3 a R 〇 and attached holes "57a, and the female 3 through holes 25 3a are configured with 1 adsorption hole 2 5 7 such as h, z I * Z b, a is so bad that the adsorption hole 2 5 7a, bayonet hole 2 5 6a and 2 5 3a to make the ring cup? Evening; 乂 \ 衣 槪 块 ^ 〖The lower side and the internal space 2 5 4 On the other hand, 'on the arm body 251' is provided with a communication hole 251a 'as shown in Figure 4 (b). The pipe 258 is connected to an exhaust blower (not shown). Therefore, by operating the exhaust blower to apply a negative pressure to the internal space 2 54, as shown in FIG. 4 (b), the entire lower surface of the ring plate 2 5 7 will form the “contact area” of the present invention and abut. The surface peripheral portion of the sheet film F can be adsorbed and held. C. Film supply unit (film supply mechanism) 7 and film storage cassette 7 1: FIG. 5 is a diagram showing a configuration of a film supply unit provided in a film supply device. This film supply unit 7 accommodates the film containing the film F! ^ 7 丨 Can be freely attached and detached from the cassette mounting table 72. Further, the cassette mounting table 72 can be moved up and down in the vertical direction Z by a lifting mechanism (not shown), so that the film storage cassette 71 loaded on the cassette mounting table 72 can be positioned in the vertical direction Z. In this embodiment, as shown in FIG. 5, three cassette mounting tables 72 ′ are provided, and a maximum of three film storage cassettes 7 1 can be mounted at the same time, but the number of the cassette mounting tables 7 2 is not limited to r. 3 "can be arbitrarily set. Fig. 6 is an exploded perspective view of a film storage box provided in the film forming apparatus of Fig. 1; Each film storage 1E 71 can store a plurality of film films F between the film films F in the cassette body 7 1 1. Three positioning pins 7 1 2 are neutrally provided in the box body 7 1 1 and are engaged with the peripheral edges of the sheet film F and the release sheet SH housed in the box body 7 1 1 to connect the sheet film F and the release sheet. SH is positioned relative to the cassette body 7 11. Thereby, in the cassette body 711, the film F and

314408(修正版).ptc 第19頁 案號 92103759 1234205 年,314408 (revised) .ptc page 19 case number 92103759 1234205,

五、發明說明(15) 脫離片SH係以經常排列之狀態被收容,, 率地進行片膜F之取出處理或脫離片所述,可有效 又,設置有相對於匣本體7丨丨, 除處理。 7 1 3。再詳述之,在保護蓋7丨3之下端々閉自如之保護蓋 設置有突出部7 1 4,而對應於各突出部°、邛之4個部分所 有插入孔715。將突出部71 4分別插入 j匣本體711設 715,並將保護蓋71 3安裝於匣本體7 、應之插入孔 關閉之狀態,而從上方覆蓋收容於兩/則保護蓋71 3形成 離片SH並加以保護。藉此1 體川之片膜F及脫 使保護蓋71 3從匣本體711朝上方移 止片膜受污染。當 啟之狀態,於是可將收容於£本體7 、,保護蓋將形成開V. Description of the invention (15) The release sheet SH is accommodated in a state of regular arrangement, and the removal process of the film F or the release sheet can be efficiently performed. deal with. 7 1 3. To further elaborate, the protective cover which is freely closed at the lower end of the protective cover 7 丨 3 is provided with protruding portions 7 1 4, and all the insertion holes 715 corresponding to the four portions of each of the protruding portions 邛 and 邛. Insert the protruding parts 71 4 into the j box body 711 and 715 respectively, and install the protective cover 71 3 on the box body 7 with the corresponding insertion hole closed, and cover and receive the protective cover 71 3 from above to form a separate piece. SH and protected. With this, the protective film 71 3 of the body film F is removed and the protective cover 71 3 is moved upward from the cassette body 711 to prevent the film from being contaminated. When it is in the open state, it can be stored in the main body 7 and the protective cover will be opened.

由上方搬出。 枣體711之片膜F及脫離片SH 為使保護蓋7 1 3開閉移動,如第$ 之膜供給單元7中,在昆載置台72之1圖所示,在本實施例 冓轉7Γ:蓋開閉驅動機構7心 A X 2周圍說轉自如之旋轉手臂7 3 1 ^ 捭π # Μ I i @ 及安裝於其前端之把 t Ϊ 由未圖示之驅動部使旋轉手臂731往1點虛 線=頭Ρ1之方向旋轉。然後,蓋開閉驅動機構73係將設置 於^位在預疋之蓋開閉位置(第8圖(a ))之膜收容匣7 i之保 瘦盖7 1 3之把手部7 1 6,以把持部7 3 2予以把持後,形成藉 由使旋轉手臂7 3 1往(-P 1 )方向旋轉而使其移動到第5圖之 退避位置之架構。欲將保護蓋7 1 3關閉時,進行與此相反 之動作即可。Move out from above. The film F and the release sheet SH of the jujube body 711 move the protective cover 7 1 3 to open and close. As shown in the figure of the film mounting unit 72 in the first film supply unit 7, in this embodiment, turn 7Γ: The cover opening and closing drive mechanism 7 heart AX 2 said that it can rotate freely around the rotating arm 7 3 1 ^ 捭 π # Μ I i @ and the handle t 安装 attached to the front end of the cover. The rotating arm 731 is moved to a dotted line by a driving unit (not shown). = Head P1 rotates in the direction. Then, the lid opening-closing driving mechanism 73 is a handle portion 7 1 6 of the thin-skinned lid 7 1 3 of the film storage box 7 i which is set at the pre-closing lid opening-closing position (FIG. 8 (a)) to hold the lid. After the portion 7 3 2 is grasped, a structure is formed in which the rotating arm 7 3 1 is rotated to the (-P 1) direction to move it to the retreat position in FIG. 5. To close the protective cover 7 1 3, perform the opposite operation.

在此蓋開閉驅動機構7 3之下方位置,配設有用以去除 脫離片SH之脫離片去除機構74。此脫離片去除機構74,如A release sheet removing mechanism 74 for removing the release sheet SH is disposed below the lid opening and closing drive mechanism 73. This release sheet removal mechanism 74, such as

314408(修正版).ptc 第20頁 1234205 案號 92103759 曰 修正 五、發明說明(16) 第5圖及第7圖所示,隔著比片膜F及脫離片SH之外徑寬之 間隔配設有2支旋轉手臂7 4 1、7 4 2。而且,在此等旋轉手 臂7 4 1、7 4 2之頂部’橫掛有往水平方向延伸之連結梁 7 4 3。在此連結梁7 4 3之中央部安裝有用以吸附脫離片s Η之 吸附板7 4 4,且如第5圖及第7圖所示,在吸附位置上,吸 附板744之下部面形成吸附面744a。如第8圖(b)所示,使 吸收面744a面向(-Z)方向之狀態下,使g載置台72上昇 時,載置在匣載置台7 2之位於膜收容匣71内最上部之脫離 片S Η將抵接於吸附面7 4 4 a,於是如第8圖(c )所示由吸附板 744所吸附保持。載置於匣载置台72上之膜收容匣71彼此 間之上下方向之間隔’係於蓋開閉驅動機構7 3將保護蓋 7 1 3予以裝卸時,足夠使上述保護蓋7丨3通過之間隔。 在旋轉手臂741、742,如第7圖所示,分別安裝有往 ( + γ)方向及(-Y)方向延伸之軸構件745、746,並以 AX3為旋轉中心可旋轉自如。而旋轉手臂741、742係由 圖示之驅動部所驅動,可往i點虛線箭頭以之方向旋 因而,如上所述將脫離片SH以吸附板744吸 褥^ ,轉手臂741、742往第9圖(a)所示之( + p2)箭頭:使 ::” t附板J44將定位於去除位置。然後解除吸附板7疋4轉 吸附吩,脫離片SH會從吸附板744往下掉落。 44之 本實施例在膜供給單元7之底面部配設 =η之脫離片回收箱7 6,且設有將如上述掉落二收, v至脫離片回收箱76之引 脫離片 片口收n,使脫離片SH可確實地回收到脫^脫離314408 (revised version) .ptc P.20 1234205 Case No. 92103759 Amendment V. Description of the Invention (16) Figures 5 and 7 are arranged at intervals wider than the outer diameter of the film F and the release film SH. There are 2 rotating arms 7 4 1 and 7 4 2. Further, a link beam 7 4 3 extending in the horizontal direction is hung on the tops' of the rotating arms 7 4 1 and 7 4 2. An adsorption plate 7 4 4 for adsorbing the release sheet s Η is attached to the central portion of the connecting beam 7 4 3, and as shown in FIGS. 5 and 7, in the adsorption position, adsorption is formed on the lower surface of the adsorption plate 744. Face 744a. As shown in FIG. 8 (b), when the g-mounting table 72 is raised with the absorbing surface 744a facing the (-Z) direction, the g-mounting table 72 is placed on the uppermost part of the film-receiving box 71 on the cassette mounting table 72. The release sheet S Η will abut against the suction surface 7 4 4 a, and is held by the suction plate 744 as shown in FIG. 8 (c). The interval between the film storage cassettes 71 placed on the cassette mounting table 72 in the up and down direction is connected to the cover opening and closing drive mechanism 7 3 when the protective cover 7 1 3 is detached, which is sufficient to allow the above-mentioned protective cover 7 丨 3 to pass. . As shown in FIG. 7, the rotating arms 741 and 742 are respectively equipped with shaft members 745 and 746 extending in the (+ γ) direction and (-Y) direction, and can rotate freely with AX3 as the rotation center. The rotating arms 741, 742 are driven by the driving unit shown in the figure, and can be rotated in the direction of the dotted arrow at point i. Therefore, as described above, the release sheet SH is sucked by the suction plate 744, and the arms 741, 742 are moved to the first position. (+ P2) arrow shown in Figure 9 (a): make :: ”t Attachment plate J44 will be positioned at the removal position. Then the adsorption plate 7 疋 4 is turned to adsorb phenol, and the release sheet SH will fall from the adsorption plate 744. In the present embodiment of 44, a release sheet recovery box 76 is provided on the bottom surface of the film supply unit 7 = η, and is provided with a tear-off sheet sheet opening that will drop the two as described above and v to the release sheet recovery box 76. N is collected so that the release sheet SH can be reliably recovered and released

314408(修正版)· 口土 第21頁 案號 92103759 1234205314408 (revised edition) · Oral soil Page 21 Case number 92103759 1234205

曰 五、發明說明(17) 7 6。所以,可有效防止脫離片S職亂於膜供认;一 圍。 …早疋7之周 其次’由於已將脫離片S Η由膜收容匣71去除, 可使片膜F露出於最上部且由該匣7丨搬出。於是示膜’所以^, 2 5以適當之時序在膜供給單元7移動,將最上部之 以吸附保持(第9圖(b))。然後往下一個處理軍-片膜巧 敷單元3搬運。 凡’亦即塗 於本實施例中,如第5圖所示,在脫離片去☆ 之附近設置有電離态7 9 ’以有效地防止當將片膜、f由構7 4 容匣7 1搬出時,或將脫離片SH去除時發生剝離帶膜收 第1 0圖係顯示設置於第1圖之薄膜形成裝置之 ^ 元之構成圖。此塗布單元3具備有:圓板狀之載物二=早 使此載物台3 1旋轉之馬達(未圖示)之旋轉轴3 2 ;用、、1 ’ 薄膜塗布液例如S0G(Spin-on —Glass)液之s〇G液用以^布 3 3 ;為淋洗周緣而將洗淨液噴淋於片膜ρ之周緣部分 淨液用喷嘴34 ;用以防止塗布液或洗淨液等飛散於77塗^;先 元3之周邊之飛散防止杯3 5。 平 在此載物台31之上面全體設有複數個未圖示之吸 孔,且與真空泵(未圖示)相連接。如上所述, 臂25將片膜F由膜供給單元7搬運到塗布單元3並載置於用手 物台31上之後’使真空栗作動,於是片膜F會確實地直* 吸附於載物台3卜又,以飛散防止杯構成、工 物台31之周圍之架構。 固伍上遠構成之载 在如此構成之塗布單元3中,者Η腺17; I _ Τ田片膜F被载置於載物台5. Description of the invention (17) 7 6. Therefore, it can effectively prevent the confession of the film from being confusing; … Week 7: Second week ”Since the release sheet S Η has been removed from the film storage box 71, the film film F can be exposed at the top and carried out from the box 7 丨. Therefore, the film ′ is moved at a proper timing in the film supply unit 7 and the uppermost portion is held by adsorption (FIG. 9 (b)). It is then transported to the next processing unit 3-the film clever application unit 3. Wherein, that is, in this embodiment, as shown in FIG. 5, an ionized state 7 9 ′ is provided near the detachment of the sheet ☆ to effectively prevent the film and f 7 from forming the container 7 1 When unloading, or when the release sheet SH is removed, a peeling tape film is received. Fig. 10 is a block diagram showing a structure of a thin film forming apparatus provided in Fig. 1. This coating unit 3 is provided with a disc-shaped carrier 2 = a rotating shaft 3 2 of a motor (not shown) that rotates the stage 3 1 early; a thin film coating liquid such as S0G (Spin- On—Glass) is used for sock cloth 3 3; for washing the peripheral edge, the cleaning liquid is sprayed on the peripheral part of the film ρ, and the cleaning liquid nozzle 34 is used to prevent the coating liquid or cleaning liquid Wait for the scattering to 77 Tu ^; Scattering prevention cup 3 5 around the first element 3. A plurality of suction holes (not shown) are provided on the entire surface of the stage 31 and are connected to a vacuum pump (not shown). As described above, the arm 25 transports the sheet film F from the film supply unit 7 to the coating unit 3 and places it on the hand stage 31 to 'actuate the vacuum pump, so that the sheet film F will be directly fixed to the carrier. Table 3 is composed of a scatter prevention cup and a structure around the work table 31. Carrier consisting of Gwu Shangyuan In the coating unit 3 thus constituted, the gland 17; I _ Τ 田 片 膜 F is placed on the stage

