TWI222696B - Defect analysis sampling control system and method - Google Patents

Abstract

Defect analysis sampling control system and method are provided. They comprise a basic setup module, batch setup module and predictive module of an under-processing product. The basic setup module and batch setup module are used for different product types to select the corresponding sampling rules and set up the sampling rule of each batch. Then match up the predictive module of an under-processing product to record all under-processing products to provide the product status and progress check. Therefore, this invention can resolve the difficulty of traditional defect analysis sampling control and reflect the product diversity. The sample rule control and adjustment of each product are more easy and simple. The sampling rule implementation is also more flexible.

Description

V. Description of the invention (1) [Technical field to which the invention belongs]

System) and = Singling Control in various product sampling rules =; = = = [Previous technology] 7 Sampling control systems and methods. Press, because semiconductor factories have to go through semiconductor products hundreds of times. The equipment and manpower are huge, and the production, especially when the size of the semiconductor: process can be completed, the product will naturally be relatively reduced, so it is necessary to connect j 'to its defect tolerance ratio to the defect ratio, so at half i = f product yield, It is necessary to try to reduce the importance. In the rich conductor process, the defect analysis appears to be particularly important. The sampling control system plays a very important role, but due to the different technical processes in yield control in f, coupled with production technology Sampling with manufacturing technology products ::::::: Health: The product is multi-affiliated. The adjustment of the sampling rules for each level is very complicated and difficult to follow for a certain product. Σσ The control and adjustment are obvious. In the case of the analysis of the defects, the sampling control product variety is diversified! :: Jiu: Processing rules and conditions in the foundry , Resulting in a lack of knowledge: 2: Two "products with different extraction and control even more inadequate and difficult. Because = adjustment analysis of the knife analysis sampling control system 'proposed-a kind of defect analysis extraction" system; Page 5. Description of the invention (2) Serving the above-mentioned shortcomings [Summary of the invention] The system and method, its transmission = two = is to provide a defect analysis sampling control system rules, and then choose the same product as the C and select the individual Knowledge defect analysis sampling control: = Regulations and adjustments to solve problems. J's difficulties, and make the setting of sampling rules more flexible and the moon sink analysis sampling control system i various + selection of sampling rules for conductor products, and simplify related ; Determination :: 统, i, ί, and ϊ ϊ ϊ ί 的: ί ΐ supply-species analysis of each batch of defect control; product prediction model •, can predict and control the state of a specific product Γ ^ In order to achieve the above-mentioned purpose, the present invention includes a beauty ... It is to perform basic setting steps in order to include = 7, and, according to different semiconductor products, select settings :; == Set step , With regard to the batch-person of the product & choose § and the corresponding batch sampling rules; and use a ί :: ϊίΓΓΠ ongoing product information and information to provide users to view the status of any product In addition, the content of the sampling rules set by the model f is established—the rules: set; i and the batch sampling rules are established according to the batch setting branch group—the batch setting list izzzoyo V. Description of the invention (3) Bottom With the help of specific examples and the accompanying drawings, it is easy to understand the purpose of the present invention, and the detailed description of the # diagram will be more effective. The technique # 内 谷, features, and the work achieved [Embodiment] The defects proposed by the present invention The analysis and sampling control can be based on different products and can be set to control and adjust the sampling rules of each product *, so that when the sample is further diversified, it can still quickly 'the factory is facing processed products 4K, am φ ^ ν ^ It is convenient to carry out sampling and testing flow of products to solve the problem of white-out defects analysis, and the setting of control is more flexible. The sub-sampling rule j First = The second block structure of the defect analysis sampling control system of the present invention is shown in the figure. The defect analysis sampling control system 10 includes a basic weight module (Ba% settlng) module 12, which The basic setting steps are performed so as to hold all the internal rules of the grip type, φ price, and step planting-u: In the formula, the relative product sampling rules are selected according to the different semiconductor products; and there is-batch determination (L〇 t setting) module 14 performs a batch setting step, which is to select and set a corresponding batch sampling rule for the batch of products of the basic setting module 12; and use a work in process forecast (WIP Predictio) Module 16, which records all ongoing product information, and records the priority order and tool information 'to provide users to view the status and progress of any product, so that users have a comprehensive treatment of related products. After Yuancheng ’s basic settings: selection of group 12 and batch setting module 14, according to the sampling rules set by the basic setting module 12

