TWI231417B - Heat sink module and fan structure thereof and fan body - Google Patents
Heat sink module and fan structure thereof and fan body Download PDFInfo
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- TWI231417B TWI231417B TW093100040A TW93100040A TWI231417B TW I231417 B TWI231417 B TW I231417B TW 093100040 A TW093100040 A TW 093100040A TW 93100040 A TW93100040 A TW 93100040A TW I231417 B TWI231417 B TW I231417B
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D29/00—Details, component parts, or accessories
- F04D29/66—Combating cavitation, whirls, noise, vibration or the like; Balancing
- F04D29/661—Combating cavitation, whirls, noise, vibration or the like; Balancing especially adapted for elastic fluid pumps
- F04D29/667—Combating cavitation, whirls, noise, vibration or the like; Balancing especially adapted for elastic fluid pumps by influencing the flow pattern, e.g. suppression of turbulence
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D29/00—Details, component parts, or accessories
- F04D29/26—Rotors specially for elastic fluids
- F04D29/28—Rotors specially for elastic fluids for centrifugal or helico-centrifugal pumps for radial-flow or helico-centrifugal pumps
- F04D29/281—Rotors specially for elastic fluids for centrifugal or helico-centrifugal pumps for radial-flow or helico-centrifugal pumps for fans or blowers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D29/00—Details, component parts, or accessories
- F04D29/26—Rotors specially for elastic fluids
- F04D29/28—Rotors specially for elastic fluids for centrifugal or helico-centrifugal pumps for radial-flow or helico-centrifugal pumps
- F04D29/30—Vanes
Abstract
Description
1231417 五、發明說明(1) 一、 發明所屬之技術領域 特別一種散熱模組及其風扇結構與扇本體, 特]有μ種於扇本體之葉片上利用不同紋路 链度.之設計’以有效解決噪音與系統散熱之問題。 二、 先前技術 隨著電腦前端匯流排的速度日益 333MHz 到400ΜΗζ、由 4_Ηζ 到 533ΜΗζ ( ·早到月的 80 0MHz等),目前筆兮己刮雷日似沾士她4 ★丹由3MHz到 σ生電細的主機板架構已將所有的系 、、充力此均集中在同一塊主機板之上,並且 (Mobile)化的市場需求,於筆 仃動式 α u ^ 乂军‘以奄細之機殼内部已無法 另外再預留出足夠的自缺對流处門 …、 相關义置的政熱技術上係已面臨了重大的設計瓶頸。所 二Πΐ筆記型電腦的散熱機制係均採用了強制對流的 散熱方式來進行。 旦=而’在貫際之風扇的使用i,當對於最大靜壓及流 里^進行提昇時,反而卻會得到更大的寬頻噪音(br〇ad band noise)及窄頻噪音(narr〇w band n〇ise)。 三、發明内容 :鑑於此,本發明之目的就在於提供一種散熱模組及 f風扇結構與扇本體"寺別是針對筆記型電腦之中央處理 早 ^(Central pr0cessing Unit,cpu)用之散熱模組中之 風扇結構及其扇本體結構,利用改變邊界層(b〇undary1231417 V. Description of the invention (1) 1. The technical field to which the invention belongs is a heat dissipation module, a fan structure and a fan body thereof, in particular, μ types are used on the blades of the fan body to utilize different patterns and chain degrees. The design is' effective Solve the problem of noise and system heat dissipation. 2. The previous technology With the increasing speed of the computer front-end bus, 333MHz to 400MΗζ, from 4_Ηζ to 533MΗζ (· 80 0MHz as early as the month, etc.), at present, it seems that the day has been scratched by thunder. 4 ★ Dan is from 3MHz to σ The power generation motherboard architecture has concentrated all the systems and power on the same motherboard, and the (Mobile) market demand is based on the manual movement of α u ^ The interior of the case can no longer reserve enough self-deficient convection doors ... The related political and thermal technologies have faced major design bottlenecks. The cooling mechanism of all IIΐ notebook computers adopts forced convection for cooling. Once the use of the fan in the interim i, when the maximum static pressure and flow ^ is increased, it will actually get greater broad band noise (br〇ad band noise) and narrow band noise (narr〇w band n〇ise). III. Summary of the Invention: In view of this, the object of the present invention is to provide a heat dissipation module, f-fan structure and fan body " Sichuan is for the central processing of notebook PCs (Central pr0cessing Unit, CPU) for heat dissipation The fan structure and the fan body structure in the module use the change of the boundary layer.
