五、發明說明（1) 【發明所屬之技術領域】V. Description of the invention (1) [Technical field to which the invention belongs]
System)及=關特 (S—ling Control 於各種產品抽樣規則之= ; = = =適用 【先前技術】 7抽樣控制糸統及方法。 按，由於半導體廠投入 半導體產品需經過數百次甚數設備與人力龐大，且 的製作，尤其當半導體的尺寸：的製程才能完成產品 自然相對降低，所以相要接j ’使其對於缺陷容忍度將 缺陷比率，因此在半i = f品良率，就必須設法降低 重要。 在丰導體製程中對於缺陷分析就顯得格外 缺陷分析抽樣控制系統在 相當重要的作用，但是由於 f中良率控制方面有著 術流程不同，再加上伙 產阳的生產技術與製造技 種產品的抽樣：：：：：：：生ί:產品多隸，對於各 關抽樣規則的調整，以隨 吊兩針對某種產品進行相 得非常複雜與困難。 σσ的抽樣規則之控制和調整顯 在4知之缺陷分析抽樣控 產品種類呈現多樣性之情況下，！：：久：於代工廠加工 樣規則與條件，冑造成習知缺::二口 《產品不同之抽 與控制更顯得不足與困難。因=刀析抽樣控制系統之調整 困擾’提出-種缺陷分析抽“制;有上效述克之 第5頁 五、發明說明（2) 服上述之該等缺失 【發明内容】 統及方法，其传=二=係在提供一種缺陷分析抽樣控制系 規則，進而掌C同之產品而選擇設定個別之4 知缺陷分析抽樣控制：=規制與調整，以解決習 活。 j的困難，並使抽樣規則的設置更加靈 統及月陷分析抽樣控制系 i各種+導體產品的抽樣規則選擇，並簡化相關的;定：： 、統及ί i明ϊ ::的：ί ΐ供-種缺陷分析抽樣控制系 的各批次進;製品預測模•，可針對特定產品 產品的狀態Γ ^的預測與控管，以確實掌握各 為達到上述之目的，本發明係包含一美… 其係進行基本設定步驟，以便在内 =7疋吴、且， 依據不同之半導體產品選擇設定：；：==中並 比次設定步驟，以針對該產品的批 -人而&擇§又疋其所對應之批次抽樣規則；以及利用一 ί::ϊίΓΓΠ進行中之產品資料及訊息，用以提供 使用者查看任何產品之狀態與進度。另外， 設模f所ί置之抽樣規則内容建立—規則言:定；i以 及根據批次設定杈組之批次抽樣規則建立—批次設定清單 izzzoyo 五、發明說明（3) 底下藉由具體貫施例配合所附 容易瞭解本發明之目的、# 圖式詳加說明，當更 效。 的技#内谷、特點及其所達成之功 【實施方式】 本發明所提出之缺陷分析抽樣控 可依據不同之產品而選擇設定個別之 各產品抽樣規則的控制與調*，使樣，I進而旱握 種類多樣性時，仍能迅速 '工廠面臨加工產品 4K , a m φ ^ ν ^方便地進行產品的抽樣檢測流 転以解决白知缺陷分析㈣控制 的設置更加靈活。 亚便抽樣規貝j 第一=本發明缺陷分析抽樣控制系統之方塊結構示 二，圖所不’一缺陷分析抽樣控制系統1〇係包括一基 本权疋（Ba% settlng)模組12，其係進行基本設定步驟 ’以便在内設之所有規則握式、φ 价 、踩植—u : 式中依據不同之半導體產品 選擇政疋相對之產品抽樣規則；並有—批次嗖定（L〇t setting)模組14進行批次設定步驟，其係針對該基本設 定模組12之產品的批次而選擇設定其所對應之批次抽樣規 則；以及利用一在製品預測（WIP Predicti〇n)模組16， 其係記錄所有進行中之產品資料，並記錄有優先權順序及 工具訊息’以提供使用者查看任何產品之狀態與進度，使 使用者對相關產品的處理具有全面性。 在元成基本设疋相：組1 2與批次設定模組1 4之選擇設定 後’根據該基本設定設模組1 2所設置之抽樣規則等内容，System) and = Singling Control in various product sampling rules =; = = = [Previous technology] 7 Sampling control systems and methods. Press, because semiconductor factories have to go through semiconductor products hundreds of times. The equipment and manpower are huge, and the production, especially when the size of the semiconductor: process can be completed, the product will naturally be relatively reduced, so it is necessary to connect j 'to its defect tolerance ratio to the defect ratio, so at half i = f product yield, It is necessary to try to reduce the importance. In the rich conductor process, the defect analysis appears to be particularly important. The sampling control system plays a very important role, but due to the different technical processes in yield control in f, coupled with production technology Sampling with manufacturing technology products ::::::: Health: The product is multi-affiliated. The adjustment of the sampling rules for each level is very complicated and difficult to follow for a certain product. Σσ The control and adjustment are obvious. In the case of the analysis of the defects, the sampling control product variety is diversified! :: Jiu: Processing rules and conditions in the foundry , Resulting in a lack of knowledge: 2: Two "products with different extraction and control even more inadequate and difficult. Because = adjustment analysis of the knife analysis sampling control system 'proposed-a kind of defect analysis extraction" system; Page 5. Description of the invention (2) Serving the above-mentioned shortcomings [Summary of the invention] The system and method, its transmission = two = is to provide a defect analysis sampling control system rules, and then choose the same product as the C and select the individual Knowledge defect analysis sampling control: = Regulations and adjustments to solve problems. J's difficulties, and make the setting of sampling rules more flexible and the moon sink analysis sampling control system i