314408(修正版).ptc 第22頁 1234205 年 月 曰 修· 案號921037沾 五、發明說明(18) 3 1而塗布處理之準備完成時,設於塗布單元3之未圖示之 馬達會作動,如第1 〇圖所示,旋轉軸32開始旋轉,隨之, 片膜F及載物口 3 1會在旋轉軸αχ4周圍旋轉。與此旋轉之同 時,或稍為遲延,會從S0G液用噴嘴33向片膜F之中心點供 給SOG液。於是’藉由片膜f之旋轉所產生之離心力,而由 片膜F之中心往全面以薄膜狀之方式塗布8〇(}液。此時飛散 於片膜F外側之SOG液將透過飛散防止杯35及未圖示之排 管排出至塗布單元3之外部。 對於^膜F之整面供給s〇G液後,實施周緣淋洗。亦 即士由洗淨液用噴嘴3 4向片膜F之周緣部分喷淋洗淨液。 2 F岡片縫膜:績旋轉,所以,藉由此旋轉可將附著於 片膜F周緣^ S之塗布液予以去除。 對於片膜之塗布彦了田—Λ、士 單元3,將片膜F予:J =4,;用手臂25將進入塗布 載物台31之真空吸附持=空系停止以解除對於 S0G膜(薄膜)之片膜F由:糟=手臂25將已形成 考神_ —. 、由塗布早兀3搬出,且搬運到下一個 處理早兀,亦即乾燥單元4。 1固 如使元:係使用s°g液作為塗布液,但 是對於基板w可構;^技術λ之光抗蚀液等所例示,只要 限定。再者,纟本成參/之溥膜的塗布液’則並沒有特定 下述之乾燥單元4以只實於塗布處理後將。片膜搬到 直接搬到轉印單元5亦^ ν'处理,但未進行乾煉處理而 Ε ·乾燥單元4 : 第11圖係顯示設於第1圖之薄膜形成裝置之乾燥單元314408 (revised version) .ptc Page 22, Rev. 1234205 · Case No. 921037 D. V. Invention Description (18) 3 1 When the preparation of the coating process is completed, a motor (not shown) provided in the coating unit 3 will operate As shown in FIG. 10, the rotation shaft 32 starts to rotate, and accordingly, the film F and the loading port 31 are rotated around the rotation axis αχ4. At the same time as this rotation, or slightly delayed, the SOG liquid is supplied from the SOG liquid nozzle 33 to the center point of the sheet film F. Then, by the centrifugal force generated by the rotation of the sheet f, the 80 ° liquid is applied in a thin film form from the center of the sheet F. At this time, the SOG liquid scattered on the outside of the sheet F will be prevented from being scattered The cup 35 and a discharge pipe (not shown) are discharged to the outside of the coating unit 3. After the entire surface of the film F is supplied with the SOG solution, peripheral rinsing is performed. That is, the film is sprayed from the nozzle 34 for the cleaning solution to the film. Spray cleaning solution on the peripheral part of F. 2 F Gang sheet seam film: rotation, so by this rotation, the coating liquid attached to the peripheral edge of the sheet F ^ S can be removed. For the film film coating Hikoda —Λ, taxi unit 3, the film F: J = 4; use the arm 25 to stop the vacuum suction into the coating stage 31 = the air system is stopped to release the film F for the SOG film (film) by: Bad = arm 25 will have formed the test god _ —., Removed from the coating early Wu 3, and transported to the next processing early Wu, that is, the drying unit 4. 1 as solid as possible: the use of s ° g solution as the coating However, as for the substrate w, a photoresist solution such as the technique λ is exemplified, as long as it is limited. Furthermore, the coating solution for the film of 纟 本 成 参 / 的 溥 ' The following drying unit 4 is not specified so that it is only after the coating process. The film is transferred to the transfer unit 5 and is also processed, but the drying process is not performed, and the drying unit 4: No. 11 The figure shows the drying unit of the film forming apparatus shown in Fig. 1

314408(修正版).ptc 第23頁 1234205 厂 ^ _案號92103759 ’年/ 月 日 修正_ 五、發明說明(19) 之圖。此乾燥單元4具備有:其内部為處理室4 1 1之處理容 器4 1 ;配置於該處理室4 1 1之内底部之熱板(載物台)4 2。 第1 1圖中之符號1 2 1表示由上述塗布單元3所形成在片膜F 表面上之S 0 G膜(薄膜)。 在此處理容器4 1之底部設有2處氮氣導入口 4 1 2、 4 1 3,未圖示之氮氣供給源將氮氣(N氦體)經由上述導入口 4 1 2、4 1 3供給至處理室4 1 1内。在處理容器4 1之頂部設有 排氣口 4 1 4,可使處理室4 1 1内之氣體成分由處理室4 1 1排 出。因而處理室4 1 1内充滿氮氣,而以此環境氣體下實施 乾燥處理。 熱板4 2係内藏有加熱器4 2 1,並藉由控制單元所供給 之電氣信號使加熱器4 2 1發熱。熱板4 2與塗布單元3之載物 台相同地,在熱板4 2之上面整體設有複數個未圖示之吸附 孔,且與未圖示之真空泵相連接。當片膜F由膜用手臂25 搬到乾燥單元4並載置於熱板4 2上之後,藉由使真空泵作 動,在片膜F將被牢固地真空吸附於熱板4 2。於是,在藉 由熱板4 2進行真空吸附之狀態下開始乾燥處理。 片膜F被加熱預定時間而乾燥處理完成時,膜用手臂 2 5進入乾燥單元4並將片膜F予以吸附保持之同時,真空泵 會停止而解除熱板4 2之真空吸附。然後,藉由膜用手臂2 5 將施以乾燥處理之片膜F由乾燥單元4搬出,並搬運到下一 個處理單元,亦即轉印單元5。 F .轉印單元5 : 第1 2圖係顯示設於第1圖之薄膜形成裝置之轉印單元 之概略剖視圖。在第1 2圖中,該轉印單元5,其内部係可314408 (revised version) .ptc page 23 1234205 factory ^ _ case number 92103759 '' year / month day amendment _ five, the description of the invention (19). This drying unit 4 is provided with: a processing container 4 1 with a processing chamber 4 1 1 inside; and a hot plate (stage) 4 2 disposed at the bottom of the processing chamber 4 1 1. The symbol 1 2 1 in FIG. 11 indicates an S 0 G film (thin film) formed on the surface of the sheet film F by the coating unit 3. Two nitrogen inlets 4 1 2, 4 1 3 are provided at the bottom of the processing container 41, and a nitrogen supply source (not shown) supplies nitrogen (N helium) to the inlets 4 1 2, 4 1 3 to the above. Inside the processing chamber 4 1 1. An exhaust port 4 1 4 is provided on the top of the processing container 41 to allow gas components in the processing chamber 4 1 1 to be discharged from the processing chamber 4 1 1. Therefore, the processing chamber 4 1 1 is filled with nitrogen, and the drying process is performed under the ambient gas. The heater 4 2 1 has a heater 4 2 1 built therein, and heats the heater 4 2 1 by an electric signal supplied from the control unit. The hot plate 42 is the same as the stage of the coating unit 3. A plurality of suction holes (not shown) are provided on the whole of the hot plate 42 and are connected to a vacuum pump (not shown). After the film F is moved to the drying unit 4 by the film arm 25 and placed on the hot plate 42, the vacuum pump is operated, and the film F is firmly vacuum-adsorbed on the hot plate 42. Then, the drying process is started in a state of being vacuum-adsorbed by the hot plate 42. When the sheet film F is heated for a predetermined time and the drying process is completed, the film arm 2 5 enters the drying unit 4 and the sheet film F is adsorbed and held, and the vacuum pump is stopped to release the vacuum adsorption of the hot plate 42. Then, the film F subjected to the drying treatment is carried out by the drying unit 4 by the film arm 2 5 and is carried to the next processing unit, that is, the transfer unit 5. F. Transfer unit 5: Fig. 12 is a schematic cross-sectional view showing a transfer unit provided in the film forming apparatus of Fig. 1. In Fig. 12, the inside of the transfer unit 5 may be

314408(修正版).ptc 第24頁 1234205 … _案號92103759 ^ 年J月(/日 修正__ — —- ~1 ~~ ^^ 五、發明說明(20) 真空排氣,而具備有形成用以實施SOG膜(薄膜)轉印處理 之室5 1 1之處理容器5 1。在此處理容器5 1之側面部設有排 氣口 5 1 2,且在此排氣口 5 1 2連接有真空泵5 2。此真空泵5 2 係與用以控制裝置全體之控制單元9電性連接,依照控制 單元9所發出之動作指令而作動,藉由排氣口 5 1 2將室5 1 1 内予以真空排氣。 在室51 1内配設有第1及第2板塊54、55,以及自動修 正第1板塊5 4相對於第2板塊5 5之傾斜度,以使形成在作為 薄膜形成對象之基板W與片膜F之SOG膜可全面受到均勻壓 力推壓之傾斜修正機構5 8。 第1板塊5 4為了與第2板塊5 5之軸線一致而藉由傾斜修 正機構5 8吊設於第2板塊5 5之上方,且在與第2板塊5 5相對 向之面(下面)裝設基板W而構成基板用板塊。因而,第1板 塊5 4之下面為確保平坦性而裝設經研磨之石英板(未圖 示),並在此石英板固定基板W。使用石英板之理由,係由 於石英不含污染基板W之物質,以及加工性良好易於獲得 所需之平坦性,因此適合作為安裝基板W之材料。第1板塊 5 4在其内部具備作為加熱裝置之加熱器5 4 1。此加熱器5 4 1 係與加熱器控制器5 4 2電性連接,且由根據來自控制單元9 之基板溫度訊號而作動之加熱器控制器5 4 2控制在2 5°C至 3 0 0°C之間加熱。 另一方之板塊,亦即第2板塊5 5係配設於第1板塊5 4之 下方,藉由在其上面裝設片膜F而構成膜用板塊。此第2板 塊5 5係由載置有片膜F之石英製之載物台,以及用以加熱 片膜F之加熱台所構成,且在加熱台之内部具有作為加熱314408 (revised version) .ptc page 24 1234205… _ case number 92103759 ^ year (/ day amendment __ — — — ~ 1 ~ ~ ^^ V. Description of the invention (20) Vacuum exhaust, and it has formed A processing container 5 1 in a chamber 5 1 1 for performing a SOG film (film) transfer process. An exhaust port 5 1 2 is provided on a side portion of the processing container 5 1 and is connected to the exhaust port 5 1 2 There is a vacuum pump 5 2. This vacuum pump 5 2 is electrically connected to a control unit 9 for controlling the entire device, and operates in accordance with an operation command issued by the control unit 9. The first and second plates 54 and 55 are arranged in the chamber 51 1, and the inclination of the first plate 5 4 with respect to the second plate 55 is automatically corrected so as to be formed as a film formation target. The tilt correction mechanism 5 8 of the SOG film of the substrate W and the sheet film F can be fully pressed by the uniform pressure. The first plate 5 4 is suspended by the tilt correction mechanism 5 8 in order to be consistent with the axis of the second plate 55. A substrate W is mounted above the second plate 55, and on a surface (lower surface) opposite to the second plate 55, thus constituting a substrate plate. A polished quartz plate (not shown) is installed under the plate 5 to ensure flatness, and the substrate W is fixed here. The reason for using the quartz plate is that quartz does not contain substances that contaminate the substrate W. And the workability is good, and it is easy to obtain the required flatness, so it is suitable as a material for the mounting substrate W. The first plate 5 4 is provided with a heater 5 4 1 as a heating device in the interior. This heater 5 4 1 is connected to a heater. The controller 5 4 2 is electrically connected, and is controlled by a heater controller 5 4 2 which is operated according to a substrate temperature signal from the control unit 9 to heat between 25 ° C and 300 ° C. The other side's plate That is, the second plate 5 5 is arranged below the first plate 5 4, and a film plate is formed by mounting a film F on the plate. The second plate 5 5 is formed by placing a film F It is composed of a quartz stage and a heating stage for heating the film F, and has heating inside the heating stage.