1231417 五、發明說明(2) layer)的設計方式以有效降低噪音。 舉例而言,本發明之勒勃π & & 个知炙政熱杈組係可針對於一主機板上 的一熱源(例如·· CPU、晶片笼、、仓—士口日日 -θ ^ ^ ^ 日日月4)進订相關的散熱,或是其 匕具有特疋熱源且必須藉由涵戶、仓—t k 只稽田風扇進灯散熱之類似結構之 中。 ^明之特徵主要在於扇本體之葉片上形成了砂狀表 面粗槌度(sand roughness)及紋路的不同(different 的設計’如此以有效提昇空氣與葉片表面之間的黏 :土 ’ ί且可降低氣流之提早分離(分離流)的現象發生。 藉由扇本體之葉片上之不同粗糙度、不同型式紋路 "X汁作用下係可產生各種不同的尾流 心㈣’進而可降低因尾流所造成之f頻噪音(dlscrete tone) ° 广此—來’藉由扇本體之葉片上之砂狀表面或不同紋 ^(different vein)的搭配運用下,由扇本體所組合而成 扇結構係可應用在|種散熱模組、或是其它需要進行 =政熱的場合之中’ #此以解決因高速元件所帶來之系 j政熱及噪音問題,同時提昇了半導體產業之技術進步了 達到輕薄短小之散熱模組的設計。 姓Μ ίΐ成上述目的,本發明提供一種散熱模組及其風扇 :構/、扇本體,藉由散熱模組以對於一熱源(主機板上之 二央處理單元(Central Pr〇cessing Unit,cpu))進行 。散熱模組包括一吸熱單元與一風扇結構,其中,吸埶 早凡(例如:具有散熱片(fins)之元件)係貼附於中央理1231417 V. Description of the invention (2) The design method of layer) effectively reduces noise. For example, the Leib π & & & & & > Cooperating System of the present invention can be directed to a heat source (e.g., CPU, chip cage, and warehouse-Shikou-ri-θ) on a motherboard. ^ ^ ^ Day, Day, and Month 4) Order related heat dissipation, or its dagger has a special heat source and must be connected to the similar structure of the lamp heat dissipation by the fan, warehouse, tk only Jitian fan. ^ Ming is mainly characterized by the formation of sandy surface roughness and sand texture on the blades of the fan body (different design 'so as to effectively improve the adhesion between the air and the blade surface: soil') and can reduce The phenomenon of early separation of air flow (separated flow) occurs. With different roughness and different patterns on the blades of the fan body " X juice, a variety of different wake palpitations can be generated, thereby reducing the cause of wake The resulting f-frequency noise (dlscrete tone) ° Wider-come 'using the sandy surface on the blades of the fan body or different veins (different veins), the fan structure is combined by the fan body system It can be applied to a variety of heat dissipation modules or other occasions that need to be used for political heat. # This solves the problems of political heat and noise caused by high-speed components, and improves the technological progress of the semiconductor industry. To achieve the design of a thin, light and short heat sink. The surname M ί is to achieve the above purpose, the present invention provides a heat sink module and a fan thereof: a structure / fan body, and the heat sink module is used for a heat source (host The central processing unit (cpu) on the board is used. The heat dissipation module includes a heat absorption unit and a fan structure. Among them, the suction unit (for example, the component with fins) is Attached to the central management
1231417 發明說明(3) 單元Η之上 五 而風扇 構包括了殼體盥戶+ °構係设置於吸埶單元之μ 匕符】双骽興扇本體,1 …早兀之上。風屬結1231417 Description of the invention (3) Above the unit 五 Five and the fan structure includes a housing + + ° structure is arranged on the suction unit μ dagger]] double 骽 Xing fan body, 1… early. Wind knot
置於殼體之上。當4 一 ,扇本體係以可II f/7 + _L 處理早兀Η之熱量時,藉 及熱早7L吸收了來自於 仃吹送,⑹此以達到散埶之目羽:構係可對於吸熱單元進、 本發明所槎Ψ 4 < a的。 心 片。基部係具有一本體中係包括有-基部與複數葉 延伸,各各葉片具有至少Ί葉片係分別由基部之基面而 部係設置於葉面部之上。=面部及複數導引部,各導引 面部的方式而-體成型於J::部係以凹陷於各葉片之葉 凸出於各葉片之葉面部的ΐ之上,或是各導引部係以 部之上。 、万式而一體成型於各葉片之葉面 於本發明之較佳每> 曲線型狀、相互平t^例中’各導引部係可採用線型或 於各葉片之上。丁3對稱等等組合方式而凹陷於或凸出 又,於本發明之 為凹陷於各葉片之筆仏貫施例中,扇本體之各導引部係 本體之各導引部係為=部的複數凹坑(dimPles),或是扇 結構。 ·、、、凸出於各葉片之葉面部的複數砂粒狀 為了讓本發明之Li ^ 明顯易懂,下文特汽述和其他目的、特徵、和優點能更 詳細說明如下:+ ~~較佳實施例,並配合所附圖示,作 四 實施方式Place on the shell. When the fan system is capable of treating the heat of the early vulture with II f / 7 + _L, the 7L absorbs the heat from the puffer, so as to achieve the dispersal of the feathers: the structure can absorb heat The unit is 4 < a of the present invention. Heart piece. The base system has a body system including-a base and a plurality of leaf extensions, and each leaf has at least a blade. The leaf system is respectively provided on the leaf surface by the base surface of the base. = Face and plural guides, each of which guides the face and is formed in J :: The department is formed by the hollows protruding from the leaves of each blade protruding from the ridges of the leaves of each blade, or each guide Department of the Ministry. In one embodiment, the leaf surfaces of the blades are integrally formed. In the preferred embodiment of the present invention, each of the guide portions may be in a linear shape or on each blade. Ding 3 is symmetrical or the like and is recessed or protruded again. In the embodiment of the present invention in which the pen is recessed in each blade, each guide portion of the fan body is a guide portion of the body. Complex pits (dimPles), or fan structures. · ,,, The plurality of sand grains protruding from the leaf surface of each blade In order to make the Li ^ of the present invention clearly understandable, the following special steam description and other purposes, features, and advantages can be described in more detail as follows: + ~~ better Examples, and in conjunction with the attached drawings, make four implementations