various + selection of sampling rules for conductor products, and simplify related ; Determination :: 统, i, ί, and ϊ ϊ ϊ ί 的: ί ΐ supply-species analysis of each batch of defect control; product prediction model •, can predict and control the state of a specific product Γ ^ In order to achieve the above-mentioned purpose, the present invention includes a beauty ... It is to perform basic setting steps in order to include = 7, and, according to different semiconductor products, select settings :; == Set step , With regard to the batch-person of the product & choose § and the corresponding batch sampling rules; and use a ί :: ϊίΓΓΠ ongoing product information and information to provide users to view the status of any product In addition, the content of the sampling rules set by the model f is established—the rules: set; i and the batch sampling rules are established according to the batch setting branch group—the batch setting list izzzoyo V. Description of the invention (3) Bottom With the help of specific examples and the accompanying drawings, it is easy to understand the purpose of the present invention, and the detailed description of the # diagram will be more effective. The technique # 内 谷, features, and the work achieved [Embodiment] The defects proposed by the present invention The analysis and sampling control can be based on different products and can be set to control and adjust the sampling rules of each product *, so that when the sample is further diversified, it can still quickly 'the factory is facing processed products 4K, am φ ^ ν ^ It is convenient to carry out sampling and testing flow of products to solve the problem of white-out defects analysis, and the setting of control is more flexible. The sub-sampling rule j First = The second block structure of the defect analysis sampling control system of the present invention is shown in the figure. The defect analysis sampling control system 10 includes a basic weight module (Ba% settlng) module 12, which The basic setting steps are performed so as to hold all the internal rules of the grip type, φ price, and step planting-u: In the formula, the relative product sampling rules are selected according to the different semiconductor products; and there is-batch determination (L〇 t setting) module 14 performs a batch setting step, which is to select and set a corresponding batch sampling rule for the batch of products of the basic setting module 12; and use a work in process forecast (WIP Predictio) Module 16, which records all ongoing product information, and records the priority order and tool information 'to provide users to view the status and progress of any product, so that users have a comprehensive treatment of related products. After Yuancheng ’s basic settings: selection of group 12 and batch setting module 14, according to the sampling rules set by the basic setting module 12
第7頁 1222696 五、發明說明（4) 即可建立一規則設定清單（Rule Setting List ) 18，以 用於查看某種特定產品的抽樣規則，且該規則設定清單1 8 内係記錄有該產品前一次進行抽樣規則的設置、修改時間 及修改者，此功能設計可使抽樣規則的修改具有可追溯性 ;而根據批次設定設模組1 4所設置之批次抽樣規則等内容 ，即可建立一批次設定清單（Lot Setting List) 20，以 查看某批次產品的抽樣規則，且此批次設定清單2 0内係記 錄有該產品前一次進行抽樣規則的設置、修改時間及修改 者，此功能設計可使抽樣規則的修改具有可追溯性，另外 ，批次設定清單2 0並提供有相應之備註攔，以方便相關使 用者了解某批次產品抽樣規則改變的原因。 尤基本设疋核組1 2與批次設定模組1 4所進行之設定步 驟而言，此二種設定係針對不同種類之產品、批次而選擇 設定不同之抽樣規則，所以其内設之所有規則内容即顯得 相當重要，底下係將基本設定模組1 2與批次設定模組1 4之 設定步驟詳細說明如後。 首先就基本設定模組1 2而言，此基本設定步驟一般係 選擇產品批號及晶圓識別碼（W a f e r I d )來設定抽樣規則 ’請同時參考第二圖所示，基本設定模組之抽樣規則設定 係先如步驟S1 0選擇產品種類，其係包含選擇半導體產品 類型、兀件規格尺寸、批號及製程技術等選項。