TWI225481B - Chemically amplified polymer having pendant group with cyclododecyl and resist composition comprising the same - Google Patents
Chemically amplified polymer having pendant group with cyclododecyl and resist composition comprising the same Download PDFInfo
- Publication number
- TWI225481B TWI225481B TW091136587A TW91136587A TWI225481B TW I225481 B TWI225481 B TW I225481B TW 091136587 A TW091136587 A TW 091136587A TW 91136587 A TW91136587 A TW 91136587A TW I225481 B TWI225481 B TW I225481B
- Authority
- TW
- Taiwan
- Prior art keywords
- group
- formula
- hydrogen
- alkyl
- patent application
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C69/00—Esters of carboxylic acids; Esters of carbonic or haloformic acids
- C07C69/52—Esters of acyclic unsaturated carboxylic acids having the esterified carboxyl group bound to an acyclic carbon atom
- C07C69/533—Monocarboxylic acid esters having only one carbon-to-carbon double bond
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
- G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C67/00—Preparation of carboxylic acid esters
- C07C67/14—Preparation of carboxylic acid esters from carboxylic acid halides
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C67/00—Preparation of carboxylic acid esters
- C07C67/30—Preparation of carboxylic acid esters by modifying the acid moiety of the ester, such modification not being an introduction of an ester group
- C07C67/333—Preparation of carboxylic acid esters by modifying the acid moiety of the ester, such modification not being an introduction of an ester group by isomerisation; by change of size of the carbon skeleton
- C07C67/343—Preparation of carboxylic acid esters by modifying the acid moiety of the ester, such modification not being an introduction of an ester group by isomerisation; by change of size of the carbon skeleton by increase in the number of carbon atoms
- C07C67/347—Preparation of carboxylic acid esters by modifying the acid moiety of the ester, such modification not being an introduction of an ester group by isomerisation; by change of size of the carbon skeleton by increase in the number of carbon atoms by addition to unsaturated carbon-to-carbon bonds
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C69/00—Esters of carboxylic acids; Esters of carbonic or haloformic acids
- C07C69/52—Esters of acyclic unsaturated carboxylic acids having the esterified carboxyl group bound to an acyclic carbon atom
- C07C69/533—Monocarboxylic acid esters having only one carbon-to-carbon double bond
- C07C69/54—Acrylic acid esters; Methacrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C69/00—Esters of carboxylic acids; Esters of carbonic or haloformic acids
- C07C69/74—Esters of carboxylic acids having an esterified carboxyl group bound to a carbon atom of a ring other than a six-membered aromatic ring
- C07C69/753—Esters of carboxylic acids having an esterified carboxyl group bound to a carbon atom of a ring other than a six-membered aromatic ring of polycyclic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F20/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
- C08F20/02—Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
- C08F20/10—Esters
- C08F20/12—Esters of monohydric alcohols or phenols
- C08F20/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F20/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C2601/00—Systems containing only non-condensed rings
- C07C2601/18—Systems containing only non-condensed rings with a ring being at least seven-membered
- C07C2601/20—Systems containing only non-condensed rings with a ring being at least seven-membered the ring being twelve-membered
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C2602/00—Systems containing two condensed rings
- C07C2602/36—Systems containing two condensed rings the rings having more than two atoms in common
- C07C2602/42—Systems containing two condensed rings the rings having more than two atoms in common the bicyclo ring system containing seven carbon atoms
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Materials For Photolithography (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Abstract
Description
1225481 玖、發明說明 【發明所屬之技術領域】 本發明係關於一種新穎的(曱基)丙烯酸或正莰烯羧 酸醋化合物,其係具有一與環十二烷基相接之側基團 (pendent group);製備該化合物之方法;及以該化合物 所合成之化學放大聚合物;及用於ArF之包含該聚合 物的光阻組合物,該光阻組合物係具有高解析度及優異 的抗餘刻性。 【先前技術】 隨著半導體裝置整合度增加之際,0.25微米以下 之超精細圖案的需求也隨之升高。為此,依據雷萊法則 (Rayleigh’s rule)用於圖案化之光源波長亦變得更短, 例如從436 nm(G-譜線)及3 65 nm(I-譜線)縮短至193 nm (ArF)、157 nm (VUV)、及 248 nm (KrF)。但在前技中, 為獲得容量在1 G位元以上之半導體裝置的圖案,一般 的光阻材料必須在248 nm下使用。因此’亟需一種能 於1 93 nm之短波長下使用且能被連續顯影來滿足精細 解析度要求之新光阻。 依據結構上的差異,可將習知可作為抗- ArF材料 的聚合物分成三大類:聚丙烯酸酯、環烯烴-順丁烯二 酸酐共聚物及聚正莰烯。就微影表現(圖案崩塌、線邊 緣粗造度、SEM束對比、抗触刻性等等)來說’在這三 類或合物中,環烯烴-順丁烯二酸酐共聚物(CyCl〇〇lefin- 1225481 maleic anhydride copolymer,COMA)-型光阻是最有用 的。但是,為順丁 稀二酸 ff* (maleic anhydride,MA)水 解之故,該 COMΑ-為底的光阻在解析度上,特別是線 密度及空間圖案上,卻會造成不良的結果。此外,包含 傳統COMA的光阻並無法表現足夠的抗性,因此仍然 無法使用乾蝕刻製程。1225481 发明 Description of the invention [Technical field to which the invention belongs] The present invention relates to a novel (fluorenyl) acrylic acid or n-pinenecarboxylic acid vinegar compound, which has a pendant group connected to pendent group); a method for preparing the compound; and a chemically amplified polymer synthesized from the compound; and a photoresist composition containing the polymer for ArF, the photoresist composition has high resolution and excellent Resistance to afterglow. [Previous Technology] As the integration degree of semiconductor devices increases, the demand for ultra-fine patterns below 0.25 micron also increases. For this reason, the wavelength of the light source used for patterning according to Rayleigh's rule has also become shorter, such as shortening from 436 nm (G-line) and 3 65 nm (I-line) to 193 nm (ArF ), 157 nm (VUV), and 248 nm (KrF). However, in the prior art, in order to obtain a pattern of a semiconductor device having a capacity of more than 1 G bit, a general photoresist material must be used at 248 nm. Therefore, there is an urgent need for a new photoresist that can be used at a short wavelength of 1 93 nm and can be continuously developed to meet the requirements of fine resolution. According to the structural differences, the polymers that are conventionally known as anti-ArF materials can be divided into three categories: polyacrylates, cycloolefin-maleic anhydride copolymers, and poly-n-pinene. In terms of lithographic performance (pattern collapse, line edge roughness, SEM beam contrast, anti-etching resistance, etc.) 'In these three types or compounds, the cycloolefin-maleic anhydride copolymer (CyCl. 〇lefin-1225481 maleic anhydride copolymer (COMA) -type photoresist is the most useful. However, because of the hydrolysis of maleic anhydride (MA) ff * (maleic anhydride, MA), the COMA-based photoresist will cause bad results in resolution, especially in linear density and spatial pattern. In addition, photoresists that include conventional COMA do not exhibit sufficient resistance, so dry etching processes still cannot be used.
【内容】 因此,本發明目的之一係提供可解決上述前技問題 之一(曱基)丙烯酸或正莰烯羧酸酯化合物,其係具有一 能增加高解析度及抗蝕刻性之大型脂肪性環取代基團; 以及製備該化合物之方法。 本發明之另一目的係提供一適合作為一化學性放大 光阻之光敏共聚物及三聚物,其係包含一具環狀結構的 側基團及脂肪性環狀化合物,以獲致高整合半導體所需 之充分解析度’同時對乾蝕刻製程可表現出極強且充分 的抗餘刻性。[Content] Therefore, one of the objectives of the present invention is to provide a (fluorenyl) acrylic or n-pinene carboxylic acid ester compound that can solve one of the above-mentioned prior art problems, and it has a large fat that can increase high resolution and resistance to etching. Ring substituents; and methods of making the compounds. Another object of the present invention is to provide a photosensitive copolymer and terpolymer suitable as a chemically amplified photoresist, which comprises a side group with a cyclic structure and an aliphatic cyclic compound to obtain a highly integrated semiconductor The required sufficient resolution can also show very strong and sufficient anti-etching resistance to the dry etching process.
