1232878 玖、發明說明： 【發明所屬之技術領域】 本發明係關於-種具熱輕射散熱功能之組成物，係可塗佈於任何須 散熱之基板，以提高該基板之散熱效率。 【先前技術】 隨著微電子製程技術的進步，電腦中央處理單元(CPU)之工作時脈越來 越快’相對地’晶片的發熱功率也愈來愈大，例如電腦p4 16G的47w到 現在3.06G的80W ;為了維持晶片運作的穩定性與可靠性，同時使壽命增 長，必須要有良好的散熱裝置控制晶片溫度，以避免晶片因溫度過高而毁 損。目前在晶片的散熱問題處理上，除了使用風扇，以對流方式散熱外， 並在晶片上建立一組金屬(Al，Cu)散熱片裝置，利用金屬熱傳導係數大的特 性進行散熱；但由於晶片的發熱功率愈來愈大，以目前的散熱裝置已逐漸 無法滿足重量輕、體積小、風扇噪音小的需求。 增加散熱片散熱效率的相關技術，主要可分為三大類：L散熱片本體材 料的不同；2·塗佈於散熱片上的組成物；3·散熱片的幾何架構與成形方法。 其中前兩類皆利用材料本身之熱傳導性質來幫助散熱，第三類則是利用增 加面積的方式來幫助散熱片本體材料在傳統上採用鋁，其具有熱阻抗低、 重量輕、成本低的特性；此外，銅也應用在散熱片上，雖然其熱阻抗更低， 但是成本較咼、重量較重的特性，造成實際應用產品較少使用銅為材料。 在此類相關研究上主要強調··（1)開發導熱係數較高材質，如Α1-Ζη合 金(台灣第491902號專利），A1-Zn-Ti-Fe-Si-Mn合金(台灣第486523號專利），1232878 发明 Description of the invention: [Technical field to which the invention belongs] The present invention relates to a composition with heat and light radiation function, which can be applied to any substrate that needs to dissipate heat to improve the heat dissipation efficiency of the substrate. [Previous technology] With the advancement of microelectronics process technology, the clock speed of the computer's central processing unit (CPU) is getting faster and faster, and the heating power of the 'relative' chip is getting larger and larger, such as 47w of computer p4 16G to the present 80W of 3.06G; In order to maintain the stability and reliability of the operation of the chip, and at the same time increase the life, it is necessary to have a good heat sink to control the temperature of the chip to avoid the chip being damaged due to the high temperature. At present, in addition to using a fan to dissipate heat by means of convection, a set of metal (Al, Cu) heat sink devices are established on the wafer to use the large thermal conductivity of the metal to dissipate heat. The heating power is getting larger and larger, and the current heat sink has gradually failed to meet the needs of light weight, small size, and low fan noise. The related technologies for increasing the heat dissipation efficiency of the heat sink can be divided into three categories: the difference in the material of the L heat sink body; 2. the composition coated on the heat sink; 3. the geometric structure and forming method of the heat sink. The first two types use the thermal conductivity of the material itself to help dissipate heat, and the third type uses the increase in area to help the heat sink body material traditionally use aluminum, which has the characteristics of low thermal resistance, light weight, and low cost. In addition, copper is also used on heat sinks. Although its thermal resistance is lower, its cost is heavier and its weight is heavier, which results in less practical use of copper as a material. In this kind of related research, it is mainly emphasized that (1) the development of materials with higher thermal conductivity, such as A1-Zη alloy (Taiwan No. 491902 patent), A1-Zn-Ti-Fe-Si-Mn alloy (Taiwan No. 486523) patent),