然後再如 步驟S12選擇是否進行基線再檢（Baseline Review)，其 係可針對特定產品或特定層次進行基線數據的收集，用以 區刀生產線上未在控制範圍（〇ut control，〇〇C)之Page 7 1222696 V. Description of the invention (4) A Rule Setting List 18 can be established for viewing a sampling rule for a specific product, and the product is recorded in the rule setting list 1 8 The previous setting, modification time and modification of the sampling rule, this function design can make the modification of the sampling rule have traceability; and according to the batch sampling rule set by the batch setting module 14 Create a batch setting list (Lot Setting List) 20 to view the sampling rules of a batch of products, and this batch setting list 20 records the previous sampling rule setting, modification time, and modifier of the product This function is designed to make the modification of the sampling rules traceable. In addition, the batch setting list 20 is provided with corresponding remarks to facilitate relevant users to understand the reason for the change of the sampling rules for a batch of products. In particular, for the setting steps performed by the core set 12 and the batch setting module 14, these two settings are set to select different sampling rules for different types of products and batches, so they are internally set. The contents of all the rules are very important. The detailed steps of the basic setting module 12 and batch setting module 14 are described below. First, as far as the basic setting module 12 is concerned, this basic setting step is generally to select the product lot number and wafer identification code (W afer I d) to set the sampling rule. 'Please also refer to the second figure, the basic setting module Sampling rule setting first selects the product type as in step S10, which includes options for selecting the semiconductor product type, component specifications, batch number, and process technology. Then, in step S12, it is selected whether to perform a baseline review, which can collect baseline data for a specific product or a specific level, so as to indicate that the knife production line is not in the control range (〇ut control, 〇〇C). Of
第8頁 1222696 五、發明說明（5) ，據藉此提供數據收集上的靈活性，並將其特別標記出 來。 f著如步驟s丨4所示，設定以何種檢測機台進行檢測 & ^ k /則機台之選擇更加靈活且具有彈性。如步驟s 1 6， 认定不須進行檢測之產品批次優先權（Lot Priority)， 以便使不同優先權之產品抽樣控制更加方便。接續設定是 否進行自動缺陷分類（Automatic Defect Classificatl〇n，ADC)，如步驟S18，其係選擇是否進行 為光學式顯微鏡自動缺陷分類係（〇M ADC )或 子錢鏡自動缺陷分類（SEMm)，此步驟\=^使式用電 者即打獲得產品是否在進行自動缺陷分類的訊息。最後， 如步驟S2 0所示設定晶圓識別碼預設值，其係根據不同之 產品選擇相對之晶圓識別碼，以提供不同檢测機台對抽樣 的晶圓識別碼具有統一之標準。 其中，上述之步驟S10至步驟S20中的所有設定步驟的 先後順序係可依據使用者之需求或喜好彈性更改，不一定 要參照上述之流程順序。 疋 就批次設定模組而言，此批次設定步騍—般係選擇晶 圓識別碼（Wafer ID )來設定抽樣規則，請同^參考第^ 圖所示’批次設定模組之批次抽樣規則設定係先如步驟一 S 3 0選擇產品批次及其相關資料與製程；接續進行步驟s 3 2 設定是否進行基線再檢、步驟S34設定所需之檢測^ a以 及步驟S36設定是否進行自動缺陷分類；最後再如步 所示，可於備註欄中附加其他說明，以方便相關使用者可Page 8 1222696 V. Description of the Invention (5), which provides flexibility in data collection and specifically marks it. f. As shown in step s 丨 4, set which detection machine to perform the detection & ^ k / The selection of the machine is more flexible and flexible. For example, in step s 16, determine the lot priority of products that do not need to be tested in order to facilitate the sampling control of products with different priorities. Then, set whether to perform Automatic Defect Classificat (ADC), as in step S18, it is to choose whether to perform the optical microscope automatic defect classification system (OM ADC) or the sub-mirror automatic defect classification (SEMm), This step \ = ^ enables the electricity consumer to obtain information on whether the product is performing automatic defect classification. Finally, the default value of the wafer identification code is set as shown in step S20, which selects the relative wafer identification code according to different products to provide different inspection machines with a uniform standard for the sampled wafer identification code. Among them, the order of all the setting steps in the above steps S10 to S20 can be flexibly changed according to the user's needs or preferences, and it is not necessary to refer to the above-mentioned process sequence.