Page 7 1222696 V. Description of the invention (4) A Rule Setting List 18 can be established for viewing a sampling rule for a specific product, and the product is recorded in the rule setting list 1 8 The previous setting, modification time and modification of the sampling rule, this function design can make the modification of the sampling rule have traceability; and according to the batch sampling rule set by the batch setting module 14 Create a batch setting list (Lot Setting List) 20 to view the sampling rules of a batch of products, and this batch setting list 20 records the previous sampling rule setting, modification time, and modifier of the product This function is designed to make the modification of the sampling rules traceable. In addition, the batch setting list 20 is provided with corresponding remarks to facilitate relevant users to understand the reason for the change of the sampling rules for a batch of products. In particular, for the setting steps performed by the core set 12 and the batch setting module 14, these two settings are set to select different sampling rules for different types of products and batches, so they are internally set. The contents of all the rules are very important. The detailed steps of the basic setting module 12 and batch setting module 14 are described below. First, as far as the basic setting module 12 is concerned, this basic setting step is generally to select the product lot number and wafer identification code (W afer I d) to set the sampling rule. 'Please also refer to the second figure, the basic setting module Sampling rule setting first selects the product type as in step S10, which includes options for selecting the semiconductor product type, component specifications, batch number, and process technology. Then, in step S12, it is selected whether to perform a baseline review, which can collect baseline data for a specific product or a specific level, so as to indicate that the knife production line is not in the control range (〇ut control, 〇〇C). Of

Page 8 1222696 V. Description of the Invention (5), which provides flexibility in data collection and specifically marks it. f. As shown in step s 丨 4, set which detection machine to perform the detection & ^ k / The selection of the machine is more flexible and flexible. For example, in step s 16, determine the lot priority of products that do not need to be tested in order to facilitate the sampling control of products with different priorities. Then, set whether to perform Automatic Defect Classificat (ADC), as in step S18, it is to choose whether to perform the optical microscope automatic defect classification system (OM ADC) or the sub-mirror automatic defect classification (SEMm), This step \ = ^ enables the electricity consumer to obtain information on whether the product is performing automatic defect classification. Finally, the default value of the wafer identification code is set as shown in step S20, which selects the relative wafer identification code according to different products to provide different inspection machines with a uniform standard for the sampled wafer identification code. Among them, the order of all the setting steps in the above steps S10 to S20 can be flexibly changed according to the user's needs or preferences, and it is not necessary to refer to the above-mentioned process sequence.疋 As far as the batch setting module is concerned, this batch setting step is generally to select the wafer ID (Wafer ID) to set the sampling rules. The sub-sampling rule setting is to select the product batch and its related data and manufacturing process as in step 1 S 3 0; then proceed to step s 3 2 to set whether to perform baseline recheck, step S34 to set the required detection ^ a, and step S36 to set whether Carry out automatic defect classification; finally, as shown in the step, you can add other instructions in the remarks column for the convenience of relevant users.

Page 9 1222696 Jade, invention description (6) " to get the reason for the change in the sampling specifications of the batch of products. The sequence of performing steps s30 to step S38 can also be changed according to the needs of the user or with good flexibility. [[Since the details of steps S32 to S36 'are the same as the basic setting steps of § and other steps, please refer to the foregoing description, so the invention is not used here to use a sampling rule for basically setting various semiconductor products. The prediction and control of the production process of a WIP prediction module is used again. Therefore, the present invention can indeed solve the diversity of conventional Yingying products, make each product simple, and set the sampling rules. The only point is that its purpose is to familiarize yourself with this technique and implement it accordingly. When it cannot be covered by the spirit disclosed by the present invention, it is within the scope of the patent of the present invention. [Simplified description of drawing numbers] The setting module and batch setting module provide selection ’and simplify related setting functions. Progress for each batch of a specific product to truly grasp the status of each product. Due to the difficulty of sampling control for defect analysis, the control and adjustment of sampling rules for products are more flexible. I. Those who explain the technical ideas and special features of the present invention can understand the scope of the present invention, and the scope or scope of the invention, namely, the changes and modifications of the masterpiece, should still be covered.