本發明之另一目的係提供一可用於ArF之化學放 大正光阻組合物,其係包含該光敏共聚物、三聚物及其 之混合物。 5 1225481 為達前述目的,本發明提供一以下列式1代表之(甲 基)丙稀酸1-烧基-1-環十二烧基醋:Another object of the present invention is to provide a chemically amplified positive photoresist composition for ArF, which comprises the photosensitive copolymer, terpolymer, and a mixture thereof. 5 1225481 In order to achieve the foregoing object, the present invention provides a (methyl) propanoic acid 1-alkyl-1-cyclododecyl vinegar represented by the following formula 1:
其中R是一曱基或乙基,且R*為氫或一甲基基團。 此外,本發明亦提供製備該式1之(甲基)丙烯酸1-烷基-1—環十二烷基酯的方法,其係包含下列步驟: a) 讓環十二烧酮與一院基格那試劑(alkyl grinard reagent)或烧基链試劑(alkyl lithium reagent)反 應,來製備1-烷基-1-環十二烷基-1-醇;及 b) 讓前述製備之 1-烷基-1-環十二烷基-1-醇與(甲 基)丙烯醯氣反應。Wherein R is a methyl group or an ethyl group, and R * is a hydrogen or a methyl group. In addition, the present invention also provides a method for preparing the 1-alkyl-1-cyclododecyl (meth) acrylate of formula 1, which comprises the following steps: a) let cyclododecanone and a courtyard group Reaction of alkyl grinard reagent or alkyl lithium reagent to prepare 1-alkyl-1-cyclododecyl-1-ol; and b) let 1-alkyl prepared above 1-cyclododecyl-1-ol is reacted with (meth) propylene tritium gas.
再者,本發明還提供一以下列式2代表之2-烷基-1-環十二烷基-4-正莰烯-1·羧酸酯化合物:Furthermore, the present invention also provides a 2-alkyl-1-cyclododecyl-4-n-pinene-1 · carboxylic acid ester compound represented by the following formula 2:
6 1225481 其中R是一甲基或乙基,且R*為氫或一甲基基團。 此外,本發明還提供一種製備該式2之2-烷基-1-環十二烷基-4-正莰烯-1-羧酸酯的方法,其係藉由讓式 1之(甲基)丙烯酸1-烷基-1-環十二烷基酯與環戊二烯進 行迪氏-亞達反應(Diels-Alde〇所製備而成的。 本發明還提供一種以下列式3代表之光敏共聚物:6 1225481 where R is monomethyl or ethyl, and R * is hydrogen or a methyl group. In addition, the present invention also provides a method for preparing the 2-alkyl-1-cyclododecyl-4-n-pinene-1-carboxylic acid ester of formula 2 by ) Prepared by 1-alkyl-1-cyclododecyl acrylate and cyclopentadiene by Diels-Aldeo reaction. The present invention also provides a photosensitizer represented by the following formula 3 Copolymer:
其中R是一甲基或乙基,且R*為氫或一甲基基團, 且η是一介於22至26間之整數。 本發明還提供一種製備該式3光敏共聚物之方法, 包括讓該式2化合物與一順丁烯二酸酐聚合之步驟。 7 1225481 此外,本發明還提供一以下列式4代表之光敏三聚 物··Wherein R is a methyl or ethyl group, R * is hydrogen or a methyl group, and η is an integer between 22 and 26. The present invention also provides a method for preparing the photosensitive copolymer of Formula 3, comprising the step of polymerizing the compound of Formula 2 with maleic anhydride. 7 1225481 In addition, the present invention also provides a photosensitive trimer represented by the following formula 4 ...
4 —— « 其中R是一甲基或乙基;R*為氫或一甲基基團;R’ 是氫、一烷基或一羥基烷基;R”是氫或一甲基基團; 且 m 與 η 分別滿足 m + η = 1,0.1<m<0.9 且 0·1<η<0·9 之條件。 此外,本發明還提供一製備該式4之光敏三聚物的 方法,其係包含讓式1化合物與一順丁烯二酸酐及一式 6之正莰烯化合物聚合之步驟:4-«where R is a methyl or ethyl group; R * is hydrogen or a methyl group; R 'is hydrogen, an alkyl group or a hydroxyalkyl group; R" is hydrogen or a methyl group; And m and η satisfy the conditions of m + η = 1, 0.1 < m < 0.9 and 0.1 < η < 0 · 9, respectively. In addition, the present invention also provides a method for preparing the photosensitive terpolymer of Formula 4, It comprises the steps of polymerizing a compound of formula 1 with maleic anhydride and an n-pinene compound of formula 6:
6 其中 R’是氫、一烷基或一羥基烷基;且R”是氫或 一甲基基團。 8 1225481 此外,本發明還提供一以下列式5代表之光敏三聚 物:6 wherein R 'is hydrogen, an alkyl group, or a hydroxyalkyl group; and R "is hydrogen or a methyl group. 8 1225481 In addition, the present invention also provides a photosensitive trimer represented by the following formula 5:
55
其中R是一甲基或乙基;R*為氫或一甲基基團;R’ 是氫、一烷基或一羥基烷基;R”是氫或一甲基基團; 且 m 與 η 分別滿足 m + η = 1,0· l<m<0.9 且 0· 1<η<0·9 之條件。 此外,本發明還提供一製備該式5之光敏三聚物的 方法,其係包含讓式2化合物與一順丁烯二酸酐及一式 7之丙稀酸酯化合物聚合之步驟:Where R is a methyl or ethyl group; R * is hydrogen or a methyl group; R 'is hydrogen, an alkyl group, or a hydroxyalkyl group; R "is hydrogen or a methyl group; and m and η Meet the conditions of m + η = 1, 0 · l < m < 0.9 and 0 · 1 < η < 0 · 9, respectively. In addition, the present invention also provides a method for preparing the photosensitive terpolymer of Formula 5, which comprises Steps for polymerizing a compound of formula 2 with maleic anhydride and a acrylate compound of formula 7:
其中R’是氫、一烷基或一羥基烷基;且R”是氫或 9 1225481 一甲基基團。 此外,本發明還提供一可用於 ArF之化學放大正 光阻組合物,其係包含一或多種選自下列之聚合物:包 括式3之光敏共聚物、式4之光敏三聚物及式5之光敏 三聚物。Wherein R ′ is hydrogen, a monoalkyl group, or a hydroxyalkyl group; and R ″ is hydrogen or a 9 1225481 monomethyl group. In addition, the present invention also provides a chemically amplified positive photoresist composition for ArF, which comprises One or more polymers selected from the group consisting of a photosensitive copolymer of Formula 3, a photosensitive terpolymer of Formula 4, and a photosensitive terpolymer of Formula 5.
特定言之,上述化學式中的R’較佳係為一具有C^ C,。之脂肪性碳氫化物的烷基基團或一具有CrC,。之脂 肪性碳氫化物的羥基烷基基團。 此外,本發明還提供一由上述光阻組合物所製備而 成的半導體裝置。 【實施方式】 本發明將詳述於下。In particular, R 'in the above chemical formula is preferably one having C ^ C ,. Alkyl group of fatty hydrocarbon or one with CrC. Hydroxyalkyl groups of fatty hydrocarbons. In addition, the present invention also provides a semiconductor device prepared from the photoresist composition. [Embodiment] The present invention will be described in detail below.
