TWI232352B - Low-temperature-fired type conductive starch applied in chip-type resistor, capacitor, inductor and the electrode of wire-bonding terminal - Google Patents

Abstract

The present invention relates to a low-temperature-fired type conductive starch applied in chip-type resistor, capacitor, inductor and the electrode of wire-bonding terminal, which mainly comprises: a first conductive powder which is spherical silver powder; a second conductive powder which is scale-like silver powder; a third conductive powder which is nickel; a first resin which is epoxy resin; a second resin which is phenol resin; a first additive which is ultra-fine clay; and adjusting solvent containing: a first solvent with boiling point above 180 DEG C, and a second solvent which is aromatic hydrocarbon-based compound with boiling point 80 to 180 DEG C. The present invention has the following advantages: to manufacture at relatively low temperature with low cost; non-toxic effects and good physical properties.

Description

1232352 V. Description of the Invention (1) [Technical Field] The present invention relates to a low-temperature electrode for wire bonding terminals: chip resistors, capacitors, inductors, and lead-free low-temperature burn-in types. The “type conductive paste” refers to a non-toxic electrical charge manufactured in a low-temperature environment, which has both relative and efficacy. The advantages of low cost and good physical properties [Previous technology] The conductive paste of the conventional traditional wafer-type lightning electrode is a component of arrogance, capacitance, inductance and wire bonding terminals. 'The main (mainly ethyl cellulose acrylic knife end (such as silver, Ming, copper, etc.), resin and glass powder. However, from Λ Qi 11 (used to dissolve the above resins), it makes the traditional The snow melting powder has a higher melting point (to reach this high temperature environment at 500 degrees Celsius, power consumption is required / a material belongs to a high temperature sintering type. At the same time, therefore, the cost is high.-Consumption is more expensive and more complicated equipment. The traditional ceramic capacitors are like traditional ceramic capacitors. When silver and other electrodes are connected to wires, solder is an alloy of tin and lead. Among them, most of the lead is known to have motherhood. However, most electronic products are used. Lead-containing electronic grades a and ', and some lead-containing wastes will pollute the environment. Second, if soldering and connecting electrodes and wires, the original silver film of the electrode must be enlarged. Big silver rafters will increase costs. In detail, if the electrical characteristics of the electrode are to be full, the thickness of this electrode is only 1 micron, but for solder connection, it needs about 3 micron. This is because the electrode formed of silver will Dissolved by solder, this is common

1232352 V. Description of the invention (2)?: Ϊ́: iJ see the image ‘thus’ must increase the thickness of the silver film to cope with this, resulting in increased costs. : The external soldering method of traditional soldering is to insert the capacitor electrode into 埶 ^ = t solder hot-melt solution and use 150 ° C to pre ^^^ to dissolve the eutectic solder solvent at 230 ° C for 1 second. The same applies to the liquid coating ^ ^ ^ ^ r ..., silly dental workers; ^ ^ ^. The leaf cloth is dried, heated, hardened, printed on the distance, and finally dipped in wax to complete the effect. 】 The main capacitance and inductance of the invention are the secondary capacitance of the invention made in the phase environment, the inductance does not include the capacitance of the invention, and the inductor has both the content. The invention is the first conductivity of the terminal. Material, the temperature of the ring resistance, electric slurry, the resistance, the electric slurry, [technical purpose of wire connection, and the characteristics of wire connection at low temperature. One purpose, and the wire connection oblique 'has one purpose, and the wire connection is low and provides a low powder for the electrode, which is to provide a low temperature firing type conductive firing molding applied to the electrode of the wafer type electric terminal, It has the advantage of being relatively low in providing a low-temperature burn-in type conductive non-toxic for electrodes used in wafer-type electrical terminals. The advantage is to provide a low-temperature burn-in type with good electrical properties applied to electrodes of wafer-type electrical terminals. It is used for chip-type resistor, capacitor, inductor and warm-burning type conductive paste, which includes: It is spherical silver powder, and its powder diameter is

1232352 V. Description of the invention (3) Between 0.05 and 0.15 microns, accounting for 30% to 55% of the total weight; a second conductive powder, which is a scaly silver powder with a length between 4 and 10 microns , Accounting for 5 to 12% of the total weight; a third conductive powder, which is nickel, accounting for 2% to 11% of the total weight; a first resin, which is an epoxy resin, accounting for 1% of the total weight Between 2% and 8%; a second resin, which is a phenolic resin, which accounts for 2% to 8% of the total weight; a first additive, which is an ultra-fine powder clay, which accounts for 2% to 5% of the total weight Time; the rest is an adjustment solvent. The above and other objects and advantages of the present invention can be easily understood from the detailed description and accompanying drawings of the selected embodiments below. [Simple illustration] Base 10 Terminal 20 Base layer 11 Resistive layer 1 2 Epoxy protective layer 13 Inner layer 21 Middle layer 22 Outer layer 23 Base 30 Two terminals 40 The first diagram is a schematic diagram of a first embodiment of the present invention applied to a resistor. The diagram is a schematic diagram of the first embodiment of the present invention applied to a capacitor. The third diagram is a partially enlarged schematic diagram of the second diagram. The fourth diagram is a schematic diagram of the second embodiment of the invention applied to a wire. The fifth diagram is a partially enlarged diagram of the fourth diagram. [Illustration of drawing number]