0696-A20067TWF(Nl);QCI-92072-TlV;alexli •Ptd0696-A20067TWF (Nl); QCI-92072-TlV; alexli • Ptd
第7頁 五、發明說明(4) [本發明之應用例] 本發明之扇本體是可以應用在各 例如:筆記型電腦之中央處理單元(Ce =結構之中,Page 7 V. Description of the invention (4) [Application examples of the present invention] The fan body of the present invention can be applied to various examples. For example: the central processing unit of a notebook computer (Ce = structure,
Unit: CPU)的散熱’或是其它具右姓〜Processing 扇進行散熱之類似結構之中。 ·疋…、源且必須藉由風 於第8圖及其相關說明中太私 田办丨妈屮1昍,卜卜埒刼# λ Λ月係針對散熱模組Μ的應 、店w加a ·ΓΡπ曰η發、 Λ對於一主機板Ρ上的一熱 源Η(例如· CPU日日片荨)進行相關的散熱。 第一實施例 [本實施例之組成構件] 請參閱第1圖及第2A圖。 =圖係表示根據本發明之第—實施例中之扇本體η 二ir糸表示根據第1圖中之線段A-A對於扇本 體F1中之早一葉片"進行剖切之剖面示意圖。 n Him/本體F1包括有一基部10與複數葉片 二ί=1 結構體,於基部10之外周胃上係具有 一 : 。硬數葉片11係分別由基面1 00而向外呈放 射狀方式進行延伸。於各荦h] 11Π , 1Π, β ^ ^ 合茶片11上係分別具有兩葉面部 110、110及複數ν引部llla、J 豆 1 1 0、1 1 0,係以相對方放报Λ认Μ /、τ ^ & 1 式形成於葉片11之兩側,並且藉由 本體F1於轉動時之迎風表面,亦即,葉 面部1顧直接與空氣進行撞擊,而複數導引部1113、 1 1 1 b係分別形成各葉面部1 1 〇之Unit: CPU) 's heat dissipation' or other similar structures with the right name ~ Processing fan for heat dissipation. · 疋…, the source must be based on the wind in Figure 8 and related descriptions. 太 屮 田田 丨 Mom 丨 1 昍 , 卜卜 埒 刼 # λ Λ is the application for the cooling module M, plus a ΓΡπ means η, Λ performs heat dissipation for a heat source Η (for example, CPU daily chip net) on a motherboard P. First Embodiment [Components of this embodiment] Please refer to FIG. 1 and FIG. 2A. = The figure is a schematic cross-sectional view showing the fan body η and ir 糸 in the first embodiment of the present invention according to the line segment A-A in FIG. 1 for cutting an earlier blade in the fan body F1. Him / body F1 includes a base 10 and a plurality of blades. Two = 1 structures, and a perimeter on the stomach outside the base 10:. The hard-numbered blades 11 are respectively extended from the base surface 100 in a radial manner. In each 荦 h] 11Π, 1Π, β ^ ^ Hecha tablet 11 has two leaf faces 110, 110 and a plurality of ν leading parts llla, J beans 1 1 0, 1 1 0, which are reported to the opposite side Λ Recognition M /, τ ^ & 1 is formed on both sides of the blade 11, and by the windward surface of the body F1 during rotation, that is, the leaf surface 1 directly collides with the air, and the plurality of guide portions 1113, 1 1 1 b is to form each leaf surface 1 1 〇
1231417 五、發明說明(5) 於本實施例中,於各葉面部1 1 0上之複數導引部 111a、111b的數目為2,並且兩導引部111a、111b於實質 上係呈現出相互間隔且相互平行方式的幾何排列狀態,亦 即,·兩導引部1 1 1 a、1 1 1 b係以相互平行方式沿著葉片1 1之 縱長方向L上進行延伸。 由第2A圖可知,葉片11之斷面於實質上係呈現出矩型 結構,兩導引部111 a、111 b係為凹陷於葉片11之葉面部 1 1 0的凹槽。於本實施例中,兩導引部11 1 a、1 1 1 b係為形 成於葉面部11 〇之上的直線型凹槽。 [本實施例之修正例] 第2B圖則是係表示根據第2A圖之葉片11所衍生之另一 修正例中之葉片1 Γ的示意圖。 與第2A圖之葉片11所不同的是,於第2B圖中之兩導引 部111 a’ 、111 b’係以相互間隔、凸出於葉片1 1 ’之葉面部 110的方式而一體成型於葉片11’之葉面部110之上的直線 型凸塊。 第二實施例 [本實施例之組成構件] 請參閱第3圖及第4A圖。 第3圖係表示根據本發明之第二實施例中之扇本體F 2 之立體圖,第4A圖係表示根據第3圖中之線段B-B對於扇本 體F 2中之單一葉片2 1進行剖切之剖面示意圖。1231417 V. Description of the invention (5) In this embodiment, the number of the plurality of guide portions 111a and 111b on each leaf surface 1 10 is two, and the two guide portions 111a and 111b substantially represent each other. The geometric arrangement state of the spaced apart and mutually parallel manner, that is, the two guide portions 1 1 1 a, 1 1 1 b extend in a mutually parallel manner along the longitudinal direction L of the blade 11. It can be seen from FIG. 2A that the cross section of the blade 11 is substantially rectangular in shape, and the two guide portions 111 a and 111 b are grooves recessed in the blade surface 1 10 of the blade 11. In this embodiment, the two guide portions 11 1 a and 1 1 1 b are linear grooves formed on the leaf surface portion 11 〇. [Modified example of this embodiment] FIG. 2B is a schematic diagram showing the blade 1 Γ in another modified example derived from the blade 11 in FIG. 2A. Different from the blade 11 in FIG. 2A, the two guide portions 111a 'and 111b' in FIG. 2B are integrally formed in a manner that they are spaced apart from each other and protrude from the blade surface 110 of the blade 1 1 '. A linear bump on the blade surface 110 of the blade 11 '. Second Embodiment [Components of this embodiment] Please refer to FIG. 3 and FIG. 4A. FIG. 3 is a perspective view showing a fan body F 2 in a second embodiment of the present invention, and FIG. 4A is a view showing a section of a single blade 21 in the fan body F 2 according to a line segment BB in FIG. 3. Schematic cross-section.