本發明提供一以具有大型脂肪性環狀取代基之(甲 基)丙烯酸羧酸酯或正莰烯羧酸酯化合物來製備一光敏 共聚物及三聚物;以及以該具高解析度及抗蝕刻性之共 聚物及三聚物來製備化學放大正光阻組合物。 讓 1-烷基-1-環十二烷基-1-醇與(曱基)丙烯醯氣反 應來製備本發明之式1的(甲基)丙烯酸1 -烷基· 1 -環十 二烷基酯。 10 1225481 該(甲基)丙烯酸1-烷基-1-環十二烷基酯之製備係 依據下列流程1 : [流程1 ]The invention provides a photosensitive copolymer and terpolymer prepared from a (meth) acrylic acid carboxylic acid ester or n-pinene carboxylic acid ester compound having a large aliphatic cyclic substituent; and the high-resolution and resistant Etching copolymers and terpolymers to prepare chemically amplified positive photoresist compositions. 1-alkyl-1-cyclododecyl-1-ol is reacted with (fluorenyl) propene tritium gas to prepare 1-alkyl (1-cyclo · dodecane) (meth) acrylic acid of formula 1 of the present invention Based ester. 10 1225481 The preparation of the 1-alkyl-1-cyclododecyl (meth) acrylate is according to the following scheme 1 [Scheme 1]
其中R是一曱基或一乙基,且X是氯或溴。 如上述流程1所示,1 -烷基-1 -環十二烷基-1-醇可 藉由讓環十二烷酮與一烷基格那試劑或烷基鋰試劑反 應,於環十二烷酮的第1位置引入一烷基基團來製備。 上述之烷基格那試劑包括一烷基溴化鎂、烷基氣化鎂 等;較佳是甲基溴化鎂或曱基氣化鎂。 之後,依據本發明,該(甲基)丙烯酸 1-烷基-1-環 十二烷基酯可藉由讓 1-烷基-1-環十二烷-1-醇與(甲基) 丙烯醯氯反應來製備,如下列流程2所示: [流程2 ]Where R is monomethyl or ethyl, and X is chlorine or bromine. As shown in Scheme 1 above, 1-alkyl-1 -cyclododecyl-1-ol can be reacted on cyclododecane by reacting cyclododecanone with an alkyl alkyl reagent or an alkyl lithium reagent. Alkone is prepared by introducing an alkyl group at the first position. The above-mentioned alkyl gena reagent includes monoalkylmagnesium bromide, alkylmagnesium vaporizer, and the like; methylmagnesium bromide or fluorenylmagnesium vaporizer is preferred. Then, according to the present invention, the 1-alkyl-1-cyclododecyl (meth) acrylate can be obtained by letting 1-alkyl-1-cyclododecane-1-ol and (meth) propylene醯 Chlorine reaction to prepare, as shown in the following scheme 2: [Scheme 2]
其中R是一曱基或一乙基,且R*是氫或甲基。 11 1225481 此外,依據本發明,式2之正莰烯化合物 之化合物來製備。 依據本發明,式2之1-烷基-1-環十二烷 烯-1 -羧酸酯化合物係藉由讓式 1之化合物與 進行迪氏-亞達反應(Diels-Alder)所製備而成 列流程3所示: [流程3 ] 〖可以式1 基-4 -正成 環戊二烯 的,如下Wherein R is monomethyl or ethyl, and R * is hydrogen or methyl. 11 1225481 Furthermore, according to the present invention, a compound of the n-pinene compound of formula 2 is prepared. According to the present invention, the 1-alkyl-1-cyclododecene-1-carboxylic acid ester compound of Formula 2 is prepared by allowing a compound of Formula 1 to undergo a Diels-Alder reaction. This is shown in column 3: [Scheme 3] [Formula 1 can be based on -4-normal cyclopentadiene, as follows
(2) ⑴ 其中R是一甲基或一乙基,且R*是氫或t 此外,依據本發明,式3之光敏共聚物〆 之光敏三聚物亦可以式1及式2之化合物來製 首先,依下式製備式3之光敏共聚物: r基。 L 式 4、5 備。 12 1225481 [流程4](2) ⑴ where R is monomethyl or ethyl, and R * is hydrogen or t In addition, according to the present invention, the photosensitive terpolymer of the photosensitive copolymer 〆 of formula 3 can also be a compound of formula 1 or 2 Preparation First, the photosensitive copolymer of Formula 3 is prepared according to the following formula: r group. L type 4, 5 equipment. 12 1225481 [Process 4]
其中R及R*之定義如上。 如以上流程4所示,式3之光敏共聚物可藉由聚合 式2之正莰烯化合物與一順丁烯二酸酐來製備。該聚合 反應可包含一諸如疊氮雙(異丁腈)(AIBN)之起始物。較 佳是,所得式 3之光敏共聚物的重量平均分子量介於 3,000至100,000間,且分散係數介於1.0至5.0間。 此外,式4及5之光敏三聚物可分別依下列流程5 及6進行製備:Where R and R * are as defined above. As shown in Scheme 4 above, the photosensitive copolymer of Formula 3 can be prepared by polymerizing an n-pinene compound of Formula 2 and a maleic anhydride. The polymerization reaction may include a starting material such as azidobis (isobutyronitrile) (AIBN). More preferably, the weight average molecular weight of the obtained photosensitive copolymer of Formula 3 is between 3,000 and 100,000, and the dispersion coefficient is between 1.0 and 5.0. In addition, the photosensitive terpolymers of formulas 4 and 5 can be prepared according to the following procedures 5 and 6, respectively:
13 4 1225481 [流程 6]13 4 1225481 [Process 6]
其中 如以 式1化合 製備。 此外 由聚合式 二酸Sf •來 所有 一諸如疊 式4及5 100,000 f 此外 光阻組合 3之光敏 物。 R、R,、R*及R”之定義如上。Wherein it is prepared as a compound of formula 1. In addition, it is composed of a polymerized diacid Sf • a photosensitizer such as a stack 4 and 5 100,000 f and a photoresist combination 3. R, R ,, R * and R "are as defined above.
Ji流程5所示,式4之光敏共聚物可藉由聚合 物及式6之正莰烯化合物與一順丁烯二酸酐來 ,如以上流程6所示,式5之光敏共聚物可藉 2化合物及式7之丙烯酸酯化合物與一順丁烯 製備。 上述式4及5之光敏三聚物的聚合反應可包含 氮雙(異丁腈)(AIBN)之起始物。較佳是,所得 之光敏三聚物的重量平均分子量介於3,000至 3,且分散係數介於1 . 〇至5.0間。 ,本發明也提供一可用於 ArF之化學放大正 物,其係包含一或多種選自下列之聚合物:式 终聚物、式4之光敏三聚物及式5之光敏三聚As shown in Ji Scheme 5, the photosensitive copolymer of Formula 4 can be obtained by using the polymer and the n-pinene compound of Formula 6 and maleic anhydride. As shown in Scheme 6 above, the photosensitive copolymer of Formula 5 can borrow 2 Compounds and acrylate compounds of Formula 7 were prepared with monobutene. The polymerization reaction of the photosensitive terpolymers of the above formulae 4 and 5 may include a nitrogen bis (isobutyronitrile) (AIBN) starting material. Preferably, the weight-average molecular weight of the obtained phototrimer is between 3,000 and 3, and the dispersion coefficient is between 1.0 and 5.0. The present invention also provides a chemically amplified positive electrode that can be used in ArF, which comprises one or more polymers selected from the group consisting of: a final polymer, a photosensitive trimer of formula 4, and a photosensitive trimer of formula 5.
