1221912 A7 B7 五、發明說明（） 發明領域： (請先閲讀背面之注意事項再填寫本頁) 本發明係有關於一種晶片針測（Chip Probe ; CP)之製造 執行系統（Manufacturing Execution System ; MES)，特別是 有關於一種用以架構晶片針測之製造執行系統的基礎模 組。 發明背景： 在半導體的製造過程中，隨著元件尺寸的微小化，以 及元件結構的日漸精密趨勢，使得對晶圓廠效率和控制能 力的要求大幅增加，因此具有強大功能之製造執行系統的 重要性也就隨之提高。當晶圓尺寸進入300mm，對強大功 能之製造執行系統的需求更是倍增。因此，在目前的晶圓 廢中’優良的製造執行系統已是不可或缺的功能。 短濟部智毯財產局員工消費合作社印製 製造執行系統係以網路計算而將生產控制與流程自動 化的資訊系統。在下載工作排程並上傳生產結果之後，製 造執行系統便將企業、工廠場地或流程控制系統之間的鴻 溝連結起來。大部分的製造執行系統係將企業生產所需之 核心業務如訂單、供應商、物管、生產、設備保養、品管 等流程整合在一起，並提供即時化、多生產型態架構、跨 公司生產管制的資訊交換，且可隨產品、訂單種類及交貨 期的變動彈性調整參數等諸多能力，能有效的協助企業管 理存貨、降低採購成本、提高準時交貨能力，增進企業少 量多樣的生產控管能力。此外，製造執行系統也可以針對 οσ 早一製程，而進行製程品質、機台、以及設備等之控管。 本木張尺度適用中國國家標準(CNS)A4規格(210Χ 297公釐） 121912 A7 〜---------__ — 五、發明説明（） 綜上所述，製造執行系統係一可輔助生管人員收集現場資 料並控制現場製造流程，以提供企業改善製程以及提高生 產效益的工具。 晶片針測之製造執行系統係用以控管針測製程之流 程、針測機台、以及設備。目前，主要的晶片針測之製造 執行系統有波赛頓（P 0 S e i d ο η)以及波密斯（p r 〇 m i S)兩種。請 參照第1圖，第1圖係繪示Poseidon之晶片針測機台的製 造執行系統的模組架構圖。Poseidon晶片針測機台之製造 執行系統的模組架構包括一種產品1 〇〇，例如電子產品之 晶片，可進行多種測試1 02，以獲知產品1 〇〇的各種性能 狀況。而每一種產品1 〇〇的每一種測試1 〇2皆對應到唯一 的一個機台群組104。其中，機台群組1 04之形成係先在 不同型號之針測機中，挑選出符合一種產品1 〇 〇之一種測 試1 02的針測機，再將所挑選之針測機組成一個機台群組 104 〇 由於，同一種型號之針測機，因其配備的不同，而使 得在這些同型號的針測機中，可能某些機台1 〇6可進行一 種產品100之一種測試102，而某些機台106卻無法進行 該種產品1 00之該種測試1 02。因此，可能導致同〆機台 隸屬於多個機台群組1〇4，而一個機台群組104包含有 各種不同型號的機台106，例如252個機台106隸屬於179 個機台群組104。當將某一型號之某一機台106的/個配 備轉移到同一型號或者是不同型號的另一個機台106時’ 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) .............._- · (請先閲讀背面之注意事項再填、寫本頁) 、一-a· 經濟部智β財產局員工消費合作社印製 α^1912 Α7 ______ 五、發明説明（） .......... ....- (請先閲讀背面之注意事項再填寫本頁) 與配備轉移有關聯之機台106以及這些有變動之機台106 所隸屬之各個機台群組1 04，甚至是機台1 〇6之配備變動 後所應隸屬的機台群組1 04，皆必須在原來之製造執行系 統中進行修正維護。因此，系統之維護相當複雜且浪費人 力資源，不符合管理效益。 此外’明參A?、第2圖’第2圖係繪示P 〇 s e i d ο η之晶片 針測的製造執行系統的測試配方模組架構圖。Poseid〇n之 測試配方模組係外掛於晶片針測的製造執行系統，其係用 以製作流程表（Traveler Sheet)以維護製造執行系統外之測 試配方資訊。Poseidon之測試配方模組包括一種產品ι5〇 可進行多種測試1 52，以獲知產品1 50的各項性能狀況， 而每一種產品1 5 0的每一種測試1 5 2皆只對應到唯一的一 個測試程式1 5 4。由於，此測試配方模組係嵌附於製造執 行系統中，其測試配方之維護資訊無法直接應用在製造執 行系統之操作流程中。而且，P 〇 s e i d ο η之測試配方模組並 不夠完善，因此無法明確指定出較適當之測試程式丨5 4， 影響產品1 5 0測試1 5 2的進行。 蝗濟部智慧財產局員工消費合作社印製 請參照第3圖，第3圖係繪示Promis之晶片針測的製 造執行系統的模組架構圖。Pro mis晶片針測之製造執行系 統的模組架構包括一種產品200，例如電子晶片，可進行 夕種測试2 0 2 ’精以獲知產品2 0 0的各種電性性能。而且， 每一種產品200的每一種測試202可能需要在具有多種不 同功能群組204之機台206上才得以進行。其中，功能群 5 本紙張尺度適用中國國家標準(CNS)A4規格(210X 297公釐) 2 91 21 12 經濟部智毯財產局員工消費合作社印製 A7 _B7____ 五、發明説明（） 組204為具有某一種共同功能之組合。因此，一個機台206 可具有多個功能群組204，而一個功能群組204可分別隸 屬於多個機台206。雖然，Promis之製造執行系統的模組 可明顯地減少功能群組204的數量，並使得pr〇mis之製造 執行系統的維護比Poseidon之製造執行系統較為簡單。然 而，Promis之製造執行系統並未針對測試程式進行模組 化。因此，Promis之製造執行系統並不完善，無法有效控 制產品200的測試202。 發明目的及概述： 鑒於上述習知晶片針測製造執行系統中，Poseidon與 Promis之製造執行系統所衍生之對應關係相當複雜，且其 模組皆未將針測板的因素考慮進去，因此除了維護困難度 高外，更無法達到有效控制測試配方的目標。而且，由於 模組的限制，這兩種製造執行系統無法明確指定出某些測 試配方。 因此，本發明的主要目的之一就是在提供一種晶片針 測之製造執行系統的模組，其係將測試單元、晶片之品質 參數、晶圓之品質參數、以及針測板之性質參數建立在製 造執行系統之基礎架構上。如此一來，可使得製造執行系 統更加的周延完備，使得測試配方更為明確。因此，可提 高針測製程的可靠度，提升線上之品質控制能力，而降低 晶圓的損失，進而提高產品良率。 本發明之再一目的就是因為本發明之製造執行系統的 6 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公楚) ......!——變.........訂......... (請先閲讀背面之注意事項再填寫本頁) 2 9 2 12 A7 _B7_ 五、發明説明（） (請先閲讀背面之注意事項再填寫本頁) 模組係將產品之每一種測試所需的功能建立在產品參數 中，且將每一個針測機台所具有之功能建立在機台參數 中，而針對於個別機台所具有的功能進行管理。