0696-A20067TWF(Nl);QCI-92072-TW;a 1 ex 1i η.ptd 第9頁 1231417 五、發明說明(6) 由第3、4A圖可看出,兩導引部21 la、21 lb係凹陷於 葉片2 1之葉面部2 1 0的凹槽。與第一實施例中之扇本體F 1 所不同的是,於第3圖中之扇本體F2之各葉片21上之兩導 引部2 11 a、2 1 1 b係於實質上呈現出相互平行間隔、放射排 列狀態,亦即,兩導引部2 1 1 a、2 1 1 b係以成對的相互平行 方式、且以一角度α傾斜於葉片21之縱長方向L上進行延 伸。於本實施例中,兩導引部2 1 1 a、2 1 1 b係為形成於葉面 部2 1 0之上的直線型凹槽。 其它與第一實施例中之具有相同功能、型狀結構之各 元件係採用相同的元件符號,於此便不再進行綴述。 [本實施例之修正例] 第4B圖係表示根據第4A圖之葉片21所衍生之另一修正 例中之葉片2 1 ’的示意圖。 與第4A圖之葉片21所不同的是,於第4B圖中之兩導引 部2 11 a’ 、2 11 b’係以相互間隔、放射狀凸出於葉片1 1 ’之 葉面部210的方式而一體成型於葉片21’之葉面部210之上 的直線型凸塊。 第三實施例 [本實施例之組成構件] 請參閱第5圖及第6A圖。 第5圖係表示根據本發明之第三實施例中之扇本體F 3 之立體圖,第6A圖係表示根據第5圖中之線段C-C對於扇本0696-A20067TWF (Nl); QCI-92072-TW; a 1 ex 1i η.ptd Page 9 1231417 V. Description of the invention (6) As can be seen in Figures 3 and 4A, the two guides 21 la and 21 lb It is a groove recessed in the leaf surface 2 1 0 of the blade 21. Different from the fan body F 1 in the first embodiment, the two guide portions 2 11 a and 2 1 1 b on each blade 21 of the fan body F2 in FIG. 3 are substantially present with each other. In a parallel spaced, radial arrangement state, that is, the two guide portions 2 1 1 a and 2 1 1 b extend in a pair parallel to each other and inclined at an angle α to the longitudinal direction L of the blade 21. In this embodiment, the two guide portions 2 1 1 a and 2 1 1 b are linear grooves formed on the blade surface portion 2 10. Other components having the same function and shape structure as those in the first embodiment adopt the same component symbols, and will not be described again here. [Modified example of this embodiment] Fig. 4B is a schematic diagram showing a blade 2 1 'in another modified example derived from the blade 21 of Fig. 4A. The difference from the blade 21 in FIG. 4A is that the two guide portions 2 11 a ′ and 2 11 b ′ in FIG. 4B are protruding from the blade surface 210 of the blade 1 1 ′ at a distance from each other. This is a linear bump integrally formed on the blade surface 210 of the blade 21 '. Third Embodiment [Components of this embodiment] Please refer to FIG. 5 and FIG. 6A. FIG. 5 is a perspective view showing a fan body F 3 in a third embodiment of the present invention, and FIG. 6A is a view showing a fan book according to a line segment C-C in FIG. 5.