14 1225481 在本發明正光阻組合物中,該一或多種選自式3之 光敏共聚物、式4之光敏三聚物及式5之光敏三聚物之 聚合物的含量,以聚合物總重來計算,較佳是介於1 % 至 30%(重量百分比)間,更佳係介於 5%至 8%(重量百 分比)間。14 1225481 In the positive photoresist composition of the present invention, the content of the one or more polymers selected from the photosensitive copolymer of formula 3, the photosensitive terpolymer of formula 4 and the photosensitive terpolymer of formula 5 is based on the total weight of the polymer To calculate, it is preferably between 1% and 30% by weight, and more preferably between 5% and 8% by weight.
再者,本發明光阻組合物包含一光酸產生劑及溶 劑;必要時,其還可組合使用各種添加物進行製備;更 佳是,以總光阻組合物之1 00份重量而言,其固體濃度 介於該重量之20%至50%間。之後,以0.2微米濾網進 行過濾、後再使用。 以總聚合物重量為1 00%進行計算,該光酸產生劑 的含量較佳係介於0.5%至 10%間。可使用的光酸產生 劑為鏺鹽、有機續酸、或其之混合物。Furthermore, the photoresist composition of the present invention includes a photoacid generator and a solvent; if necessary, it can also be prepared by using various additives in combination; more preferably, based on 100 parts by weight of the total photoresist composition Its solid concentration is between 20% and 50% of the weight. After that, it was filtered through a 0.2 micron sieve and used again. Based on the total polymer weight being 100%, the content of the photoacid generator is preferably between 0.5% and 10%. Photoacid generators that can be used are phosphonium salts, organic continuous acids, or mixtures thereof.
可用於本發明之溶劑包括乙二醇單甲基乙基醚、乙 二醇單乙醚、乙二醇單甲醚、二乙二醇單乙醚、丙二醇 單曱醚乙酸酯(PGMEA)、曱苯、二曱苯、曱乙酮、環己 酮、2-羥基丙酸乙酯、2-羥基2 -曱基丙酸乙酯、乙氧乙 酸乙酯、羥基乙酸乙酯、2 -羥基3 -甲基丁酸曱酯、3 -甲 氧基 2-甲基丙酸曱酯、3-乙氧丙酸乙酯、3-曱氧 2-曱 基丙酸乙酯、3 -乙氧丙酸乙酯、3 -甲氧2 -甲基丙酸乙酯、 乙酸乙酯、乙酸丁酯等。 再者,本發明光阻組合物更可包含一有機驗,其係 佔約 0.01%至 2.00 %(重量百分比)。可使用的有機鹼包 括三乙胺、三異丁胺、三異辛胺、二乙醇胺、三乙醇胺 15 1225481 或其之混合物。Solvents that can be used in the present invention include ethylene glycol monomethyl ethyl ether, ethylene glycol monoethyl ether, ethylene glycol monomethyl ether, diethylene glycol monoethyl ether, propylene glycol monomethyl ether acetate (PGMEA), and toluene Benzene, acetophenone, cyclohexanone, ethyl 2-hydroxypropionate, ethyl 2-hydroxy-2-methylpropionate, ethyl ethoxylate, ethyl hydroxyacetate, 2-hydroxy3-methyl Methyl ethyl butyrate, ethyl 3-methoxy-2-methylpropionate, ethyl 3-ethoxypropionate, ethyl 3-ethoxy-2-methylpropionate, ethyl 3-ethoxypropionate , Ethyl 3-methoxy-2-methylpropionate, ethyl acetate, butyl acetate, and the like. Furthermore, the photoresist composition of the present invention may further include an organic test, which accounts for about 0.01% to 2.00% by weight. Organic bases that can be used include triethylamine, triisobutylamine, triisooctylamine, diethanolamine, triethanolamine 15 1225481 or a mixture thereof.
此外,本發明可提供一具有極佳圖案之半導體裝 置,其係藉由旋塗將上述光阻組合物塗佈於一矽晶圓或 鋁基材上以形成一光阻膜,並經曝光、顯影及烘烤製程 所製備而成。顯影溶液可使用諸如氫氧化鈉、氫氧化鉀、 碳酸鈉及四甲基氫氧化銨(TMAH)之類的鹼性化合物之 0.1 %至 1 0%的鹼性水溶液。此外,亦可使用適量之諸 如甲醇、及乙醇之水溶性有機溶劑及一表面活性劑於上 述顯影溶液中。顯影後,以超純水清洗該光阻膜。 以下將藉實施例來說明本發明,但本發明之範疇並 不僅限於下附實施例中。 實施例 實施例1-1 :合成(甲基)丙烯酸1-曱基-1-環十二烷酯(R = 甲基)(化合物1) a)製備1-曱基-1-環十二烷-1-醇In addition, the present invention can provide a semiconductor device having an excellent pattern. The photoresist composition is coated on a silicon wafer or an aluminum substrate by spin coating to form a photoresist film. Prepared by development and baking processes. As the developing solution, a 0.1% to 10% alkaline aqueous solution of a basic compound such as sodium hydroxide, potassium hydroxide, sodium carbonate, and tetramethylammonium hydroxide (TMAH) can be used. In addition, an appropriate amount of a water-soluble organic solvent such as methanol and ethanol, and a surfactant may be used in the developing solution. After development, the photoresist film was washed with ultrapure water. Hereinafter, the present invention will be described by way of examples, but the scope of the present invention is not limited to the following examples. Examples Example 1-1: Synthesis of 1-fluorenyl-1-cyclododecane (meth) acrylate (R = methyl) (Compound 1) a) Preparation of 1-fluorenyl-1-cyclododecane 1-ol
以2 00毫升無水THF稀釋210毫升(0.64莫耳)之 甲基溴化鎂的二乙醚溶液(3.0M)。將溶液倒入1公升的 燒瓶内並將其維持在 0 °C。以漏斗將環十二烷酮 (5 8.3 克,0.3 2莫耳)緩緩滴入上述溶液中,之後在室溫下反 應2小時。反應終止後,以旋轉揮發器移除過量THF, 並以稀硫酸中和反應產物,以二乙醚萃取,並以無水硫 酸鎂進行乾燥。以色層層析管柱來純化所得產物,可得 1-曱基-1-環十二烷基-1-醇之標題化合物(產率:90%)。 16 1225481 b) 合成丙烯酸1-甲基-1-環十二烷酯 將上述a)之1_曱基-1-環十二烷基醇(5 3 6克, 〇·27莫耳)與三乙胺(44.48亳升,〇 32莫耳)溶於25〇毫 升THF中,以漏斗緩緩加入丙烯醯氯(26毫升,〇 32莫 耳)。之後在室溫下反應2小時。反應終止後,以旋轉 揮發器移除過量THF,並將產物倒入純水中。之後, 以稀鹽酸中和反應產物,以二乙醚萃取,並以無水硫酸 錤進行乾燥。以色層層析管柱(正·己烷:乙酸乙酯=4 : 1)來純化所得產物,可得丙烯酸1-甲基_ 1 _環十二烷酯 之標題化合物(產率:70%)。 c) 合成(甲基)丙烯酸1-甲基-1β環十二烷酯 除了以甲基丙烯醢氣來代替丙烯醯氣外,同上述b) 之步驟進行製備,可製得(曱基)丙烯酸1-甲基-1-環十 二烷酯。 實施例~成甲杲二環十二烷基-4-正莰烯-1-羧 魅(R==甲合物2) 將上逃實施例1 -1 b)所製備之丙烯酸1 -甲基-1 -環 十二烧酯(40 4 * 。 見’ 〇·16莫耳)溶於250毫升THF中, 'C下緩緩滴入環戊二烯(3168克,〇·48莫耳),之 後將溫度提;^、 内至至溫。在室溫下一邊攪拌,一邊反應24 小日寺。應 %〜止後’以旋轉揮發器移除過量THF,並 真空蒸館可得 甲基-1-環十二烧基-4-正获稀-1-叛酸醋 之標題化合物^ φ 奶(產率:70%)。 