1229400 五、發明說明（1) 【發明所屬之技術領域】 本發明係有關於一種探測器清潔方法，特別有關於一種用 於凸塊化半導體元件測試之探測器清潔方法。 【先前技術】 半導體元件，例如裸半導體晶片（bare semiconductor die)、半導體封裝構造（semic〇nduct〇r package)、晶片 尺寸封裝構造（chip scaie pac kage )、球格陣列封裝構造 (BGA device)以及半導體晶圓（semiconductor wafer )，可包含凸塊狀之接觸端點。這類型的元件有時被稱為凸 塊化元件（bumped component，例如凸塊化晶片bumped die、凸塊化封裝構造bumped package、凸塊化晶圓 wafer )。 …第1圖所示為一凸塊化晶圓100，包含複數個晶片1〇2以及 複數個凸塊接點1 〇 4形成於該晶片丨〇 2的表面上丨〇 6。轉：塊 接點104允許該晶片102以表面接著於相配合之基板（例^印 刷電路板）。一般而言，該凸塊接點丨〇4係由銲錫製成，因 此該晶片102可經由一個銲錫回銲製程被接合在該相配合之 基板。該晶片102包含複數個接墊（未示於圖中）電性 於該凸塊接點104，且該晶片1Q2中包含内部電路（未示於 與該接墊電性連接，4經由該接塾電性連接至該凸塊接 為了執行針對晶片1 02或是其他半導體元件的檢測過程， 必須使檢測儀器之裝置暫時與該凸塊接點1〇4電性連接。 了完成這個暫時電性連接，目前已發展出多種的探測器〜1229400 V. Description of the invention (1) [Technical field to which the invention belongs] The present invention relates to a method for cleaning a detector, and more particularly to a method for cleaning a detector for testing bumped semiconductor elements. [Prior art] Semiconductor components, such as bare semiconductor die, semiconductor package structure, chip scaie pac kage, ball grid array package structure (BGA device), and A semiconductor wafer may include bump-shaped contact terminals. This type of component is sometimes referred to as a bumped component (for example, a bumped die, a bumped package structure, a bumped package, or a bumped wafer). ... Fig. 1 shows a bumped wafer 100, which includes a plurality of wafers 102 and a plurality of bump contacts 104 formed on the surface of the wafer. Turn: The block contact 104 allows the wafer 102 to be surface-bonded to a mating substrate (e.g., a printed circuit board). Generally speaking, the bump contacts 04 are made of solder, so the wafer 102 can be bonded to the mating substrate through a solder reflow process. The chip 102 includes a plurality of pads (not shown) electrically connected to the bump contacts 104, and the chip 1Q2 includes internal circuits (not shown electrically connected to the pads, and 4 via the connection) Electrical connection to the bump connection In order to perform the inspection process for the wafer 102 or other semiconductor components, the device of the testing instrument must be temporarily electrically connected to the bump contact 104. This temporary electrical connection is completed , Has developed a variety of detectors ~
第7頁 1229400 五、發明說明（2) 二典型用在晶圓級（^ ^ he1 )的探測器係 針測卡1〇"8复勺二” card)。第1圖所示之為一種典型之 點104雷性、查^匕3禝數個針（nee(He ) 110用以與該凸塊接 掐上’ 。應注意的是，另外還有多種類之連接器及 偵測卡能完成这錄雷，4 k ^ 盥&饱接fi: Ί ^卷種士電連接，然而，無論那一類型之連接器 /、 ”、、 〇 4暫時電性連接時，都會發生連接器之連接端 點的污染問題。 逆按知 凸塊接點通常係藉由高溫將銲騎化形成球狀，以盘 面上的接墊接合。一般為使炫融的錫球與接塾有良 a ，會於接墊上噴灑具有強酸性質的助銲劑，或者， ^ 助銲刈及鲜錫粉末混合而成之錫膏。由於助銲劑會去 二，墊表©之氧化物，故可確保錫球與接塾之間的焊錫連接 二 ί J〇lnt Μ118511 ί1：7)。然而，錫球的表面經 I 助紅劑，故在測試步驟之中，針測卡等連接_的連 接接點（針）與表面具有助銲劑的錫球接觸，錢得|^接 點（針）被助鲜劑污染 二义些殘留在連接接點上的助銲劑，會在測試過程中造成測 u的：差’還可能沾附到其他被測元件之凸塊接點。因 此般而δ ，個偵測卡之針與凸塊接點接觸數百次之後 便需要清潔。 第2a到2c圖所示為目前使用之清潔偵測卡之針的方法，其 ^驟如下。首先提供一具有旋轉功能之研磨盤2 q2，該研磨八 2 0 2具有一相對粗糙之表面2 〇 4。