疋 As far as the batch setting module is concerned, this batch setting step is generally to select the wafer ID (Wafer ID) to set the sampling rules. The sub-sampling rule setting is to select the product batch and its related data and manufacturing process as in step 1 S 3 0; then proceed to step s 3 2 to set whether to perform baseline recheck, step S34 to set the required detection ^ a, and step S36 to set whether Carry out automatic defect classification; finally, as shown in the step, you can add other instructions in the remarks column for the convenience of relevant users.
第9頁 1222696 玉、發明說明（6) " 以得到該批次產品抽樣規格改變之原因。在進行步驟s3〇 至步驟S38的先後順序亦可依據使用者之需求或直好彈性 更改。其[由於步驟S32至步驟S36之詳細内容'系與基本 設定杈組之§亥等步驟相g，請參考前述說明，故於此不再 本發明係利用一基本設 各種半導體產品的抽樣規則 ，再利用一在製品預測模組 行生產流程的預測與控管， 此，本發明確實可解決習知 應映產品的多樣性，使各產 簡便，並使抽樣規則的設置 以上所述之實施例僅係 點’其目的在使熟習此項技 容並據以實施，當不能以之 凡依本發明所揭示之精神所 蓋在本發明之專利範圍内。 【圖號簡單說明】 定模組與批次設定模組，提供 選擇’並簡化相關的設定功能 針對特定產品的各批次進度進 以確實掌握各產品的狀態。因 缺陷分析抽樣控制的困難，以 品抽樣規則的控制和調整更加 更加靈活。 I說明本發明之技術思想及特 藝之人士能夠瞭解本發明之内 限定本發明之專，利範圍，即大 作之岣等變化或修飾，仍應涵Page 9 1222696 Jade, invention description (6) " to get the reason for the change in the sampling specifications of the batch of products. The sequence of performing steps s30 to step S38 can also be changed according to the needs of the user or with good flexibility. [[Since the details of steps S32 to S36 'are the same as the basic setting steps of § and other steps, please refer to the foregoing description, so the invention is not used here to use a sampling rule for basically setting various semiconductor products. The prediction and control of the production process of a WIP prediction module is used again. Therefore, the present invention can indeed solve the diversity of conventional Yingying products, make each product simple, and set the sampling rules. The only point is that its purpose is to familiarize yourself with this technique and implement it accordingly. When it cannot be covered by the spirit disclosed by the present invention, it is within the scope of the patent of the present invention. [Simplified description of drawing numbers] The setting module and batch setting module provide selection ’and simplify related setting functions. Progress for each batch of a specific product to truly grasp the status of each product. Due to the difficulty of sampling control for defect analysis, the control and adjustment of sampling rules for products are more flexible. I. Those who explain the technical ideas and special features of the present invention can understand the scope of the present invention, and the scope or scope of the invention, namely, the changes and modifications of the masterpiece, should still be covered.
第1〇頁 1222696 圖式簡單說明 第一圖為本發明之方塊結構示意圖。 第二圖為本發明之基本設定模組的設定步驟示意圖。 第三圖為本發明之批次設定模組的設定步驟示意圖。 1·Page 10 1222696 Brief description of the diagram The first diagram is a block diagram of the present invention. The second figure is a schematic diagram of the setting steps of the basic setting module of the present invention. The third figure is a schematic diagram of the setting steps of the batch setting module of the present invention. 1·