17 1225481A solution of 210 ml (0.64 moles) of methyl magnesium bromide in diethyl ether (3.0 M) was diluted with 200 ml of anhydrous THF. Pour the solution into a 1 liter flask and maintain it at 0 ° C. Slowly drop cyclododecanone (5 8.3 g, 0.3 2 mol) into the above solution using a funnel, and then react at room temperature for 2 hours. After the reaction was terminated, excess THF was removed with a rotary volatile, and the reaction product was neutralized with dilute sulfuric acid, extracted with diethyl ether, and dried over anhydrous magnesium sulfate. The resulting product was purified by a chromatography column to obtain the title compound of 1-fluorenyl-1-cyclododecyl-1-ol (yield: 90%). 16 1225481 b) Synthesis of 1-methyl-1-cyclododecyl acrylate The 1-fluorenyl-1-cyclododecyl alcohol (5 36 g, 0.27 mol) of a) above and three Ethylamine (44.48 liters, 032 moles) was dissolved in 250 ml of THF, and propylene chloride (26 ml, 032 moles) was slowly added from a funnel. It was then reacted at room temperature for 2 hours. After the reaction was terminated, excess THF was removed with a rotary evaporator and the product was poured into pure water. After that, the reaction product was neutralized with dilute hydrochloric acid, extracted with diethyl ether, and dried with anhydrous sodium sulfate. The product was purified by a chromatography column (n-hexane: ethyl acetate = 4: 1) to obtain the title compound of 1-methyl_1-cyclododecyl acrylate (yield: 70%). ). c) Synthesis of (meth) acrylic acid 1-methyl-1β cyclododecanyl, except that methacrylic thoron gas is used instead of propylene thoron gas, and the same procedure as in b) above can be used to prepare (fluorenyl) acrylic acid 1-methyl-1-cyclododecane ester. Example ~ Formamidine dicyclododecyl-4-n-pinene-1-carboxene (R == formate 2) 1-methyl acrylic acid prepared in Example 1 -1 b) -1 -cyclododecyl ester (40 4 *. See '〇.16 moles) dissolved in 250 ml of THF, and cyclopentadiene (3168 g, 0.48 moles) was slowly dripped at' C, Increase the temperature afterwards; ^, to the temperature. While stirring at room temperature, react 24 Koriji Temple. Should be% ~ after the 'removal of excess THF with a rotary volatilizer, and the title compound of methyl-1-cyclododecyl-4- is obtained in a vacuum vaporizer ^ φ milk ( Yield: 70%). 17 1225481
·合成基二乙某-卜寧+二烷睡 .合物U 除了以l.OM之乙基氣化鎂之二乙醚溶液來代替 3 ·〇Μ之甲基氣化鎂之二乙醚溶液外,同上述實施例1-1 a) 之步驟進行製備,可分別製得丙烯酸卜乙基β卜環十二 烷醋及(甲基)丙烯酸1-乙基環十二烷醋。 f施例1-.4 ··合成_1-乙十二烷某-心正莰烯-i•羧 酸酯(R=乙基)(化合物2) 除了以實施例1-3之丙烯酸乙基-^環十二烷酯 來代替實施例1-1 b)所製備之丙烯酸卜甲基β1_環十二 烧酿外,依上述實施例1 -2之步驟進行製備。 复-^1^2-1 :以Li甲基_1:環十二烷某-4-正莰烯-1-^^ 備共聚物(化合物3、 將32.5克(0.102莫耳)之實施例卜2之1-曱基-!、環 十二烷基-4-正莰烯-1-羧酸酯、10.0克(0.102莫耳)之顺 丁歸二酸酐及0.7克之疊氮雙(異丁腈)(AIBN)溶於25 克的THF中,以冷凍法將反應物脫氣。之後於68。(:下 進行聚合反應24小時。反應終止後,將反應物緩緩地 滴入過量二乙醚中使生成沉澱,再以THF溶解及二乙 喊沉搬,可得共聚物(產率:40%)。 所得共聚物之重量平均分子量及分散係數分別為 8,000 及 1.80。 18 1225481 复_ 2 :以1 -乙筝-1 -瓖七二烧基正获彿-1 -叛l 共聚物(化合物3)_ 除了使用實施例卜4之卜乙基-卜環十二烧基-心正 莰烯-1 -綾酸酯外,依據實施例2 -1之步驟進行製備。 所得共聚物之重量平均分子量及分散係數分別為 7,〇〇〇 及 1.85。· Synthetic group diethyl-bunn + dioxane. Compound U except that 1.0 OM ethyl magnesium hydride in diethyl ether solution was used instead of 3.0 mM methyl magnesium hydride in diethyl ether solution, The preparation is performed in the same manner as in the above Example 1-1 a), and ethyl ethyl β-cyclododecane acrylate and 1-ethyl cyclododecane (meth) acrylate can be prepared respectively. fExample 1-.4 ·· Synthesis of 1-ethylenedodecane-cardio-pinene-i · carboxylic acid ester (R = ethyl) (Compound 2) Except for the ethyl acrylate of Example 1-3 -^ Cyclododecanate was used in place of the methyl methacrylate β1_cyclododecyl acrylate prepared in Example 1-1 b), and was prepared according to the steps of Example 1-2 above. Complex- ^ 1 ^ 2-1: Example of preparing a copolymer (compound 3, 32.5 g (0.102 mole)) of Limethyl_1: cyclododecane-4-n-pinene-1-^^ Bu 2 of 1-fluorenyl- !, cyclododecyl-4-n-pinene-1-carboxylic acid ester, 10.0 g (0.102 mole) of maleic anhydride and 0.7 g of azidobis (isobutyl) Nitrile) (AIBN) was dissolved in 25 g of THF, and the reactant was degassed by freezing. Then, the polymerization reaction was performed at 68 ° C for 24 hours. After the reaction was terminated, the reactant was slowly dropped into an excess of diethyl ether The precipitate was generated in the medium, and then dissolved in THF and diethyl ether to obtain a copolymer (yield: 40%). The weight average molecular weight and dispersion coefficient of the obtained copolymer were 8,000 and 1.80, respectively. 18 1225481 Compound _ 2: 1-Ethyl-1 -Heptaerythyl is gaining the Buddha-1 -Bei-1 copolymer (compound 3) _ Except for the use of ethyl-bucyclododecyl-cardioxin-1 in Example 4 -Except for the osmic ester, it was prepared according to the procedure of Example 2-1. The weight average molecular weight and dispersion coefficient of the obtained copolymer were 7,000 and 1.85, respectively.