0696-A20067TWF(Nl);QCI-92072-TW;alexlin.ptd 第10頁 1231417 五、發明說明(7) 體F 3中之單一葉片3 1進行剖切之剖面示意圖。 由第5、6A圖可看出,兩導引部311a、311b係凹陷於 葉片3 1之葉面部3 1 0的凹槽。與第一實施例中之扇本體 F1、·第二實施例中之扇本體F 2所不同的是,於第5圖中之 扇本體F3之各葉片31上之兩導引部311a、311b係於實質上 呈現出相互間隔且相互對稱方式呈現於葉片3 1之葉面部 3 1 0之上,亦即,兩導引部3 11 a、3 11 b係於實質上係以逐 漸展開之曲線型式,沿著且相對於縱長方向L上進行延 伸。於本實施例中,兩導引部3 1 1 a、3 1 1 b係為形成於葉面 部3 1 0之上的曲線型凹槽。 其它與第一實施例中之具有相同功能、型狀結構之各 元件係採用相同的元件符號,於此便不再進行綴述。 [本實施例之修正例] 第6B圖係表示根據第6A圖之葉片3 1所衍生之另一修正 例中之葉片3 Γ的示意圖。 與第6A圖之葉片31所不同的是,於第6B圖中之兩導引 部3 11 a’ 、3 11 b’係以相互間隔與對稱、凸出於葉片3 1 ’之 葉面部310的方式而一體成型於葉片31’之葉面部310之上 的曲線型凸塊。 第四實施例 [本實施例之組成構件] 請參閱第7A圖。0696-A20067TWF (Nl); QCI-92072-TW; alexlin.ptd Page 10 1231417 V. Description of the invention (7) Sectional view of the single blade 31 in the body F 3. As can be seen from Figs. 5 and 6A, the two guide portions 311a and 311b are recessed in the grooves of the blade surface 3 1 0 of the blade 31. Different from the fan body F1 in the first embodiment and the fan body F 2 in the second embodiment, the two guide portions 311a and 311b on each blade 31 of the fan body F3 in FIG. 5 are It appears on the leaf surface 3 1 0 of the blade 31 in a spaced-apart and symmetrical manner, that is, the two guide portions 3 11 a and 3 11 b are substantially in a curved pattern that gradually expands. , Extending along and relative to the longitudinal direction L. In this embodiment, the two guide portions 3 1 1 a and 3 1 1 b are curved grooves formed on the leaf surface portion 3 1 0. Other components having the same function and shape structure as those in the first embodiment adopt the same component symbols, and will not be described again here. [Modified example of this embodiment] FIG. 6B is a schematic diagram showing a blade 3 Γ in another modified example derived from the blade 31 in FIG. 6A. The difference from the blade 31 in FIG. 6A is that the two guide portions 3 11 a ′ and 3 11 b ′ in FIG. 6B protrude from the blade surface 310 of the blade 3 1 ′ at a distance and symmetry from each other. Curved bumps integrally formed on the blade surface portion 310 of the blade 31 '. Fourth Embodiment [Components of this embodiment] Please refer to FIG. 7A.
0696-A20067TWF(Nl) ;QCI-92072-TW;a 1 ex 1i η.ptd 第11頁 1231417 五、發明說明(8) -- 第7A圖係表示根據本發明之第四實施例中之扃本體ρ4 立體f ’ Ϊ中’扇本體F4包括有複數葉片41 ’於各葉片 41上具有一茱面部41〇。 …·由第?圖可看出,複數導弓丨部411係以相互間隔的方 式^成於Ϊ片4 1之葉面部4 1 〇上。與上述各實施例所不同 的疋/於—第7A圖中之扇本體F4之各葉片41上之複數導引部 4 11係於貫質上呈現出不等間隔且不相互對稱,均勻自由 分布之方式呈現於葉片41之葉面部41〇之上,亦即,複數 導引部m係於貫質上係以凹陷於葉片41之葉面部41〇的方 式進灯设置。於本實施例中,複數導引部41 i係為一體成 型方式之凹陷於各葉片4丨之葉面部41〇的複數凹坑 (dimples) 〇 其它與第一實施例中之具有相同功能、型狀結構之各 元件係採用相同的元件符號,於此便不再進行綴述。 [本實施例之修正例] 請參閱第7B圖。 第7B圖係表示根據第7a圖之扇本體f4所衍生之另一修 正例的立體圖,其中,扇本體!?4包括有複數葉片41,。 與第7A之葉片4所不同的是,於第7B圖中之複數導引 部411係為一體成型方式凸出於各葉片41,之葉面部41〇的 複數砂粒狀結構(p a r t i c 1 e s )。 [本發明之應用例]0696-A20067TWF (Nl); QCI-92072-TW; a 1 ex 1i η.ptd P.11 1231417 V. Description of the invention (8)-Figure 7A shows the 扃 body in the fourth embodiment of the present invention The ρ4 three-dimensional f 'Ϊ 中' fan body F4 includes a plurality of blades 41 'and each blade 41 has a dogwood surface 41. ... · by the first? It can be seen from the figure that the plurality of guide bow portions 411 are formed on the leaf surface 4 1 0 of the sepal 41 in a spaced manner. Different from the above embodiments, the plural guides 4 11 on the blades 41 of the fan body F4 in FIG. 7A are unequally spaced and not symmetrical with each other on the mass, and are evenly and freely distributed. The method is presented on the leaf surface portion 41 of the blade 41, that is, the plurality of guide portions m are arranged on the substrate in a manner of being recessed in the leaf surface portion 41 of the blade 41 to be installed in the lamp. In this embodiment, the plurality of guide portions 41 i are a plurality of dimples recessed in the leaf surface 41 of each blade 4 in an integral molding manner. Others have the same functions and types as those in the first