因此，可 大幅降低製造執行系統的複雜度，而減低.系統維護的困難 度，進而減輕系統維護的負擔，有效縮減系統維護所耗費 之人力資源與成本。 經濟部智慧財產局員工消費合作社印製 根據以上所述之目的，本發明更提供了 一種晶片針測 之製造執行系統的模組，適用於建構一製造執行系統以進 行複數個晶圓之複數個待測晶片的複數個測試，且該晶片 針測之製造執行系統的模組至少包括：一產品特性單元， 其中此產品特性單元包括有對應於這些晶圓的產品特性； 一測試性質單元，其中此測試特性單元至少包括有對應於 這些晶圓之這些測試的測試性質；一測試單元，其中此測 試單元係用以依據這些晶圓而從產品特性單元中取出相對 應之產品特性，以及依據測試種類而從測試性質單元取出 相對應之測試性質，以進行這些晶圓之待測晶片的測試， 並控制傳送一訊號至這些晶圓之每一個待測晶片、接收每 一個待測晶片所回傳之一回應訊號、判斷這些晶圓之待測 晶片的品質、以及判斷這些晶圓之品質，且這些待測晶片 之每一種測試至少包括一需求功能參數；以及複數個針測 板群組分別對應至上述之待測晶片的每一種測試，且這些 針測板群組對應至複數個測試機型，其中每一個針測板群 組至少包括複數個針測機台，且每一個針測機台至少包括 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) 1221912 A7 B7 五、發明説明（） (請先閲讀背面之注意事項再填寫本頁) 一目前功能參數，而這些針測板群組係用以控制上述之測 試單元，並藉以使上述之測試單元依據這些晶圓之待測晶 片的測試而從這些測試機型中選擇相對應者。 當每一個針測機台之目前功能參數符合上述之待測晶 片之測試者的需求功能參數時，這些待測晶片之待測試者 才可以利用這些針測機台來進行。此外，利用上述之測試 單元進行晶圓上之待測晶片的這些測試時，可獲得每一個 待測晶片之品質參數，並可藉由每一個待測晶片之品質參 數獲付此晶圓之產品品質參數。 圖式簡單說明： 本發明的較佳實施例將於往後之說明文字中辅以下列 圖形做更詳細的闡述，其中： 第1圖為繪示P 〇 s e i d ο η之晶片針測機台的製造執行系 統的模組架構圖； 第2圖為繪示Poseidon之晶片針測的製造執行系統的 測試配方模組架構圖； 第3圖為繪示Promis之晶片針測的製造執行系統的模 組架構圖，以及 經濟部智毯財產局員工消費合作社印製 第4圖為繪示本發明之一較佳實施例之晶片針測的製 造執行系統的模組架構圖。 圖號對照說明： 100 產品 102 測試 104 機台群組 106 機台 8 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) 2 9 2 12 A7 B7 經濟部智慧財產局賣工消費合作社印製 (請先閲讀背面之注意事項再填寫本頁) 152 測試 200 產品 204 功能群組 300 產品 304 需求功能參數 308 晶片品質參數 3 10 晶 圓品質參數 3 12 針 測 板群 組 3 14 測 試機型 3 16 測 試 機 台 3 1 8 前功能參數 發 明 詳 細 說明： 本發 明揭露一種晶 片 針 測 之 製 造 執 行 系 統 的 模 組 J 其 係 將 晶 片 針測之測試單 元 產 品 特 性 、 針 測 板 功 能 等 參 數 建 立 於 製 造執行系統的 模 組 中 並 將 測 試機 台 之 功 能 狀 態 納 入 機 台 的特性内，且 將 產 品 測 試 所 需 之 測 試 機 配 備 納 入 產 品 特 性 的考量參數中 0 因 此 ， 可 大 幅 提 升 線 上 品 質 的 控 制 能 力 1 增加製造執行 系 統 的 完 備 性 y 進 而 減 低 系 統 維 護 的 人 力 與 成本。為了使 本 發 明 之 敘 述 更 加 詳 盡 與 完 備 y 可 參 照 下 列 描述並配合第 4 圖 之 圖 示 〇 前 的晶片針測之 製 造 執 行 系 統 的 機 台 與 配 方 模 組 無 法 正 確 地 指定適當之測 試 單 元 與 機 台 配 備 〇 而 且 受 限 於 模 組 或 相 當複雜的額外 輔 助 系 統 > 導 致 製 造 執 行 系 統 選 擇 了 錯 誤 的 測試配方與機 台 來 進 行 針 測 0 如 此 一 來 9 常 導 致 需 要 花 費 大量的人力來 維 護 製 造 執 行 系 統 外 之 額 外 輔 助 系 五、發明説明（） 150 產品 154 測試程式 202 測試 206 機台 302 測試 306 測試單元 9 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) 1221912 經濟部智毯財產局員工消費合作社印製 A7 B7 五、發明説明（） 統’相當不符合經濟效益。再加上，a曰圓p +、仓 上 日日W尺寸進入到1 2吋 後’測试機台及相關設備的價格變得^ 份支传相當昂責，使得現存 之晶片針測的製造執行系統已不敷使用。 為了解決習知晶片針測之製造執杆备 衣w巩仃系統的問題，並彌 補其不足，因此本發明提出更完盖之a 、日|丨—… 疋。夂曰曰片針測之製造執行 系統的模組。請參照第4圖，第4圖係繪示本發明之一較 佳實施例之晶片針測的製造執行系統的模組架構圖。每一x 個產品300 ,例如晶圓上之眾多積體電路晶片，需進行多 種不同的測試3 02，才能得知產品3 〇〇的各項電性是否符 合元件需求。其中，產品300單元中提供有例如產品3〇〇 的各項性質等，而測試302單元中則提供有例如各項測試 302的内容等。而且，對於每一個產品3〇〇的每一種測試 3 02皆有其相對應之需求功能參數3 04，其中每一個產品 3 0 0之每一種測試3 0 2的需求功能參數3 0 4包括有例如進 行此產品3 00之此種測試3 02所需之測試功能與配備。因 此’也就是說，一個測試機台3 1 6之測試功能與配備需符 合某一產品3 0 0之某一種測試3 0 2的需求功能參數3 0 4， 才得以利用此測試機台3 1 6進行此產品3 0 0之此種測試 302 〇 產品300之各種測試302係由測試單元306所進行， 其中測試單元3 0 6至少包括例如控制：傳送測試訊號至產 品3 00，例如晶圓上之每一待測晶片，以進行產品3 00之 品質測試；接收每一個產品3 0 0所回傳之回應訊號，並進 10 本紙張尺度適用中國國家標準(CNS)A4規格(210X 297公楚) ..............變.........、耵.........^0 (請先閲讀背面之注意事項再填寫本頁) 五 I 經濟部智慧財產局員工消費合作社印製 A7 ------- B7 發明說明（） 了 ’則蜮訊號與回應訊號之 的品暂咖 G對，以及判斷所測試之產品300 貝。舉例而言，進行晶圓u _試嚴- _上之某一待測晶片的針測時， 疋306會對此待測晶只级山丄 待測曰w 月發出相對應之測試訊號，此 曰日片接收到此測試訊號 3〇6 4. u卩產生回應訊號。