艾例3·1 :合戎三聚物乙j )(化合_fe·. 4) 除了使用丙烯酸1-甲基-1-環十二烷酯及甲基丙烯 酸1 _甲基-1 -環十二烷酯外,一由丙烯酸1 -曱基-1 -環十 二烷酯或甲基丙烯酸 1-甲基-1-環十二烷酯組成之共聚 物可依下法進行製備。 a) 合成三聚物(r=甲基,r3 =氫)Ai Example 3.1: He Rong terpolymer Bj) (Chemical_fe ·. 4) In addition to using 1-methyl-1-cyclododecane acrylate and 1 _methyl-1 -cyclodecamethacrylate In addition to the dialkyl esters, a copolymer composed of 1-fluorenyl-1-cyclododecyl acrylate or 1-methyl-1-cyclododecyl methacrylate can be prepared according to the following method. a) Synthesis of trimer (r = methyl, r3 = hydrogen)
將51 .5克(0.2 04莫耳)之實施例1-1之丙烯酸卜甲 基-1-環十二烷酯、14.1克之5-正莰烯-2-羧酸酯、10.0 克(0.102莫耳)之順丁烯二酸酐及〇·7克之疊氮雙(異丁 腈ΗΑΙΒΝ)溶於50克的無水THF中,以冷凍法將反應 物脫氣。之後於6 8 °C下進行聚合反應2 4小時。反應終 止後’將反應物緩緩地滴入過量二乙醚中使生成沉殿, 再以THF溶解及二乙醚沉澱,可得三聚物(產率:4〇%)。 所得共聚物之重量平均分子量及分散係數分別為 7,000 及 1.85。 b) 合成三聚物(R=甲基,r3 =羥基乙基) 除了使用2-羥基乙基-5-正莰烯-2_羧酸酯來代替% 19 1225481 正莰烯-2 -羧酸外,依實施例3 -1 a)之步驟製備三聚物。 所得三聚物之重量平均分子量及分散係數分別為 7.500 及 1.80 ° c)合成三聚物(R=乙基,R3=甲基) 除了使用甲基-5-正莰烯-2-羧酸酯來代替 5-正莰烯 -2-羧酸外,依實施例3-1 a)之步驟製備三聚物。51.5 g (0.2 04 mole) of p-methyl-1-cyclododecane acrylate of Example 1-1, 14.1 g of 5-n-pinene-2-carboxylic acid ester, 10.0 g (0.102 mole) The maleic anhydride and 0.7 g of azidobis (isobutyronitrileΗΑΙΒΝ) were dissolved in 50 g of anhydrous THF, and the reaction was degassed by freezing. The polymerization reaction was then carried out at 68 ° C for 24 hours. After the reaction is terminated, the reactant is slowly dropped into an excess of diethyl ether to form a sink, and then dissolved in THF and precipitated with diethyl ether to obtain a trimer (yield: 40%). The weight average molecular weight and dispersion coefficient of the obtained copolymer were 7,000 and 1.85, respectively. b) Synthetic trimer (R = methyl, r3 = hydroxyethyl) except for using 2-hydroxyethyl-5-n-pinene-2-carboxylic acid ester instead of% 19 1225481 n-pinene-2-carboxylic acid In addition, the terpolymer was prepared according to the procedure of Example 3-1 a). The weight average molecular weight and dispersion coefficient of the obtained trimer are 7.500 and 1.80 ° c) Synthetic trimer (R = ethyl, R3 = methyl) except that methyl-5-n-pinene-2-carboxylic acid ester is used Instead of 5-n-pinene-2-carboxylic acid, a terpolymer was prepared according to the procedure of Example 3-1 a).
所得三聚物之重量平均分子量及分散係數分別為 8,000 及 1.80 〇 實施例3-2 :合成三聚物(R=乙基)(化合物4) 除了使用丙烯酸 1-乙基-1-環十二烷酯及曱基丙烯 酸1 -乙基-1 -環十二烷酯外,一由丙烯酸1 -乙基-1 -環十 二烷酯或曱基丙烯酸 1-乙基-1-環十二烷酯組成之共聚 物可依下法進行製備。 a) 合成三聚物(R=乙基,R3=氫)The weight average molecular weight and dispersion coefficient of the obtained trimer were 8,000 and 1.80, respectively. Example 3-2: Synthesis of a trimer (R = ethyl) (Compound 4) In addition to using acrylic acid 1-ethyl-1-cyclododeca Alkyl esters and 1-ethyl-1 -cyclododecane fluorenyl acrylate, 1-ethyl-1 -cyclododecane acrylate or 1-ethyl-1-cyclododecane fluorenyl acrylate A copolymer having an ester composition can be prepared by the following method. a) Synthesis of trimer (R = ethyl, R3 = hydrogen)
除了使用實施例 1 - 3之甲基丙烯酸 1 -乙基-1 -環十 二烷酯來代替甲基丙烯酸 1 -曱基-1 -環十二烷酯外,依 實施例3 -1 a)之步驟進行製備。 所得共聚物之重量平均分子量及分散係數分別為 6.500 及 1.8 ° b) 合成三聚物(R =乙基,R3 =經基乙基) 除了使用2-羥基乙基-5-正莰烯-2-羧酸酯來代替5-正莰烯-2-羧酸外,依實施例3-2 a)之步驟製備三聚物。 所得三聚物之重量平均分子量及分散係數分別為 20 1225481 8,000 A 1.50。 c)合成三聚物(R=乙基,R3=甲基) 除了使用甲基-5-正莰烯-2-羧酸酯來代替 5-正莰烯 -2-羧酸外,依實施例3-2 a)之步驟製備三聚物。 所得三聚物之重量平均分子量及分散係數分別為 8,500 及 1.80。Except using 1-ethyl-1 -cyclododecyl methacrylate in Example 1-3 instead of 1-fluorenyl-1 -cyclododecyl methacrylate, according to Example 3 -1 a) Steps to prepare. The weight average molecular weight and dispersion coefficient of the copolymer obtained were 6.500 and 1.8 ° b) Synthetic terpolymers (R = ethyl, R3 = triethyl) except for the use of 2-hydroxyethyl-5-n-pinene-2 A carboxylic acid ester was used instead of 5-n-pinene-2-carboxylic acid, and a terpolymer was prepared according to the procedure of Example 3-2 a). The weight average molecular weight and dispersion coefficient of the obtained terpolymer were 20 1225481 8,000 A 1.50. c) Synthesis of trimer (R = ethyl, R3 = methyl) Except using methyl-5-n-pinene-2-carboxylic acid ester instead of 5-n-pinene-2-carboxylic acid, according to the examples Step 3-2 a) to prepare a trimer. The weight average molecular weight and dispersion coefficient of the obtained terpolymer were 8,500 and 1.80, respectively.