314408(修正版).ptc 第25頁 1234205 ^ 々、? _ 一 案號 92103759 /。年 β 月’日__ 五、發明說明(21) 裝置之加熱器551。此加熱器551係與加熱器控制器5 52電 性連接,由根據來自控制單元9之基板溫度訊號而作動之 加熱器控制器5 5 2控制在2 5°C至3 0 0°C之間加熱。f上& a 加熱口 之下面中央一體垂設有轴553。此軸55 3係藉由轴承$ g 1可 上下移動自如地支撐,並藉由作為加重機構之加重馬達 5 9 2沿著移動方向Z上下移動。 其次,對於傾斜修正機構5 8之構成,參照第丨2至丨4圖 予以詳述。第1 3圖為第1 2圖之C - C線剖視圖。第丨4圖係顯 示傾斜修正機構之部分切割斜視圖。在本實施例中,傾斜 修正機構5 8係配設成將第1板塊5 4之外周圍住之方式,藉 由朝與移動方向Z大致垂直之第1方向X延伸之第1軸構件 5 8 1連接於第1板塊5 4,並具備有:以第1旋轉軸a X 5為中心 將第1板塊5 4可旋轉自如地支撐之環狀之第1支撐體5 8 2 ; 以及配設於第1支撐體5 8 2之外周,藉由朝與移動方向2及 第1方向X大致垂直之第2方向Y延伸之第2軸構件583連接於 第1支撐體5 82,以第2旋轉轴AX6為中心將第1支樓體582可 旋轉自如支撐之第2支撐體584。在本實施例中,如第14圖 所示,在安裝於第1板塊5 4之基板W之表面,亦即薄膜形成 面1 1 2之面内,設有包括第1及第2旋轉轴a X 5、A X 6之各軸 構成 5 8 1、5 8 3。 在如此構成之傾斜修正機構5 8中,第1板塊係藉由第1 支撐體81以可在第1旋轉軸AX5周圍旋轉自如之方式支撐, 且藉由第2支撐體5 8 3以可在第2旋轉軸αχ6周圍旋轉自如之 方式支撐,利用所謂之轴旋轉,可使第1板塊5 4相對於移 動方向Z傾斜。314408 (revised version) .ptc page 25 1234205 ^?,? _ One case number 92103759 /. Year β month ’__ V. Description of the invention (21) Device heater 551. The heater 551 is electrically connected to the heater controller 5 52, and is controlled by a heater controller 5 5 2 which is operated according to a substrate temperature signal from the control unit 9 between 25 ° C and 300 ° C. heating. A shaft 553 is vertically integrated at the center below the f & a heating port. This shaft 55 3 is supported freely up and down by a bearing $ g 1, and is moved up and down in a moving direction Z by a weighting motor 5 9 2 as a weighting mechanism. Next, the structure of the tilt correction mechanism 58 will be described in detail with reference to FIGS. 2 to 4. Fig. 13 is a sectional view taken along line C-C in Fig. 12. Figure 4 is an oblique view showing a partial cut of the tilt correction mechanism. In this embodiment, the inclination correction mechanism 58 is arranged so as to surround the first plate 54 outside, and the first axis member 5 8 extends in the first direction X substantially perpendicular to the moving direction Z. 1 is connected to the first plate 5 4 and includes a ring-shaped first support body 5 8 2 that rotatably supports the first plate 5 4 around the first rotation axis a X 5; The outer periphery of the first support body 5 8 2 is connected to the first support body 5 82 by a second shaft member 583 extending in a second direction Y that is substantially perpendicular to the moving direction 2 and the first direction X, and the second rotation axis AX6 is a second supporting body 584 which can rotatably support the first branch body 582 as a center. In this embodiment, as shown in FIG. 14, a surface including a first and a second rotation axis a is provided on the surface of the substrate W mounted on the first plate 54, that is, the surface of the film formation surface 1 12. Each axis of X 5, AX 6 constitutes 5 8 1 and 5 8 3. In the tilt correction mechanism 58 constructed in this way, the first plate is supported by the first support 81 so as to be rotatable around the first rotation axis AX5, and is supported by the second support 5 8 3 The second rotation axis αχ6 is supported in a freely rotating manner, and the so-called axis rotation can tilt the first plate 54 with respect to the moving direction Z.

314408(修正版).pti 第26頁 1234205 π … __案號 92103759 / 年 ^ 月 / 日_____ 五、發明說明(22) 傾斜修正機構5 8之第2支撐體5 8 4係如第1 4圖所示,由 以將第1支撐體5 8 2在Y方向挾住之方式往方向Z延伸之2個 柱部5 84a、5 84b,以及將兩柱部584a、584b之上部予以連 結之梁部5 8 4 c所構成。從梁部5 8 4 c之中央部朝上方延設有 支柱部5 8 4 d,並吊掛在室5 1 1内。再詳細說明之,此支柱 部5 8 4 d係藉由軸承5 9 3可上下移動自如地支撐,其上端為 防止往下掉落而一體突設有凸緣5 9 4。第1 2圖中之符號5 9 5 係對應於凸緣5 9 4所設置之加重感測器,其係用以檢測施 加於基板W與片膜F間之加重值,並將該加重值送往控制單 元9 〇 其次說明使用上述轉印單元5之轉印處理工序。於本 實施例中,係在薄膜形成面丨丨2 (形成有電極配線等之應形 成薄膜之面)朝下之狀態下,利用基板用手臂2 4之基板支 撐塊2 4 5機械性支撐基板w,並將基板w從後述之反轉單元8 搬到轉印單元5,並以使薄膜形成面1丨2朝下之方式將基板 W裝设於第1板塊5 4之下面。在第2板塊5 5上面,以使S0G膜 朝上之方式裝設有其表面預先以塗布單元3塗布s 〇 G膜1 2 1 (參照第1 1圖)所形成之片膜F。然後,控制單元9係如下所 述控制裝置各部分’以將片膜F上之薄膜轉印於基板w。 首先’由加熱器控制器5 4 2通電於加熱器5 4 1以加熱第 1板塊5 4 ’而使基板w加熱到所希望之溫度,並且藉由加熱 器控制器5 5 2通電於加熱器5 5 1以加熱第2板塊5 5,而使片 膜下加熱到所希望之溫度。 以真空泵5 2進行真空排氣,以使室5 1 1内到達所希望 之真空度。室5 1 1内到達所希望之真空度之後,從控制單314408 (revised version). Pti Page 26 1234205 π… __ Case No. 92103759 / year ^ month / day _____ V. Description of the invention (22) Tilt correction mechanism 5 8 The second support 5 8 4 is as the first As shown in FIG. 4, two pillar portions 5 84a and 5 84b extending in the direction Z by holding the first support body 5 8 2 in the Y direction, and the upper portions of the two pillar portions 584a and 584b are connected. Beam portion 5 8 4 c. A pillar portion 5 8 4 d is extended upward from the central portion of the beam portion 5 8 4 c and is hung in the chamber 5 1 1. To explain in more detail, the pillar portion 5 8 4 d is supported by a bearing 5 9 3 so as to be able to move up and down freely. The upper end of the pillar portion 5 9 4 is integrally provided with a flange 5 9 4 to prevent falling down. The symbol 5 9 5 in FIG. 12 is a weighting sensor provided corresponding to the flange 5 9 4 and is used to detect the weighting value applied between the substrate W and the film F, and send the weighting value. Next, the control unit 9 will be described with reference to the transfer processing step using the transfer unit 5 described above. In this embodiment, the substrate support block 2 4 5 is used to mechanically support the substrate in a state where the film formation surface 丨 2 (the surface where the electrode wiring and the like should be formed) is facing downward. w, and the substrate w is transferred from the reversing unit 8 to the transfer unit 5 described later, and the substrate W is mounted below the first plate 54 so that the film formation surface 1 丨 2 faces downward. On the second plate 5 5, a sheet film F formed by coating the surface with a coating film 3 s 0 G film 1 2 1 (refer to FIG. 11) is installed so that the SOG film faces upward. Then, the control unit 9 controls each part 'of the device as described below to transfer the thin film on the sheet film F to the substrate w. First, the heater controller 5 4 2 is energized to the heater 5 4 1 to heat the first plate 5 4 to heat the substrate w to a desired temperature, and the heater controller 5 5 2 is energized to the heater. 5 5 1 to heat the second plate 5 5 to heat the film to the desired temperature. Vacuum is evacuated by the vacuum pump 5 2 so that the desired degree of vacuum is achieved in the chamber 5 1 1. After the desired degree of vacuum is reached in the chamber 5 1 1

314408(修正版).ptc 第27頁 1234205 , _案號 92103759 、年 _^1_日 倐 iL _ 五、發明說明(23) 元9將驅動訊號傳送至加重馬達5 9 2 ’而開始加重操作。藉 此,第2板塊5 5沿著移動方向Z上昇並將片膜F推壓至基板 W。此時,第1板塊5 4與傾斜修正機構5 8係藉由第2板塊5 5 一體被往上推。 進行該上推時,如第1板塊5 4相對於第2板塊5 5有所傾 斜,則當第2板塊5 5抵接於第1板塊5 4時,藉由傾斜修正機 構5 8將第1板塊5 4之傾斜予以自動修正。亦即,由於第以反 塊5 4係藉由傾斜修正機構5 8以可相對於移動方向z傾斜之 方式所保持,所以,例如在第1 2圖中往左方小角度傾斜 時,首先第2板塊5 5之左端側將接觸到第1板塊5 4,並將第 1板塊5 4往上推。因此,第1板塊5 4以存在於基板w之表面 内的第1旋轉軸AX5為旋轉中心朝順時針方向旋轉,使基板 W與片膜F之接觸面積往右方緩缓擴大。然後,第1板塊5 4 之傾斜被完全修正到與第2板塊5 5平行時,以均等壓力推 壓基板W與片膜F全面。 接著,藉由加重馬達5 9 2繼續加重,當由加重感測器 595栓測出所希望之加重時,控制單元9將控制加重馬達*° 5 9 2 ’使該加重持續一定時間。在此期間基板w與片膜F仍 加熱維持於預定之溫度。 上述一連之加重操作結束後,控制單元9將信號傳送 至加重馬達5 9 2,俾使加重狀態成為零。此時控制使真空 排氣停止。 ~ 如上所述,在轉印單元5中將80(}膜i 2丨轉印於基板w 基板W與片膜F將S0G膜(薄膜)挾在中間成為一體,並 藉由進入轉印單元5之基板用手臂2 4之吸附孔2 4 6至2 4 8將314408 (revised version) .ptc page 27 1234205, _case number 92103759, year _ ^ 1_ 日 倐 iL _ V. Description of the invention (23) Yuan 9 sends the drive signal to the weighting motor 5 9 2 'to start the weighting operation . Thereby, the second plate 55 rises in the moving direction Z and pushes the sheet film F to the substrate W. At this time, the first plate 54 and the tilt correction mechanism 58 are pushed up integrally by the second plate 5 5. When this push-up is performed, if the first plate 5 4 is inclined with respect to the second plate 5 5, when the second plate 5 5 is in contact with the first plate 5 4, the first plate 5 4 is adjusted by the tilt correction mechanism 5 8. The inclination of plate 54 is automatically corrected. That is, since the first inverse block 54 is held by the tilt correction mechanism 58 so as to be tiltable with respect to the moving direction z, for example, when tilting to the left at a small angle in FIG. 12, the first The left end of plate 2 5 will touch the first plate 5 4 and push the first plate 5 4 upward. Therefore, the first plate 54 is rotated clockwise with the first rotation axis AX5 existing in the surface of the substrate w as the rotation center, so that the contact area between the substrate W and the sheet film F is gradually enlarged to the right. Then, when the inclination of the first plate 5 4 is completely corrected so as to be parallel to the second plate 55, the substrate W and the sheet film F are pushed by the uniform pressure. Then, the weighting is continued by the weighting motor 5 92. When the weighting desired by the weighting sensor 595 is detected, the control unit 9 controls the weighting motor * ° 5 9 2 ′ to make the weighting last for a certain time. During this period, the substrate w and the sheet film F are still heated and maintained at a predetermined temperature. After the above-mentioned successive weighting operations are completed, the control unit 9 transmits a signal to the weighting motor 5 9 2 so that the weighting state becomes zero. Control stops vacuum exhaust. ~ As described above, in the transfer unit 5, the 80 () film i 2 丨 is transferred to the substrate w, the substrate W and the sheet film F, and the SOG film (thin film) is integrated into the middle, and it enters the transfer unit 5 by The substrate with the 2 2 suction holes 2 4 6 to 2 4 8 will