當測試單元 欠到此待測晶片所回值 訊號伽 1寻之回應訊號後，會進行測試 現與回應訊號的比對，並 片之σ ^ Α根據比對結果來判斷此待測晶 。口質，而得到晶片品質 合b面 貝麥數308。測試單元306再綜 曰曰圓上之每一個待測晶 整個曰a 片的日日片品質參數308，來判斷 u日日圓之品質以及可能的制 數3丨〇。 的1程誤差，而獲得晶圓品質參 此*外’由於針測板的特& 機夕、， 符14會影響測試單元306對測試 測試機型314的選擇，因士收 級人 U此將具有相同特性之針測板 測之制十'則板群組312 ’並將針測板群組3 1 2納入晶片針 :欠/造執行系、統的模組中。舉例而t：，針測板包括有每 二刪：單一晶片、每次可測試兩個晶片、或者每次可測 每:個阳片的型式，而針測機之測試機型3 1 4可能包括有 二/、忐測試一個晶片、兩個晶片、或多個晶片者。因此， 同的針測板型式需選用相對應之測試機型3丨4，也就是 备測試單元3 0 6選用每次只能測試一個晶片的針測板 群組3 1 2 ’測試單元306就須選擇每次只能測試一個晶片 的測試機型3 1 4。 在每一種測試機型3 1 4中，包括一個測試機台3 1 6或 多個測試機台3 1 6。而且，由於不管測試機台3 1 6是否屬 本紙張尺度適用中國國家標準(CNS)A4規格(210X 297公釐) ...............I (請先閲讀背面之注意事項再場寫本頁) 、v'tr 2 9 2 12 A7 _B7_. 五、發明説明（） (請先閲讀背面之注意事項再填寫本頁) 於同一種測試機型3 1 4，每一個測試機台3 1 6皆可能具有 不同的功能與配備。將每一個測試機台3 1 6所具有之測試 功能與配備組成為相對應之目前功能參數3 1 8。因此，將 每一個測試機台3 1 6之目前功能參數3 1 8納入晶片針測之 製造執行系統的模組中，以個別管理每一個測試機台 3 1 6 所具有之功能。因此，進行某一種產品3 00、之其中一種測 試3 02時，測試單元3 06所選用之測試機台3 1 6的目前功 能參數3 1 8必須需符合此種產品3 00之此種測試3 02的需 求功能參數3 04，才能利用此測試機台3 1 6進行此種產品 3 00之此種測試302。 本發明之一優點就是因為將測試單元、晶片之品質參 數、晶圓之品質參數、以及針測板之性質參數建立在晶片 針測之製造執行系統的模組中，而使得製造執行系統更加 的周延完備，並使得測試配方更為明確。因此，可增加線 上品質的控制能力，並大幅提高針測製程之可靠度，進而 達到提高產品良率的目的。 經濟部智毯財產局員工消費合作社印製 本發明之另一優點就是因為將產品之每一種測試所需 的功能建立在產品參數中，並將每一個針測機台所具有之 功能建立在機台參數中，以針對個別針測機台所具有的功 能進行管理。因此，製造執行系統的複雜度可獲得有效改 善，系統的維護更加地簡單容易。於是，可大幅減輕製造 執行系統的維護負擔，進而達到降低系統維護所耗費之人 力資源與成本的目的^ 12 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐) 1221912 A7 B7 五、發明説明（） 如熟悉此技術之人員所瞭解的，以上所述僅為本發明 之較佳實施例而已，並非用以限定本發明之申請專利範 圍；凡其它未脫離本發明所揭示之精神下所完成之等效改 變或修飾，均應包含在下述之申請專利範圍内。 (請先閲讀背面之注意事項再填寫本頁) 經濟部智迖財產局員工消費合作社印製 13 本紙張尺度適用中國國家標準(CNS)A4規格(210X297公釐)1221912 A7 B7 V. Description of the invention () Field of invention: (Please read the precautions on the back before filling this page) The present invention relates to a Manufacturing Execution System (Chip Probe; CP) Manufacturing Execution System (MES) ), In particular, relates to a basic module of a manufacturing execution system for building a chip probe. Background of the Invention: In the manufacturing process of semiconductors, with the miniaturization of component sizes and the increasingly precise trend of component structures, the requirements for wafer fabs' efficiency and control capabilities have greatly increased. Therefore, a powerful manufacturing execution system is important. Sexuality will improve accordingly. When the wafer size reaches 300mm, the demand for powerful manufacturing execution systems is multiplied. Therefore, an excellent manufacturing execution system has become an indispensable function in the current wafer waste. Printed by the Employees' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs and Manufacturing Co., Ltd. The manufacturing execution system is an information system that uses network calculations to automate production control and processes. After downloading job schedules and uploading production results, the manufacturing execution system bridges the gap between the enterprise, plant site, or process control system. Most of the manufacturing execution systems integrate the core business required by the company's