embodiment. Each element of the structure has the same element symbol and will not be described here. [Modification of this embodiment] Please refer to FIG. 7B. Fig. 7B is a perspective view showing another modified example derived from the fan body f4 of Fig. 7a, in which the fan body 4 includes a plurality of blades 41 '. The difference from the blade 4 in FIG. 7A is that the plurality of guide portions 411 in FIG. 7B are integrally formed in a plurality of sand-like structures (p a r t i c 1 e s) protruding from each blade 41 and the blade surface portion 41. [Application Examples of the Present Invention]
0696-A20067nVF(Nl);QCI-92072-TlV;alexlin.ptd 第12頁 1231417 五、發明說明(9) 第8圖係表示根據本發明之散熱模組μ應用以對於一熱 源Η進行散熱之立體示意圖。於此之熱源η係主要以筆記型 電腦之主機板Ρ上之中央處理單元(Central Pr〇cessing U n i t,C P U)(以下簡稱’’中央處理單元η ”)為例子。 散熱模組Μ包括一吸熱單元s與一風扇結構κ,其中, 吸熱單,s_(例如:具有散熱片(fins)之元件)係貼附於中 央處理單元Η之上,而風扇結構κ係設置於吸熱單元s之 上。風扇結構K包括了殼體F0與扇本體以,其中,扇本體 F1係以可轉動方式設置於殼體之上。0696-A20067nVF (Nl); QCI-92072-TlV; alexlin.ptd Page 12 1231417 V. Description of the invention (9) Figure 8 shows the three-dimensional application of the heat dissipation module μ according to the present invention to dissipate heat from a heat source. schematic diagram. The heat source η here is mainly based on a central processing unit (CPU) (hereinafter referred to as a “central processing unit η”) on the main board P of the notebook computer. The heat dissipation module M includes a The heat absorbing unit s and a fan structure κ, wherein the heat absorbing unit, s_ (for example, a component with fins) is attached to the central processing unit Η, and the fan structure κ is provided on the heat absorbing unit s The fan structure K includes a housing F0 and a fan body, wherein the fan body F1 is rotatably disposed on the housing.
於本應用例中,散熱模組M中之風扇結構κ中之扇本體 係以第一實施例中之扇本體F1而提出說明,其它如實施 中之F2、F3、F4亦是可以應用在風扇結構κ之中,於1 不再綴述。 當散熱模組Μ之吸熱單元S吸收了來自於中央處理 Η之熱量時,藉由風扇結構κ係可對於吸熱單元s進行—70 送,如此以達到散熱之目的。 ^丁人In this application example, the fan structure κ in the cooling module M is described with the fan body F1 in the first embodiment. Other implementations such as F2, F3, and F4 can also be applied to fans. In the structure κ, Yu 1 will not be described again. When the heat-absorbing unit S of the heat-dissipating module M absorbs the heat from the central processing unit ,, the fan structure κ can send -70 to the heat-absorbing unit s, so as to achieve the purpose of heat dissipation. ^ Dingren
此外,由於在扇本體之葉片上形成了砂狀表面 及不同紋路的設計作用下,如此以有效提昇空氣盥, 面之間的黏著性’並且可降低氣流之提早分離('分'離 現象發生。再者,藉由扇本體之葉片上之不同粗严/il 同型式紋路的設計可改變邊界層,以產生各種不二 型式’進而可降低因尾流所造成之窄頻噪音。如此」尾 藉由扇本體之葉片上之砂狀表面或不同紋二的‘配;, 下,由扇本體所組合而成之風扇結構係可應用在各種$In addition, due to the design of the sandy surface and different textures on the blades of the fan body, this can effectively improve the air-to-surface adhesion and reduce the early separation of the air flow (the 'separation' phenomenon occurs) In addition, by designing different thicknesses on the blades of the fan body / il the same pattern can change the boundary layer to produce a variety of unique patterns', which can reduce the narrow-band noise caused by the wake. With the sand-like surface on the blades of the fan body or different patterns, the fan structure composed of the fan body can be applied to various types
1231417 五、發明說明(10) 模組、或是其它需要進行風扇散熱的場合之中,如此以解 決因高速元件所帶來之系統散熱及噪音問題。 雖然本發明已以較佳實施例揭露如上,然其並非用以 限制本發明,任何熟習此項技藝者,在不脫離本發明之精 神和範圍内,當可做更動與潤飾,因此本發明之保護範圍 當事後附之申請專利範圍所界定者為準。1231417 V. Description of the invention (10) Modules, or other occasions where fan cooling is needed, so as to solve the problem of system heat dissipation and noise caused by high-speed components. Although the present invention has been disclosed as above with preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make changes and retouching without departing from the spirit and scope of the present invention. The scope of protection shall be determined by the scope of the patent application.