再參照第仏圖，使欲清潔 之針大112與a亥研磨盤2〇2之表面2〇4接觸，將該針尖112具有Page 7 1229400 V. Description of the invention (2) Two detectors typically used at the wafer level (^ ^ he1) are probe card 10 ("8 double spoon two" card). Figure 1 shows a kind of The typical point is 104 thunder, and 3 pins (nee (He) 110 are used to connect with the bump.) It should be noted that there are many types of connectors and detection cards. After completing this recording, 4 k ^ & & full fi: Ί ^ roll type electrical connection, however, no matter what type of connector /, ",, 〇4 temporary electrical connection, the connector will occur The contamination problem of the connection end points. The reverse contact is known that the bump contact is usually formed into a ball by high temperature welding, and the pads are joined by the pad surface. Generally, the solder ball and the connection are good. It will spray flux with strong acid properties on the pads, or ^ solder paste made from a mixture of soldering tin and fresh tin powder. Since the flux will go to two, the oxide on the pad surface can ensure the solder ball and the solder The solder connection between 塾 2 (J0lnt M118511 (1: 7)). However, the surface of the solder ball is subject to I reddish agent, so in the test step, the connection contact (pin) of the connection card (such as a probe card) and the solder ball with flux on the surface contact, and the money | ^ contact (pin ) Contaminated by the freshener. Some of the remaining flux on the connection contacts will cause the measurement u during the test: Poor 'may also stick to the bump contacts of other tested components. Because of this, δ needs to be cleaned after the probe card contacts the bump contacts hundreds of times. Figures 2a to 2c show the current method for cleaning the needle of a detection card. The steps are as follows. First, a grinding disc 2 q2 with a rotating function is provided. The grinding wheel 8 2 has a relatively rough surface 2 0 4. Referring to the second figure again, the needle big 112 to be cleaned is brought into contact with the surface 204 of the a-hai grinding disc 200, and the needle tip 112 has
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五、發明說明（3) 殘留物1 1 4的表面磨去之後，再蔣 表命204移開。如第2c圖所示，這=^尖112自該研磨器2〇2 之釺尖表面的污染物，卻也會使斜 法雖然能清潔偵測卡 利用研磨的方式清潔之後，針會越 的材質被磨去，多次 長起不平均，而使價值不偵數個針研磨成 本發明因此尋求提供一改良之方鎖。.， ， 接凸塊化元件之連接器的連接接點，α潔上述之用於連 技術所面臨上述之問題以克服或至少改善先前 t發明内容】 探測器清潔方法，用以非破壞性| :各用於λ塊化+導體元件測試之探測器連接接點。 方法了之目的，本發明提供一種探測器清潔 預土設定距離的位置。㈣源雖不#連接接 ‘ 到熱而盥空氣中的^作^連，接點表面的有機殘留物會因受 分解成氣體，逸散到空氣中。 顯Κι;:;上述和其他目的、特徵、和優點能更明 說明如下。牛發明較佳實施例’並配合所附圖 < ’作詳 【實施方式] 第3圖係圖示根據本發明之一實施例清潔一探測器 (pro er )例如一偵測卡1〇8之連接接點（例如針1 1〇 )之 1229400 五、發明說明（4) 法。針1 1 0具有一尖端用以接觸一凸塊化半導體元件之凸塊 接點。該針1 1 0之尖端上具有測試後形成之殘留物1 1 4。該方 法之主要步驟係將一熱源30 0靠近待清潔的針11〇，但是不接 觸針11 0。更具體地說，熱源3 0 0係被置於針測卡1 〇 8的下 方，對針11 0釋放熱，使得針11 0的表面（尤其是需清潔的尖 端部分表面）之溫度上升至約4 5 0 °C至約6 0 〇。。。 對沾附於連接接點上的助銲劑或是其他有機物質施加足以 使其氧化的南溫（約4 5 0 C至約6 0 0 °C )。殘留於連接接點上 的有機物質受到高溫會與空氣中的氧作用，產生氧化反應^ 而分解成二氧化碳或是水等氣體離開連接接點的表面。 本發明之特徵在於該熱源未接觸待清潔之連接接點，以避 免熱在探測器中傳導過快，而破壞連接接點之外的部分或是 探測器内部的線路。以偵測卡為例，針狀的連接接點係由卡 座部分延伸而出。該針狀的連接接點多為金屬材質，食，約 45 0 °C至約60 0°C的溫度下不會被破壞。但是偵測卡的晨座部 分卻不能耐約45 0 t至約6 0 0 t的高溫，可能會受熱融化或變 形。因此熱源必須靠近連接接點但是遠離探測器的其他部 分。較佳地’熱源能集中針對沾有有機殘留物的部分（通常 是連接接點的端點部分，例如針的尖端部份）傳送熱，藉此 僅僅使連接接點沾有有機殘留物的表面溫度上升至約4 5 〇 t 至約6 0 0 C ’但是卻大致不會影響到探測器其他部分的功 能。 第4圖係圖示本發明之另一實施例。在此實施例中，係將 熱源3 0 0設置於欲清潔之針丨丨〇的側邊，平行地對針的尖端V. Description of the invention (3) After the surface of the residue 1 1 4 is ground away, Jiang Mingming 204 is removed. As shown in Figure 2c, this = ^ Tip 112 is a contaminant from the surface of the tip of the grinder 200, but it will also enable the oblique method to clean the detection card. The material is worn away, and it grows unevenly many times, so that the value does not detect the grinding of several needles. The invention therefore seeks to provide an improved square lock. .,, The connection contact of the connector of the bumped component, the above-mentioned