production, such as orders, suppliers, property management, production, equipment maintenance, quality control and other processes, and provide instant, multi-production type architecture, cross-company Production control information exchange, and the ability to adjust parameters flexibly with changes in products, order types, and delivery time, can effectively assist companies in managing inventory, reduce procurement costs, improve on-time delivery capabilities, and improve small and diverse production Control ability. In addition, the manufacturing execution system can also control the process quality, machine, and equipment for οσ earlier processes. The standard of this wood sheet is in accordance with China National Standard (CNS) A4 specification (210 × 297 mm) 121912 A7 ~ ---------__ — V. Description of the invention () In summary, the manufacturing execution system Assist bio-management personnel to collect on-site data and control on-site manufacturing processes to provide companies with tools to improve processes and increase production efficiency. The manufacturing execution system of wafer pin test is used to control the process of the pin test process, the pin test machine, and the equipment. At present, there are two main manufacturing execution systems for pin testing: Poseidon (P 0 S e i d ο η) and Bomi (P r 〇 mi i S). Please refer to Fig. 1. Fig. 1 is a diagram showing the module structure of the manufacturing execution system of Poseidon's wafer prober. Manufacturing of the Poseidon chip probe tester The module structure of the execution system includes a product 100, such as the chip of an electronic product. Various tests 10 02 can be performed to learn the various performance status of the product 1000. Each test 100 of each product 100 corresponds to a unique machine group 104. Among them, the formation of machine group 1 04 is based on different types of needle testers, first selecting a needle tester that matches a product 100 and testing a 02, and then combining the selected needle testers into a machine. Unit group 104 〇 Due to the different types of needle measuring machines of the same model, it is possible that among these needle measuring machines of the same model, some machines 106 can perform a test of a product 100 102 However, some machines 106 cannot perform the test of the product 100 and the test of the 02. Therefore, peer machines may belong to multiple machine groups 104, and one machine group 104 includes machines 106 of various models, for example, 252 machines 106 belong to 179 machine groups Group 104. When transferring the equipment of one machine 106 of a certain model to another machine 106 of the same model or a different model 'This paper size applies to the Chinese National Standard (CNS) A4 specification (210X297 mm) .. ............_- (Please read the precautions on the back before filling out and write this page), a-a · Printed by the Intellectual β Property Bureau Employee Consumer Cooperatives of the Ministry of Economic Affairs α ^ 1912 Α7 ______ V. Description of the invention () .......... ....