Page 10 1222696 Brief description of the diagram The first diagram is a block diagram of the present invention. The second figure is a schematic diagram of the setting steps of the basic setting module of the present invention. The third figure is a schematic diagram of the setting steps of the batch setting module of the present invention. 1·

Claims (1)

1222696 VI. Scope of patent application 1 · A kind of defect analysis sampling control system, a basic setting module, which is too small. According to different semiconductor products! In all the rule modes set, set the module and pin according to-batch; =; 2 pairs of sampling rules; and choose to set the batch-work in progress prediction module of the product paired with 瘅 ^ 疋 module; Then you can record all the products in 2 and ππ 杏 丁 11 β β //, and use k for viewing 4 products. Status and progress of the mouth. For example, the patent application scope of the first jg zone, +, n, φ ^ ^ # head, | ^, and the defect analysis sampling control system further includes a-regulation acceptance list, which is determined according to the content of the basic setting module In order to view the sampling rules for a certain product, the defect analysis sampling control system described in item 2 of the scope of patent application, in which the rule setting list records the setting and modification time of the previous sampling rule for the product. And modifiers. According to the defect analysis sampling control system described in item 1 of the scope of patent application, it further includes a batch setting list, which is determined by the content of the batch setting module. 'M is used to view the sampling rules of a batch of products The defect analysis sampling control system described in item 4 of the scope of the patent application, wherein the batch setting list records the setting, modification time and modification of the previous sampling rule of the product, and a remarks column. Lik K provides the sampling analysis control for defect analysis as described in item 1 of the corresponding patent application range. The basic setting module is to select the batch number and wafer identification of the product. Page 1212696 Code to set the sampling rules. 7 8 • The defect analysis and extraction as described in the item of the scope of patent application, where the sampling rule setting of the basic setting module is the choice of the semiconductor product, component specifications and manufacturing process; · whether to perform baseline re-inspection; Required inspection machines; Set product batch priority without inspection; Set whether to perform automatic defect classification; and Set default values for wafer identification codes. Defect analysis sampling control as described in Section 1 of the patent patent. The rule order setting module selects the wafer identification code to set. As described in the first patent application scope, the lot setting module疋 Set whether to perform baseline re-inspection of production batches and related data; set the required testing machines; defect analysis sampling control system sample rule settings include: and process; set whether to perform automatic defect classification; and in the remarks Additional explanations are provided in the column. The defect analysis sampling control type described in this item is an optical microscope or automatic scanning classification. The defect analysis sampling control system% has a priority order and XI i 〇 • If the system of patent application range 7 or 9 system, where the automatic defect tracing electron microscope automatic defect i i • As described in the scope of patent application item 1, wherein the WIP prediction module is I222696 12 · 13 · message. One kind of defect is basically the same as half, the batch is selected, and the in-process is selected to provide the same rules as applying for the application. Analyze the setting step, the conductor production setting, the setting selection, the product prediction, view the profit range, and establish the content control method, which includes the following steps, which are in all rule modes, the product selection setting is the relative sampling rule; ί, which is For the basic set of products, the corresponding batch sampling rules; and steps, which record all ongoing production $, product status and progress. As described in item 12, the method of sampling control for defect analysis, the step of setting a rule list is based on the founder of the base, and is used to view a certain sample of the product. 14 · 1 5 · The defect analysis sampling control method described in item 13 of the scope of patent application, in which the rule setting list records the setting, modification time and amendment of the previous sampling rule of the product. According to the defect analysis sampling control method described in Item 12 of the scope of patent application, it further includes a step of establishing a batch setting list, which is created according to the content of the batch setting 'for viewing the batch of products. Sampling rules. 16 · As described in item 15 of the scope of patent application, the sampling analysis method for defect analysis, in which the batch setting list is "the previous sampling rule setting, modification time and modification of the product, and provided with Corresponding to the 17 comments column. Sampling control method for defect analysis as described in Patent Application Park No. 12 1222696 VI. The basic setting procedure in application 1 is to select the lot number of the product and the selection of wafer identification defect analysis sampling control method; priority, β and code to set the sampling rules. i 8 • As described in item 12 of the scope of patent application, where the basic setting steps include whether the semiconductor product, component specifications, and the setting of the cake are to be re-inspected; set the required testing equipment; set no inspection required Whether to perform automatic defect classification for the product batch setting; set the default value of the wafer identification code. ν 4 i 9 • The defect as described in item 12 of the scope of the patent application = 2 = sampling control method, wherein the batch setting step is to select the wafer pool Bima to set the sampling rule ° Ｍ 八 k B, 2 〇 · As described in Item 12 of the scope of the patent application, the method for controlling the sample pattern is as follows, wherein the batch setting step includes the following steps: • setting the product batch and its related data and the owner's setting; Required testing machine; set whether to perform automatic defect classification; add instructions in the remarks column. Ye, Liao 21 22 As in the patent application scope No. 18 or No. 20, / L, trap analysis sampling k method, where the automatic defect classification is the automatic defect automatic classification of optical x-ray electron microscope. ", Government mirror, or scan Defect reduction analysis method as described in item i 2 of the scope of patent application 1222696 6. Scope of patent application, in which the WIP prediction step records the priority order and tool information. Page 16