is used for the connection technology faced with the above-mentioned problems to overcome or at least improve the previous t Summary of the invention] Detector cleaning method for non-destructive | : Detector connection contacts for λ block + conductor element testing. For the purpose of the method, the present invention provides a position where the detector cleans the pre-set soil at a set distance. Although the source is not connected to the hot air, the organic residue on the surface of the contact will be decomposed into gas and escape into the air. The above and other objects, features, and advantages can be explained more clearly as follows. The preferred embodiment of the invention is described in conjunction with the accompanying drawings < 'Details [Embodiment] FIG. 3 is a diagram illustrating cleaning a detector (pro er) such as a detection card 108 according to an embodiment of the present invention. 1229400 of the connection contact (such as pin 1 1 10) V. Description of the invention (4) method. The pin 1 10 has a bump contact having a tip for contacting a bumped semiconductor element. The tip of the needle 1 1 0 has a residue 1 1 4 formed after the test. The main step of this method is to place a heat source 300 near the needle 110 to be cleaned, but not to contact the needle 110. More specifically, the heat source 300 is placed under the probe card 108 and releases heat to the needle 110, so that the temperature of the surface of the needle 110 (especially the surface of the tip part to be cleaned) rises to about 4 5 0 ° C to about 600. . . Apply a temperature (about 450 ° C to about 60 ° C) sufficient to oxidize the flux or other organic substances adhering to the connection contacts. The organic matter remaining on the connection point will react with oxygen in the air under high temperature to generate an oxidation reaction ^ and decompose into gas such as carbon dioxide or water and leave the surface of the connection point. The present invention is characterized in that the heat source is not in contact with the connection contacts to be cleaned, so as to prevent heat from being conducted too fast in the detector, thereby damaging parts outside the connection contacts or the wiring inside the detector. Taking the detection card as an example, the pin-shaped connection contacts are extended from the card part. The needle-shaped connection contacts are mostly made of metal, and will not be damaged at a temperature of about 45 ° C to about 60 ° C. However, the morning seat portion of the detection card cannot withstand a high temperature of about 45 0 t to about 6 0 0 t, and may be melted or deformed by heat. The heat source must therefore be close to the connection point but away from the rest of the detector. Preferably, the heat source can concentrate heat to the portion where the organic residue is contaminated (usually the end portion of the connection contact, such as the tip portion of a needle), thereby only making the surface of the connection contact contaminated with the organic residue. The temperature rises to about 450 ° to about 600 ° C. but does not substantially affect the function of other parts of the detector. FIG. 4 illustrates another embodiment of the present invention. In this embodiment, the heat source 300 is set on the side of the needle to be cleaned, and the tip of the needle is parallel to the needle.