1234205 。、 f ^__鎌92103759 /、年,月/日 你不 五、發明說明(24) ' -- 一體化狀態之基板W予以吸附保持。亦即,使用基板用手 ’ 2 4之下方側保持機構將密接物(第1 5圖中之符號M所示 者,即藉由S0G膜1 2 1互相密接之基板W及片膜f )予以吸附 保持。然後,在此吸附保持狀態下基板用手臂24係將密接 物由室5 1 1搬運到剝離單元6。 山 G ·剝離單元6 : 弟1 5圖顯示設於第1圖之薄膜形成裝置之剝離單元之 圖。此剝離單元6具備有:其内部為處理室6 11之處理容哭 6 1 ;以及配置於此處理室6 11之下方,且用以真空吸附由 上述轉印單元5所形成之密接物Μ之片膜F之吸附板6 2 ;以 及在處理室6 1 1中,設於吸附板6 2之上方,可吸附載置於 吸附板6 2上之密接物Μ之基板W,而可在沿著上下方向(2方 向)及X方向之軸ΑΧ7周圍旋轉之基板吸附部63。在第丨5圖 中之符號1 1 1表示形成在基板薄膜形成面n 2之電極配 線。 在基板吸附部63連接有··為了使該基板吸附部63在轴 A X 7周圍旋轉,而採用旋轉型之汽缸等之旋轉機構6 4。而 且,在基板吸附部6 3設有昇降機構6 5。 昇降機構6 5具有:藉由汽缸等之驅動構件6 6,可相對 於基板吸附部6 3中之基板W之接觸面進退之銷6 7。當基板 吸附部6 3旋轉而使基板W呈朝上之狀態時,藉由使銷6 了上 昇則可使基板W上昇到基板吸附部6 3之上方。 在處理容器6 1之處理室6 11,設有未圖示之除電器, 而在處理室6 11内可形成臭氧(〇 3)環境氣體。 其次說明上述構成之剝離單元6之動作。藉由轉印單1234205. , F ^ __ sickle 92103759 /, year, month / day you are not 5. Description of the invention (24) '-The substrate W in an integrated state is adsorbed and held. That is, the substrate is held by the substrate's lower side holding mechanism by means of the substrate 2 (shown by the symbol M in FIG. 15, that is, the substrate W and the sheet film f that are closely adhered to each other by the SOG film 1 2 1). Adsorption remains. Then, the substrate arm 24 transfers the adherend from the chamber 5 1 to the peeling unit 6 in the suction-holding state. Shan G · Peeling unit 6: Figure 15 shows a diagram of the peeling unit of the thin film forming apparatus shown in Figure 1. This peeling unit 6 is provided with: a processing chamber 6 1 whose inside is a processing chamber 6 11; and a peeling unit 6 which is arranged below the processing chamber 6 11 and is used to vacuum-suck the seal M formed by the transfer unit 5 described above. The adsorption plate 6 2 of the sheet film F; and the substrate W provided above the adsorption plate 62 in the processing chamber 6 1 1 and capable of adsorbing the dense object M placed on the adsorption plate 62, The substrate adsorption portion 63 is rotated around the axis A × 7 in the up-down direction (two directions) and the X-direction. Symbols 1 1 1 in FIG. 5 indicate electrode wirings formed on the substrate film formation surface n 2. The substrate adsorption unit 63 is connected to a rotary mechanism 64 such as a rotary cylinder in order to rotate the substrate adsorption unit 63 around the axis A X 7. Furthermore, a lifting mechanism 65 is provided in the substrate suction section 63. The elevating mechanism 65 has a pin 67 capable of advancing and retreating with respect to the contact surface of the substrate W in the substrate adsorption portion 63 by a driving member 66 of a cylinder or the like. When the substrate adsorption portion 63 is rotated to make the substrate W face upward, the substrate W can be raised above the substrate adsorption portion 63 by raising the pin 6. A processing chamber 6 11 of the processing container 61 is provided with a non-illustrated static eliminator, and an ozone (0 3) ambient gas can be formed in the processing chamber 6 11. Next, the operation of the peeling unit 6 configured as described above will be described. By transfer slip

314408(修正版).ptc 第29頁314408 (Revised) .ptc Page 29

修正 1234205 、、f 月 __案號 92103759 Ί 五、發明說明(25) 元5並隔著S0G膜1 2 1貼合片膜F之基板W,亦即密接物Μ,係 藉由中心機器人2之基板用手臂2 4吸附保持’同時被搬入 到剝離單元6之處理室6 1 1内。此時’基板吸附部6 3會退避 到上方。基板用手臂24係使片膜F接觸於吸附板62,將密 接物Μ載置於吸附板6 2之後,退避到處理容器6 1之外。 吸附板6 2將片膜F予以吸附之同時,退避於上方之基 板吸附部6 3會下降並吸附基板W之背面(非薄膜形成面)。 又,將處理容器6 1關閉,並使除電器作動以使處理室6 1 1 内形成臭氧環境氣體之狀態。如此將片膜F予以吸附,並 藉由該片膜F將S0G膜121中之溶劑排出而使S0G膜121乾 燥。藉由此乾燥處理,片膜F與S0G膜1 2 1之界面和基板W與 SOG膜1 2 1之界面相比較,前者較能促進S0G膜1 2 1之乾燥且 較容易剝離。經過預定時間之後,基板吸附部6 3上昇時, 片膜F與S0G膜121之界面會剝離,於是s〇G膜會由片膜F轉 印於基板W。 其次,上昇之基板吸附部63係藉由旋轉機構64而旋轉 於軸ΑΧ7之周圍。而在基板之薄膜形成面i丨2朝向上方而 呈水平姿勢之狀態下,亦即在面朝上之狀態下停止。然 後,基板吸附部6 3解除對於基板f之吸附之同時,昇降 構65使基板W上昇。亦即,藉由驅動構件66使銷67上昇, 而使基板W由與基板吸附部6 3之接觸面往上昇。 鐘-已t幵;&之基*板/係稭由基板用手f 24搬運到下述之反 ί::二? 部ID之基板搬運機器人12收容於基 板收容匣11。 电 H.反轉單元8:Amend 1234205, f month __Case No. 92103759 发明 V. Description of the invention (25) Yuan 5 and the substrate W attached to the sheet F through the S0G film 1 2 1, that is, the tightly sealed object M, is made by the central robot 2 The substrate is sucked and held by the arm 2 4 while being carried into the processing chamber 6 1 1 of the peeling unit 6. At this time, the 'substrate adsorption portion 63 is retracted upward. The substrate arm 24 contacts the sheet film F to the adsorption plate 62, and after placing the adherend M on the adsorption plate 62, it retracts out of the processing container 61. At the same time as the adsorption plate 62 absorbs the sheet film F, the substrate adsorption portion 63, which has evacuated above, lowers and adsorbs the back surface (non-film-forming surface) of the substrate W. In addition, the processing container 61 is closed, and the static eliminator is operated so that an ozone ambient gas is formed in the processing chamber 61. The sheet film F is thus adsorbed, and the solvent in the SOG film 121 is discharged by the sheet film F, so that the SOG film 121 is dried. By this drying treatment, the interface of the sheet film F and the SOG film 1 2 1 and the interface of the substrate W and the SOG film 1 2 1 can promote the drying and peeling of the SOG film 1 2 1 more easily than the interface of the substrate W and the SOG film 1 2 1. After the lapse of a predetermined time, when the substrate adsorption portion 63 is raised, the interface between the sheet film F and the SOG film 121 is peeled off, so the soG film is transferred from the sheet film F to the substrate W. Next, the raised substrate suction portion 63 is rotated around the axis AX7 by the rotation mechanism 64. In the state where the film formation surface i2 of the substrate faces upward and is in a horizontal posture, that is, it stops with the surface facing upward. Then, while the substrate suction section 63 releases the suction of the substrate f, the lifting mechanism 65 raises the substrate W. That is, the pin 67 is raised by the driving member 66, and the substrate W is raised from the contact surface with the substrate adsorption portion 63. The bell-and-tick; & of the base plate / system straw is carried by the substrate with the hand f 24 to the following reverse ί :: two? The substrate transfer robot 12 with the ID is stored in the substrate storage box 11. Electricity H. Reversing unit 8:

1234205 案號 921037591234205 Case number 92103759

修正 五、發明說明(26) 第1 6圖係顯示設於第1圖之薄膜形成裝置之反轉單元 之構成圖’弟圖(a)為由上方俯視反轉單元之俯視圖, 第16圖(b)為第16圖(a)中D-D線之剖視圖。此反轉單元8具 有用來在與中心機器人2之基板用手臂2 4之間接收交付基 板W之一對基板夾爪8 1、8 1。此一對基板夾爪8 1、8 1係以 互相對向之方式間隔配置。而且’各基板夾爪8 1係安裝於 旋轉汽缸8 2之桿8 3之前端部,並隨桿8 3往X方向移動而往X 方向移動,且隨桿8 3之旋轉動作而在桿8 3周圍1 8 0。旋 轉。 因而,藉由標引部I D之基板搬運機器人丨2將未處理之 基板W搬運到相互隔開之基板夾爪8 1、8 1之間時,兩桿8 3 將伸長,如第1 6圖所示,一對基板夾爪8 1、8 1將基板W夾 持之後,基板搬運機器人1 2將退避。然後,兩桿8 3旋轉 18 0° 。於是,以面朝上之狀態,亦即以便形成於薄膜形 成面1 1 2之電極配線1 1 1朝上方之狀態被搬運而來之基板w 會反轉而形成面朝下之狀態。 另一方面,如上所述藉由在面朝上之狀態下以基板用 手臂2 4機械性保持之中心機器人2,將已形成薄膜之基板w 從剝離單元6搬到反轉單元8時,兩桿8 3將伸長,如第1 6圖 所示,一對基板夾爪8卜8 1僅將基板W夾持,不進行反轉 處理,而直接在基板搬運機器人1 2接收交付。 I.動作: 第1 7圖係顯示上述構成之薄膜形成裴置之全體動作之 圖,第1 7圖中之實線箭頭表示基板w之搬運順序,1點虛線 前頭表示片膜F之搬運順序,空心箭頭則表示密接物之搬Amendment V. Description of the invention (26) Figure 16 shows the structure of the reversing unit of the thin film forming device provided in Figure 1. 'Picture (a) is a top view of the reversing unit viewed from above, Figure 16 ( b) is a sectional view taken along the line DD in FIG. 16 (a). This reversing unit 8 has a pair of substrate clamping jaws 8 1, 8 1 for receiving and delivering one of the substrates W to and from the substrate arm 2 4 of the center robot 2. The pair of substrate clamping claws 81 and 81 are arranged at intervals so as to face each other. Moreover, each of the substrate clamping jaws 8 1 is installed at the front end of the rod 8 3 of the rotary cylinder 8 2 and moves in the X direction as the rod 8 3 moves in the X direction, and in the rod 8 as the rod 8 3 rotates. 3 around 1 8 0. Rotate. Therefore, when the unprocessed substrate W is transferred between the substrate clamping claws 8 1 and 81 by the substrate transfer robot ID 2 of the indexing part ID, the two rods 8 3 will be extended, as shown in FIG. 16 As shown, after a pair of substrate holding claws 8 1 and 81 hold the substrate W, the substrate carrying robot 12 will retreat. Then, the two rods 8 3 rotate 180 °. Then, the substrate w carried in the state of facing up, that is, the state where the electrode wiring 1 1 1 formed on the film forming surface 1 1 2 faces upward, is reversed to form the state of facing down. On the other hand, as described above, when the substrate robot w is mechanically held by the substrate arm 2 4 in a face-up state, the substrate w formed with the film is moved from the peeling unit 6 to the reversing unit 8. The rod 83 will be extended. As shown in FIG. 16, a pair of substrate clamping claws 81 and 81 will only hold the substrate W, and will not perform the inversion process, but directly receive and deliver the substrate transfer robot 12. I. Action: Figure 17 is a diagram showing the overall operation of the thin film formation structure described above. The solid line arrows in Figure 17 indicate the transportation order of the substrate w, and the front of the one-dotted dotted line indicates the transportation order of the film F. , The hollow arrow indicates the movement of the seal