Page 61232352 Outer layer 43 V. Description of the invention (4) Inner layer 41 Middle layer 42 Magnetic capacitor 50 Wire 61, 62 Adhesive part 7 0 [Detailed description of the embodiment] The present invention is a chip-type resistor, capacitor and inductor The first embodiment of the low-temperature firing type conductive paste for electrodes and wire-bonding terminals is applied to the wafer-type resistor of the first figure. In structure, the wafer crack resistor has a base 10 and two terminals 20, and the base 10 has a base layer 11, a resistance layer 12, and an epoxy protection layer 13 from bottom to top; and each terminal 20 has an inner layer 21, a middle layer 22, and an outer layer formed of a conductive paste from the inside to the outside. Layer 23. The components of the conductive paste of the present invention include: a first conductive powder, which is a spherical silver powder, the diameter of the powder is about 0.1 micrometers, is between 0.05 and 0.15 micrometers, and the weight is 80 grams (49 3wt%); A third conductive powder, a second conductive powder, which is a scale-like silver powder, having a length of about 7 microns, between 4 to 10 microns, and a weight of 15 grams (9.3% by weight); , Which is nickel, weighs 5 grams (3.1 wt%); a first resin, which is a bisphenol A epoxy resin, weighs 5 grams (3.1 wt%); a second resin ' It is a thermosetting phenolic resin, its weight is 11 grams (6.8 wt%); the first-additive, it is an ultra-fine powder clay, ... 6 grams (3.

1232352 V. Description of the invention (5) The rest is an adjustment solvent, which includes the adjustment solvent system including: a first solvent, which is a solvent having a boiling point of 180 ° C or higher, the first solvent is diethylene glycol monobutylene Ether (butyl carbitol) has a weight of 24 grams (14.9 wt. 9; and a second solvent, which is an aromatic hydrocarbon system having a boiling point of 80 to 180 degrees Celsius, and weighs 15 grams (9 · 4wt%). Therefore, the total weight of the above number is 161 grams (100wt%). Regarding the first embodiment, 60% of the high-temperature sintered type silver paste was copied using a rubber roller, and it was coated on a wafer. After the drying process, the end surface is sintered in an environment of about 600 degrees Celsius to form an electrode. Then, the low-temperature firing type conductive paste having the above composition is coated with the same copy. After drying, use about He was hardened by heating in an environment of 250 degrees Celsius. First, electroplating was performed with an acidic nickel plating solution, and then electric ore was applied with an acidic ore tin solution. The implementation results of the first embodiment described above are internal electrodes that have occurred in the past. Neither "top" or "hollowing" occurred The physical properties such as electrical characteristics or heat resistance or strength of the joint are the same as those of ordinary products, but in terms of moisture resistance, life test results, and insulation resistance values, they are better than the original products. Therefore, the present invention An excellent chip-type resistor supply will be obtained. Of course, the first embodiment can also be applied to chip-type inductors or capacitors, as shown in the first and second figures. Taking the valley as an example, the structure includes a The base and two terminals 40, and each terminal 40 has an inner layer 41, a middle layer 42 (such as a nickel layer), and an outer layer formed by low-temperature firing of the conductive paste from the inside to the outside.

1232352 V. Description of the invention (6) 43 (such as tin layer), also has quite excellent characteristics. The second embodiment of the present invention is applied to the connection of electrodes and wires of a magnetic capacitor. Please refer to the fourth and fifth diagrams. Two sides of a magnetic capacitor 50 need to be fixed with two wires 61 and 62 respectively. The conductive paste of the present invention can be applied and fired and hardened. The conductive paste system includes: a first conductive powder, which is a spherical silver powder, and the powder diameter is between 0.05 and 0.15 microns, and the weight 50 grams (36.5wt%); a second conductive powder, which is a scaly silver powder, whose length is between 4 to 10 microns, and a weight of 10 grams (7.3wt%); a third conductive powder , Its system is nickel, its weight is 10 grams (7.3 wt%); a first resin, its system is bisphenol A epoxy resin, its weight is! 〇g (7.3 w 10 / 〇; a second resin, which is a thermosetting phenolic resin, its weight is 10 grams (7.3 wt90); a first additive, which is an ultrafine powder clay, Its weight is 5 grams (3.6 wt%); a first solvent, which is a solvent having a boiling point of i80 ° C or more, and the first solvent is diethylene glycol monobutyl ether (butylcarbitol), and its weight is For 5 grams (3.6 wt%) ί One adjustment office ^ 2? For the Buddha's point is taken from 0 to 18 Hydrocarbon system 'The second solvent system is two ... Its weight is 35 grams (25 · 6wt%); Chinese and foreign, It also includes a second wa · addition, which is ultrafine powder calcium carbonate, and its weight is 2 grams,