第10頁 1229400 五、發明說明（5) 機殘留物11 4，並且 產生不利影響。 定測試次數時，即啟 。探測器清潔完畢 需先將探測器拆卸下 線作業（ο η 1 i n e)的 接接點之便利性。適 高溫的光源或是其他 於清潔其它種類之探 之測試槽座（s 〇 c k e 〇 112傳送熱，藉此清潔尖端112表面之有 有效避免對與針11 〇連接之卡座部分1! 6 較佳地’當探測器進行測試時至一預 動該熱源30 0，以進行清潔針尖的步驟£ 後，便可繼續進行測試工作。亦即，不 來，再移動至另一清潔作業區。藉由連 清潔方式’可大幅提高清潔探測器之連 用於本發明的熱源包含鎢絲燈等能發出 加熱器例如能提供熱風之裝置。 可以理解的是，本發明之方法亦適用 測器（例如用於測試晶片或是封裝構造 的連接接點。 t k 雖然本發明已以前述較佳實施例揭示，铁i 本發明，任何熟習此技藝者，在“、、/、並非用以限定 内，當可作各種之更動與修改。因此 ，明之精坪重範圍 後附之申請專利範圍所界定者為準。 x明之保護範::園當視Page 10 1229400 V. Description of the invention (5) Machine residue 11 4 and produce adverse effects. When the number of tests is determined, it is turned on. The detector is cleaned. It is convenient to remove the contact of the detector for offline operation (ο η 1 i n e). Light source suitable for high temperature or other test slot seat (s 〇cke 〇112 for cleaning other kinds of probes) to transmit heat, so as to clean the surface of the tip 112 effectively to avoid the part of the seat connected with the needle 11 〇 1 6 Jiadi 'When the detector is tested to a pre-movement of the heat source 300 to perform the step of cleaning the needle tip, the test can be continued. That is, if not, move to another cleaning work area. The cleaning method can greatly improve the connection of the cleaning detector. The heat source used in the present invention includes a device such as a tungsten lamp that can emit a heater, such as a device that can provide hot air. It can be understood that the method of the present invention is also applicable to a detector (such as It is used to test the connection points of the chip or the package structure. Tk Although the present invention has been disclosed in the foregoing preferred embodiments, the iron i, the present invention, anyone skilled in the art is not limited to Make various changes and modifications. Therefore, the definition of the scope of patent application attached to the scope of Ming Zhi Jing Ping shall prevail. X 明 之 范范 :: 园 当 视
第11頁 1229400 圖式簡單說明 【圖式簡單說明】 第1圖：係用以說明習知利用針測卡測試凸塊化半導體元 件之方法； 第2a-2c圖：以剖示圖圖示習用清潔第1圖針測卡之方法主 要步驟； 第3圖：以剖示圖圖示根據本發明一實施例清潔第1圖針測 卡之方法主要步驟；以及 第4圖：以剖示圖圖示根據本發明另一實施例之清潔第1圖 針測卡之方法主要步驟。 圖號說明： 100 凸塊化晶圓 102 晶片 104 凸塊接點 106 上表面 108 針測卡 110 針 112 尖端 114 殘留物 116 卡座 202 研磨盤 204 表面 300 熱源Page 1229400 Brief description of the drawings [Simplified description of the drawings] Figure 1: It is used to explain the conventional method of testing bumped semiconductor components with a pin test card; Figures 2a-2c: Cross-section diagrams show the conventional application The main steps of the method of cleaning the probe card of FIG. 1; FIG. 3: the cross-sectional view illustrates the main steps of the method of cleaning the probe card of FIG. 1 according to an embodiment of the present invention; The main steps of a method for cleaning the probe card of FIG. 1 according to another embodiment of the present invention are shown. Description of drawing number: 100 bump wafers 102 wafers 104 bump contacts 106 upper surface 108 pin test card 110 pin 112 tip 114 residue 116 card holder 202 grinding disc 204 surface 300 heat source
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