Al-Mg-Si合金(台灣第454319號專利）’碳化矽顆粒強化鋁基陶兗複合材料 1232878 (MMCs，CMCs)，高分子基複合材料(PMCs)、c_c複合材料(c(Xs)等；（2) 將散熱狀台灣第5G5·號專利：碳切、碳、氧倾、玻璃、聚酿 胺、金屬）或發泡狀態合成(台灣S I29349號專利），以增加與空氣接觸表面 積。 第二類： 另-類增加健效率财式係於散料上之域物來增加散 熱效率。此類之辅技藝主要_在原有散熱片上以钱、塗佈、網印、 鋼板印刷或喷霧(spmy)方式加上一層具高導熱係數之導熱組成，如台灣第 521560號專利所揭示的銀焊處理(銀6〇%、銅35%、鎳鉻5%)，台灣第 號專利所揭示的Μ〜導鱗及G〜的金鋼砂(卿混合組 成，WO9810632所揭示的陶究粉末(Al2〇3，疆，、絕熱別“分末，相變化 物質)分散於有基黏、结劑中(聚亞烯胺，液晶高分子），以增加散熱效率。 熱1的傳遞方式有三種，分別是熱傳導、熱對流及熱輻射。目前在解 决a曰片的政熱問題上皆僅考量前兩者，然而對某些材料而言，熱轄射傳遞 的熱夏亦不m若能湘此祕量傳遞方式於散難置巾，即可增加 原散熱裝置之效率，關應當前晶片發熱功率日益增加的問題。 【發明内容】 有鑑於對散熱效麵需求，及先前在散健置上對触射散熱效果的 心各本务明係提供一種具熱輻射散熱功能之組成物，係包含重量比 0〜99.99%之黏結劑及重量比〇 〇1〜1〇〇%之具熱輻射放射率e〉〇 5之粉末材 料0 1232878 包含重量比10〜30%之黏結劑 前述具熱輻射散熱功能之組成物，較佳係 及重量比70〜90%之具熱輻射放射率e >〇·5之粉末材料 前述之熱輻職射粉末㈣細熱輻射放轉ε 之粉末材料為 較佳；如 ε =0.99 之蒙脫土(momtmorillonite)。 前述之減舰祕及熱雛高分子樹脂、域材齡結劑、或 其混合物；其中《之高分子樹酬如魏樹脂、祕樹脂、壓克力樹脂 或聚苯乙烯類樹脂；前述無機材料黏結_如魏鹽黏結劑、或苦土水泥 等0 前述之触射放射率ε >0.5之粉末材料係為黏土、遠紅外線陶究粉 末、或其混合物等具較高熱轄射放熱率之材料；黏土材料例如：石夕象石類 黏土 (smectite clay)、蛭石（venniculite)、管狀高領土 (haU〇ysite)、絹雲母 (sericite)、雲母(mica)等；其中石夕礬石類黏土係為蒙脫土、息土(鄉⑽㈣、 富鋁蒙脫土(beidellite)、矽鐵石(nontroriite)等。 前述之具熱輻射散熱功能之組成物係可進—步添加導熱材料，如金屬 粉末、金鋼砂(SiC)、氧化紹粉末 '氮化链粉末等，以增加其導熱效果。 前述之具熱輻射散熱功能之組成物係可進一步包含適當溶劑。 本發明之另一目的係提供一種具熱輻射散熱效果之基板，係包含··一 基板，及一具熱輻射散熱功能之被覆層，其中前述之被覆層係包含重量比 0〜99.99%之黏結劑及重量比_〜刚％之具熱輻射放射率ε >〇·5之粉末材 料0 前述被覆層較佳係包含重量比1〇〜3〇%之黏結劑及重量比7〇〜9〇%之具 1232878 ；王鋼V(SiC)、氧化銘粉末、氮化銘粉末等，以增加其導熱效果。 ，刚边之具熱㈣散熱功能之組成物係可進—步包含適當溶射。前述 之塗佈方法亚無特職制，係可為旋轉塗佈、浸沾式塗佈、或噴灑式涂佈 等。 、" 刚迷之乾無方法係為自然乾燥或加熱乾燥。 則述之基板係可為散熱片、電腦機殼、馬料電子元件1該基板之 材料可為任何導熱性或非導熱性之材料，不受限制。 本發明係_過錢忽略的_導機财的熱輻射散熱方式，提供一 具熱輻射散熱魏德雜，敝係可塗佈於任何導麵不佳之 •藉由’、南放率之熱輪射散熱功能來增加散熱效率，確保電子元件 正常運作，並可減少散熱裝置重量及體積，降低成本。 【實施方式】 本發明係提供-種具触射散熱魏之組成物，係包含健爾重量比 〇〜99.99%)及熱輻射放射率£ >〇 5之粉末材料(重量比謂〜腑〇。該組成 物亚可進-步添加導熱材料，如金屬、金鋼砂(sic)、氧化紹粉末、氮化铭 粉末等，以增加其導熱效果。 月il述具熱輻射散熱功能之組成物，較佳係包含重量比1〇〜3〇%之黏結劑 及重量比70〜90%之具熱輻射放射率ε >〇·5之粉末材料。 前述之具熱輻射散熱功能之組成物係可進一步包含適當溶劑。 其中W述之黏結劑係包含熱固性及熱塑性高分子樹脂、無機材料黏結 10 1232878 劑、或其混合物；其t前述之高分子樹脂例 J如％虱树脂、酚醛樹脂、壓克 力树月曰或聚笨乙烯類樹脂；前述無機材料 <丁十砧結劑例如矽酸鹽黏結劑、或苦 土水泥等。。航之幽爾率e >Q·5之_讓為黏土、遠红外線 陶究粉末、雌混合轉錄高熱_放_之材料；黏场料例如：石夕 礬石類黏土、經石、管狀高領土、絹雲母 、— 云母寺，其中矽礬石類黏土係 為蒙脫土、皂土、富4呂蒙脫土、石夕鐵石蓉。乂 寻則述之熱輻射放射粉末材料並 以熱輕射輯㈣>0.95之粉末㈣(如e ,之蒙耻)為較佳。 第-圖係顯示本發明提供之增加基板散熱效果之方法流程圖，包含下 列步驟：首先’將-定比例之黏結劑(如熱固性或熱塑性樹脂)及熱韓射放射 率ε >0.5之具熱轄射粉末材料(如黏土、遠紅外線陶曼粉末)均勾混合，即 形成-具熱傭散熱魏之組成物；接著，提供—基板，並塗佈前述之具 熱韓射散熱功能之組成物於前述基板上，該塗佈方式無特別_，係可使 用旋轉塗佈、浸沾式塗佈、或喷灑式塗鱗方式；然後以自然乾燥或加熱 方式乾燥前述之組成物，驗成物即軸—具熱鋪散熱魏之被覆層， 可提南基板之散熱效率。 其中刖述之黏結劑比例係為重量比〇〜99.99%，較佳係重量比1〇〜3〇% ; 鈾述之熱輪射放射率ε >0·5之粉末材料比例係為重量比〇 〜1⑽。/。，較佳 Α重1比70〜90%，且剞述之粉末材料係以熱輕射放射率ε > 〇·95之粉末材 料(如蒙脫土)為較佳。 前述之具熱輻射散熱功能之組成物係可進一步添加導熱材料，如金屬 粉末、金鋼砂(SiC)、氧化铭粉末、氮化铭粉末等，以增加其導熱效果。 1232878 如述之具熱幸S射散熱功能之組成物係可進一步混於適當溶劑中，如去 離子水、乙醇。 前述之基板係可為散熱片、電腦機殼、馬達等電子元件；且該基板之 材料可為任何導熱性或非導熱性之材料，不受限制。 第二圖係本發明提供之具熱輻射散熱效果之基板1〇，係包含：一基板 11;及一具熱轄射散熱功能之被覆層12，其中前述之被覆層12係包含一定 比例之黏結劑及熱輪射放射帛e >0·5之粉末材料，且該被覆層12係覆蓋 於前述基板11上，可提高基板u之散熱效率。 前述之基板11係可為散熱片、電職殼、馬達等電子元件；且該基板 之材料可為任何導熱性或非導熱性之材料，不受限制。 减之被Μ 12係包含重量比G〜99 99·、纟域(如環_脂、祕樹 脂、壓克力樹脂或聚苯乙稀類樹脂）、重量比001〜100%之熱輕射放射率ε >〇·5之知末材料(如黏土、遠紅外線陶究粉末)及適當溶劑，該彼覆層12並 可進-步包含導麟料，如金屬粉末、金鋼砂_、氧脑粉末、氣化紹 粉末等，以增加其導熱效果。前述被覆層12係可選擇覆蓋於基板^之全 部或部分面積，不受特別之限制。 月)L被k層12 IxL係包含重量比丨G〜之黏結劑及重量比7Q〜9〇%之 具熱輻射放射率ε >0.5之粉末材料。 j t彼仅纟12中所3之粉末材料係、以熱輻射放射率e >㈣之粉末材 料(如ε =0.99之蒙脫土)為較佳。 以下藉由實補進—步朗本翻提狀涵細«魏組成物及 1232878 其應用方法。 實施例1 將去離子水及聚乙稀啦σ各酮(polyvinylpyrolidone，pvp)以重量比 99.8 :0·2之比例混合攪拌，接著取前述之〇·2%聚乙烯吡咯酮446g與l〇g之 CL42蒙脫土（ε=〇·99)均勻混合，即成為一具熱輻射散熱功能之⑶幻組成 物’其中前述之 CL42 蒙脫 土係由 (NawCao.nXAlwMgoaXS^AlwXVOHh 組成。塗佈前述 CL42 組成物於 鋁質容器表面，烘乾該組成物，即形成一具熱輻射散熱功能之被覆層。 實施例2 將然水酒精及水乙細醇縮丁酸^〇17\^11}4 131^}仰1，？