- (Please read the notes on the back before filling out this page) Machines 106 related to equipment transfer and these changed machines Each machine group 1 04 to which the station 106 belongs, or even machine group 1 04 to which the machine 1 06 should be attached, must be corrected and maintained in the original manufacturing execution system. Therefore, the maintenance of the system is quite complicated and wastes human resources, which is not in line with management benefits. In addition, "Mingshen A ?, Fig. 2" and Fig. 2 are diagrams showing the structure of the test recipe module of the manufacturing execution system of the wafer pin test of P 0 s e i d ο η. Poseidon's test recipe module is a manufacturing execution system that is plug-in to the wafer pin test. It is used to create a Traveler Sheet to maintain test recipe information outside the manufacturing execution system. Poseidon's test formula module includes a product ι50, which can be used for various tests 1 52 to know the performance status of product 150, and each test 1 50 of each product 150 corresponds to a unique one. Test program 1 5 4. Because this test recipe module is embedded in the manufacturing execution system, the maintenance information of its test recipe cannot be directly applied to the operation process of the manufacturing execution system. In addition, the test formula module of P 0 s e i d ο η is not perfect, so it is impossible to clearly specify a more appropriate test program 5 4, which affects the performance of the product 150 test 1 52. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Locust. Please refer to Figure 3, which shows the module architecture diagram of the manufacturing execution system of Promis's wafer pin test. The module architecture of the Pro mis chip pin test manufacturing execution system includes a product 200, such as an electronic chip, which can be subjected to a variety of tests 2 02 ′ to obtain various electrical properties of the product 2000. Moreover, each test 202 of each product 200 may need to be performed on a machine 206 having a plurality of different functional groups 204. Among them, the functional group 5 paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X 297 mm) 2 91 21 12 Printed by A7 _B7____ of the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs V. Description of the invention () Group 204 A combination of common functions. Therefore, one machine 206 may have multiple function groups 204, and one function group 204 may belong to multiple machines 206, respectively. Although, the module of Promis's manufacturing execution system can significantly reduce the number of functional groups 204, and make the maintenance of promis' manufacturing execution system easier than Poseidon's manufacturing execution system. However, Promis's manufacturing execution system is not modularized for test programs. Therefore, Promis's manufacturing