TWI229472B - Ceramic, low-temperature co-fired ceramic ferrite composite material, method for preparing slurry, and method for manufacturing combined filter inhibiting electromagnetic interference - Google Patents

Abstract

The present invention relates to a ceramic, a low-temperature co-fired ceramic-ferrite composite material, a method for preparing them, and a filter inhibiting electromagnetic interference (EMI). The invented method mainly comprises performing a low temperature co-firing on a ceramic-ferrite heterojunction material. In addition to using a glass-filled binder, the following factors are considered for obtaining an optimum heterojunction binding: sintering shrinkage affected by different junction materials, amount of addition of glass component, and sintering shrinkage affected by the particle size of material powder and thickness of dielectric layer. The invented low-temperature co-fired ceramic ferrite composite material can be used to produce anti-EMI versatile combined passive devices and has an excellent electromagnetic coupling effect.

Description

1229472

The invention relates to a ceramic, ceramic-ferrite magnet low-temperature co-fired composite material and its multiple combined passive components for preparing and preventing electromagnetic interference, that is, a ceramic-ferrite magnet (Ceramic ~ Ferrite) low-temperature co-fired using a different dielectric material. Making filter elements (EM 丨 Lc ·

Fi Iter), in addition to adding glass filler components for bonding, in order to obtain the best heterodielectric bonding after sintering, consider the sintering shrinkage of different dielectric materials and the amount of glass components added. The sintering shrinkage problem involves raw materials. The design of the particle size of the powder and the thickness of the dielectric layer, the present invention mainly lies in the ceramic-ferrite magnet (Ceramic-Ferrite) heterodielectric low-temperature co-firing materials and materials manufacturing technology, through the laminated passive component process, Production of diversified combined passive components related to the prevention of electromagnetic interference (EMI). , Different dielectric materials Ceramic-Ferrite co-firing low-temperature co-fired electromagnetic wave components, for the electrical characteristics of the device, at the same time both low-loss (low 10s) capacitor materials and high electromagnetic coupling (high, electromagnet ic couple ) Inductive material. If this material is used for module development, it will not need to consider the electromagnetic compatibility (EMC) of the module. In order to prove that this heterodielectric material has superior electromagnetic coupling effect, the comparison of a single ceramic material and a single ferrite magnet material to a heterodielectric composite material will be introduced below. °

The left ceramic material can be seen in the application of passive electronic components such as resistors, capacitors, inductors, etc. It is inevitable to use ceramic electronic components whether it is information, communication or military. There are two main types of wafer-type electronic parts: thin film and thick film. In thick film manufacturing, ceramic materials provide the high dielectric value and stable weather-resistant carrier required for strong cc. At present, low dielectric ceramic (Ah%) is more High frequency crystal

1229472 V. Description of the invention (2) • Main material of one-chip inductor. In the manufacture of thin-film electronic parts, ceramic materials are also the main source of substrates or carriers. At present, the development direction of electronic components based on ceramic materials is mainly: (1) small size, multi-layer number, high unit volume capacitance or inductance value, in order to meet the development of electronic products in the short, thin, and high functional density. (2) Moving towards modularization, using passive network components, integrating several passive components in a single chip to reduce the number of passive components on the PCB and use area, reduce costs and improve performance And reliability. The creators of advanced process technology believe that the above two development trends are the staged technological evolution of mankind's desire for new electronic products. The more futuristic solution is the development of modular process. The process is to first integrate all passive components. (Resistance, capacitance, inductance, transmission line, and matching line), the next is the integrated functional module. The next is the functional module that integrates different media. 2. Low Temperature Co-fired

Ceramics; LTCC) materials and process technology have been proven to have advantages in helmet line communication, satellite communication Ifl, circuit packaging, automotive electronics and other advantages. Low-temperature co-fired ceramics evolved from high-temperature co-fired ceramics. Due to the addition of glass fillers, the sintering temperature of the ceramic body can be reduced to between 850 and 950 ° C, so that it can be used with highly conductive metal coatings. Co-firing, such as gold, silver, copper, silver to palladium, etc., to achieve high quality factor (q factor) circuits. If it is equipped with a 3D multilayer structure, it can achieve small size and special specifications. Now it has become the choice of wireless communication components or line processes:-, * chip filters, chip antennas, power amplifiers, Bluetooth modules