314408(修正版).ptc 第31頁 1234205 __一^1103759__f 7 年 J 月 / g_修正 五、發明說明(27) 匣7 1。將位於膜收容匣7 1之最上部之片膜F以膜用手臂2 5 運。在此薄膜形成裝置中,在其表面形成有電極配線1丄1 之基板W係收容於基板收容匣n,且片膜ρ係收容於膜收容 驟 最 容 搬運到塗布單元3,在此片膜ρ之表面塗布S0G膜1 2 1 (步 S1 :塗布處理)。此時,如脫離片δΗ位於膜收容匣7 1之 上部時’以上述「c •膜供給單元(膜供給機構)7及膜收 E 7 1」之項所說明之動作次序將最上部之脫離片SH去除, 並使片膜F位於最上部之後,再將片膜F搬運到上述塗布單 元3,並進行塗布單元3之塗布處理。 與此片膜F之搬出及塗布處理並行,在標引部丨D中, 將藉由基板搬運機器人丨2而收容於基板收容匣丨丨之基板w 以面朝上之狀態予以取出,並搬運到反轉單元8。藉由反 轉單兀8將基板w予以反轉而形成面朝下狀態(步驟s2 :反 ,處理)。然後,以基板用手臂24之基板支撐塊245由反轉 單元8,收基板W並將其搬到轉印單元5,再裝設於轉印單 元5之第1板塊54之下面。如此,在本實施例中,藉由基板 用手臂24之上方側保持機構保持基板w,並將其從反轉 元8搬運到轉印單元5。 田塗敷處理結束時,藉由膜用手臂2 5將片膜由塗布單 元3搬到乾燥單元4,在此乾燥單元4中,使片膜ρ上面之 S0G膜121乾燥(步驟S3:乾燥處理)。此時,如無需進行乾 燥處,,則藉由膜用手臂2 5將片膜F由塗布單元3直接搬^ 轉印單元5,並將片膜F裝設於第2板塊5 5上。 如此’基板W及片膜F在轉印單元5分別安裝於第1及第 2板塊54、55時,則依上述「F·轉印單元5」之項所詳述之314408 (revised version) .ptc page 31 1234205 __ 一 ^ 1103759__f 7 years J month / g_ amendment V. Description of the invention (27) Box 71. The film F located at the uppermost part of the film storage box 71 is transported with the film arm 2 5. In this thin film forming apparatus, a substrate W having electrode wirings 1 丄 1 formed on its surface is stored in a substrate storage box n, and a film ρ is stored in a film storage step and is most preferably transported to the coating unit 3, where the film is The surface of ρ is coated with a SOG film 1 2 1 (step S1: coating process). At this time, if the release sheet δΗ is located on the upper part of the film storage box 7 1 ', the uppermost part is separated from the operation sequence described in the item "c • film supply unit (film supply mechanism) 7 and film receiving E 7 1". After the sheet SH is removed and the sheet film F is positioned at the uppermost part, the sheet film F is transported to the coating unit 3 described above, and the coating process of the coating unit 3 is performed. In parallel with the unloading and coating process of this film F, in the indexing section 丨 D, the substrate w stored in the substrate storage box 丨 丨 by the substrate transfer robot 丨 2 is taken out in a face-up state and transferred. Go to the reverse unit 8. The substrate w is inverted by the reversing unit 8 to form a face-down state (step s2: reverse, processing). Then, the substrate support block 245 of the substrate arm 24 receives the substrate W from the reversing unit 8 and transfers it to the transfer unit 5, and then installs it under the first plate 54 of the transfer unit 5. As described above, in this embodiment, the substrate w is held by the substrate holding mechanism 24 above the arm 24, and is transferred from the reversing unit 8 to the transfer unit 5. At the end of the field coating process, the sheet film is moved from the coating unit 3 to the drying unit 4 by the film arm 25, and in this drying unit 4, the SOG film 121 on the sheet film ρ is dried (step S3: drying process) ). At this time, if there is no need for a dry place, the sheet film F is directly transferred from the coating unit 3 to the transfer unit 5 by the film arm 25, and the sheet film F is mounted on the second plate 55. In this way, when the substrate W and the sheet film F are mounted on the first and second plates 54 and 55 respectively, the details are as described in the above item "F · Transfer Unit 5".

314408(修正版).ptc 第32頁 1234205 五、發明說明 案號 (28) 92103759314408 (revised version) .ptc page 32 1234205 V. Description of the invention Case number (28) 92103759

修正 動作順序,實施將S0G膜1 2 1轉印於基板W之處理(步驟S4 : 轉印處理)。 其次,使基板用手臂2 4進入轉印單元5,以手臂本體 2 4 3之下面側吸附保持基板W之後,以該吸附狀態將密接物 搬到剝離單元6。如此,由轉印單元5將密接物搬到剝離單 元6之搬運,係使用基板手臂2 4之下方側保持機構。 接著,僅將片膜F從搬到剝離單元6之密接物μ選擇性 剝離(步驟S 5 .剝離處理)。如此則可獲得在薄膜形成面 1 1 2僅形成SOG膜1 2 1之基板w。然後,將此基板W以面朝上 狀態,由基板用手臂24之基板支撐塊245予以保持,並將 基板W搬到反轉單元8。亦即,以基板用手臂2 4之上方側保 持機構貫施基板之搬運。至於已剝離之片膜F則予以丟 棄。 係在標 11 〇 如此’回到反轉單元8之已形成薄膜之基板W, 引部I D中利用基板搬運機器人丨2收容於基板收 J ·作用效果: 如上所述Correct the operation sequence, and perform the process of transferring the S0G film 1 2 1 to the substrate W (step S4: transfer process). Next, the substrate arm 2 4 is brought into the transfer unit 5, and the substrate W is sucked and held by the lower surface of the arm body 2 4 3, and then the adhered matter is transferred to the peeling unit 6 in the sucked state. In this manner, the transfer unit 5 transfers the adhered matter to the peeling unit 6 by using the lower side holding mechanism of the substrate arm 24. Next, only the sheet film F is selectively peeled from the adherend μ carried to the peeling unit 6 (step S5. Peeling process). In this way, a substrate w in which only the SOG film 1 2 1 is formed on the thin film formation surface 1 1 2 can be obtained. Then, the substrate W is held in a face-up state by the substrate support block 245 of the substrate arm 24, and the substrate W is transferred to the reversing unit 8. That is, the substrate is carried by the substrate holding mechanism 24 above the substrate holding mechanism. The peeled film F was discarded. In the standard 11 〇 In this way, the substrate W formed by the thin film is returned to the reversing unit 8. The substrate ID is used in the lead ID to accommodate the substrate in the substrate J. The effect is as described above.

、/ 很錁本實施例可獲得如下述之作用效果: 本發明之膜形成裝置’在工序部ppt,具有 基板[在塗布單/功能之中心機器人2將片膜w /或 置)4、轉印單元(塗布裝置)3、乾燥單兀(乾燥裝 間搬運,以進彳-^印裝置)5、及剝離單元(剝離裝置)6之 以無需藉由人片膜F將薄膜形成於基板W的步驟,所 而且,因在:ΐ Γ可進行使用片膜F之薄膜形成。 7,以將片膜F直接:設置膜供給單元(膜供給裝置) __ 接i、給至工序部ρρ,所以可提昇片膜F之The following effects can be obtained in this embodiment: The film forming device of the present invention has a substrate [in the process part ppt, and has a substrate [the central robot 2 in the coating sheet / function 2 will place the film w / or set) 4. Printing unit (coating device) 3. Drying unit (drying room to carry in-printing device) 5. Peeling unit (peeling device) 6. It is not necessary to form a thin film on the substrate W by a human film F In addition, since: ΐ Γ can be used to form a thin film using the sheet film F. 7, to directly direct the film F: set the film supply unit (film supply device) __ connected to i, to the process section ρρ, so the film F can be raised

314權(修正版)ptc 第33頁314 Rights (Revised Edition) PTC Page 33

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案號 921037M Μ 修正 年 五、發明說明(29) 搬運效率,隨之提升裝置之吞吐量。 部 (2)將中心機器人2固定配置於工序部pp之大致中央 並在此中心機器人2之周圍配置塗布單元(塗布' 置)3、乾燥單元(乾燥裝置)4、轉印單元(轉印裝置&、剝 ,單兀(剝離裝置)6、膜供給單元(膜供給裝置)7、及反轉 單兀8’且可使基板用手臂2 4或獏用手臂2 5直接進入各單 元3至8,所以無需設置中心機器人2之搬運路徑’ 於裝置之小型化。 5 ^ )中〜機盗人2具有上方側保持機構及下方側保持機 構,可以兩種保持樣態搬運基板?,而上述實施例 板W之狀態替換保持樣態。所以,可適應於基板?之狀能, 且可有效率地搬運基板。 “ (4)將片膜F上之S0G膜121轉印於基板w之薄膜形成面 112之轉印裝置,除了上述實施例所採用之轉印單元5之 外,亦可使用先前即已公開之種種裝置,例如日本專利特 開200卜1 35 6 34號公報所記載之裝置。然而,在本實施例 中,傾斜修正機構5 8係如上述「F ·轉印單元5」之項所詳 述,可使用藉由以2個旋轉軸AX5、AX6為旋轉」中心之軸旋 轉,而使第1板塊54可相對於上下方向z傾斜之轉印單元 5,所以如第1圖所示,可使乾燥單元4與轉印單元5在上下 方向Z重疊配置,因而可減低用以設置薄膜形成装置所需 之佔地面積,其理由如下。為了以均勻加重壓力將基板W 整面推壓至片膜F,而提案有將例如上述公報所記載之傾 斜修正機構,亦即藉由使第1板塊沿著凸板與凹板之球面 旋轉而進行傾斜修正之機構組裝轉印單元之方法,但此公Case No. 921037M Μ Amendment Year V. Invention Description (29) The handling efficiency will increase the throughput of the device. Section (2) The central robot 2 is fixedly disposed at approximately the center of the process section pp, and a coating unit (coating unit) 3, a drying unit (drying device) 4, and a transfer unit (transfer device) are arranged around the central robot 2. & Peel, unit (peeling device) 6, film supply unit (membrane supply device) 7, and reversing unit 8 'and allow the substrate arm 2 4 or the arm 2 5 to directly enter each unit 3 to 8, so there is no need to set the transport path of the central robot 2 'for miniaturization of the device. 5 ^) Medium ~ Robot Thief 2 has an upper holding mechanism and a lower holding mechanism, which can be used to carry the substrate in two ways? However, the state of the board W in the above embodiment is replaced and maintained. So, can it be adapted to a substrate? This makes it possible to efficiently carry the substrate. "(4) A transfer device for transferring the SOG film 121 on the sheet film F to the film formation surface 112 of the substrate w, in addition to the transfer unit 5 used in the above embodiment, a previously disclosed one may also be used. Various devices are described in, for example, Japanese Patent Laid-Open No. 200 1 35 6 34. However, in this embodiment, the tilt correction mechanism 58 is described in detail in the above-mentioned item "F · transfer unit 5". The transfer unit 5 can be used by rotating the two axes AX5 and AX6 as the center of rotation, so that the first plate 54 can be tilted relative to the vertical direction z, so as shown in Fig. 1, The drying unit 4 and the transfer unit 5 are arranged to overlap with each other in the up-down direction Z, so that the floor space required for installing the film forming apparatus can be reduced for the following reasons. In order to push the entire surface of the substrate W to the film F with a uniformly increasing pressure, for example, a tilt correction mechanism described in the above publication is proposed, that is, by rotating the first plate along the spherical surface of the convex plate and the concave plate, A method for assembling a transfer unit by a mechanism for performing tilt correction, but this public

1234205 / & _案號92103759 υ,年〆月/日 修正_ 五、發明說明(30) 開例會有在上下方向Z大型化之問題,而使轉印單元與乾 燥單元之積層配置在實際上有所困難。相對於此,藉由上 述實施例之轉印單元,則與習知之轉印單元相比較可大幅 降低轉印單元5之高度,並且可使乾燥單元4與該轉印單元 5在上下方向重疊配置,而可降低裝置之佔地面積。 (5 )由於係在片膜F之間介有脫離片SH之狀態下將片膜 F收容於膜收容匣7 1,所以可防止片膜彼此間之密接,可 確實地分離使用各片膜F。而且,由於脫離片SH位於膜收 容匣7 1之最上部,所以可有效防止片膜F受污染。再者, 在本實施例中,設有脫離片去除機構7 4,其係可將位於最 上部之脫離片SH予以去除之構造,因而可使片膜F位於膜 收容匣7 1之最上部,並且可輕易地從膜收容匣7 1將片膜F 取出。其結果,無需藉由人工操作即可依需要供給片膜 F,並且可有效率地供給片膜F。片膜F係樹脂製之薄膜狀 物或薄膜狀物。而脫離片SH係用以保護片膜F或抑制帶電 而夾於片膜F間之薄板狀物或薄膜狀物。其材料在帶電抑 制或發塵抑制之觀點上,以採用無塵紙為佳,其他採用 紙、樹脂等亦可。 (6 )由於膜收容匣7 1可相對於薄膜收容裝置裝卸自 如,所以可預先準備收容有片膜F之膜收容匣7 1,依需要 將膜收容匣7 1安裝於裝置以補給片膜F,並且可有效率地 供給片膜F。 (7 )藉由鼓風機使形成於膜用手臂2 5内部之内部空間 2 5 4成為負壓狀態,以使片膜F吸附保持於膜用手臂2 5,亦 即,提高排氣流量以對吸附孔施加負壓,所以,即使從吸1234205 / & _Case No. 92103759 υ, year / month / day correction_ V. Description of the invention (30) In the example, there will be a problem of large size in the vertical direction Z. The actual arrangement of the stacking unit of the transfer unit and the drying unit Somewhat difficult. In contrast, with the transfer unit of the above embodiment, compared with the conventional transfer unit, the height of the transfer unit 5 can be greatly reduced, and the drying unit 4 and the transfer unit 5 can be overlapped and arranged in the vertical direction. , Which can reduce the footprint of the device. (5) Since the sheet film F is stored in the film storage box 71 with the release sheet SH interposed between the sheet films F, it is possible to prevent the sheet films from being tightly connected to each other and to reliably separate and use each sheet film F. . Further, since the release sheet SH is located at the uppermost part of the film container 71, the film F can be effectively prevented from being contaminated. Furthermore, in this embodiment, a release sheet removing mechanism 74 is provided, which is a structure that can remove the release sheet SH located at the uppermost part, so that the film film F can be located at the uppermost part of the film storage box 71. Moreover, the sheet film F can be easily taken out from the film storage box 71. As a result, the sheet film F can be supplied as needed without manual operation, and the sheet film F can be efficiently supplied. The film F is a thin film or film made of resin. The release sheet SH is a thin plate-like or thin-film-like object for protecting the sheet film F or suppressing charging and sandwiching the sheet film F. From the standpoint of charging suppression or dust suppression, it is preferable to use dust-free paper, and other materials such as paper and resin are also acceptable. (6) Since the film storage box 71 can be freely attached to and detached from the film storage device, a film storage box 71 containing a film F can be prepared in advance, and the film storage box 71 can be installed in the device to replenish the film F as required. And, the film F can be efficiently supplied. (7) The internal space 2 5 4 formed inside the film arm 25 is brought into a negative pressure state by a blower, so that the sheet film F is adsorbed and held on the film arm 25, that is, the exhaust flow rate is increased to prevent the adsorption. The hole applies negative pressure, so even from suction

314408(修正版).ptc 第35頁 1234205 . r _案號92103759 年,月7日 修正_ 五、發明說明(31) 附孔2 4 6至2 4 8至鼓風機之排氣路徑之一部分發生洩漏時, 負壓雖僅減少對應於洩漏量的量,但仍可產生足夠吸附保 持片膜F之負壓,可穩定性佳地搬運片膜F,並且可有效率 地實施片膜之搬運。 K.其他: 本發明並非限定於上述實施例,只要不逸脫本發明之 意旨,則可進行上述以外之種種變更。例如,在上述實施 例中,如第1圖所示,雖係以中心機器人2為中心將處理單 元3至8配置成放射狀,但,中心機器2及各處理單元3至8 之配置佈局並非限定於此,即使將中心機器人2沿著搬運 路徑可移動自如地配置,並沿著搬運路徑在該搬運路徑之 兩側或一側配置處理單元3至8亦可。 再者,在上述實施例中,為實施片膜F之處理而設 置:實施塗布處理之塗布單元3、實施乾燥處理之乾燥單 元4、實施轉印處理之轉印單元5、及實施剝離處理之剝離 單元6,但除了此等單元之外為實施其他處理之單元,例 如組裝有對片膜F實施親水性表面處理之親水性處理用單 元,或相反地,刪除一部分單元亦可,亦即,本發明可適 用在設有用以處理片膜F之單元的所有薄膜形成裝置。 再者,在上述實施例中,雖係將相當於轉印裝置之轉 印單元5、相當於剝離裝置之剝離單元6分別以不同之其他 單元來構成,但設置兼具轉印裝置與剝離裝置之單元以取 代單元5、6之薄膜形成裝置亦可適用本發明。 再者,在上述實施例中,雖係在轉印單元5之上下方 向Z將乾燥單元4積層配置,但亦可將乾燥單元4相對於其314408 (revised version) .ptc page 35 1234205. r _ case number 92103759 amended on July 7 _ V. Description of the invention (31) Attachment holes 2 4 6 to 2 4 8 to a part of the exhaust path of the blower leaks At this time, although the negative pressure only reduces the amount corresponding to the amount of leakage, it can still generate a negative pressure sufficient to adsorb and hold the sheet film F, can carry the sheet film F with good stability, and can efficiently carry the sheet film. K. Others: The present invention is not limited to the above-mentioned embodiments, and various changes other than the above can be made as long as they do not depart from the spirit of the present invention. For example, in the above embodiment, as shown in FIG. 1, although the processing units 3 to 8 are arranged radially with the center robot 2 as the center, the arrangement layout of the center machine 2 and each processing unit 3 to 8 is not It is limited to this, even if the center robot 2 is movably arranged along the conveyance path, and the processing units 3 to 8 may be arranged on both sides or one side of the conveyance path along the conveyance path. Furthermore, in the above-mentioned embodiment, it is provided for the treatment of the sheet film F: the coating unit 3 that performs the coating process, the drying unit 4 that performs the drying process, the transfer unit 5 that performs the transfer process, and the peeling process The peeling unit 6 is a unit for performing other treatments besides these units, for example, a unit for hydrophilic treatment for performing a hydrophilic surface treatment on the sheet film F is assembled, or conversely, a part of the units may be deleted, that is, the unit The invention is applicable to all thin film forming apparatuses provided with a unit for processing the sheet film F. Furthermore, in the above-mentioned embodiment, although the transfer unit 5 corresponding to the transfer device and the peel unit 6 corresponding to the peeling device are configured by different units, respectively, both the transfer device and the peeling device are provided. The present invention can also be applied to a thin film forming apparatus in which units are replaced with units 5 and 6. Furthermore, in the above-mentioned embodiment, although the drying unit 4 is laminated and disposed toward Z above and below the transfer unit 5, the drying unit 4 may be opposed to it.

314408(修正版).ptc 第36頁 1234205314408 (revised version) .ptc page 36 1234205

五、發明說明(32) 二處理單元積層配置,或使乾燥單元4獨立配i,將乾燥 :兀獨立配置時1可將複數之乾燥單元4一併積層配 。至於無而乾紐處理時,當然亦可單元4之配 設。 再f,中心機器人2具有2種保持樣態,且具有可依基 板之狀態替換保持樣態並搬運基板或可同時搬運2牧基板 之特徵,其係相當於本發明之搬運機構。在上述實施例 中’利用此特徵而冑中心機器Λ 2適用於薄膜形成裝置, 但本發明之搬運機構,可適用於具有基板搬運之所有裝 置,而可獲得上述之效果(3),亦即,適應於基板之狀 態,且可獲得有效率地搬運基板之效果。 再者,本發明遘合在具有凹凸圖案之基板的凹部未形 成空隙而壓接薄膜,並使薄膜表面平坦之處理。例如,在 具有金屬等配線圖案之基板形成作為層間絕緣膜之s〇D膜 或S0G膜時,,或在接觸孔等之孔或具有溝形狀之基板埋入 導電性之薄膜時之處理。 再者,本發明除了適用於半導體晶圓或液晶面板用玻 璃基板之外,不但可適用於光掩膜用玻璃基板、電漿顯示 用玻璃基板、光碟用基板等基板形成薄膜時,亦可適用於 1C卡或太陽能電池裝置之製造等。 [發明之效果] 如上所述,根據本發明之薄膜形成裝置,係在工序部 中,利用搬運裝置將片膜及/或基板在塗在、 置、及剝離裝置之間進行搬運,以谁t姑、置 轉P衣 /上^ 心间退仃叛連以進仃使用片膜而將薄膜 形成於基板之㈣’所以,無需藉由人工操作,即可實現V. Description of the invention (32) The two processing units are stacked, or the drying unit 4 is independently equipped with i, and the drying is performed: When the drying unit 4 is independently configured, a plurality of drying units 4 can be stacked and arranged together. As for the non-stop operation, it is of course also possible to configure the unit 4. Furthermore, the central robot 2 has two types of holding patterns, and has the characteristics that the substrates can be replaced and held according to the state of the substrate, and the substrate can be transported at the same time, which is equivalent to the carrying mechanism of the present invention. In the above-mentioned embodiment, 'the center machine Λ 2 is applied to a thin film forming apparatus using this feature, but the conveyance mechanism of the present invention can be applied to all apparatuses having substrate conveyance, and the above-mentioned effect (3) can be obtained, that is , Adapt to the state of the substrate, and can obtain the effect of efficiently transporting the substrate. Furthermore, the present invention is a process in which a film is crimped without forming a void in a recessed portion of a substrate having a concave-convex pattern, and the surface of the film is flattened. For example, when a substrate having a wiring pattern such as a metal is formed as a SOD film or a SOG film as an interlayer insulating film, or when a conductive film is buried in a hole such as a contact hole or a substrate having a groove shape, the conductive film is processed. In addition, the present invention is applicable not only to semiconductor wafers or glass substrates for liquid crystal panels, but also to substrates such as photomask glass substrates, plasma display glass substrates, and optical disk substrates. In the manufacture of 1C cards or solar cell devices. [Effect of the Invention] As described above, according to the thin film forming apparatus of the present invention, the sheet film and / or the substrate are transported between the coating, placing, and peeling device by the conveying device in the process section. It ’s easy to use a film to form a thin film on the substrate. So, it can be achieved without manual operation.

314408(修正版)· ptc 第37頁 1234205 案號92〗03759 五、發明說明(33) 使用片膜之薄膜形成。而且, 以將片膜直接供給至工序部, 率,並且可提昇吞吐量。 再者,根據本發明之膜供 將最上部之脫離片由膜收容厘 之最上部,以使片膜可從膜收 年314408 (revised version) · ptc page 37 1234205 case number 92〗 03759 V. Description of the invention (33) It is formed by using a thin film. In addition, by directly supplying the sheet film to the process section, the throughput can be improved. Furthermore, the film according to the present invention provides the uppermost release sheet from the uppermost part of the film receiving film so that the film can be collected from the film.

操作即可有效率地供給片膜 再者,根據本發明之膣 機排氣吸附保持# _ 片膜,並且可有效率^孤運 i I t 手地貫施片 ’根據本發明 於係以互為不同之樣能保f板 之狀態替換保持能心保持基 丰地貫施基板之搬運。 仕工序部設置膜供給裝置 所以可提高片膜之搬運效 給機構及膜收容匣,由於係 ^除’使片膜位於膜收容匣 谷厘取出,所以無需藉由人 之搬運機構,因於藉由鼓風 片膜,所以穩定性佳地搬運 膜之搬運。 之搬運機構及搬運方法,由 板並予以搬運,且可依基板 可適應於基板之狀態,並且 ❿The film can be efficiently supplied by operation. Furthermore, according to the invention, the exhaust gas adsorption and maintenance of the film # _ film, and can efficiently apply the film manually according to the present invention. Replace the board with a different one to maintain the state of the f-board. The film processing device is provided in the process section to improve the film transport efficiency to the mechanism and the film storage box. Because the film is located in the film storage box and removed, it is not necessary to use a person's transport mechanism. The film is blown by the blower, so the film can be transported with good stability. The transport mechanism and transport method are carried by the board and can be adapted to the state of the board according to the board.

第38頁 1234205 _μ Ί _案號92103759 / 年。月/日 修正_ 圖式簡單說明 [圖式簡單說明] 第1圖顯示本發明之薄膜形成裝置之一實施例之配置 圖。 第2圖(a)及(b)顯示中心機器人之圖。 第3圖(a )及(b )顯示構成第2圖之中心機器人之基板用 手臂之構成圖。 第4圖(a)及(b)顯示構成第2圖之中心機器人之膜用手 臂之構成圖。 第5圖顯示設於第1圖之薄膜形成裝置之膜供給單元之 構成圖。 第6圖係設於第1圖之薄膜形成裝置之膜收容匣之分解 組裝斜視圖。 第7圖顯示設於第5圖之膜供給單元之脫離片去除機構 之斜視圖。 第8圖(a)至(c)顯示第5圖之膜供給單元之動作的圖。 第9圖(a)及(b)顯示第5圖之膜供給單元之動作的圖。 第1 0圖顯示設於第1圖之薄膜形成裝置之塗布單元之 構成圖。 第1 1圖顯示設於第1圖之薄膜形成裝置之乾燥單元之 圖。 第1 2圖顯示設於第1圖之薄膜形成裝置之轉印單元之 概略剖視圖。 第1 3圖係第1 2圖中C-C線之剖視圖。 第1 4圖顯示設於第1 2圖之轉印單元之傾斜修正機構之Page 38 1234205 _μ Ί _ Case No. 92103759 / year. Month / Day Modification _ Brief Description of Drawings [Simplified Illustration of Drawings] Fig. 1 shows a configuration diagram of an embodiment of the thin film forming apparatus of the present invention. Figures 2 (a) and (b) show the central robot. Figures 3 (a) and (b) show the structure of the arm for the substrate of the center robot shown in Figure 2. Figures 4 (a) and (b) show the structure of the hand arm of the membrane constituting the center robot of Figure 2. Fig. 5 is a configuration diagram of a film supply unit provided in the film forming apparatus of Fig. 1. Fig. 6 is an exploded perspective view of a film storage box provided in the film forming apparatus of Fig. 1; Fig. 7 is a perspective view showing a release sheet removing mechanism provided in the film supply unit of Fig. 5; Figures 8 (a) to (c) are diagrams showing the operation of the film supply unit of Figure 5. Figures 9 (a) and (b) are diagrams showing the operation of the film supply unit of Figure 5. Fig. 10 shows a configuration diagram of a coating unit provided in the thin film forming apparatus shown in Fig. 1. Fig. 11 is a view showing a drying unit provided in the film forming apparatus of Fig. 1. Fig. 12 shows a schematic sectional view of a transfer unit provided in the film forming apparatus of Fig. 1. Figure 13 is a sectional view taken along the line C-C in Figure 12. Figure 14 shows the tilt correction mechanism of the transfer unit shown in Figure 12

314408(修正版).ptc 第39頁 1234205 。 > _案號92103759 /年β月 日 修正_ 圖式簡單說明 部分切割斜視圖。 第1 5圖顯示設於第1圖之薄膜形成裝置之剝離裝置之 圖。 第16圖(a)及(b)顯示設於第1圖之薄膜形成裝置之反 轉單元之構成圖。 第1 7圖顯示第1圖之薄膜形成裝置之整體動作的圖。 第1 8圖(a)至(d)顯示習知薄膜形成裝置中之薄膜形成 順序之圖。 [主要元件符號說明] 2 中心機器人(搬運機構) 3 塗布單元(塗布裝置 4 乾燥單元(乾燥裝置) 5 轉印單元(轉印裝置 6 剝離單元(剝離裝置) 7 膜供給單元(膜供給裝置 、膜供給機構) 8 反轉單元 9 控制單元 11 基板收容匣 21 機器人本體 11、 23 多關節手臂(驅動部) 24 基板用手臂(基板用保持 部) 25 膜用手臂(膜用保持部) 31 載物台 32 旋轉軸 33 SOG液用喷嘴 34 洗淨液用喷嘴 35 飛散防止環 54 弟1板塊(基板用板塊) 55 第2板塊(膜用板塊) 58 傾斜修正機構 62 吸附板 63 吸附部 64 旋轉機構 65 昇降機構 66 驅動構件 67 銷 71 膜收容匣314408 (revised) .ptc p.39 1234205. > _Case No. 92103759 / Year β Month Day Amendment _ Brief description of the drawing Partial cut oblique view. Fig. 15 is a view showing a peeling apparatus provided in the film forming apparatus shown in Fig. 1. Figures 16 (a) and (b) are diagrams showing the configuration of a reversing unit of the thin film forming apparatus shown in Figure 1. Fig. 17 is a diagram showing the overall operation of the thin film forming apparatus of Fig. 1; Figs. 18 (a) to (d) are diagrams showing a sequence of film formation in a conventional film forming apparatus. [Description of main component symbols] 2 Central robot (conveying mechanism) 3 Coating unit (coating device 4 Drying unit (drying device) 5 Transfer unit (transfer device 6 Peeling unit (peeling device) 7 Film supply unit (film supply device, Film supply mechanism) 8 reversing unit 9 control unit 11 substrate storage box 21 robot body 11, 23 multi-joint arm (driving part) 24 substrate arm (substrate holding part) 25 film arm (substrate holding part) 31 Stage 32 Rotary shaft 33 Nozzle for SOG liquid 34 Nozzle for cleaning liquid 35 Anti-scattering ring 54 Plate 1 (substrate plate) 55 Second plate (membrane plate) 58 Tilt correction mechanism 62 Suction plate 63 Suction section 64 Rotation Mechanism 65 Lifting mechanism 66 Drive member 67 Pin 71 Film storage cassette

314408(修正版).ptc 第40頁 1234205 案號 92103759 圖式簡單說明314408 (revised version) .ptc page 40 1234205 case number 92103759 simple illustration

72 74 76 ΊΊ、 79 82 111 121 243〜 245 246、 249 252 2 5 3a 255 257 412、 42卜 542、 58卜 584 592 595 712 714 匣載置台 脫離片去除機構 電離器 旋轉汽缸 電極配線 SOG膜(薄膜) 251 手臂本體 溝部(下方侧保持機構) 環構件 • 2 5 6 a 貫穿孔 支柱構件 環板塊 4 1 3氮氣導入〇 541、551加熱器 M2加熱器控制°器 5 8 3 軸構件 第2支撐體 加重馬達(加重機構) 加重感測器 支位銷 突出部 曰 修正 73 蓋開閉驅動 c裝置 ) 裝置 ) 81 基板夾爪 83 桿 112 薄膜形成面 24卜 2 4 2板塊 244 翼部 :構) (下方側保持機構 251a 連通孔 253 板塊構件 254 内部空間 256 概墊 411 處理室 414〜 5 1 2 排氣口 511 室 553 軸 582 第1支撐體 591 轴承 594 凸線 711 匣本體 713 保護蓋 715 插入孔72 74 76 ΊΊ, 79 82 111 121 243 ~ 245 246, 249 252 2 5 3a 255 257 412, 42b 542, 58b 584 592 595 712 714 Cassette stage release sheet removal mechanism Ionizer rotating cylinder electrode wiring SOG film ( Film) 251 Arm body groove (lower side retaining mechanism) Ring member • 2 5 6 a Through-hole pillar member Ring plate 4 1 3 Nitrogen gas introduction 541, 551 heater M2 heater control ° 5 8 3 Second support of shaft member Body weighting motor (weighting mechanism) Weighting sensor support pin projections are corrected 73 cover opening and closing drive c device) device) 81 substrate clamp 83 lever 112 film forming surface 24 2 2 2 2 plate 244 wing: structure) ( Lower side holding mechanism 251a, communication hole 253, plate member 254, internal space 256, general pad 411, processing chamber 414 to 5 1 2 exhaust port 511, chamber 553 shaft 582 first support 591 bearing 594 convex wire 711 box body 713 protective cover 715 insertion hole

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Claims (1)

1234205 、 r 7 _案號92103759 / ’年〆月/日 修正_ 六、申請專利範圍 1. 一種薄膜形成裝置,其係具備有: 使用片膜而在基板形成薄膜之工序部;以及供給 基板至上述工序部之標引部;其中, 上述工序部包括有: 用以供給片膜之膜供給裝置; 在上述膜供給裝置所供給之片膜表面塗布薄膜用 塗布液以形成薄膜之塗布裝置; 使已形成薄膜之片膜與上述標引部所供給之基板 相密接而形成密接物,以將上述薄膜轉印於上述基板 之轉印裝置; 由上述密接物剝離上述片膜之剝離裝置;以及 在上述膜供給裝置、上述塗布裝置、上述轉印裝 置、及上述剝離裝置之間搬運片膜及/或基板之搬運裝 置。 2. 如申請專利範圍第1項之薄膜形成裝置,其中,上述膜 供給裝置、上述塗布裝置、上述轉印裝置、及上述剝 離裝置係配設於上述搬運裝置之周圍。 3. 如申請專利範圍第1項之薄膜形成裝置,其中,在上述 工序部中,上述搬運裝置可沿著搬運路徑移動自如, 而且,沿著上述搬運路徑,將上述膜供給裝置、上述 塗布裝置、上述轉印裝置、及上述剝離裝置配設於上 述搬運路徑之兩側。 4. 如申請專利範圍第1項之薄膜形成裝置,其中,在上述 工序部中,上述搬運裝置可沿著搬運路徑移動自如,1234205, r 7 _ Case No. 92103759 / 'Year / Month / Day Amendment_' VI. Patent application scope 1. A thin film forming apparatus comprising: a process section for forming a thin film on a substrate using a sheet film; and supplying the substrate to The indexing section of the above-mentioned process section; wherein the above-mentioned process section includes: a film supply device for supplying a sheet film; a coating device for applying a coating solution for a film on the surface of the sheet film supplied by the film supply device to form a film; A film forming film is in close contact with a substrate supplied by the indexing portion to form a sealing material, a transfer device for transferring the film to the substrate; a peeling device for peeling the film film from the sealing material; and The film supply device, the coating device, the transfer device, and the transfer device that transfers a sheet film and / or a substrate between the peeling device. 2. The thin film forming apparatus according to item 1 of the patent application scope, wherein the film supply device, the coating device, the transfer device, and the peeling device are arranged around the conveying device. 3. The thin film forming apparatus according to item 1 of the patent application range, wherein in the process section, the conveying device can move freely along a conveying path, and further, the film supplying device and the coating device are provided along the conveying path. The transfer device and the peeling device are disposed on both sides of the transport path. 4. For example, the thin film forming apparatus of the scope of application for a patent, wherein in the process section, the conveying device can move freely along the conveying path, 314408(修正版).ptc 第43頁 1234205 六、申請專利範圍 __ 塗布裝^考f述搬運路徑,將上述膜供給裝置、上述 述搬運路徑之印裝置、及上述剝離裝置配設於上 •::請專利範圍二丨至4項之任一項 其中, ^ 1 貝之潯膜形成裘置, 上述拣i運裝置且借右·用 保持部;用以侔姓;、備有·肖保持上述片膜之膜用 t述膜用保持部及上述基板用保持部移:以及使 述片膜及上述基板之驅動部;f M多動,以搬運上 上述基板用保持部具有··手臂 本體之上面側㈣基板之上方侧料Z盖在上述手臂 述手臂本體之下面側保持基板之下技以及在上 6. 如申請專利範圍第!至4項之任一 $保持機構。 其中更具備有:與上述塗布裝置及溥膜形成裝置, 上述剝離裝置中之一個裝置^上上述轉印裴置以及 用以使塗布於上述片膜表 =重叠配置,且 燥裝置。 用塗布液乾燥之乾 7. 如申請專利範圍第5項之薄 有:與上述塗布裝置及上述:印成/置置,其中更具備 8 於上述片膜表面之薄膜用塗二=置,且用以使涂^ 如申請專利範圍第6項之薄膜形^ c燥之乾燥裝置: 上述轉印裝置,係可沿著/上成表置’其中, 自如地相對向配設,並在其 下方向互相相到·梦& '、Y之一方之;T夕動 板塊之對向面314408 (Revised version) .ptc Page 43 1234205 6. Application scope of patents __ Coating equipment ^ Consider the conveying path described above, and arrange the film supply device, the printing device of the conveying path, and the peeling device. :: Please use any one of the patent scope 2 丨 to 4 of them, ^ 1 The film of the shell is formed, and the above-mentioned picking and transporting device is borrowed from the right holding unit; the last name is used; The film film and the film holding section and the substrate holding section are moved: and the film film and the substrate driving section are moved; f M is multi-moved to carry the substrate holding section with the arm body. The upper side of the base plate and the upper side material Z cover the lower side of the arm body and the lower side of the arm body to hold the lower side of the substrate and the upper 6. If the scope of patent application is the first! Any of up to 4 $ holding institutions. It further includes: the above-mentioned coating device and the film-forming device, one of the above-mentioned peeling devices, the above-mentioned transfer printing device, and the above-mentioned sheet and film coating device, and a drying device. Drying with coating liquid 7. If the thickness of item 5 in the scope of the patent application is as follows: with the above coating device and above: print / placement, which has more than 8 films on the surface of the above-mentioned film. In order to make the coating ^ such as the film shape of the patent application No. 6 ^ c dry drying device: the above-mentioned transfer device can be placed along / upper surface, where it can be freely arranged in the opposite direction, and in the lower direction Come to each other · Dream & 'One of the Y; Opposite side of the T Xi moving plate 1234205 ο、… _案號92103759 丨…7年’1月/日 修正_ 六、申請專利範圍 裝設基板,而且具備有:將具有薄膜之片膜裝設於另 一方之板塊之對向面之第1及第2板塊;將上述第1及第 2板塊中之至少一方沿著上述移動方向移往另一側,以 將上述基板與上述片膜推壓預定時間,以使上述薄膜 轉印於上述基板之加重機構;以及具有下述之第1及第 2支撐體,以可相對於上述移動方向傾斜自如之方式保 持上述第1板塊,以自動修正相對於上述第2板塊之相 對傾斜度之傾斜修正機構; 上述乾燥裝置係與上述轉印裝置在上下方向重疊 配置, 上述第1支撐體係以圍繞上述第1板塊之外周的方 式配設,以朝與上述移動方向大致垂直之第1方向延伸 之第1旋轉軸為中心,將上述第1板塊予以可旋轉自如 地支撐, 上述第2支撐體係配設於上述第1支撐體之外周, 以朝與上述移動方向及上述第1方向大致垂直之第2方 向延伸之第2旋轉軸為中心,將上述第1支撐體可旋轉 自如地予以支撐。 9.如申請專利範圍第7項之薄膜形成裝置,其中, 上述轉印裝置,係可沿著上下方向互相相對移動 自如地相對向配設,並在其中之一方之板塊之對向面 裝設基板,而且具備有:將具有薄膜之片膜裝設於另 一方之板塊之對向面之第1及第2板塊;將上述第1及第 2板塊中之至少一方沿著上述移動方向移往另一側,以1234205 ο, ... _ Case No. 92103759 丨 ... 7 years' January / Jan. Amendment_ Sixth, the scope of the patent application is to install the substrate, and it is equipped with: a film with a thin film installed on the opposite side of the other plate First and second plates; moving at least one of the first and second plates along the moving direction to the other side to push the substrate and the sheet film for a predetermined time so that the film is transferred to The weighting mechanism of the substrate; and the first and second support bodies described below, which hold the first plate in a manner capable of tilting freely with respect to the moving direction to automatically correct the relative inclination of the second plate with respect to the second plate. Tilt correction mechanism; The drying device is arranged to overlap the transfer device in the up-down direction, and the first support system is arranged to surround the outer periphery of the first plate, and extends in a first direction substantially perpendicular to the moving direction. The first rotation axis is the center, and the first plate is rotatably supported. The second support system is arranged on the outer periphery of the first support to move toward the above. To the first direction and the second direction substantially perpendicular to the second rotational shaft extending to the center, to the first support member is supported to be freely rotatable. 9. The thin film forming device according to item 7 of the scope of the patent application, wherein the above-mentioned transfer device is arranged opposite to each other in a freely movable manner along the up-down direction, and is installed on the opposite side of one of the plates A substrate, further comprising: a first and a second plate in which a sheet having a thin film is installed on the opposite side of the other plate; and at least one of the first and the second plate is moved in the moving direction to On the other side, with 314408(修正版).ptc 第45頁 1234205 p 7 _案號92103759 V年c月 /日 修正_ 六、申請專利範圍 將上述基板與上述片膜推壓預定時間,以使上述薄膜 轉印於上述基板之加重機構;以及具有下述之第1及第 2支撐體,以可相對於上述移動方向傾斜自如之方式保 持上述第1板塊,以自動修正相對於上述第2板塊之相 對傾斜度之傾斜修正機構; 上述乾燥裝置係與上述轉印裝置在上下方向重疊 酉己置, 上述第1支撐體係以圍繞上述第1板塊之外周的方 式配設,以朝與上述移動方向大致垂直之第1方向延伸 之第1旋轉軸為中心,將上述第1板塊予以可旋轉自如 地支撐, 上述第2支撐體係配設於上述第1支撐體之外周, 以朝與上述移動方向及上述第1方向大致垂直之第2方 向延伸之第2旋轉軸為中心,將上述第1支撐體可旋轉 自如地予以支擔。 1 0. —種膜供給機構,係使用在使用片膜而在基板形成薄 膜之薄膜形成裝置且用以供給上述片膜之膜供給機 構,其包括有: 在片膜之間介有脫離片之狀態之下收容上述片膜 之膜收容匣;以及 藉由將位於上述膜收容E最上部之脫離片從上述 膜收容匣予以去除,以使片膜位於上述膜收容匣之最 上部之脫離片去除裝置。 11.如申請專利範圍第1 〇項之膜供給機構,其中,在上述314408 (revised version) .ptc Page 45 1234205 p 7 _ Case No. 92103759 Rev. c / day V_ Application for patent scope Push the substrate and the sheet film for a predetermined time to transfer the film to the above Substrate weighting mechanism; and having the following first and second support bodies, the first plate is held in such a manner as to be able to tilt freely with respect to the moving direction to automatically correct the tilt of the relative tilt with respect to the second plate Correction mechanism; the drying device is overlapped with the transfer device in an up-down direction, and the first support system is arranged to surround the outer periphery of the first plate so as to be in a first direction substantially perpendicular to the moving direction The extended first rotation axis is the center, and the first plate is rotatably supported. The second support system is arranged on the outer periphery of the first support body so as to be substantially perpendicular to the moving direction and the first direction. The second rotation axis extending in the second direction is centered, and the first support body is rotatably supported. 1 0. —The seed film supply mechanism is a film supply mechanism for supplying a thin film using a thin film forming device that forms a thin film on a substrate using a thin film, and includes: a release sheet interposed between the thin films; A film storage box that stores the above-mentioned film film in a state; and removing the release sheet located at the uppermost part of the film storage E from the film storage box so that the release film that is located at the uppermost part of the film storage box is removed Device. 11. The film supply mechanism according to item 10 of the patent application scope, wherein 314408(修正版).ptc 第46頁 1234205 a 、,) _案號92103759 / 年 < 月 > 日 修正_ 六、申請專利範圍 膜收容匣開閉自如地設有用以保護所收容之片膜之保 護蓋時, 更設置有用以開閉上述保護蓋之蓋開閉裝置。 1 2 .如申請專利範圍第1 0或1 1項之膜供給機構,其中更包 括有:用以回收由上述膜收容匣所去除之脫離片之脫 離片回收裝置。 1 3. —種膜收容匣,係使用在將薄膜形成於基板之薄膜形 成裝置且用以收容片膜之膜收容匣,其包括有: 在片膜之間介有脫離片之狀態下可收容複數個片 膜之匣本體;以及, 與收容於上述匣本體之片膜及脫離片之周緣部相 扣合,以使片膜及脫離片相對於上述E本體進行定位 之定位構件。 1 4.如申請專利範圍第1 3項之膜收容匣,其中更包括有: 相對於上述匣本體開閉自如地裝設,於關閉狀態下從 上方覆蓋收容於上述匣本體之片膜及脫離片並加以保 護,而於開放狀態下可將收容於上述匣本體之片膜及 脫離片由上方搬出之保護蓋。 1 5 .如申請專利範圍第1 3或1 4項之膜收容匣,其中,相對 於上述薄膜形成裝置可裝卸自如。 1 6. —種搬運機構,係使用在使用片膜以形成薄膜之薄膜 形成裝置且用以搬運上述片膜之搬運機構,其包括 有: 在與片膜抵接之抵接領域設有吸附孔之膜用手314408 (revised version) .ptc page 46 1234205 a ,,) _ case number 92103759 / year < month > day amendment _ 6, patent application scope The film storage box can be opened and closed freely to protect the film For the protective cover, a cover opening and closing device for opening and closing the protective cover is further provided. 12. The film supply mechanism according to item 10 or 11 of the scope of patent application, which further includes: a release sheet recovery device for recovering the release sheet removed by the film storage box. 1 3. — Seed film storage box is a film storage box used for a thin film forming device for forming a thin film on a substrate and used to store a sheet film, which includes: It can be stored in a state where a release sheet is interposed between the sheet film and the film. A cassette body of a plurality of sheet films; and a positioning member that is engaged with the peripheral edge portion of the sheet film and the release sheet contained in the cassette body to position the sheet film and the release sheet relative to the E body. 1 4. The film storage box according to item 13 of the scope of patent application, which further includes: It can be installed and opened freely with respect to the box body, and covers the film and the release film contained in the box body from above in the closed state. It is protected, and in the open state, the film film and the release film contained in the box body can be carried out from above by a protective cover. 15. The film storage cassette according to item 13 or 14 of the scope of patent application, wherein the film storage device can be detachably attached to the film forming device. 1 6. A conveying mechanism is a film-forming device that uses a film to form a film, and is used to convey the film, and includes a suction hole provided in an abutting area that abuts the film. Film by hand 314408(修正版).ptc 第47頁 1234205 ^ . _案號92103759 年 月/日 修正_ 六、申請專利範圍 臂; 藉由形成在上述膜用手臂内部之内部空間與上述 吸附孔相連通,將上述内部空間之内部予以鼓風排 氣,以使上述片膜吸附保持於上述膜用手臂之鼓風 機;以及 在藉由上述鼓風機將上述片膜吸附保持於上述膜 用手臂之狀態下,使上述膜用手臂移動,以搬運上述 片膜之驅動部。 1 7 .如申請專利範圍第1 6項之搬運機構,其中, 在上述片膜之表面中之中央部形成有薄膜,且當 表面周緣部露出時, 上述搬運機構係使上述膜用手臂之抵接領域抵接 於上述表面周緣部,以進行吸附保持者。 1 8. —種處理裝置,配置有複數個處理單元,該裝置具 備: 標引部,配置收容基板之基板收容S,並從上述 基板收容匣將基板取出或收容;以及 工序部,配置複數個處理單元,並具有一面保持 來自上述標引部之基板,一面予以搬運至複數個處理 單元之搬運機構, 其中, 前述搬運機構係具備: 手臂本體; 上方側保持機構,於上述手臂本體的上面側保持314408 (Revised version) .ptc Page 47 1234205 ^. _ Case No. 92103759 Amended / Date _ VI. Patent application scope arm; by connecting the internal space formed inside the above-mentioned membrane arm with the above-mentioned adsorption hole, A blower for exhausting the inside of the internal space so that the sheet film is adsorbed and held on the arm for the film; and the film is adsorbed and held on the arm for the film by the blower; The arm is moved to carry the driving part of the film. 17. The conveying mechanism according to item 16 of the scope of patent application, wherein a thin film is formed on a central portion of the surface of the sheet film, and when the peripheral edge portion of the surface is exposed, the conveying mechanism causes the film to come into contact with the arm of the film. The contact area abuts on the peripheral edge portion of the surface to adsorb and hold the holder. 1 8. A processing device, which is provided with a plurality of processing units, the device includes: a indexing section, a substrate storage S configured to store a substrate, and a substrate to be taken out or stored from the substrate storage box; and a process section configured to have a plurality of The processing unit has a transfer mechanism that holds the substrate from the indexing part and transfers it to a plurality of processing units, wherein the transfer mechanism includes: an arm body; an upper side holding mechanism on the upper side of the arm body maintain 314408(修正版).ptc 第48頁 1234205 ^^—921^3759 六、申請專利範圍 基板; 下方側保持機 基板;以及 驅動部,使上 同時,前述搬 持基板之形態以及 換’而且’ 一面保 1 9 ·如申請專利範圍第 機構之上述下方側 體之下面側之吸附 2 0 ·如申請專利範圍第 搬運機構之上述上 本體之上面側之基 保持者。 2 1 · —種搬運方法,係 板並搬運該基板之 面側保持基板並搬 板之狀態以上述第 搬運基板。 2 2 .如申請專利範圍第 轉印裝置將形成於 形成面,並藉由上 體化之密接物後, 接物剝離之薄膜形314408 (revised version) .ptc Page 48 1234205 ^^ — 921 ^ 3759 VI. Patent application scope substrate; the lower side holder substrate; and the drive unit, so that the shape of the above-mentioned carrying substrate and the 'and' side are changed at the same time Warranty 19 · Such as the adsorption of the lower side of the above-mentioned lower body of the patent application scope of the mechanism 2 · As of the base holder of the upper side of the above main body of the patent application scope of the transport mechanism. 2 1 · A method of transporting a substrate, and transporting the substrate on the front side of the substrate. The substrate is transported in the state described above. 2 2. If the patent application is covered by the patent, the transfer device will be formed on the formation surface, and the film will be peeled off by the adhesive after the body is sealed. 述搬運 手臂本 上述 構’於上述手臂本體的下面側保持 述手臂本體移動而搬運上述基板 運機構係在工序部,將在上面側保 在下面側保持基板之形態加以切 持2片基板並同時予以搬運 18項之處理裝置,其中,上 保持機構係藉由形成於上述 孔將基板予以吸附保持者。 1 8或1 9項之處理裝置,其中,工地 方側保持機構係藉由設於上述手臂 板支撐構件將基板予以機械性支撐 具有:在手臂本體之上面側保持基 苐1搬運模式;在上述手臂本體之下 運該基板之第2搬運模式;並依照基 1及第2搬運模式之其中一搬運模式 2 1項之搬運方法,其中,係在藉由 片膜表面之薄膜轉印於基板之薄膜 述薄膜形成上述片膜與上述基板一 利用剝離裝置將上述片膜從上述密 成裝置中搬運基板,The carrying arm described above is configured to hold the arm body on the lower side of the arm body and move the substrate carrying mechanism in the process section. The two substrates are cut while holding the substrate on the lower side while holding the upper side. The processing device for carrying 18 items, wherein the upper holding mechanism is a holder that sucks and holds the substrate by forming the holes. The processing device according to item 18 or item 19, wherein the work-site-side holding mechanism is configured to mechanically support the substrate by the arm plate supporting member, and includes: holding the base 1 on the upper side of the arm body; The second conveying mode of carrying the substrate under the arm body; and the conveying method according to one of the conveying mode 21 of the base 1 and the second conveying mode, in which the film is transferred to the substrate through a film on the surface of the film. The thin film forms the sheet film and the substrate. The sheet film is transported from the compacting device by a peeling device. 314408(修正版).Ptc 第49頁 1234205 案號92103759 ^年,月/日 修正 六、申請專利範圍 以上述第2搬運模式將上述密接物由上述轉印裝置 搬運到上述剝離裝置,並以上述第1搬運模式將已形成 薄膜之基板由上述剝離裝置搬出。314408 (revised version). Ptc page 49 1234205 case number 92103759 ^ year, month / day amendment 6. Application scope of the patent In the above second conveying mode, the sealed object is transferred from the transfer device to the peeling device, and the above In the first transport mode, the substrate on which the thin film has been formed is carried out by the peeling device. 314408(修正版).ptc 第50頁314408 (revised) .ptc Page 50
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