1232352 V. Description of the invention (7) ^ Therefore, the total weight of the above number is 137 grams (100wt%). Regarding the second embodiment, since tin-lead alloy solder is not used in the present invention, it is not toxic. Secondly, when applied to the connection of electrodes, since the traditional soldering operation is replaced, there will be no problem of polluting the environment caused by the wrong ingredients. Secondly, since the present invention does not have the "silver-eating" phenomenon of traditional solder, the original silver film does not need to be thickened, so the cost can be reduced. Compared with the traditional solder, although the electrical conductivity of the present invention is higher than the traditional solder ^, but when used in fixed contact with the wire of the electrode, the electrical conductivity will not be less than: 'The present invention makes the conductive powder used low: 'Material' can reduce costs. In addition, as for the curing time, the present invention takes more than fifteen minutes, but the step hardening method is a completely hard method, and the use is: heat curing is very common, so there is no problem in the manufacturing process. θ ', the actual service is to make the full service, and the electric guest 5 | Xi Lei is placed near the intersection of the electrode and the wire = plus: the wire is used for about three minutes at about 150 degrees Celsius After dropping a drop of the invention, 'the liquid paint is subjected to cooling-heating, and then it can be solidified. At about 15 degrees Celsius. Do it for 30 minutes, and then show four small ^^^: After immersing in wax, you can finish it. : The tensile strength and humidity resistance of the wire are measured. According to the electrical characteristics of the present invention, it is considered that the present invention is better than traditional solder. However,: = The result of the test, the exact thickness obtained by the present invention (1 micro

Page 101232352 Brief description of the drawings [Simple schematic description] The first diagram is a schematic diagram of the first embodiment of the present invention applied to a resistor The second diagram is a schematic diagram of the first embodiment of the present invention applied to a capacitor The third diagram is the second Partial enlarged schematic diagram of the fourth diagram is a schematic diagram of the second embodiment of the present invention applied to a wire. Fifth diagram is a partially enlarged schematic diagram of the fourth diagram. [Illustration of the drawing number] Base 1 0 Terminal 2 0 Base layer 11 Resistive layer 1 2 Epoxy Resin protective layer 1 3 Inner layer 21 Inner layer 22 Outer layer 23 Base 30 Two terminals 40 Inner layer 41 Inner layer 42 Outer layer 43 Magnetic capacitor 50 Conductor 61, 62 Adhesive part 7 0

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Claims (1)

1232352 Patent Application Scope • A low-temperature fired conductive paste applied to wafer-type resistors, capacitors, electrodes, inductors, and electrodes of wire bonding terminals, and includes--conductive powder, which is spherical Silver powder, whose powder diameter is between 0.05 and 0.15 microns, which accounts for 0% to 55% of the total weight; a second conductive powder, whose length is between 4 and 10 microns, is a scaly silver powder, whose proportion is 5 to 12% of the total weight is a second conductive powder, which is nickel, which accounts for 2% to 11% of the total weight; a first resin, which is an epoxy resin, which accounts for 2% to 8% of the total weight A second resin, which is a phenolic resin, accounts for 2% to 8% of the total weight; a first additive, which is an ultra-fine powder clay, which accounts for 2% to 5% of the total weight; the rest is -Adjust the solvent. 2. The low-temperature-fired conductive paste applied to the electrodes of chip-type resistors, capacitors, inductors, and wire bonding terminals as described in item 1 of the scope of the patent application, wherein the first additive is a double hope A-ring The adjusting solvent system includes: a first solvent, which is a diethylene glycol monobutyl ether (butylcarbitol) solvent having a boiling point of 180 ° C or more; Page 13 1232352 6. Scope of patent application A second solvent, which is an aromatic hydrocarbon system with a boiling point of 80 to 180 degrees Celsius. 3 · The low-temperature fired conductive paste for wafer-type resistors, capacitors, inductors, and electrodes of wire bonding terminals as described in item 1 of the scope of the patent application, wherein the first additive is a bisphenol A ring The adjusting solvent system includes: a second additive system is a thermosetting epoxy resin; a first solvent is diethylene glycol monobutyl ether (butylcarbitol); and a second solvent , Which is xylene. Page 14