0696-A20067TW(Nl);QCI-92072-TW;alexlin.ptd 第14頁 1231417 圖式簡單說明 第1圖係表示根據本發明之第一實施例中之扇本體 (F1 )之立體圖; 第2A圖係表示根據第1圖中之線段(A-A)對於扇本體 (F 1广中之單一葉片(1 1 )進行剖切下之示意圖; 第2B圖係表示根據第2A圖之葉片(1 1 )所衍生之另一修 正例中之葉片(1 1 ’)的示意圖; 第3圖係表示根據本發明之第二實施例中之扇本體 (F2)之立體圖; 第4A圖係表示根據第3圖中之線段(B-B)對於扇本體 (F2)中之單一葉片(21 )進行剖切下之示意圖; 第4B圖係表示根據第4A圖之葉片(21 )所衍生之另一修 正例中之葉片(2 1 ’)的示意圖; 第5圖係表示根據本發明之第三實施例中之扇本體 (F3)之立體圖; 第6A圖係表示根據第3圖中之線段(C-C)對於扇本體 (F 3 )中之單一葉片(3 1)進行剖切下之示意圖; 第6B圖係表示根據第6A圖之葉片(31 )所衍生之另一修 正例中之葉片(3Γ )的示意圖; 第7A圖係表示根據本發明之第四實施例中之扇本體 (F4)之立體圖,其中,扇本體(F4)包括有複數葉片(41); 第7B圖係表示根據第7A圖之扇本體(F4)所衍生之另一 修正例的立體圖,其中,扇本體(F 4 )包括有複數葉片 (4 1 ’);以及 第8圖係表示根據本發明之散熱模組(Μ)應用以對於一0696-A20067TW (Nl); QCI-92072-TW; alexlin.ptd Page 14 1231417 Brief Description of Drawings Figure 1 is a perspective view showing the fan body (F1) in the first embodiment of the present invention; Figure 2A It is a schematic diagram of the fan body (a single blade (1 1) of F 1 Guangzhong) is cut according to the line segment (AA) in FIG. 1; FIG. 2B is a diagram showing the blade (1 1) according to FIG. 2A Schematic diagram of the blade (1 1 ') in another modified example; FIG. 3 is a perspective view showing the fan body (F2) in the second embodiment of the present invention; FIG. 4A is a view showing the blade in accordance with FIG. 3 The line segment (BB) is a schematic diagram of a single blade (21) in the fan body (F2); FIG. 4B shows a blade (in another modified example derived from the blade (21) in FIG. 4A) 2 1 ′); FIG. 5 is a perspective view showing the fan body (F3) in the third embodiment of the present invention; FIG. 6A is a view showing the fan body (F) according to the line segment (CC) in FIG. 3) A schematic view of a single blade (3 1) in section; Figure 6B shows the blade (31) according to Figure 6A A schematic diagram of a blade (3Γ) in another modified example derived; FIG. 7A is a perspective view of a fan body (F4) according to a fourth embodiment of the present invention, wherein the fan body (F4) includes a plurality of blades ( 41); FIG. 7B is a perspective view showing another modified example derived from the fan body (F4) according to FIG. 7A, wherein the fan body (F4) includes a plurality of blades (4 1 '); and FIG. 8 It means that the heat dissipation module (M) according to the present invention is applied to a
0696-A20067TWF(Nl);QCI-92072-,nV;alexlin.ptd 第15頁 1231417 圖式簡單說明 熱源(Η)進行散熱之示意立體圖,其中,散熱模組(Μ)包括 一吸熱單元(S)與一風扇結構(Κ),並且於風扇結構(Κ)中 具有一扇本體(F 1 )。 符號說明 1 0〜基部 100〜基面 11 、 11’〜葉片 11 0、11 0 ’〜葉面部 111a、111b〜導引部 111a’ 、111b’〜導引部 21 、21’〜葉片 2 1 0〜葉面部 21 la、21 lb〜導引部 21 la’ 、21 lb’〜導引部 31 、 31’〜葉片 3 1 0〜葉面部 31 la、31 lb〜導引部 31 la’ 、31 lb’〜導引部 41 、 41’〜葉片 4 1 0〜葉面部 A -A、B-B、C-C〜線段 F0〜殼體 FI 、F2、F3、F4〜扇本體0696-A20067TWF (Nl); QCI-92072-, nV; alexlin.ptd Page 15 1231417 The schematic diagram illustrates the heat source (Η) for heat dissipation. The heat dissipation module (M) includes a heat absorption unit (S). And a fan structure (K), and a fan body (F1) in the fan structure (K). DESCRIPTION OF SYMBOLS 1 0 to base 100 to base surface 11, 11 'to blade 11 0, 11 0' to leaf surface portion 111a, 111b to guide portion 111a ', 111b' to guide portion 21, 21 'to blade 2 1 0 ~ Leaf surface 21 la, 21 lb ~ Guide 21 la ', 21 lb' ~ Guide 31, 31 '~ Blade 3 1 0 ~ Leaf surface 31 la, 31 lb ~ Guide 31 la', 31 lb '~ Guide 41, 41' ~ Leaf 4 1 0 ~ Leaf surface A -A, BB, CC ~ Segment F0 ~ Housing FI, F2, F3, F4 ~ Fan body
0696-A20067TWF(Nl);QCI-92072-TW;alexlin.ptd 第16頁 12314170696-A20067TWF (Nl); QCI-92072-TW; alexlin.ptd Page 16 1231417
0696-A20067TWF(Nl);QCI-92072-TW;alexlin.ptd 第17頁0696-A20067TWF (Nl); QCI-92072-TW; alexlin.ptd Page 17
Claims (1)
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TW093100040A TWI231417B (en) | 2004-01-02 | 2004-01-02 | Heat sink module and fan structure thereof and fan body |
US10/932,131 US20050147498A1 (en) | 2004-01-02 | 2004-09-01 | Heat-dissipating module, fan structure and impeller thereof |
Applications Claiming Priority (1)
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TW093100040A TWI231417B (en) | 2004-01-02 | 2004-01-02 | Heat sink module and fan structure thereof and fan body |
Publications (2)