1229472 V. Description of the invention (3) ^ M plastic ^ materials are still the mains of multilayer integrated circuit boards (BGA)-LT low temperature co-fired ceramic LTCC technology is based on: (1) can integrate passive crying nr & inductor. (2) Passive circuits can be integrated, such as Qin Bo 4 * said green self, road. (3) High-density interconnection (interconnection), which can reduce the cost significantly and is considered as one of the best implementation technologies for wireless and broadband communication. Therefore, if you can expand the use of group and if tools to enhance the designer ’s understanding of the advantages and applications of ceramics, and then the application of Tian 1, u,: Guang j Wu, future low temperature co-fired ceramic process technology will not be able to become a designer. Mainstream technology in mind. After 1991, Japanese and European and American manufacturers of passive components began to use simple ceramic materials or ferrite magnet materials to make simpler LC ferrules (T type was 1 1 to 2 fUter). Due to the lack of technology and process capabilities at the time, 70 pieces of clothing filter are large in size, most of which are used in FM and AM broadcasting systems f. With the increase of communication frequency in the past j years, Bluetooth Bluetooth, broadband wireless LAN, and other related wave components have come out, and their manufacturing processes are mostly ", low-temperature co-firing pottery KG production, materials used For ceramic materials with lower dielectric value (K = 4. 7 ~ 13). Π LC ceramic made by low temperature co-firing of ceramics _ ferromagnetic composite materials. Developed m pieces of ytterbium-like magnet composite materials, but the electrical failure characteristics are not very good. In recent years, Japan Electric Glass Co., Ltd. and South Korea Ceratech. Have also developed TDK-like heterodielectric co-firing technology, but their temperature and k technology are not good. , Often cause the sample to crack or warp. Therefore, domestic and foreign passive parts manufacturers are actively engaged in such low-temperature co-firing =

1229472 V. Description of the invention (4), adding filtering element. The power supply and the general two terminals that use the ground in the entire machine are exchanged. Therefore, the IC of the electromagnetic puppet computer for the noise of the small noise is set up, and the capacitor IC is constructed because of the noise countermeasure. The purpose of the development of noise reduction and radiation elimination is to make use of the characteristics of different dielectric materials to produce a smaller volume (0,063) of liquid and piconet as examples to illustrate. There are many sources of noise generation, and there are many small grounding plates in the computer, which cannot be significant, and the noise that occurs can be caused by the frequency of the device or inductor that can not wave. The strategy is often to use a EMI filter to remove noise from the design itself, and use a shield (

News. The EM I wave filter usually refers to a low-pass wave filter composed of an inductor and a capacitor. A low-pass filter can be composed of only a capacitor and an inductor, and a combination of several inductors and capacitors. There are various types of circuit element finished products. The multilayer chip EM I filter is a combination of several multilayer chip inductors and multilayer chip capacitors through circuit design and multilayer chip component manufacturing processes. It has a monolithic structure (M〇 nol i thic

Structure) and miniaturization (size 3 · 2 x 1 · 6mm), suitable for surface adhesion technology.

Analysis of the electrical characteristics of filter elements based on materials. If a filter element is made of a ceramic material made by a general LTCC process, its insertion loss (dB) versus frequency Freq · (Hz) can be seen in the insertion loss range from 3dB to 20dB, and its bandwidth is as high as 60%. Above 〇mHz, this component cannot be used in the speech system of communication products. Furthermore, if ceramic materials are used to make high-frequency filters that comply with Bluetooth (2.45 GHz) or WLAN (5.0 GHz) safety regulations, it is not necessary. Because when the signal frequency

Claims (1)