\^6)以重量比95:5 之比例混合攪拌’接著取前述之5%聚乙烯醇縮丁醛5〇g與1〇g之ε =〇 87 遠紅外線（FIR)喊粉末均勻混合，成為一具熱輻射散熱功能之服組 成物，其中前述FIR陶瓷粉末之組成係包含ZrSi〇4, Al2〇3, Ti〇2,（Ce，[a，Al-Mg-Si alloy (Taiwan Patent No. 454319) 'Silicon carbide particles reinforced aluminum-based ceramic concrete composite materials 1232878 (MMCs, CMCs), polymer-based composite materials (PMCs), c_c composite materials (c (Xs), etc .; (2) Heat-dissipating Taiwan patent No. 5G5 ·: carbon cutting, carbon, oxygen pouring, glass, polyamine, metal) or foaming state synthesis (Taiwan SI 29349 patent) to increase surface area in contact with air. The second type: another type of increasing health efficiency financial system is to increase the efficiency of heat dissipation. This type of auxiliary technology mainly _ adds a layer of high thermal conductivity to the original heat sink by means of money, coating, screen printing, stencil printing or spray (spmy), such as the silver disclosed in Taiwan Patent No. 521560 Welding treatment (60% of silver, 35% of copper, 5% of nickel-chromium), M ~ guide scales and G ~ gold steel grit (mixed composition, disclosed in WO9810632, ceramic powder (Al2 〇3, Xinjiang, and adiabatic "dividends, phase change substances) are dispersed in the base adhesive, cement (polyene amine, liquid crystal polymer) to increase heat dissipation efficiency. There are three ways to transfer heat 1, respectively It is thermal conduction, thermal convection and thermal radiation. At present, only the first two are considered in solving the political and thermal problems of a film. However, for some materials, the hot summer of thermal transmission is not the same. The quantity transmission method can be used to disperse difficult towels, which can increase the efficiency of the original heat dissipation device, which is related to the current problem of increasing heating power of the wafer. [Summary of the Invention] In view of the demand for heat dissipation efficiency, and the previous contact with the scattered health Radiation effect of heat radiation is to provide a heat radiation with heat radiation The energy composition is a powder material with a weight ratio of 0 to 99.99% and a weight ratio of 001 to 100% with a thermal radiation emissivity e> 05. 0 1232878 contains a weight ratio of 10 to 30% The aforementioned composition with heat radiation function of the adhesive is preferably a powder material with a heat radiation emissivity e > 0.5 of 70 to 90% by weight. The aforementioned heat radiation powder ㈣ fine heat radiation transfer The powder material of ε is better; for example, montmorillonite with ε = 0.99. The aforementioned ship-reducing and hot young polymer resins, domain cements, or mixtures thereof; Wei resin, secret resin, acrylic resin or polystyrene resin; the aforementioned inorganic material bonding _ such as Wei salt bonding agent, or bitter cement, etc. 0 The aforementioned powder material with a contact emissivity ε > 0.5 is clay. , Far-infrared ceramics research powder, or mixtures thereof with materials with high thermal radiation emission rate; Clay materials such as: smectite clay, venniculite, haU〇site , Sericite, mica, etc .; Eveningite-type