execution system is not complete and cannot effectively control the test 202 of the product 200. Object and summary of the invention: In view of the above-mentioned conventional wafer probe manufacturing execution system, the corresponding relationship derived from the manufacturing execution system of Poseidon and Promis is quite complicated, and its modules do not take the factors of the probe board into consideration, so in addition to maintenance In addition to the high degree of difficulty, the goal of effective control of the test formulation cannot be achieved. Moreover, due to the limitations of the modules, these two manufacturing execution systems cannot explicitly specify certain test recipes. Therefore, one of the main objectives of the present invention is to provide a module for a manufacturing execution system for wafer pin testing, which establishes a test unit, a quality parameter of the wafer, a quality parameter of the wafer, and a property parameter of the pin test board. Manufacturing execution system infrastructure. In this way, the manufacturing execution system can be made more complete and complete, and the test formula can be made clearer. Therefore, the reliability of the needle measurement process can be improved, the quality control ability on the line can be improved, the loss of the wafer can be reduced, and the product yield can be improved. Another purpose of the present invention is because the 6 paper sizes of the manufacturing execution system of the present invention are applicable to the Chinese National Standard (CNS) A4 specification (210X297) ....!-Change ... ..Order ... (Please read the notes on the back before filling this page) 2 9 2 12 A7 _B7_ V. Description of the invention () (Please read the notes on the back before filling this page) The module is to establish the functions required for each test of the product in the product parameters, and to establish the functions of each pin test machine in the machine parameters, and to manage the functions of the individual machines. Therefore, the complexity of the manufacturing execution system can be greatly reduced, and the difficulty of system maintenance can be reduced, thereby reducing the burden of system maintenance, and effectively reducing the human resources and costs of system maintenance. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs According to the above-mentioned purpose, the present invention further provides a module for manufacturing execution system for wafer pin testing, which is suitable for constructing a manufacturing execution system to perform multiple wafers. A plurality of tests of the wafer to be tested, and the module of the manufacturing execution system of the wafer pin test includes at least: a product characteristic unit, wherein the product characteristic unit includes product characteristics corresponding to the wafers; a test property unit, wherein The test characteristic unit includes at least test characteristics