Publication Number | Publication Date |
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TWI231417B true TWI231417B (en) | 2005-04-21 |
TW200523721A TW200523721A (en) | 2005-07-16 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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TW093100040A TWI231417B (en) | 2004-01-02 | 2004-01-02 | Heat sink module and fan structure thereof and fan body |
Country Status (2)
Country | Link |
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US (1) | US20050147498A1 (en) |
TW (1) | TWI231417B (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7713030B2 (en) * | 2005-12-12 | 2010-05-11 | International Business Machines Corporation | Fan with improved heat dissipation |
US20080130226A1 (en) * | 2006-11-30 | 2008-06-05 | Matsushita Electric Industrial Co., Ltd. | Centrifugal fan device and electronic apparatus having the same |
CN101498317B (en) * | 2008-02-01 | 2012-03-14 | 富准精密工业(深圳)有限公司 | Heat radiating fun and impeller thereof |
CN106593540B (en) * | 2017-02-03 | 2018-06-26 | 刘欧阳 | A kind of turbo blade and the turbine being made of the turbo blade |
CN109356887A (en) * | 2018-11-28 | 2019-02-19 | 郑州云海信息技术有限公司 | The tool-free dismounting blower tray of one kind and fan mould group |
EA037061B1 (en) * | 2019-01-25 | 2021-02-01 | Частное Учреждение "Назарбаев Университет Рисеч Энд Инновэйшн Систэм" | Centrifugal pump impeller blade |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1352848A (en) * | 1917-10-30 | 1920-09-14 | Stanyo Desider | Fan-wheel |
US1864803A (en) * | 1929-07-11 | 1932-06-28 | John M Clark | Marine and aeroplane propeller |
US2054144A (en) * | 1934-07-19 | 1936-09-15 | Gen Motors Corp | Refrigerating apparatus |
US2238749A (en) * | 1939-01-30 | 1941-04-15 | Clarence B Swift | Fan blade |
US2616764A (en) * | 1948-05-22 | 1952-11-04 | Earl M Parrish | Wear resistant blower surface |
US2794509A (en) * | 1954-05-14 | 1957-06-04 | Gail E Mix | Fan having detachable blades |
US3578264A (en) * | 1968-07-09 | 1971-05-11 | Battelle Development Corp | Boundary layer control of flow separation and heat exchange |
US3608976A (en) * | 1969-09-12 | 1971-09-28 | Fines A Zugelder | Fan blade having wear-resistant ribs and fan including a plurality of same |
US4128363A (en) * | 1975-04-30 | 1978-12-05 | Kabushiki Kaisha Toyota Chuo Kenkyusho | Axial flow fan |
US4025231A (en) * | 1975-11-26 | 1977-05-24 | Revcor, Inc. | Propeller fan construction |
US4441857A (en) * | 1981-09-25 | 1984-04-10 | Union Carbide Corporation | Wear resistant fan blade for centrifugal fan |
GB2188101B (en) * | 1986-03-22 | 1990-12-05 | Usui Kokusai Sangyo Kk | Fan blades |
DE3716717A1 (en) * | 1986-05-19 | 1987-11-26 | Usui Kokusai Sangyo Kk | BLADES FOR HIGH-SPEED PROPELLER FANS |
DE3716718A1 (en) * | 1986-05-19 | 1987-11-26 | Usui Kokusai Sangyo Kk | LOW SPEED PROPELLER FANS |
US5430610A (en) * | 1994-06-15 | 1995-07-04 | Hung; Chin-Ping | Separable positioning device for the heat sink on computer chips |
US6017185A (en) * | 1998-08-13 | 2000-01-25 | Chaun-Choung Industrial Corp. | Fan fixing structure of a radiator |
US6472781B2 (en) * | 1999-03-31 | 2002-10-29 | Toshiba Home Technology Corporation | Fan Motor |
US6538887B2 (en) * | 2001-07-26 | 2003-03-25 | Hewlett-Packard Company | Fan blade providing enhanced performance in air movement |
US6872048B2 (en) * | 2001-11-26 | 2005-03-29 | Lennox Industries, Inc. | Fan with reduced noise generation |
TW586740U (en) * | 2002-03-06 | 2004-05-01 | Hon Hai Prec Ind Co Ltd | Heat dissipation device |
TW590272U (en) * | 2003-02-14 | 2004-06-01 | Bi Sonic Technology Corp | Structure improvement of heat dissipation fan |
-
2004
- 2004-01-02 TW TW093100040A patent/TWI231417B/en not_active IP Right Cessation
- 2004-09-01 US US10/932,131 patent/US20050147498A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
TW200523721A (en) | 2005-07-16 |
US20050147498A1 (en) | 2005-07-07 |
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Legal Events
Date | Code | Title | Description |
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MM4A | Annulment or lapse of patent due to non-payment of fees |