實施例4-1 :合成三聚物(化合物5) a) 合成三聚物(R=甲基,R3=氫)Example 4-1: Synthesis of trimer (Compound 5) a) Synthesis of trimer (R = methyl, R3 = hydrogen)
將35.5克(0.102莫耳)之實施例1-2之1-曱基-1-環 十二烷基-4-正莰烯-1-羧酸酯、0.44克(0.005莫耳)之甲 基丙烯酸、10.0克(0.102莫耳)之順丁烯二酸酐及 0.7 克之疊氮雙(異丁腈)(AIBN)溶於25克的無水THF中, 以冷凍法將反應物脫氣。之後於68 °C下進行聚合反應24 小時。反應終止後,將反應物緩緩地滴入過量二乙醚中 使生成沉澱,再以 THF溶解及二乙醚沉澱,可得三聚 物(產率:40%)。 所得三聚物之重量平均分子量及分散係數分別為 8.500 A 1.80 〇 b) 合成三聚物(R=甲基,R3 =經基乙基) 除了使用甲基两烯酸2 -羥基乙酯來代替曱基丙烯 酸外,依實施例4-1 a)之步驟製備三聚物。 所得三聚物之重量平均分子量及分散係數分別為 8.500 及 1.80 ° 21 1225481 c)合成三聚物(R=甲基,R3=甲基) 除了使用甲基丙烯酸甲酯來代替甲基丙烯酸外,依 實施例4-1 a)之步驟製備三聚物。 所得三聚物之重量平均分子量及分散係數分別為 8,500 及 1.80。 實施例4-2 :合成三聚物(化合物5)35.5 g (0.102 mole) of 1-fluorenyl-1-cyclododecyl-4-n-pinene-1-carboxylic acid ester of Example 1-2 and 0.44 g (0.005 mole) of methyl group Acrylic acid, 10.0 g (0.102 mole) of maleic anhydride and 0.7 g of azidobis (isobutyronitrile) (AIBN) were dissolved in 25 g of anhydrous THF, and the reaction was degassed by freezing. Polymerization was then carried out at 68 ° C for 24 hours. After the reaction was terminated, the reactant was slowly dropped into an excess of diethyl ether to cause precipitation, and then dissolved in THF and diethyl ether to obtain a trimer (yield: 40%). The weight average molecular weight and dispersion coefficient of the obtained terpolymer were 8.500 A and 1.80 〇b) Synthetic terpolymer (R = methyl, R3 = ylethyl) except for using methyldienoic acid 2-hydroxyethyl instead In addition to fluorenyl acrylic acid, a terpolymer was prepared according to the procedure of Example 4-1 a). The weight average molecular weight and dispersion coefficient of the obtained trimer are 8.500 and 1.80 ° 21 1225481 c) Synthetic trimer (R = methyl, R3 = methyl) In addition to using methyl methacrylate instead of methacrylic acid, A trimer was prepared according to the procedure of Example 4-1 a). The weight average molecular weight and dispersion coefficient of the obtained terpolymer were 8,500 and 1.80, respectively. Example 4-2: Synthesis of trimer (compound 5)
a) 合成三聚物(R=乙基,R3=氫) 除了以實施例 1-4之1-乙基-1-環十二烷基-4-正莰 烯-1-羧酸酯來代替 1-甲基-1-環十二烷基-4-正莰烯-1-羧酸酯外,依實施例4-1 a)之步驟製備三聚物 所得三聚物之重量平均分子量及分散係數分別為 8.500 及 1.80。 b) 合成三聚物(R==乙基’ R3 =經基乙基) 除了使用曱基丙烯酸2-羥基乙酯來代替曱基丙烯 酸外,依實施例4-2 a)之步驟製備三聚物。a) Synthesis of trimer (R = ethyl, R3 = hydrogen) except that 1-ethyl-1-cyclododecyl-4-n-pinene-1-carboxylic acid ester of Example 1-4 was used instead Except for 1-methyl-1-cyclododecyl-4-n-pinene-1-carboxylic acid ester, the weight average molecular weight and dispersion of the trimer obtained according to the procedure of Example 4-1 a) were used to prepare the trimer. The coefficients are 8.500 and 1.80, respectively. b) Synthesis of trimer (R == ethyl 'R3 = merylethyl). Except using 2-hydroxyethyl fluorenyl acrylate instead of fluorenyl acrylic acid, the trimer was prepared according to the procedure of Example 4-2 a). Thing.
所得三聚物之重量平均分子量及分散係數分別為 8.500 A 1.80。 c) 合成三聚物(R=乙基,R3=甲基) 除了使用曱基丙烯酸甲酯來代替甲基丙烯酸外,依 實施例4-2 a)之步驟製備三聚物。 所得三聚物之重量平均分子量及分散係數分別為 8.500 及 1.80。 22 ^5481 例5 :製備光阻組合物 將20克實施例2-1之共聚物及0· 02克之三苯銃三 佛得(triphenyl sulfonium triflate)(TPS-105)完全溶於 17 克的丙二醇單曱醚乙酸酯(PGMEA)中。以0·2微米之碟 形濾器過濾溶液可得一光阻溶液。之後,將該光阻溶液 塗佈於經六甲基二矽烷(HMDS)處理過之矽晶圓上,厚 度約0.30微米。The weight average molecular weight and dispersion coefficient of the obtained terpolymer were 8.500 A and 1.80, respectively. c) Synthesis of a trimer (R = ethyl, R3 = methyl) In addition to using methyl methyl acrylate instead of methacrylic acid, a trimer was prepared according to the procedure of Example 4-2 a). The weight average molecular weight and dispersion coefficient of the obtained terpolymer were 8.500 and 1.80, respectively. 22 ^ 5481 Example 5: Preparation of a photoresist composition 20 grams of the copolymer of Example 2-1 and 0.02 grams of triphenyl sulfonium triflate (TPS-105) were completely dissolved in 17 grams of propylene glycol Monomethyl ether acetate (PGMEA). Filter the solution through a 0.2-micron dish filter to obtain a photoresist solution. Then, the photoresist solution was coated on a silicon wafer treated with hexamethyldisilanes (HMDS) to a thickness of about 0.30 micrometers.
將已塗佈該光阻溶液之矽晶圓於11 0°C下預烘烤90 秒,並以孔徑值為0.60之ArF激光雷射曝光。之後, 於130°C下進行曝光後烘烤90秒。 之後,以 2.38%(重量百分比)之四曱基氫氧化銨 (TMAH)溶液將產物顯影30秒。結果,當曝光係以20 毫焦耳/平方公分之能量進行時,可獲得一線寬約〇. 1 3 微米之長方形光阻圖案。本發明共聚物可降低對聚矽之 蝕刻速率約20%,因此,相較於傳統COMA,表現出較 佳的抗蝕刻性。The silicon wafer coated with the photoresist solution was pre-baked at 110 ° C for 90 seconds, and exposed with an ArF laser with an aperture value of 0.60. Thereafter, post-exposure baking was performed at 130 ° C for 90 seconds. After that, the product was developed with a 2.38% (wt%) tetramethylammonium hydroxide (TMAH) solution for 30 seconds. As a result, when the exposure is performed with an energy of 20 mJ / cm 2, a rectangular photoresist pattern with a line width of about 0.1 3 μm can be obtained. The copolymer of the present invention can reduce the etching rate to polysilicon by about 20%. Therefore, compared with the conventional COMA, it exhibits better etching resistance.
實施例6 :製備光阻組合物 將20克實施例3-1之三聚物及0.02克之三苯疏三 佛得(triphenyl sulfonium triflate)(TPS-105)完全溶於 17 克的丙二醇單甲醚乙酸酯(PGMEA)中。同實施例5之步 驟製備光阻溶液。長方形光阻圖案之線寬約0.1 2微米。 實施例7 :製備光阻組合物 23 1225481 將20克實施例4-1之三聚物及0.02克之三苯銃三 佛得(triphenyl sulfonium triflate)(TPS-105)完全溶於 17 克的丙二醇單甲醚乙酸酯(PGME A)中。同實施例5之步 驟製備光阻溶液。長方形光阻圖案之線寬約0.1 2微米。Example 6: Preparation of a photoresist composition 20 grams of the terpolymer of Example 3-1 and 0.02 grams of triphenyl sulfonium triflate (TPS-105) were completely dissolved in 17 grams of propylene glycol monomethyl ether Acetate (PGMEA). The same procedure as in Example 5 was used to prepare a photoresist solution. The line width of the rectangular photoresist pattern is about 0.1 2 microns. Example 7: Preparation of photoresist composition 23 1225481 20 grams of the terpolymer of Example 4-1 and 0.02 grams of triphenyl sulfonium triflate (TPS-105) were completely dissolved in 17 grams of propylene glycol mono Methyl ether acetate (PGME A). The same procedure as in Example 5 was used to prepare a photoresist solution. The line width of the rectangular photoresist pattern is about 0.1 2 microns.