12¾¾¾ W — Ιβ 91124451 1. — A kind of "ceramic low temperature co-fired material with appropriate proportion of dielectric ceramic and _ ial includes barium octylate according to the dielectric constant value: less important component is oxygen one substance 'and: force ratio To increase the wealth of the second: strong t H co-fired materials _ preparation methods, "including: The: Proper ratio of dielectric ceramics and dioxygen ... Denier two magnets + one to prepare | composition is cinnamic acid lock, owing The main ingredients are oxidized oxide and shari rare earth element hafnium oxide thorium oxide, and an appropriate proportion of borax is added. According to an appropriate ratio, 2 is placed in a ball mill tank containing thorium oxide balls of different particle sizes, and then an appropriate amount of ethanol, toluene and dispersion Set the low speed of the ball mill and grind to the appropriate particle size. Take the appropriate table material and add an appropriate amount of a binder and an appropriate amount of plasticizer, and mix evenly. 3. According to the "method for preparing a ceramic low temperature co-fired material slurry" described in item 2 of the scope of the patent application, wherein the particle size is controlled to 0.1 5 to 0.2 3 // m. 4 · A "method for preparing ferrite magnet low temperature co-fired material slurry", which includes: · The appropriate proportion of ferric oxide, nickel oxide, oxide and copper oxide is adjusted according to the initial permeability value, and an appropriate amount of ferrite magnet is taken. Formula powder is added with an appropriate amount of R. 〇 water and an appropriate amount of dispersant, and the process powder is dried after being stirred uniformly; the aforementioned powder is calcined at 750 ° C and held at temperature for 2 hours; the appropriate amount of powder after calcination is added and an appropriate amount of ethanol and Benzene and dispersant are ground in a ball mill tank containing oxidized balls with different particle diameters to control the particle size of the powder to 0 · 4 5 ~ 0 · 5 0 // m; take the appropriate amount of the above slurry and add an appropriate amount of binder and Moderate amount of plasticizer, mix evenly Page 14 1. Adjust the appropriate proportion of the dielectric according to the dielectric constant value and add the appropriate proportion of borax. Then, put the zirconium ball mill in the proper proportion, and then add the appropriate amount of B. The ball mill is set to a low speed and milled into appropriate grain. &Quot; J. Add an appropriate amount of binder and an appropriate amount of plasticizer, or paste; ^% & Dispose an appropriate proportion of zinc trioxide and copper oxide according to the initial permeability value, take an appropriate amount of ferrite magnet formula water and apply 1 Dispersant, uniform stirring and drying process 7 ^ 0 c, + holding temperature for 2 hours, take the appropriate amount of alcohol, toluene and dispersant after sintering to a different particle size = grind to a suitable particle size, take an appropriate amount of slurry Add appropriate amount of clam'j and mix into ferrite magnet low-temperature co-firing slurry. The ceramic low-temperature co-firing slurry is prepared into a single layer through the internal electrode printing process of the raw embryo; ^ 1 prepare ferrite magnet low-temperature co-firing slurry. After a hole-filling-internal electrode printing process, a layer of ceramic and silicon dioxide is formed. After containing different diameters of oxyalcohol, toluene, and dispersion diameter, and then taking an appropriate amount of slurry to synthesize ceramics, low-temperature co-fired ferrous iron, nickel oxide, Add the appropriate amount of R. 〇 powder , Powder calcination powder addition amount of B hammer ball mill pot with a bonding agent and an appropriate amount of plasticized fill punch punching - > > Page 15 Page 16, 4f 2 Ming K = 12 K = 27 K = 36 K = 50 wt (g) wt% wt (g) wt% wt (g) wt% wt (g) wt% Dielectric Ceramic K = 100 75.0 66.37 100.0 72.46 220.0 85.27 320.0 92.7 Si02 30.0 26.55 30.0 21.74 30.0 11.63 20.0 5.8 Na2B4O7 * 10H2O 8.0 7.08 8.0 5.80 8.0 3.10 5.3 1.5 Total 113.0 100.00 138.0 100.00 258.0 100.00 345.3 100.00 First picture /// i = 25 // i = 100 ju i = 500 ju i = 750 Wt (g) mol% wt (g) mol% wt (g) mol% wt (g) mol% Fe2〇3 334.71 48.20 329.60 48.00 327.74 48.24 327.47 48.30 NiO 145.60 44.83 77.34 24.08 32.68 10.28 21.97 6.93 ZnO 6.56 1.85 61.80 17.66 108.48 31.34 112.02 32.43 CuO 17.70 5.12 35.06 10.25 34.31 10.14 41.67 12.34 Total 504.57 100.00 503.80 100.00 503.21 100.00 503.13 100.00 The second figure firing curve Third picture