clays are montmorillonite, polyclay (country dwelling, beidellite, nontroriite, etc.) The aforementioned composition system with heat radiation function can be further added-further heat conduction Materials, such as metal powder, silicon steel sand (SiC), oxide powder, nitride chain powder, etc., to increase its thermal conductivity. The aforementioned composition with heat radiation function can further include a suitable solvent. Another aspect of the present invention One purpose is to provide a substrate with a heat radiation effect, comprising a substrate and a coating layer with a heat radiation function, wherein the aforementioned coating layer contains a binder and a weight ratio of 0 to 99.99% by weight. _ ~ Gangue of powder material with thermal emissivity ε > 0.5 · 0 The aforementioned coating layer preferably contains a binder with a weight ratio of 10 to 30% and a weight ratio of 70 to 90% with a 1232878 ; Wang Gang V (SiC), oxide powder, nitride powder, etc. to increase its thermal conductivity. The composition of the heat-dissipating and heat-dissipating function of the rigid edge can be further advanced-including proper dissolution. The aforementioned coating method is non-specialized, and can be spin coating, dip coating, or spray coating. &Quot; There is no method for drying just to dry naturally or heat. The substrate mentioned can be a heat sink, a computer case, or a horse electronic component. The material of the substrate can be any thermally or non-thermally conductive material, without limitation. The invention is a thermal radiation method of _guiqicai_ which provides a thermal radiation heat sink. It can be applied to any poorly conductive surface. The heat radiation function is used to increase the heat dissipation efficiency, ensure the normal operation of the electronic components, and reduce the weight and volume of the heat sink and reduce the cost. [Embodiment] The present invention provides a kind of composition with radiation heat radiation, which comprises a powder material (weight ratio of 0 ~ 99.99%) and a heat radiation emissivity of £ > 〇05 (a weight ratio of ~ 腑 〇). The composition can further add heat-conducting materials, such as metal, sic, oxide powder, nitride powder, etc., to increase its heat-conducting effect. It is preferably a powder material containing a binder with a weight ratio of 10 to 30% and a powder material with a heat radiation emissivity ε > 0.5 in a weight ratio of 70 to 90%. The aforementioned composition system with a heat radiation function A suitable solvent may be further included. The adhesive agent described in the above includes a thermosetting and thermoplastic polymer resin, an inorganic material adhesive 10 1232878 agent, or a mixture thereof; examples of the aforementioned polymer resins such as% lice resin, phenolic resin, pressure Acrylic resin or polybenzyl vinyl resin; the aforementioned inorganic materials < ding ten anvil bonding agent such as silicate bonding agent, or bitter earth cement, etc. Hang Zhiyou rate e > Q · 5 of _ let High transcription for clay, far-infrared ceramic powder, and female mix _ 放 _ 的 材料 ； Clay materials such as: stone syenite clay, warp stone, tubular high territory, sericite, — mica temple, of which the sialonite-type clay system is montmorillonite, bentonite, rich 4 Lumeng Detachment, Shixi Iron Stone Rong. It is better to use the thermal radiation to radiate the powder material described in Xun Xun, and to use powder light powder (such as e, shame) which is lighter than 0.95. Figure-shows the present invention provides The flow chart of the method for increasing the heat dissipation effect of the substrate includes the following steps: First, a 'fixed ratio of a binder (such as a thermosetting or thermoplastic resin) and a thermally radiant emissivity ε > 0.5 of a thermally radiative powder material (such as clay) , Far-infrared taoman powder) are mixed together to form a composition with thermal commissioning and heat dissipation; then, a substrate is provided, and the aforementioned composition with thermal radiation function is coated on the aforementioned substrate, and the coating The cloth method is not special. It can use spin coating, dip coating, or spray coating scale method; then dry the aforementioned composition by natural drying or heating. The test result is the shaft—with heat spreading. The coating of Wei can improve the heat dissipation efficiency of the south substrate. The ratio of the binder in the description is 0-99.99% by weight, preferably 10 ~ 30% by weight; the ratio of the thermal emission of the uranium described by ε > 0.5 is the weight ratio 〇 ~ 1⑽. It is preferable that the A weight ratio is 70 to 90%, and the powder material described above is a powder material (e.g., montmorillonite) with a thermal light emissivity ε > 0.95. The aforementioned composition with thermal radiation function can further add thermally conductive materials, such as metal powder, gold grit (SiC), oxide powder, nitride powder, etc. to increase its thermal conductivity. 1232878 Fortunately, the composition of the S-radiation function can be further mixed in a suitable solvent, such as deionized water and ethanol. The aforementioned substrates can be electronic components such as heat sinks, computer cases, and motors; and the materials of the substrates can be any thermally or non-thermally conductive material, without limitation. The second figure is a substrate 10 with heat radiation effect provided by the present invention, including: a substrate 11; and a covering layer 12 having a heat radiation function, wherein the aforementioned covering layer 12 includes a certain proportion of bonding Agent and powder material of thermal radiation 帛 e > 0.5, and the covering layer 12 is covered on the substrate 11, which can improve the heat radiation efficiency of the substrate u. The aforementioned substrate 11 may be electronic components such as heat sinks, electrical housings, and motors; and the material of the substrate may be any thermally or non-thermally conductive material, without limitation. The minus M 12 series contains a weight ratio of G ~ 99 99 ·, a fluorene domain (such as cycloaliphatic resin, secret resin, acrylic resin, or polystyrene resin), and a thermal