上述實施例5-7及前述COMA型式光阻之光敏度、 解析度及圖案形狀示於下表1。此外,實施例7及前技 之COMA光阻圖案則分別示於第1圖及第2圖。此外, 第3圖及第4圖分別顯示以實施例5至7及前技COMA 型光阻對氧化物及聚合物之抗蝕刻性。 表1 光敏度 解析度 圖案形狀 (毫焦耳/平方公分) (微米) 實施例5 20 0.13 長方形 實施例6 22 0.12 長方形 實施例7 19 0.12 長方形 前技COMA 25 0.14 變窄The photosensitivity, resolution, and pattern shape of the above-mentioned Examples 5-7 and the aforementioned COMA type photoresist are shown in Table 1 below. In addition, the COMA photoresist patterns of Example 7 and the prior art are shown in Fig. 1 and Fig. 2, respectively. In addition, Fig. 3 and Fig. 4 respectively show the etching resistance of oxides and polymers by Examples 5 to 7 and the prior art COMA type photoresist. Table 1 Photosensitivity Resolution Pattern shape (mJ / cm2) (microns) Example 5 20 0.13 Rectangle Example 6 22 0.12 Rectangle Example 7 19 0.12 Rectangle COMA 25 0.14 Narrow
從表 1及第1-4圖可知,相較於前技COMA型光 阻,本發明光阻具有極佳的長方形圖案形狀,同時對氧 化物及聚合物具有極佳之抗蝕刻性。 如上述,本發明可提供一共聚物或三聚物,其係使 用新穎之(曱基)丙烯酸化合物或正莰烯羧酸酯化合物來 製備,該新穎之(曱基)丙烯酸化合物或正莰烯羧酸酯化 24 1225481 合物係具有一與環十二烷基連接之側基團;且該共聚物 或三聚物可提供一可使用 ArF之化學放大正光阻組合 物,藉由使用該聚合物可使其具有極佳的高解析度及抗 蝕刻性,並因而可獲得極佳的光阻圖案。 【圖式簡單說明】 第1圖顯示本發明實施例7的光阻圖案。As can be seen from Table 1 and Figures 1-4, compared with the COMA photoresist of the prior art, the photoresist of the present invention has an excellent rectangular pattern shape, and at the same time has excellent resistance to oxides and polymers. As described above, the present invention can provide a copolymer or terpolymer prepared by using a novel (fluorenyl) acrylic compound or n-pinene carboxylic acid ester compound, the novel (fluorenyl) acrylic compound or n-pinene The carboxylic acid esterification 24 1225481 composition has a pendant group connected to the cyclododecyl group; and the copolymer or terpolymer can provide a chemically amplified positive photoresist composition that can use ArF, by using the polymerization The object can make it have excellent high resolution and etching resistance, and thus can obtain an excellent photoresist pattern. [Brief description of the drawings] FIG. 1 shows a photoresist pattern according to Embodiment 7 of the present invention.
第2圖顯示一前技COMA型光阻的圖案結果。 第3圖顯示本發明實施例5至7之氧化物的抗蝕刻 性結果。 第4圖顯示前技聚COMA型光阻的抗蝕刻性結果。 25Figure 2 shows the pattern results of a prior art COMA photoresist. Figure 3 shows the results of the etching resistance of the oxides of Examples 5 to 7 of the present invention. Figure 4 shows the results of the etching resistance of the previous poly COMA photoresist. 25
Claims (1)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020020067883A KR100865864B1 (en) | 2002-11-04 | 2002-11-04 | Chemically amplified polymer having pendant group with cyclododecyl and resist composition comprising the same |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200407298A TW200407298A (en) | 2004-05-16 |
TWI225481B true TWI225481B (en) | 2004-12-21 |
Family
ID=32310814
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW091136587A TWI225481B (en) | 2002-11-04 | 2002-12-18 | Chemically amplified polymer having pendant group with cyclododecyl and resist composition comprising the same |
Country Status (4)
Country | Link |
---|---|
KR (1) | KR100865864B1 (en) |
AU (1) | AU2002357535A1 (en) |
TW (1) | TWI225481B (en) |
WO (1) | WO2004041770A1 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101087846B (en) * | 2004-12-27 | 2010-09-29 | Jsr株式会社 | Thermoplastic resin composition, optical film and oriented film |
KR100676812B1 (en) * | 2006-02-14 | 2007-02-02 | 주식회사 이엔에프테크놀로지 | Process for preparing norbornene lactone ester compound |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61159408A (en) * | 1984-12-29 | 1986-07-19 | Hitachi Chem Co Ltd | Production of polymer |
TW457277B (en) * | 1998-05-11 | 2001-10-01 | Shinetsu Chemical Co | Ester compounds, polymers, resist composition and patterning process |
JP2002006501A (en) * | 1999-11-09 | 2002-01-09 | Sumitomo Chem Co Ltd | Chemical amplification resist composition |
KR20010081854A (en) * | 2000-02-19 | 2001-08-29 | 김동석 | 8-Alkyl-8-tricyclodecanyl (meth)acrylates and producing method therefor |
KR20010081852A (en) * | 2000-02-19 | 2001-08-29 | 김동석 | 8-Alkyl-8-tricyclodecanyl 5-norbornene-2-carboxylates and producing method therefor |
KR100765245B1 (en) * | 2000-09-25 | 2007-10-09 | 후지필름 가부시키가이샤 | Positive photoresist composition |
JP2002244295A (en) * | 2001-02-15 | 2002-08-30 | Jsr Corp | Solution of radiation sensitive resin composition and method for improving shelf stability of the same |
JP4726362B2 (en) * | 2001-09-10 | 2011-07-20 | 日本曹達株式会社 | (Meth) acrylic acid copolymer and method for producing the same |
-
2002
- 2002-11-04 KR KR1020020067883A patent/KR100865864B1/en active IP Right Grant
- 2002-11-18 WO PCT/KR2002/002150 patent/WO2004041770A1/en not_active Application Discontinuation
- 2002-11-18 AU AU2002357535A patent/AU2002357535A1/en not_active Abandoned
- 2002-12-18 TW TW091136587A patent/TWI225481B/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
AU2002357535A1 (en) | 2004-06-07 |
WO2004041770A1 (en) | 2004-05-21 |
TW200407298A (en) | 2004-05-16 |
KR100865864B1 (en) | 2008-10-29 |
KR20040039118A (en) | 2004-05-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI328144B (en) | Photoresist compositions comprising resin blends | |
KR101173089B1 (en) | Hydroxyphenyl acrylate monomers and polymers | |
JP2009501207A (en) | Photoactive compound | |
KR20000060410A (en) | Organic anti-reflective polymer and method for manufacturing thereof | |
JP6820233B2 (en) | A polymer, a resist composition containing the polymer, and a method for producing a device using the polymer. | |
TWI291078B (en) | Partially crosslinked polymer for bilayer photoresist | |
JP2006330401A (en) | Positive-type resist composition and resist pattern forming method | |
KR20080032098A (en) | Photoresist polymer having nano smoothness and etching resistance and resist composition | |
JP5548940B2 (en) | Photoactive compound | |
CN102718932B (en) | Photosensitive copolymer and photoresist composition | |
JPH10182552A (en) | Preparation of tertiary alcohol ester and resist material | |
TWI242003B (en) | Chemically amplified polymer having pendant group with dicyclohexyl and resist composition comprising the same | |
US6472120B1 (en) | Photosensitive polymer and chemically amplified photoresist composition containing the same | |
JPH1048814A (en) | Radiation sensitive resin composition | |
JP2002003447A (en) | Novel monomer, polymer, synthetic methods therefor and photoresist composition | |
TW552472B (en) | Photosensitive polymer having cyclic backbone and resist composition comprising the same | |
TWI269801B (en) | Photosensitive polymer | |
TW476022B (en) | Photosensitive polymer having cyclic backbone and resist composition comprising the same | |
JP2002201223A (en) | Photosensitive polymer having both phenyl ring and lactone group and resist composition | |
TWI225481B (en) | Chemically amplified polymer having pendant group with cyclododecyl and resist composition comprising the same | |
CN115141304B (en) | High-refraction film-forming resin containing triphenylmethyl ester structure and photoresist composition | |
JP2008163056A (en) | Method for synthesizing hyper branched polymer, hyper branched polymer, resist composition, semiconductor integrated circuit, and method for producing semiconductor integrated circuit | |
KR100902535B1 (en) | Positive resist composition and method of forming resist pattern | |
JP4979915B2 (en) | Polymer compound, negative resist composition, and resist pattern forming method | |
TW593409B (en) | Chemically amplified polymer having pendant group with camphoryl and resist composition comprising the same |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |