TW593409B - Chemically amplified polymer having pendant group with camphoryl and resist composition comprising the same - Google Patents

Chemically amplified polymer having pendant group with camphoryl and resist composition comprising the same Download PDF

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TW593409B
TW593409B TW091136586A TW91136586A TW593409B TW 593409 B TW593409 B TW 593409B TW 091136586 A TW091136586 A TW 091136586A TW 91136586 A TW91136586 A TW 91136586A TW 593409 B TW593409 B TW 593409B
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hydrogen
alkyl
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TW200407350A (en
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Yong-Joon Choi
Eun-Kyung Son
Deog-Bae Kim
Jae-Hyun Kim
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Dongjin Semichem Co Ltd
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/039Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G03F7/0397Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07CACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C67/00Preparation of carboxylic acid esters
    • C07C67/14Preparation of carboxylic acid esters from carboxylic acid halides
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07CACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C67/00Preparation of carboxylic acid esters
    • C07C67/30Preparation of carboxylic acid esters by modifying the acid moiety of the ester, such modification not being an introduction of an ester group
    • C07C67/333Preparation of carboxylic acid esters by modifying the acid moiety of the ester, such modification not being an introduction of an ester group by isomerisation; by change of size of the carbon skeleton
    • C07C67/343Preparation of carboxylic acid esters by modifying the acid moiety of the ester, such modification not being an introduction of an ester group by isomerisation; by change of size of the carbon skeleton by increase in the number of carbon atoms
    • C07C67/347Preparation of carboxylic acid esters by modifying the acid moiety of the ester, such modification not being an introduction of an ester group by isomerisation; by change of size of the carbon skeleton by increase in the number of carbon atoms by addition to unsaturated carbon-to-carbon bonds
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    • C07ORGANIC CHEMISTRY
    • C07CACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C69/00Esters of carboxylic acids; Esters of carbonic or haloformic acids
    • C07C69/52Esters of acyclic unsaturated carboxylic acids having the esterified carboxyl group bound to an acyclic carbon atom
    • C07C69/533Monocarboxylic acid esters having only one carbon-to-carbon double bond
    • C07C69/54Acrylic acid esters; Methacrylic acid esters
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    • C07ORGANIC CHEMISTRY
    • C07CACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C69/00Esters of carboxylic acids; Esters of carbonic or haloformic acids
    • C07C69/74Esters of carboxylic acids having an esterified carboxyl group bound to a carbon atom of a ring other than a six-membered aromatic ring
    • C07C69/753Esters of carboxylic acids having an esterified carboxyl group bound to a carbon atom of a ring other than a six-membered aromatic ring of polycyclic acids
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10Esters
    • C08F220/12Esters of monohydric alcohols or phenols
    • C08F220/16Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F220/18Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • C08F220/1811C10or C11-(Meth)acrylate, e.g. isodecyl (meth)acrylate, isobornyl (meth)acrylate or 2-naphthyl (meth)acrylate
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/0045Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/039Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/039Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G03F7/0395Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having a backbone with alicyclic moieties
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • G03F7/2041Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07CACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C2602/00Systems containing two condensed rings
    • C07C2602/36Systems containing two condensed rings the rings having more than two atoms in common
    • C07C2602/42Systems containing two condensed rings the rings having more than two atoms in common the bicyclo ring system containing seven carbon atoms

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Materials For Photolithography (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)

Abstract

The present invention relates to a chemically amplified polymer having a pendent group with camphoryl bonded thereto, a process for the preparation thereof and a resist composition comprising it, and more particularly, to a novel (meth)acrylic or norbornene carboxylate compound with camphoryl bonded thereto, a process for the preparation thereof, a chemically amplified polymer synthesized therewith, and a positive photoresist composition for ArF comprising said polymer with high resolution and excellent etching resistance.

Description

州409 玖、發明說明 【發明所屬之技術領域] 本發明係關於一種新穎的(甲 外必你 & )丙烯酸或正莰烯羧 酸酯化合物,其係具有一與楂 ^ 興樟腦基相接之側基團 (pendent group);製備該化合物之方法;及以該化合物 所合成之化學放大聚合物;及用於ArF之包含該聚合 物的光阻組合物’該光阻組合物係具有高解析度及優異 的抗蚀刻性。 【先前技術】 隨著半導體裝置整合度增加之際,〇.25微米以下 之超精細圖案的需求也隨之升高。為此,依據雷萊法則 (Rayleigh’s rule)用於圖案化之光源波長亦變得更短, 例如從436 nm(G-譜線)及3 65 nm(I-譜線)縮短至193 nm (ArF)、157 nm (VUV)、及 248 nm (KrF)。但在前技中, 為獲得容量在1 G位元以上之半導體裝置的圖案,一般 的光阻材料必須在248. nm下使用。因此,亟需一種能 於1 93 nm之短波長下使用且能被連續顯影來滿足精細 解析度要求之新光阻。 依據結構上的差異,可將習知可作為抗-ArF材料 的聚合物分成三大類:聚丙烯酸酯、環烯烴-順丁烯二 酸酐共聚物及聚正莰烯。就微影表現(圖案崩塌、線邊 緣粗造度、SEM束對比、抗蝕刻性等等)來說’在這三 類或合物中,環烯烴-順丁烯二酸酐共聚物(cycloolefin· 593409 maleic anhydride copolymer, COMA)-型光阻是 的。但是,為川員丁婦二酸fff(maleic anhydride, 解之故,該 COMA-為底的光阻在解析度上,特 密度及空間圖案上,卻會造成不良的結果。此外 傳統COMA的光阻並無法表現足夠的抗性,因 無法使用乾蝕刻製程。 【内容】 因此,本發明目的之一係提供可解決上述前 之一(曱基)丙烯酸或正莰烯羧酸酯化合物,其係 能增加高解析度及抗蝕刻性之大型脂肪性環取代 以及製備該化合物之方法。 本發明之另一目的係提供一適合作為一化學 光阻之光敏共聚物及三聚物,其係包含一具環狀 側基團及脂肪性環狀化合物,以獲致高整合半導 之充分解析度,同時對乾蝕刻製程可表現出極強 的抗蝕刻性。 本發明之另一目的係提供一可用於ArF之 大正光阻組合物,其係包含該光敏共聚物、三聚 之混合物。 最有用 MA)水 別是線 ,包含 此仍然 技問題 具有一 基團; 性放大 結構的 體所需 且充分 化學放 物及其State 409 发明 Description of the invention [Technical field to which the invention belongs] The present invention relates to a novel (exo-bibutyl &) acrylic or n-pinene carboxylic acid ester compound, which has a connection with a hawthorn ^ camphor group A pendent group; a method for preparing the compound; and a chemically amplified polymer synthesized from the compound; and a photoresist composition containing the polymer for ArF; the photoresist composition has a high Resolution and excellent etch resistance. [Previous technology] As the integration degree of semiconductor devices increases, the demand for ultra-fine patterns below 0.25 micron also increases. For this reason, the wavelength of the light source used for patterning according to Rayleigh's rule has also become shorter, such as shortening from 436 nm (G-line) and 3 65 nm (I-line) to 193 nm (ArF ), 157 nm (VUV), and 248 nm (KrF). However, in the prior art, in order to obtain a pattern of a semiconductor device having a capacity of more than 1 G bit, a general photoresist material must be used at 248. nm. Therefore, a new photoresist that can be used at a short wavelength of 1 93 nm and can be continuously developed to meet the requirements of fine resolution is urgently needed. According to structural differences, polymers that are conventionally known as anti-ArF materials can be divided into three categories: polyacrylates, cycloolefin-maleic anhydride copolymers, and poly-n-pinene. In terms of lithographic performance (pattern collapse, line edge roughness, SEM beam contrast, etch resistance, etc.) 'In these three types of compounds, cycloolefin-maleic anhydride copolymer (cycloolefin · 593409 maleic anhydride copolymer (COMA) -type photoresist Yes. However, because of the maleic anhydride fff (maleic anhydride), the COMA-based photoresist will cause bad results in terms of resolution, density, and spatial pattern. In addition, the traditional COMA light Resistance can not show sufficient resistance, because the dry etching process cannot be used. [Content] Therefore, one of the objects of the present invention is to provide a solution of one of the foregoing (fluorenyl) acrylic or n-pinene carboxylic acid ester compounds, Large aliphatic ring substitution capable of increasing high resolution and etching resistance and a method for preparing the same. Another object of the present invention is to provide a photosensitive copolymer and terpolymer suitable as a chemical photoresist. It has cyclic side groups and aliphatic cyclic compounds to obtain sufficient resolution of highly integrated semiconductors, and at the same time, it can show very strong resistance to etching in dry etching processes. Another object of the present invention is to provide a method that can be used in ArF's Taisho photoresist composition, which is a mixture of the photosensitive copolymer and trimer. The most useful MA) water is a thread, which contains a group containing this technical problem; Required and adequate chemical radiation and

5 593409 為達前述目的,本發明提供一以下列式1代表之(甲 基)丙烯酸2-烷基-2-樟腦酯: R*5 593409 In order to achieve the foregoing object, the present invention provides a 2-alkyl-2-camphoryl (meth) acrylate represented by the following Formula 1: R *

I )=0I) = 0

其中R是一甲基或乙基,且R*為氫或一曱基基團。 此外,本發明亦提供製備該式1之(曱基)丙烯酸2-烷基-2-樟腦酯的方法,其係包含下列步驟: a) 讓樟腦與一烧基格那試劑(alkyl grinard reagent) 或烧基链試劑(alkyl lithium reagent)反應,來 製備2-烷基-2-樟腦醇;及 b) 讓前述製備之2-烷基-2-樟腦醇與(甲基)丙烯醯 氯反應。Where R is a methyl or ethyl group and R * is hydrogen or a fluorenyl group. In addition, the present invention also provides a method for preparing 2-alkyl-2-camphoryl (fluorenyl) acrylate of formula 1, which comprises the following steps: a) let camphor and alkyl grinard reagent Or reacting with an alkyl lithium reagent to prepare 2-alkyl-2-camphorol; and b) reacting the 2-alkyl-2-camphorol prepared above with (meth) acrylic acid chloride.

再者,本發明還提供一以下列式2代表之2-烷基-2-樟腦基-5-正莰烯-2-羧酸酯化合物:Furthermore, the present invention also provides a 2-alkyl-2-camphoryl-5-n-pinene-2-carboxylic acid ester compound represented by the following formula 2:

6 593409 其中R是一甲基或乙基,且R*為氫或一曱基基團。 此外,本發明還提供一種製備該式2之2-烷基-2-樟腦基-5-正莰烯-2-羧酸酯化合物的方法,其係藉由讓 式1之(甲基)丙烯酸2-烷基-2-樟腦酯與環戊二烯進行 迪氏亞達反應(Diels-Alder)所製備而成的。 本發明還提供一種以下列式3代表之光敏共聚物:6 593409 where R is monomethyl or ethyl, and R * is hydrogen or a fluorenyl group. In addition, the present invention also provides a method for preparing the 2-alkyl-2-camphoryl-5-n-pinene-2-carboxylic acid ester compound of the formula 2, by allowing the (meth) acrylic acid of the formula 1 2-alkyl-2-camphoryl ester and cyclopentadiene are prepared by a Diels-Alder reaction. The present invention also provides a photosensitive copolymer represented by the following formula 3:

其中R是一曱基或乙基,且R*為氫或一曱基基團, 且η是一介於25至30間之整數。 本發明還提供一種製備該式3光敏共聚物之方法, 包括讓該式2化合物與一順丁烯二酸酐聚合之步驟。 7 593409 此外,本發明還提供一以下列式4代表之光敏三聚 物:Where R is a fluorenyl or ethyl group, and R * is hydrogen or a fluorenyl group, and η is an integer between 25 and 30. The present invention also provides a method for preparing the photosensitive copolymer of Formula 3, comprising the step of polymerizing the compound of Formula 2 with maleic anhydride. 7 593409 In addition, the present invention also provides a photosensitive trimer represented by the following formula 4:

其中R是一甲基或乙基;R*為氫或一曱基基團;R’ 是氫、一烷基或一羥基烷基;R”是氫或一甲基基團; 且 m 與 η 分別滿足 m + η = 1,0.1<m<0.9 且 0·1<η<0.9 之條件。 此外,本發明還提供一製備該式4之光敏三聚物的 方法,其係包含讓式1化合物與一順丁烯二酸酐及一式 6之正莰烯化合物聚合之步驟:Where R is a methyl or ethyl group; R * is hydrogen or a fluorenyl group; R 'is hydrogen, an alkyl group, or a hydroxyalkyl group; R "is hydrogen or a methyl group; and m and η Meet the conditions of m + η = 1, 0.1 < m < 0.9 and 0 · 1 < η < 0.9, respectively. In addition, the present invention also provides a method for preparing the photosensitive trimer of Formula 4, which comprises letting Formula 1 Steps for polymerizing the compound with maleic anhydride and n-pinene compound of Formula 6:

RO 〇 6 其中R’是氫、一烷基或一羥基烷基;且R”是氫或 一曱基基團 8 593409 此外,本發明還提供一以下列式5代表之光敏三聚 物:RO 〇 6 wherein R ′ is hydrogen, an alkyl group, or a hydroxyalkyl group; and R ″ is a hydrogen group or a fluorenyl group 8 593409 In addition, the present invention also provides a photosensitive trimer represented by the following formula 5:

其中R是一曱基或乙基;R*為氫或一甲基基團;R’ 是氫、一烷基或一羥基烷基;R”是氫或一曱基基團; 且 m 與 η 分別滿足 m + η = 1,0.1<m<0.9 且 0·1<η<0·9 之條件。 此外,本發明還提供一製備該式5之光敏三聚物的 方法,其係包含讓式2化合物與一順丁烯二酸肝及一式 7之丙烯酸酯化合物聚合之步驟: R" 593409 其中R’是氫、一烷基或一羥基烷基;且R”是氫 一甲基基團。 此外,本發明還提供一可用於 ArF之化學放大 光阻組合物,其係包含一或多種選自下列之聚合物: 括式3之光敏共聚物、式4之光敏三聚物及式5之光 三聚物。 特定言之,上述化學式中的R’較佳係為一具有< C1Q之脂肪性碳氮化物的烧基基團或一具有C^-C^。之 肪性碳氫化物的經基烧基基團。 此外,本發明還提供一由上述光阻組合物所製備 成的半導體裝置。 【實施方式】 本發明將詳述於下。 本發明提供一以具有大型脂肪性環狀取代基之( 基)丙烯酸羧酸酯或正莰烯羧酸酯化合物來製備一光 共聚物及三聚物;以及以該具高解析度及抗蝕刻性之 聚物及三聚物來製備化學放大正光阻組合物。 讓 2-烷基-2-樟腦醇與(曱基)丙烯醯氯反應來製 本發明之式1的(甲基)丙烯酸2-烷基-2-樟腦酯。 或 正 包 敏 脂 而 曱 敏 共 備 10 593409 該(曱基)丙烯酸2-烷基-2-樟腦酯之製備係依據下 列流程1 : [流程1 ]Where R is a fluorenyl or ethyl group; R * is hydrogen or a methyl group; R 'is hydrogen, an alkyl group, or a hydroxyalkyl group; R "is hydrogen or a fluorenyl group; and m and η Meet the conditions of m + η = 1, 0.1 < m < 0.9 and 0 · 1 < η < 0 · 9, respectively. In addition, the present invention also provides a method for preparing the photosensitive terpolymer of formula 5, which comprises letting Step of polymerizing a compound of formula 2 with maleic acid and an acrylate compound of formula 7: R " 593409 where R 'is hydrogen, an alkyl group, or a hydroxyalkyl group; and R "is a hydrogen-methyl group . In addition, the present invention also provides a chemically amplified photoresist composition that can be used in ArF, which comprises one or more polymers selected from the group consisting of a photosensitive copolymer of formula 3, a photosensitive terpolymer of formula 4, and a polymer of formula 5 Phototrimer. In particular, R 'in the above chemical formula is preferably an alkyl group having an aliphatic carbonitride of < C1Q or an alkyl group having C ^ -C ^. An alkyl group of a fatty hydrocarbon. In addition, the present invention also provides a semiconductor device prepared from the photoresist composition. [Embodiment] The present invention will be described in detail below. The present invention provides a photopolymer and terpolymer prepared from a (meth) acrylic acid carboxylate or n-pinene carboxylic acid ester compound having a large aliphatic cyclic substituent; and the high-resolution and anti-etching method is provided. Polymer and terpolymer to prepare chemically amplified positive photoresist compositions. 2-Alkyl-2- camphorol is reacted with (fluorenyl) propylene fluorene chloride to produce 2-alkyl-2-camphoryl (meth) acrylate of formula 1 of the present invention. Or, it is coated with sensitive lipids and fluorene sensitively. 10 593409 The (fluorenyl) acrylic acid 2-alkyl-2-camphoryl ester is prepared according to the following scheme 1: [Scheme 1]

其中R是一曱基或一乙基,且X是氣或溴。 如上述流程 1所示,2-烷基-2-樟腦醇可藉由讓樟 腦與一烷基格那試劑或烷基鋰試劑反應,於樟腦的第2 位置引入一烷基基團來製備。上述之烷基格那試劑包括 一烷基溴化鎂、烷基氯化鎂等;較佳是曱基溴化鎂或曱 基氯化鎂。 之後,依據本發明,該(甲基)丙烯酸 2-烷基-2-樟 腦酯可藉由讓 2-烷基-2-樟腦醇與(甲基)丙烯醯氯反應 來製備,如下列流程2所示:Where R is monomethyl or ethyl, and X is gas or bromine. As shown in Scheme 1 above, 2-alkyl-2-camphorol can be prepared by reacting camphor with an alkyl gena reagent or alkyl lithium reagent and introducing an alkyl group at the second position of camphor. The above-mentioned alkyligna reagent includes monoalkylmagnesium bromide, alkylmagnesium chloride, and the like; fluorenylmagnesium bromide or fluorenylmagnesium chloride is preferred. Then, according to the present invention, the 2-alkyl-2-camphor (meth) acrylate can be prepared by reacting 2-alkyl-2-camphorol with (meth) acrylic acid chloride, as shown in the following scheme 2 As shown:

[流程2][Process 2]

11 593409 其中R是一甲基或一乙基,且R*是氫或甲基。此 外,依據本發明,式2之正莰烯化合物可以式1之化合 物來製備。 依據本發明,式2之2-烷基-2-樟腦基-5-正莰烯-2-羧酸酯化合物係藉由讓式1之化合物與環戊二烯進行迪 氏-亞達反應(Diels-Alder)所製備而成的,如下列流程3 所示: [流程3 ]11 593409 where R is monomethyl or ethyl and R * is hydrogen or methyl. In addition, according to the present invention, the n-pinene compound of Formula 2 can be prepared from the compound of Formula 1. According to the present invention, the 2-alkyl-2-camphoryl-5-n-pinene-2-carboxylic acid ester compound of Formula 2 is obtained by subjecting a compound of Formula 1 to cyclopentadiene to undergo a Diricht-Yard reaction ( Diels-Alder), as shown in the following process 3: [Process 3]

R* (1) (2) 其中R是一曱基或一乙基,且R*是氫或曱基。 此外,依據本發明,式 3之光敏共聚物及式 4、5 之光敏三聚物亦可以式1及式2之化合物來製備。 首先,依下式製備式3之光敏共聚物: Ο !> 7 12 593409R * (1) (2) where R is a fluorenyl or monoethyl group, and R * is hydrogen or fluorenyl. In addition, according to the present invention, the photosensitive copolymer of Formula 3 and the photosensitive terpolymer of Formulas 4 and 5 can also be prepared from the compounds of Formula 1 and Formula 2. First, a photosensitive copolymer of Formula 3 was prepared according to the following formula: 〇! ≫ 7 12 593409

其中R及R*之定義如上。 如以上流程4所示,式3之光敏共聚物可藉由聚合 式2之正莰烯化合物與一順丁烯二酸酐來製備。該聚合 反應可包含一諸如疊氮雙(異丁腈)(AIBN)之起始物。較 佳是,所得式3之光敏共聚物的重量平均分子量介於 3,000至1 00,000間,且分散係數介於1.0至5.0間。Where R and R * are as defined above. As shown in Scheme 4 above, the photosensitive copolymer of Formula 3 can be prepared by polymerizing an n-pinene compound of Formula 2 and a maleic anhydride. The polymerization reaction may include a starting material such as azidobis (isobutyronitrile) (AIBN). More preferably, the weight-average molecular weight of the obtained photosensitive copolymer of Formula 3 is between 3,000 and 100,000, and the dispersion coefficient is between 1.0 and 5.0.

此外,式4及5之光敏三聚物可分別依下列流程5 及6進行製備:In addition, the photosensitive terpolymers of formulas 4 and 5 can be prepared according to the following procedures 5 and 6, respectively:

13 593409 [流程6 ]13 593409 [Process 6]

其中R、R,、R*及R”之定義如上。 如以上流程5所示,式4之光敏共聚物可藉由聚合 式1化合物及式6之正莰烯化合物與一順丁烯二酸酐來 製備。 此外,如以上流程6所示,式5之光敏共聚物可藉 由聚合式2化合物及式7之丙烯酸酯化合物與一順丁烯 二酸酐來製備。 所有上述式4及5之光敏三聚物的聚合反應可包含 一諸如疊氮雙(異丁腈)(AIBN)之起始物。較隹是,所得 式4及5之光敏三聚物的重量平均分子量介於3,000至 1 00,000間,且分散係數介於1.0至5.0間。 此外,本發明也提供一可用於 ArF之化學放大正 光阻組合物,其係包含一或多種選自下列之聚合物:式 3之光敏共聚物、式4之光敏三聚物及式5之光敏三聚 物0 14 593409 之 之 1% 百 溶 更 度 進 劑 生 乙 .醇 .己 k乙 -甲 ••甲 .係 :包 L胺 在本發明正光阻組合物中,該一或多種選自式3 光敏共聚物、式4之光敏三聚物及式5之光敏三聚物 聚合物的含量,以聚合物總重來計算,較佳是介於 至30%(重量百分比)間,更佳係介於5%至8%(重量 分比)間。 再者,本發明光阻組合物包含一光酸產生劑及 劑;必要時,其還可組合使用各種添加物進行製備; 佳是,以總光阻組合物之1 0 〇份重量而言,其固體濃 介於該重量之20%至50%間。之後,以0.2微米濾網 行過濾後再使用。 以總聚合物重量為1 〇〇%進行計算,該光酸產生 的含量較佳係介於0 · 5 %至1 0 %間。可使用的光酸產 劑為鏘鹽、有機磺酸、或其之混合物。 可用於本發明之溶劑包括乙二醇單甲基乙基醚、 二醇單乙醚、乙二醇單曱醚、二乙二醇單乙醚、丙二 單曱醚乙酸酯(PGMEA)、甲苯、二甲苯、甲乙酮、環 酮、2 -羥基丙酸乙酯、2 -羥基2 -甲基丙酸乙酯、乙氧 酸乙酯、羥基乙酸乙酯、2 -羥基3 -曱基丁酸甲酯、3 氧基2 -甲基丙酸曱酯、3 -乙氧丙酸乙酯、3 -甲氧2 基丙酸乙酯、3 -乙氧丙酸乙酯、3 -甲氧2 -曱基丙酸乙醋 乙酸乙酯、乙酸丁酯等。 再者,本發明光阻組合物更可包含一有機鹼, 佔約 0.01%至2.00%(重量百分比)。可使用的有機 括三乙胺、三異丁胺、三異辛胺、二乙醇胺、三乙 15 593409 或其之混合物。 此外,本發明可提供一具有極佳圖案之半導體裝 置,其係藉由旋塗將上述光阻組合物塗佈於一矽晶圓或 鋁基材上以形成一光阻膜,並經曝光、顯影及烘烤製程 所製備而成。顯影溶液可使用諸如氫氧化鈉、氫氧化鉀、 碳酸鈉及四曱基氫氧化銨(TMAH)之類的鹼性化合物之 0.1 %至 1 0%的鹼性水溶液。此外,亦可使用適量之諸 如甲醇、及乙醇之水溶性有機溶劑及一表面活性劑於上 述顯影溶液中。顯影後,以超純水清洗該光阻膜。 以下將藉實施例來說明本發明,但本發明之範疇並 不僅限於下附實施例中。 實施例 實施例 1-1 :合成(甲基)丙彿酸2-甲基-2-樟腦酯(R=曱 基)(化合物1) a)製備2-甲基-2-樟腦醇 以2 00毫升無水THF稀釋210毫升(0.64莫耳)之 甲基溴化鎂的二乙醇溶液(3· 0M)。將溶液倒入1公升的 燒瓶内並將其維持在〇°C。以漏斗將樟腦(48.7克,0.32 莫耳)緩缓滴入上述溶液中,之後在室溫下反應2小時。 反應終止後,以旋轉揮發器移除過量 THF,並以稀硫 酸中和反應產物,以二乙醚萃取,並以無水硫酸鎂進行 乾燥。以色層層析管柱來純化所得產物,可得2-曱基-2-樟腦醇之標題化合物(產率·· 90%)。 16 593409 b) 合成丙婦酸2·甲基_2_樟腦酯 將上述a)之2'曱基-2-樟腦醇(45.4克,〇·27莫耳) 與三乙胺(44.48毫升,〇 32莫耳)溶於25〇毫升tHf中, 以漏斗緩緩加入丙烯醯氯(26毫升,〇 32莫耳)。之後 在室溫下反應2小時。反應終止後,以旋轉揮發器移除 過量THF,並將產物倒入純水中。之後,以稀鹽酸中 和反應產物,以二乙靆萃取,並以無水硫酸鎂進行乾燥。 以色層層析&柱(正_已烷:乙酸乙酯·· i)來純化所得The definitions of “R, R ,, R * and R” are as above. As shown in Scheme 5 above, the photosensitive copolymer of Formula 4 can be polymerized by n-pinene compound of formula 1 and 6 and maleic anhydride. In addition, as shown in Scheme 6 above, the photosensitive copolymer of Formula 5 can be prepared by polymerizing a compound of Formula 2 and an acrylate compound of Formula 7 and maleic anhydride. All of the above-mentioned photosensitive of Formula 4 and 5 The polymerization of the trimer may include a starting material such as azide bis (isobutyronitrile) (AIBN). The weight-average molecular weight of the obtained photosensitive trimer of the formulae 4 and 5 is 3,000 to 100,000. And the dispersion coefficient is between 1.0 and 5.0. In addition, the present invention also provides a chemically amplified positive photoresist composition for ArF, which comprises one or more polymers selected from the group consisting of: a photosensitive copolymer of formula 3, Photosensitive terpolymer of formula 4 and 1% of phototrimer of formula 5 0 14 593409 One hundred percent more advanced agent Sheng B. Alcohol. Hexyl B-A •• A. System: Lamine is included in the present invention In the positive photoresist composition, the one or more kinds are selected from a photosensitive copolymer of formula 3 and a photosensitive trimer of formula 4 The content of the photosensitive terpolymer polymer of Formula 5 is calculated based on the total weight of the polymer, preferably between 30% by weight, and more preferably between 5% and 8% by weight. Furthermore, the photoresist composition of the present invention comprises a photoacid generator and an agent; if necessary, it can also be prepared by using various additives in combination; preferably, it is based on 100 parts by weight of the total photoresist composition. In other words, the solid concentration is between 20% and 50% of the weight. After that, it is filtered through a 0.2 micron filter and then used. Based on the total polymer weight of 100%, the content of the photoacid is less than It is preferably between 0.5% and 10%. Photoacid generators that can be used are sulfonium salts, organic sulfonic acids, or mixtures thereof. Solvents useful in the present invention include ethylene glycol monomethyl ethyl ether. , Glycol monoethyl ether, ethylene glycol monoethyl ether, diethylene glycol monoethyl ether, propylene glycol monoethyl ether acetate (PGMEA), toluene, xylene, methyl ethyl ketone, cyclic ketone, ethyl 2-hydroxypropionate, 2-hydroxy 2-methyl propionate, ethyl ethoxylate, ethyl hydroxyacetate, 2-hydroxy 3-methyl methyl butyrate, 3-oxy 2-methyl Acetate, Ethyl 3-ethoxypropionate, Ethyl 3-methoxy-2-propionate, Ethyl 3-ethoxypropionate, Ethyl 3-methoxy-2-acetoxypropionate, Ethyl acetate Butyl ester, etc. In addition, the photoresist composition of the present invention may further include an organic base, accounting for about 0.01% to 2.00% by weight. Organic triethylamine, triisobutylamine, and triisooctylamine may be used. , Diethanolamine, triethyl 15 593409, or a mixture thereof. In addition, the present invention can provide a semiconductor device having an excellent pattern, which is obtained by coating the photoresist composition on a silicon wafer or an aluminum substrate by spin coating. A photoresist film is formed on the material, and is prepared through the processes of exposure, development and baking. As the developing solution, a 0.1% to 10% alkaline aqueous solution of a basic compound such as sodium hydroxide, potassium hydroxide, sodium carbonate, and tetramethylammonium hydroxide (TMAH) can be used. In addition, an appropriate amount of a water-soluble organic solvent such as methanol and ethanol, and a surfactant may be used in the developing solution. After development, the photoresist film was washed with ultrapure water. Hereinafter, the present invention will be described by way of examples, but the scope of the present invention is not limited to the following examples. EXAMPLES Example 1-1: Synthesis of (methyl) propanoic acid 2-methyl-2-camphoryl ester (R = fluorenyl) (compound 1) a) Preparation of 2-methyl-2- camphorol at 200 Dilute 210 ml (0.64 mol) of methylmagnesium bromide in diethanol (3.0 M) with anhydrous THF. The solution was poured into a 1 liter flask and maintained at 0 ° C. Camphor (48.7 g, 0.32 mol) was slowly dropped into the above solution through a funnel, and then reacted at room temperature for 2 hours. After the reaction was terminated, excess THF was removed with a rotary volatile, and the reaction product was neutralized with dilute sulfuric acid, extracted with diethyl ether, and dried over anhydrous magnesium sulfate. The obtained product was purified by a chromatography column to obtain the title compound of 2-fluorenyl-2- camphorol (yield: 90%). 16 593409 b) Synthesis of 2-methyl-2- camphoryl valerate The 2 'fluorenyl-2- camphorol (45.4 g, 0.27 mol) of a) above and triethylamine (44.48 mL, 32 mol) was dissolved in 250 ml of tHf, and propylene chloride (26 ml, 032 mol) was slowly added from a funnel. Thereafter, the reaction was carried out at room temperature for 2 hours. After the reaction was terminated, the excess THF was removed with a rotary evaporator and the product was poured into pure water. After that, the reaction product was neutralized with dilute hydrochloric acid, extracted with diethylpyrene, and dried over anhydrous magnesium sulfate. Chromatography & column (n-hexane: ethyl acetate · i) was used to purify the obtained

產物,可得丙婦酸 2田I 甲基-2-樟腦酯之標題化合物(產 率:70%) 〇 c) 合成(曱基)丙烯酸2_甲基·2樟腦酯 除了以甲基丙稀酿氯來代替丙㈣氣外,同上㈣ 之步驟進行製備,可製得(甲基)丙烯酸2-甲基·2-樟腦 酯0 ] 正莰烯-2-羧酴酷 (R =甲基)(化合物2) 將上述實施例1-1 b)所製 丨甸 < 丙烯酸2 -甲基-2-榼 腦酯(35.6克,0.16莫耳)溶於25 笔升丁11卩中,於〇V 下緩緩滴入環戊二烯(31.68 # n , 译担a 士 — 充,〇·48莫耳),之後將溫 度k两至室溫。在室溫下一邊 c ^ 叹欖井,〜邊反應24小時。 反應終止後,以旋轉揮發器 砂除過蕙THF,並真空基 館可得2 -曱基-2-樟腦基正迖、膝1 、 物 人、 、藥酸醋之標題化合 物(產率:70%)。 17 593409 AAtLl-3 :合成(甲基)丙嬌酸2-乙基樟腦酷 基)⑽t物1) 除了以 1.0M之乙基氯化鎂之二乙醚溶液來代替 3 ·0M之甲基氯化鎂之二乙醚溶液外,同上述實施例1 -1 a) 之步驟進行製備,可分別製得丙烯酸2 -乙基-2-樟腦醋 及(曱基)丙烯酸2 -乙基-2-樟腦酯。 :合成 2-乙基-2-蟑腦基正莰烯鉍紿啼 )(化合物2) 除了以實施例1-3之丙烯酸2-乙基-2-樟腦酯來代 替實施例1_1 b)所製備之丙烯酸2-甲基-2-樟腦酯外, 依上述實施例1 -2之步驟進行製備。 童AA 2-1 ··以 2_曱基·2_樟腦某·5_正-获烯_2·羧醢醢辛 聚物(化合物3) 將3 9.4克(0.102莫耳)之實施例1-2之2-甲基-2-樟 腦基-5-正莰烯-2-羧酸酯、1〇·〇克(0.102莫耳)之順丁婦 二酸酐及0.7克之疊氮雙(異丁腈)(ΑΙΒΝ)溶於25克的 THF中,以冷凍法將反應物脫氣。之後於68 °C下進行 ♦合反應24小時。反應終止後,將反應物緩緩地滴入 過量二乙醚中使生成沉澱,再以THF溶解及二乙醚沉 觀’可得共聚物(產率·_ 40%)。 所得共聚物之重量平均分子量及分散係數分別為 8,〇〇〇 及 1.80 〇 18 ft 5翁 593409 實施例 2-2 :以 2-乙基-2-樟腦基-5-正莰烯-2-羧酸酯來 盤備共聚物(化合物3) 除了使用丙烯酸2-甲基-2-樟腦酯及甲基丙烯酸2-曱基-2-樟腦酯外,一由丙烯酸2-甲基-2-樟腦酯或甲基 丙烯酸2-曱基-2-樟腦酯組成之共聚物可依下法進行製 備。 a) 合成三聚物(R=甲基,R3 =氫) 將4 5.4克(0.204莫耳)之實施例1-1之丙烯酸2 -曱 基-2-樟腦酯、14.1克(0.1 02莫耳)之5-正莰烯-2-羧酸、 10.0克之順丁烯二酸酐及0.7克之疊氮雙(異丁腈)(AIBN) 溶於50克的無水THF中,以冷凍法將反應物脫氣。之 後於6 8 °C下進行聚合反應24小時。反應終止後,將反 應物緩緩地滴入過量二乙醚中使生成沉澱,再以 THF 溶解及二乙醚沉澱,可得三聚物(產率:40%)。 所得三聚物之重量平均分子量及分散係數分別為 7.000 及 1.80 ° b) 合成三聚物(R=曱基,R3 =經基乙基) 除了使用2-羥基乙基-5-正莰烯-2-羧酸酯來代替5-正莰烯-2-羧酸外,依實施例3-1之步驟製備三聚物。 所得三聚物之重量平均分子量及分散係數分別為 8.000 及 1.80 ° c) 合成三聚物(R=曱基,R3=曱基) 除了使用曱基-5-正莰烯-2-羧酸酯來代替 5-正莰烯 •2-羧酸外,依實施例3-1之步驟製備三聚物。 19 593409 所得三聚物之重量平均分子量及分散係數分別為 8.000 A 1.80 〇 實施例3-2 :合成三聚物(R=乙基)(化合物4) 除了使用丙烯酸2-乙基-2-樟腦酯及甲基丙烯酸2-乙基-2-樟腦酯外,一由丙烯酸2-乙基-2-樟腦酯或甲基 丙烯酸2-乙基-2-樟腦酯組成之共聚物可依下法進行製 備。 a) 合成三聚物(R=曱基,R3 =氫) 除了使用實施例 1-3之甲基丙烯酸2-乙基-2-樟腦 酯來代替甲基丙烯酸2-甲基-2-樟腦酯外,依實施例 3-1之步驟製備三聚物 所得三聚物之重量平均分子量及分散係數分別為 6,500 及 1.80。 b) 合成三聚物(R=乙基,R3 =羥基乙基) 除了使用2-羥基乙基-5-正莰烯-2-羧酸酯來代替5-正莰烯-2-羧酸外,依實施例3-2 a)之步驟製備三聚物。 所得三聚物之重量平均分子量及分散係數分別為 8.000 及 1.80。 c) 合成三聚物(R=乙基,R3=甲基) 除了使用曱基-5 -正莰烯-2-羧酸酯來代替 5 -正莰烯 -2-羧酸外,依實施例3-2 a)之步驟製備三聚物。 所得三聚物之重量平均分子量及分散係數分別為 8.000 及 1.80» 20 593409 實施例4-1 :合成三聚物(化合物5) a) 合成三聚物(R=甲基,R3=氫) 將29.4克(0.102莫耳)之實施例1-2之2 -曱基-2-樟 腦基-5-正莰烯-2-羧酸醋、0.44克(0·005莫耳)之甲基丙 烯酸、10.0克(0.102莫耳)之順丁烯二酸酐及0.7克之 疊氮雙(異丁腈)(ΑΙΒΝ)溶於25克的無水THF中,以冷 凍法將反應物脫氣。之後於68 °C下進行聚合反應24小 時。反應終止後,將反應物緩緩地滴入過量二乙醚中使 生成沉澱,再以THF溶解及二乙醚沉澱,可得三聚物(產 率·· 40%)。 所得三聚物之重量平均分子量及分散係數分別為 8,500 及 1.80。 b) 合成三聚物(R=甲基,R3 =羥基乙基) 除了使用甲基丙烯酸2-羥基乙酯來代替甲基丙烯 酸外,依實施例4-1 a)之步驟製備三聚物。 所得三聚物之重量平均分子量及分散係數分別為 8.000 A 1.80。 c) 合成三聚物(R=曱基,R3=甲基) 除了使用曱基丙烯酸甲酯來代替曱基丙烯酸外,依 實施例4-1 a)之步驟製備三聚物。 所得三聚物之重量平均分子量及分散係數分別為 8.000 A 1.80° 實施例 4-2 » 合成三聚物(化合物 5) 544 21 593409 a) 合成三聚物(R=乙基,R3 =氫) 除了以實施例1-4之2 -乙基-2-樟腦基-5-正莰烯-2-羧酸酯來代替2-甲基-2-樟腦基-5-正莰烯-2-羧酸酯外, 依實施例4-1 a)之步驟製備三聚物 所得三聚物之重量平均分子量及分散係數分別為 8.500 A 1.80。 b) 合成三聚物(R=乙基,R3 =羥基乙基) 除了使用曱基丙烯酸2 -羥基乙酯來代替甲基丙烯 酸外,依實施例4-2 a)之步驟製備三聚物。 所得三聚物之重量平均分子量及分散係數分別為 8.500 及 1.80 〇 c) 合成三聚物(R=乙基,R3=甲基) 除了使用甲基丙烯酸曱酯來代替曱基丙烯酸外,依 實施例4-2 a)之步驟製備三聚物。 所得三聚物之重量平均分子量及分散係數分別為 8.500 A 1.80。 實施例5 :製備光阻組合物 將20克實施例2-1之共聚物及0.02克之三苯锍三 佛得(triphenyl sulfonium triflate)(TPS-1 05)完全溶於 1 7 克的丙二醇單甲醚乙酸酯(PGME A)中。以0.2微米之碟 形濾器過濾溶液可得一光阻溶液。之後,將該光阻溶液 塗佈於經六曱基二矽烷(HMDS)處理過之矽晶圓上,厚 度約0.3 0微米。 Γ>4'7 22 593409 將已塗佈該光阻溶液之矽晶圓於11 0°C下預烘烤90 秒,並以孔徑值為0.60之入”激光雷射曝光。之後, 於130°C下進行曝光後烘烤90秒。The product can be obtained as the title compound of 2-propionate 2-methyl-2-camphoryl ester (yield: 70%). 〇c) Synthesis of (methyl) acrylic acid 2-methyl · 2 camphoryl ester except methyl propyl Chlorine is used instead of propane gas, and the same process as above is used to prepare 2-methyl · 2-camphoryl (meth) acrylate 0] n-pinene-2-carboxyfluorene (R = methyl) (Compound 2) The above-prepared example 1-1 b) above was dissolved in 25 liters of dibutyl cyanide (35.6 g, 0.16 mol) in Slowly drip cyclopentadiene (31.68 # n, translator a charge — 0.48 mol) at V, then increase the temperature k to room temperature. At room temperature, the reaction takes place for 24 hours. After completion of the reaction, the THF was removed by rotary volatile sand, and the title compound of 2-fluorenyl-2-camphoryl stilbene, knee 1, phytosanitary, and vinegar was obtained in a vacuum base (yield: 70 %). 17 593409 AAtLl-3: Synthesis of (methyl) propanoic acid 2-ethylcamphoryl) 1) Except the use of 1.0 M ethyl magnesium chloride in diethyl ether instead of 3.0 M methyl magnesium chloride in diethyl ether The solution was prepared in the same manner as in the above Example 1 -1 a), and 2-ethyl-2-camphor acrylate and 2-ethyl-2-camphor acrylate (fluorenyl) acrylate could be prepared separately. : Synthesis of 2-ethyl-2-carnosyl-n-pinenebismuth (Compound 2), except that the 2-ethyl-2-camphoryl acrylate of Example 1-3 was used in place of Example 1_1 b) In addition to 2-methyl-2-camphoryl acrylate, it was prepared according to the procedure of Example 1-2 above. Child AA 2-1 ·· 2-fluorenyl · 2_ camphor some 5-n-acrylene 2 · carboxyl octyl polymer (compound 3) Example 1 of 3 9.4 g (0.102 mole) -2 of 2-methyl-2-camphoryl-5-n-pinene-2-carboxylic acid ester, 10.0 g (0.102 mole) of maleic anhydride and 0.7 g of azidobis (isobutyl) Nitrile) (AIBN) was dissolved in 25 g of THF and the reaction was degassed by freezing. Thereafter, the reaction was carried out at 68 ° C for 24 hours. After the reaction was terminated, the reactant was slowly dropped into an excessive amount of diethyl ether to form a precipitate, which was then dissolved in THF and diethyl ether was precipitated to obtain a copolymer (yield 40%). The weight average molecular weight and dispersion coefficient of the obtained copolymer were 8,000 and 1.80 ft. 5 von 593409. Example 2-2: 2-ethyl-2-camphoryl-5-n-pinene-2- Carboxylic acid ester copolymer (Compound 3) In addition to 2-methyl-2-camphor acrylate and 2-fluorenyl-2-camphor methacrylate, 2-methyl-2-camphor acrylate A copolymer composed of an ester or 2-fluorenyl-2-camphoryl methacrylate can be prepared according to the following method. a) Synthesis of a trimer (R = methyl, R3 = hydrogen) 4 5.4 g (0.204 mole) of the 2-acryl-2-camphoryl acrylate of Example 1-1, 14.1 g (0.1 02 mole) ) Of 5-n-pinene-2-carboxylic acid, 10.0 g of maleic anhydride and 0.7 g of azidobis (isobutyronitrile) (AIBN) were dissolved in 50 g of anhydrous THF, and the reaction was removed by freezing. gas. Thereafter, polymerization was carried out at 68 ° C for 24 hours. After the reaction was terminated, the reaction product was slowly dropped into an excess of diethyl ether to form a precipitate, which was then dissolved in THF and precipitated with diethyl ether to obtain a trimer (yield: 40%). The weight average molecular weight and dispersion coefficient of the obtained terpolymers are 7.000 and 1.80 °, respectively. B) Synthetic terpolymers (R = fluorenyl, R3 = transylethyl) except for using 2-hydroxyethyl-5-n-pinene- A trimer was prepared according to the procedure of Example 3-1 except that 2-carboxylic acid ester was used instead of 5-n-pinene-2-carboxylic acid. The weight average molecular weight and dispersion coefficient of the obtained terpolymer are 8.000 and 1.80 ° c) Synthetic terpolymer (R = fluorenyl group, R3 = fluorenyl group) Except using fluorenyl-5-n-pinene-2-carboxylic acid ester Instead of 5-n-pinene • 2-carboxylic acid, a terpolymer was prepared according to the procedure of Example 3-1. 19 593409 The weight average molecular weight and dispersion coefficient of the terpolymer obtained are 8.000 A 1.80. Example 3-2: Synthetic trimer (R = ethyl) (Compound 4) In addition to using 2-ethyl-2-camphor acrylic acid Ester and 2-ethyl-2-camphoryl methacrylate, a copolymer composed of 2-ethyl-2-camphoryl acrylate or 2-ethyl-2-camphoryl methacrylate can be carried out according to the following method preparation. a) Synthesis of a trimer (R = fluorenyl, R3 = hydrogen) except that 2-ethyl-2-camphoryl methacrylate was used in place of 2-methyl-2-camphoryl methacrylate in Example 1-3 In addition, the weight average molecular weight and dispersion coefficient of the terpolymer obtained by preparing the terpolymer according to the procedure of Example 3-1 were 6,500 and 1.80, respectively. b) Synthesis of trimer (R = ethyl, R3 = hydroxyethyl) except that 2-hydroxyethyl-5-n-pinene-2-carboxylic acid ester is used instead of 5-n-pinene-2-carboxylic acid According to the procedure of Example 3-2 a), a trimer is prepared. The weight average molecular weight and dispersion coefficient of the obtained terpolymer were 8.000 and 1.80, respectively. c) Synthesis of trimer (R = ethyl, R3 = methyl) Except using 5-methyl-n-pinene-2-carboxylic acid ester instead of 5-n-pinene-2-carboxylic acid, according to the examples Step 3-2 a) to prepare a trimer. The weight average molecular weight and dispersion coefficient of the obtained terpolymer are 8.000 and 1.80 »20 593409, respectively. Example 4-1: Synthesis of a trimer (Compound 5) a) Synthesis of a trimer (R = methyl, R3 = hydrogen) 29.4 grams (0.102 moles) of Example 1-2 2-fluorenyl-2-camphoryl-5-n-pinene-2-carboxylic acid vinegar, 0.44 grams (0.05 moles) of methacrylic acid, 10.0 g (0.102 mole) of maleic anhydride and 0.7 g of azidobis (isobutyronitrile) (AIBN) were dissolved in 25 g of anhydrous THF, and the reaction was degassed by freezing. The polymerization was then carried out at 68 ° C for 24 hours. After the reaction was terminated, the reactant was slowly dropped into an excess of diethyl ether to form a precipitate, which was then dissolved in THF and precipitated with diethyl ether to obtain a trimer (yield 40%). The weight average molecular weight and dispersion coefficient of the obtained terpolymer were 8,500 and 1.80, respectively. b) Synthesis of a trimer (R = methyl, R3 = hydroxyethyl) In addition to using 2-hydroxyethyl methacrylate instead of methacrylic acid, the trimer was prepared according to the procedure of Example 4-1 a). The weight average molecular weight and dispersion coefficient of the obtained terpolymer were 8.000 A and 1.80, respectively. c) Synthesis of trimer (R = fluorenyl, R3 = methyl) Except using fluorenyl methyl acrylate instead of fluorenyl acrylic acid, the terpolymer was prepared according to the procedure of Example 4-1 a). The weight average molecular weight and dispersion coefficient of the obtained terpolymer were 8.000 A 1.80 ° Example 4-2 »Synthetic trimer (Compound 5) 544 21 593409 a) Synthetic trimer (R = ethyl, R3 = hydrogen) Except replacing 2-methyl-2-camphoryl-5-n-pinene-2-carboxylate with 2-ethyl-2-camphoryl-5-n-pinene-2-carboxylic acid ester of Example 1-4 Except for the acid ester, the weight average molecular weight and dispersion coefficient of the terpolymer obtained by preparing the terpolymer according to the procedure of Example 4-1 a) were 8.500 A and 1.80, respectively. b) Synthesis of trimer (R = ethyl, R3 = hydroxyethyl) Except using 2-hydroxyethyl fluorenyl acrylate instead of methacrylic acid, the trimer was prepared according to the procedure of Example 4-2 a). The weight average molecular weight and dispersion coefficient of the obtained terpolymers are 8.500 and 1.80, respectively. C) Synthetic terpolymers (R = ethyl, R3 = methyl). Except using methacrylic acid ester instead of methacrylic acid, according to the implementation The procedure of Example 4-2 a) produces a trimer. The weight average molecular weight and dispersion coefficient of the obtained terpolymer were 8.500 A and 1.80, respectively. Example 5: Preparation of a photoresist composition 20 g of the copolymer of Example 2-1 and 0.02 g of triphenyl sulfonium triflate (TPS-1 05) were completely dissolved in 17 g of propylene glycol monomethyl Ether acetate (PGME A). Filter the solution through a 0.2 micron dish filter to obtain a photoresist solution. After that, the photoresist solution was coated on a silicon wafer treated with hexamethylene disilane (HMDS) to a thickness of about 0.30 micrometers. Γ> 4'7 22 593409 The silicon wafer on which the photoresist solution has been applied is pre-baked at 110 ° C for 90 seconds, and the laser beam is exposed with an aperture of 0.60 ". Then, it is exposed at 130 ° Post-exposure bake at 90 ° C.

之後,以 2.3 8 % (重量百分比)之四甲基氫氧化銨 (TMAH)溶液將產物顯影 30秒。結果,當曝光係以 20 毫焦耳/平方公分之能量進行時,可獲得一線寬約 0.1 3 微米之長方形光阻圖案。本發明共聚物可降低對聚矽之 蝕刻速率約20%,因此,相較於傳統COMA,表現出較 佳的抗蝕刻性。 實施例6 :製備光阻組合物 將20克實施例3-1之三聚物及0.02克之三苯锍三 佛得(triphenyl sulfonium triflate)(TPS-105)完全溶於 17 克的丙二醇單甲醚乙酸酯(PGME A)中。同實施例5之步 驟製備光阻溶液。長方形光阻圖案之線寬約0.1 2微米。Thereafter, the product was developed with a 2.38% (wt%) solution of tetramethylammonium hydroxide (TMAH) for 30 seconds. As a result, when the exposure is performed with an energy of 20 mJ / cm², a rectangular photoresist pattern with a line width of about 0.1 3 microns can be obtained. The copolymer of the present invention can reduce the etching rate to polysilicon by about 20%. Therefore, compared with the conventional COMA, it exhibits better etching resistance. Example 6: Preparation of a photoresist composition 20 grams of the terpolymer of Example 3-1 and 0.02 grams of triphenyl sulfonium triflate (TPS-105) were completely dissolved in 17 grams of propylene glycol monomethyl ether Acetate (PGME A). The same procedure as in Example 5 was used to prepare a photoresist solution. The line width of the rectangular photoresist pattern is about 0.1 2 microns.

實施例7 :製備光阻組合物 將20克實施例4-1之三聚物及0.02克之三苯锍三 佛得(triphenyl sulfonium triflate)(TPS-105)完全溶於 17 克的丙二醇單曱醚乙酸酯(PGME A)中。同實施例5之步 驟製備光阻溶液。長方形光阻圖案之線寬約0.1 2微米。 上述實施例5-7及前述COMA型式光阻之光敏度、 解析度及圖案形狀示於下表1。此外,實施例7及前技 之COMA光阻圖案則分別示於第1圖及第2圖。此外, 23 593409 第3圖及第4圖分別顯示以實施例5至7及前技COM A 型光阻對氧化物及聚合物之抗蝕刻性。 表1 光敏度 解析度 圖案形狀 (亳焦耳/平方公分) (微米) 實施例5 20 0.13 長方形 _實施例6 21 0.12 長方形 實施例7 18 0.12 長方形 前技COMA 25 0.14 變窄 從表1及第1-4圖可知,相較於前技COMA型光 阻’本發明光阻具有極佳的長方形圖案形狀,同時對氧 化物及聚合物具有極佳之抗蝕刻性。 如上述,本發明可提供一共聚物或三聚物,其係使 用新穎之(甲基)丙烯酸化合物或正莰烯羧酸酯化合物來 製備’該新穎之(甲基)丙烯酸化合物或正莰烯羧酸酯化 合物係具有一與樟腦基連接之側基團;且該共聚物或三 聚物可提供一可使用ArF之化學放大正光阻組合物, 藉由使用該聚合物可使其具有極佳的高解析度及抗蝕刻 性’並因而可獲得極佳的光阻圖案。 【圖式簡單說明】 第1圖顯示本發明實施例7的光阻圖案。 β44' 24 593409 第2圖顯示一前技COMA型光阻的圖案結果。 第3圖顯示本發明實施例5至7之氧化物的抗蝕刻 性結果。 第4圖顯示前技聚COMA型光阻的抗蝕刻性結果。 fyM% 25Example 7: Preparation of a photoresist composition 20 grams of the terpolymer of Example 4-1 and 0.02 grams of triphenyl sulfonium triflate (TPS-105) were completely dissolved in 17 grams of propylene glycol monofluorenyl ether Acetate (PGME A). The same procedure as in Example 5 was used to prepare a photoresist solution. The line width of the rectangular photoresist pattern is about 0.1 2 microns. The photosensitivity, resolution, and pattern shape of the above-mentioned Examples 5-7 and the aforementioned COMA type photoresist are shown in Table 1 below. In addition, the COMA photoresist patterns of Example 7 and the prior art are shown in Fig. 1 and Fig. 2, respectively. In addition, Figures 3 and 4 of 23 593409 show the etching resistance of oxides and polymers with Examples 5 to 7 and the prior art COM A type photoresist. Table 1 Photosensitivity resolution pattern shape (亳 Joules / cm²) (microns) Example 5 20 0.13 Rectangular_Example 6 21 0.12 Rectangular Example 7 18 0.12 Rectangular front technology COMA 25 0.14 Narrowing from Tables 1 and 1 As can be seen from the figure -4, compared with the prior art COMA type photoresist, the photoresist of the present invention has an excellent rectangular pattern shape, and at the same time has excellent resistance to etching of oxides and polymers. As described above, the present invention can provide a copolymer or terpolymer which is prepared by using a novel (meth) acrylic compound or n-pinene carboxylate compound. The carboxylate compound has a pendant group connected to the camphor group; and the copolymer or terpolymer can provide a chemically amplified positive photoresist composition that can use ArF. By using the polymer, it can have an excellent photoresist composition. High resolution and etch resistance 'and thus can obtain excellent photoresist patterns. [Brief description of the drawings] FIG. 1 shows a photoresist pattern according to Embodiment 7 of the present invention. β44 '24 593409 Figure 2 shows the pattern results of a prior art COMA photoresist. Figure 3 shows the results of the etching resistance of the oxides of Examples 5 to 7 of the present invention. Figure 4 shows the results of the etching resistance of the previous poly COMA photoresist. fyM% 25

Claims (1)

593409593409 弟巧"弘说號專利案%年3月修正‘ 拾、申請專利範圍 1· 一種式1之(甲基)丙烯酸2-烷基-2-樟腦酯化合物,Brother Qiao's "Hong" patent case amended in March ‘pick up and apply for patent scope 1. A 2-alkyl-2-camphoryl (meth) acrylate compound of formula 1, 其中R是一甲基或乙基,且R*為氫或一曱基基團。Where R is a methyl or ethyl group and R * is hydrogen or a fluorenyl group. 2· —種製備申請專利範圍第1項之(甲基)丙烯酸2-烷基-2-樟腦酯之式1化合物的方法,其至少包含以下步驟: a)讓樟腦與一烧基格那試劑(alkyl grinard reagent) 或院基鐘試劑(alkyl lithium reagent)反應,來製 備2-烷基-2-樟腦醇;及 b)讓前述製備之2-烷基-2-樟腦醇與(甲基)丙烯醯氯 反應。 3. 一種式2之2-烷基-2-樟腦基-5-正莰烯-2-羧酸酯化合 物, 262. · A method for preparing a compound of formula 1 with 2-alkyl-2-camphoryl (meth) acrylate in the first patent application scope, which comprises at least the following steps: a) let camphor and monokidna reagent (Alkyl grinard reagent) or alkyl lithium reagent to produce 2-alkyl-2-camphorol; and b) the aforementioned 2-alkyl-2-camphorol and (methyl) Propylene and chlorine react. 3. A 2-alkyl-2-camphoryl-5-n-pinene-2-carboxylic acid ester compound of formula 2, 26 593409 其中 R是一曱基或乙基,且R*為氫或一甲基基團。593409 where R is monomethyl or ethyl, and R * is hydrogen or a methyl group. 4. 一種製備申請專利範圍第3項之2-烷基-2-樟腦基-5-正莰烯-2-羧酸酯之式2化合物的方法,其係藉由讓申 請專利範圍第1項之(曱基)丙烯酸2-烷基-2-樟腦酯之 式 1化合物與環戊二烯進行迪氏-亞達反應(Diels-Alder)所製備而成的。 5. —種式3之光敏共聚物,4. A method for preparing a compound of formula 2 with 2-alkyl-2-camphoryl-5-n-pinene-2-carboxylic acid ester in item 3 of the scope of patent application, which is obtained by allowing item 1 in the scope of patent application (Methyl) 2-alkyl-2-camphoryl acrylate is prepared by a Diels-Alder reaction with cyclopentadiene. 5. —photosensitive copolymer of type 3, 其中 R是一曱基或乙基,R*為氫或一曱基基團,且 27 593409 η係介於25至30間的整數。 6. —種製備申請專利範圍第5項之式3光敏共聚物的方 法,其係包含讓申請專利範圍第3項之式2化合物與 順丁烯二酸酐聚合之步驟。Wherein R is a monomethyl group or an ethyl group, R * is a hydrogen or a monomethyl group, and 27 593409 η is an integer between 25 and 30. 6. A method for preparing a photosensitive copolymer of formula 3 in the scope of the patent application, which comprises the step of polymerizing a compound of formula 2 in the scope of the patent application, and maleic anhydride. 其中R是一曱基或乙基;R*為氫或一甲基基團;R’是 氫、一烷基或一羥基烷基;R”是氫或一甲基基團;且m 與η分別滿足m + n= l,0.1<m<0.9且0·1<η<0·9之條件。Where R is a methyl group or an ethyl group; R * is hydrogen or a methyl group; R 'is hydrogen, an alkyl group, or a hydroxyalkyl group; R "is hydrogen or a methyl group; and m and η The conditions of m + n = 1, 0.1 < m < 0.9 and 0 · 1 < η < 9 · 9 are satisfied, respectively. 8. —種製備申請專利範圍第7項之式4光敏三聚物的方 法,其係包含讓申請專利範圍第1項之式1化合物與 順丁烯二酸酐及下列式 6之正莰烯化合物聚合之步 驟: 288. A method for preparing a photosensitive terpolymer of the formula 4 in the scope of the patent application, which comprises allowing the compound of the formula 1 in the scope of the patent application and the maleic anhydride and the n-pinene compound of the following formula 6 Aggregation steps: 28 593409 其中 R’是氫、一烷基或一羥基烷基;且R”是氫或一 曱基基團。 9. 一種式5之光敏三聚物,593409 wherein R 'is hydrogen, an alkyl group, or a hydroxyalkyl group; and R "is hydrogen or a fluorenyl group. 9. A photosensitive trimer of Formula 5, 其中R是一曱基或乙基;R*為氫或一甲基基團;R’是 氫、一烷基或一羥基烷基;R”是氫或一甲基基團;且m 與η分別滿足m + n=l,0.1<m<0.9且0.1<n<0.9之條件。 1 〇· —種製備申請專利範圍第9項之式5光敏三聚物的方 法,其係包含讓申請專利範圍第3項之式2化合物與 順丁烯二酸酐及下列式7之丙烯酸酯化合物聚合之步 驟: 29 593409 R"Where R is a methyl group or an ethyl group; R * is hydrogen or a methyl group; R 'is hydrogen, an alkyl group, or a hydroxyalkyl group; R "is hydrogen or a methyl group; and m and η Meet the conditions of m + n = 1, 0.1 < m < 0.9 and 0.1 < n < 0.9 respectively. 1 〇-a method for preparing a photosensitive terpolymer of formula 5 in the ninth item of the scope of patent application, which comprises Step of polymerizing a compound of formula 2 with maleic anhydride and an acrylate compound of formula 7 below in the scope of patent application: 29 593409 R " 其中 R’是氫、一烷基或一羥基烷基;且R”是氫或一 曱基基團。Wherein R 'is hydrogen, a monoalkyl group or a hydroxyalkyl group; and R "is a hydrogen or a fluorenyl group. 1 1 · 一種供 ArF使用之化學放大正光阻組合物,其至少包 含一或多種選自由式3之光敏共聚物、式4之光敏三 聚物及式5之光敏三聚物所組成之聚合物中:1 1 · A chemically amplified positive photoresist composition for ArF, comprising at least one or more polymers selected from the group consisting of a photosensitive copolymer of Formula 3, a photosensitive trimer of Formula 4, and a photosensitive trimer of Formula 5 in: 3030 593409 其中R是一曱基或乙基;R*為氫或一甲基基團;R’是 氫、一烷基或一羥基烷基;R”是氫或一曱基基團;且m · 與η分別滿足m + n=l,0.1<m<0.9且0·1<η<0·9之條件。 1 2 ·如申請專利範圍第 11項之化學放大正光組組合物, 其特徵是該聚合物之含量佔總組成物重量之1 %至3 0% · 間(重量百分比)。 1 3 .如申請專利範圍第11項之化學放大正光組組合物, ' 其特徵是該光阻組合物更包含一光酸產生劑,該光酸 產生劑之含量約為總聚合物重量之0.5%至10%間(重 ® 量百分比)。 14 ·如申請專利範圍第 1 3項之化學放大正光組組合物, - 其特徵是該光酸產生劑係選自由鑌鹽、有機磺酸、或 , 其之混合物所組成之群組中。 1 5.如申請專利範圍第11項之化學放大正光組組合物, 31 593409 其特徵是該光阻組合物更包含一有機鹼,該有機鹼係 選自三乙胺、三異丁胺、三異辛胺、二乙醇胺、三乙 醇胺或其之混合物;且該有機鹼之用量為總聚合物重 量之0.01%至2.00%間(重量百分比)。593409 wherein R is a fluorenyl or ethyl group; R * is hydrogen or a methyl group; R 'is hydrogen, an alkyl group, or a hydroxyalkyl group; R "is hydrogen or a fluorenyl group; and m · And η satisfy the conditions of m + n = 1, 0.1 < m < 0.9 and 0 · 1 < η < 0 · 9, respectively. 1 2 · The chemically amplified positive light group composition according to item 11 of the patent application scope, which is characterized in that The content of the polymer is from 1% to 30% by weight (% by weight) of the total composition. 1 3. If the chemically amplified positive light composition of the scope of the patent application No. 11 is applied, the feature is the photoresist combination The product further contains a photoacid generator, the content of the photoacid generator is about 0.5% to 10% of the total polymer weight (% by weight). 14 · Chemically amplified positive light as described in item 13 of the scope of patent application Composition,-characterized in that the photoacid generator is selected from the group consisting of a phosphonium salt, an organic sulfonic acid, or a mixture thereof. 1 5. The chemically amplified positive light group according to item 11 of the scope of patent application Composition, 31 593409, characterized in that the photoresist composition further comprises an organic base, the organic base is selected from triethylamine Triisobutylamine, tri-iso-octylamine, diethanolamine, triethanolamine, or the mixtures thereof; and the amount of the organic base is between 0.01 to 2.00 percent by weight of the total polymer (wt%). 3232
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