light emission of 001 ~ 100% by weight. Rate material ε > 0.5, and other suitable materials (such as clay, far-infrared ceramic powder) and appropriate solvents, the other coating 12 can further include guide materials, such as metal powder, gold steel sand, oxygen brain Powder, gasification powder, etc. to increase its thermal conductivity. The aforementioned covering layer 12 is selected to cover all or part of the area of the substrate ^ and is not particularly limited. Month) The L k layer 12 IxL is a powder material including a binder with a weight ratio of G to G and a weight ratio of 7Q to 90% with a heat radiation emissivity ε > 0.5. J t is only a powder material as described in 纟 12, and a powder material with a thermal emissivity e > ㈣ (e.g., montmorillonite of ε = 0.99) is preferred. The following is supplemented by the actual method-Bulangben, the culmination of «Wei composition and 1232878, and its application method. Example 1 Deionized water and polyvinylpyrolidone (pvp) were mixed and stirred at a weight ratio of 99.8: 0: 2, and then 446 g and 10 g of the 0.2% polyvinylpyrrolidone were taken. CL42 montmorillonite (ε = 0.999) is uniformly mixed to become a CG magic composition with heat radiation function. The CL42 montmorillonite system is composed of (NawCao.nXAlwMgoaXS ^ AlwXVOHh. Coating CL42 The composition is dried on the surface of an aluminum container to form a coating layer with a function of heat radiation. Example 2 Water alcohol and water ethyl butyric acid ^ 〇17 \ ^ 11} 4 131 ^} 扬 1,? \ ^ 6) Mix and stir at a weight ratio of 95: 5 ', then take the aforementioned 5% polyvinyl butyral 50g and 10g ε = 〇87 Far Infrared (FIR) The powder is uniformly mixed to become a clothing composition with a function of heat radiation. The composition of the aforementioned FIR ceramic powder includes ZrSi〇4, Al2〇3, Ti〇2, (Ce, [a,
Nd)P〇4之混合燒結物。塗佈前述FIR組成物於鋁質容器表面，烘乾該組成 物，即形成一具熱輻射散熱功能之被覆層。 實施例3 然水酒精及聚乙烯醇縮丁醛(polyvinyl butyral，pVB)以重量比95 : 5之 比例混合攪拌，接著取前述之5%聚乙烯醇縮丁醛3〇g與1〇g之遠 、’工外、·泉（FIR)陶允粉末均勻混合，即成為_具熱輻射散熱功能之跳組成 物。塗佈W述FIR組成物於純容器表面，烘乾該組成物，即形成一具熱 輻射散熱功能之被覆層。 4 2878 實施例 〇c、乂’關1之塗佈CL42組成物的1§質容器中，添加溫度為60-100 教的乙—醇做為熱量變化來源’在容器前方放置散熱風扇，以溫度計量測 =錄每分鐘溫度的變化’計算其散熱係數⑴，_與未塗佈具熱傭 7功能組之崎容魏行比較。結果鮮塗佈W2之㈣容器散熱 崎為_64,未塗佈之崎容器散熱係數為嶋6，其散熱效率提昇赐 散熱係數定義為k=AT/(T-T〇〇) △τ·溫度變化量 T : 鋁質容器溫度Nd) Mixed sintered product of Po4. The aforementioned FIR composition is coated on the surface of an aluminum container, and the composition is dried to form a coating layer having a heat radiation function. Example 3 Ran alcohol and polyvinyl butyral (pVB) were mixed and stirred at a weight ratio of 95: 5, and then 30 g and 10 g of the foregoing 5% polyvinyl butyral were taken Yuan, Gongwai, Quan (FIR) Tao Yun powder is evenly mixed, and it becomes a jumping composition with heat radiation function. The WIR composition is coated on the surface of a pure container, and the composition is dried to form a coating layer having a heat radiation function. 4 2878 Example 0c, 1 'quality container coated with CL42 composition of Guan1, adding ethyl alcohol at a temperature of 60 to 100 ° C as a source of heat change'. A cooling fan was placed in front of the container, using a thermometer. Measure = record the change in temperature per minute 'calculate its heat dissipation coefficient ⑴, _ compared with the non-coated with hot commission 7 functional group of Qi Rong Weixing. Results The heat dissipation coefficient of the freshly coated W2 container was _64, and the heat dissipation coefficient of the uncoated container was 嶋 6. The heat dissipation efficiency improvement was defined as k = AT / (TT〇〇) △ τ · Temperature change T: aluminum container temperature
Too :環境溫度 實施例5 在前述實施例2之塗佈FIR組成物_f容器中，添加溫度為6議 t的乙二賴為歸變化麵，在容器前紐置散熱風扇，以溫度計量測 並記錄每分触度的變化’轉其散熱魏⑴，同軸未塗佈具熱轄射 散熱功能組成物之織容器進行比較，其結果顯示塗佈视之㈣容器散 熱係數為嶋’未塗佈之料容器散熱錄為_8，其散熱效率提昇 29%。 實施例6 在前述實施例3之塗佈™組成物的㈣容器中，添加溫度為织〇〇 °(：的乙二賴為熱«化來源，在容㈣綠置散熱顯，以溫度計量測 14 1232878 並記錄每分鐘溫度的變化，計算其散埶/ u + @…、知數00，同時與未塗佈具埶輻射 散熱功能組成物之鋁質容器進行比較，复 …、 人〜結果顯示塗佈FIR之|呂質容器散 熱係數為0.0396，未塗佈之鋁質容考1 、的 、為政熱係數為0.0293,其散熱效率提昇 35%。 ▲雖然本發明已啸佳實補揭露如上，然其並義以限定本發明，任 何熟悉此技勢者，在不脫離本發明之精神和範圍内，當可作各種之更動與 潤飾，因此，本發明之保護範圍，當視後附之申請專利範圍所界定者為準iToo: Ambient temperature Example 5 In the coated FIR composition_f container of Example 2 described above, add the temperature of 6 Er to the surface of change, add a cooling fan in front of the container, and measure by temperature measurement And record the change in touch per minute 'turn to its heat sink Wei Zhi, coaxial uncoated woven container with thermal radiation function composition comparison, the results show that the coating sees the heat dissipation coefficient of the container is' uncoated' The material container heat dissipation record is _8, and its heat dissipation efficiency is increased by 29%. Example 6 In the container of the coated ™ composition of Example 3 described above, the temperature was set to be woven at 00 ° (: Ethylene was used as the source of heat, and the heat was displayed in Rongyang Green, and measured by temperature measurement. 14 1232878 and record the temperature change per minute, calculate its dispersion / u + @ ..., know the number 00, and compare it with the aluminum container that is not coated with the composition of radiation heat dissipation function. The heat dissipation coefficient of the coated container with FIR is 0.0396, and the uncoated aluminum capacity test 1 is 0.0293, which improves the heat dissipation efficiency by 35%. ▲ Although the present invention has been disclosed above, However, it does not limit the present invention. Anyone who is familiar with this skill can make various modifications and retouches without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be regarded as the attached application. The scope of the patent shall prevail
15 1232878 【圖式簡單說明】 第一圖係顯示本發明增加基板散熱效果之方法流程圖。 第二圖係顯示本發明具熱輻射散熱效果之基板示意圖。 【主要元件符號對照說明】 10— 具熱輪射散熱效果之基板 11— 基板 12—被覆層15 1232878 [Brief description of the drawings] The first diagram is a flowchart of a method for increasing the heat dissipation effect of a substrate according to the present invention. The second figure is a schematic diagram showing a substrate with thermal radiation effect of the present invention. [Comparison explanation of main component symbols] 10—Substrate with heat radiation effect 11—Substrate 12—Cover layer