corresponding to the tests of the wafers; a test unit, wherein the test unit is used to extract corresponding product characteristics from the product characteristic unit according to the wafers, and according to the test The corresponding test properties are taken from the test property unit to test the test wafers of these wafers, and to control the transmission of a signal to each of the test wafers of these wafers, and to receive the return of each test wafer. One responds to the signal, judges the quality of the wafers to be tested for these wafers, and judges these wafers. Quality, and each test of these chips under test includes at least one required function parameter; and a plurality of pin test board groups correspond to each of the above-mentioned test chip tests, and these pin test board groups correspond to a plurality of Test models, each of which consists of at least a plurality of probes, and each probe includes at least the paper size applicable to the Chinese National Standard (CNS) A4 (210X297 mm) 1221912 A7 B7 V. Description of the invention () (Please read the notes on the back before filling out this page) A current function parameter, and these pin test board groups are used to control the above test units, so that the above test units are based on these The wafer to be tested is selected from these test models. When the current function parameters of each pin testing machine meet the functional parameters required by the tester of the wafer to be tested, the testers of the chip to be tested can use these pin testing machines to perform. In addition, when using the above-mentioned test unit to perform these tests on the wafers to be tested, the quality parameters of each wafer to be tested can be obtained, and the products of this wafer can be paid for by the quality parameters of each wafer to be tested Quality parameters. Brief description of the drawings: The preferred embodiment of the present invention will be described in more detail in the following explanatory text with the following figures, where: Figure 1 is a diagram showing a wafer pin tester of P oseid ο η The module architecture diagram of the manufacturing execution system; Figure 2 is a diagram of the module structure of the manufacturing execution system of Poseidon's wafer pin test; Figure 3 is the module of the manufacturing execution system of Promis's chip pin test The structure diagram, and the printed by the Consumer Cooperatives of the Intellectual Property Office of the Ministry of Economic Affairs. FIG. 4 is a module structure diagram of a manufacturing execution system for wafer pin testing according to a preferred embodiment of the present invention. Comparative description of drawing numbers: 100 products 102 tests 104 machine groups 106 machines 8 This paper size is applicable to China National Standard (CNS) A4 specifications (210X297 mm) 2 9 2 12 A7 B7 Sales and Consumer Cooperatives, Intellectual Property Bureau, Ministry of Economic Affairs Printed (Please read the precautions on the back before filling this page) 152 Test 200 Product 204 Function Group 300 Product 304 Demand Function Parameter 308 Wafer Quality Parameter 3 10 Wafer Quality Parameter 3 12 Pin Test Board Group 3 14 Test Machine Model 3 16 test machine 3 1 8 Front functional parameter invention detailed description: The present invention discloses a module J for manufacturing execution system of wafer pin test. It is to establish the parameters of the test unit of the wafer pin test and the parameters of the pin test board. In the module of the manufacturing execution system, the functional status of the test machine is included in the characteristics of the machine, and the test machine equipment required for product testing is included in the consideration parameters of the product characteristics. Therefore, the line can be greatly improved. Product quality control ability of a human to increase cost of the finished apparatus and reduce the low y intake system maintenance manufacturing execution system. In order to make the description of the present invention more detailed and complete, you can refer to the following description and cooperate with the diagram in Figure 4. The machine and formula module of the manufacturing execution system of the wafer pin test before can not correctly specify the appropriate test unit and machine. The equipment is equipped with 0 and is limited by the module or a fairly complicated additional auxiliary system.> As a result, the manufacturing execution system selects the wrong test recipe and machine to perform the pin test. As a result, 9 often leads to the need to spend a lot of manpower to maintain the manufacturing. Additional auxiliary systems outside the execution system V. Description of the invention 150 Product 154 Test program 202 Test 206 Machine 302 Test 306 Test unit 9 This paper size applies to China National Standard (CNS) A4 specification (210X297 mm) 1221912 Ministry of Economic Affairs Printed by the Consumer Property Cooperative of the Blanket Property Bureau A7 B7 V. Description of the invention () The system is quite inconsistent with economic benefits. In addition, the price of "a" circle p +, and the W size of the warehouse has entered 12 inches, and the price of the test machine and related equipment has become very heavy. This makes the existing wafer pin test manufacturing. The execution system is insufficient. In order to solve the problem of the conventional manufacturing system for the manufacturing of a rod and awake system, and to make up for its shortcomings, the present invention proposes a more comprehensive a, date | 丨 —... 疋. The module of the manufacturing execution system of the pin and pin test. Please refer to FIG. 4. FIG. 4 is a module architecture diagram of a manufacturing execution system for wafer pin testing according to a preferred embodiment of the present invention. Each x product 300, such as many integrated circuit wafers on a wafer, needs to undergo a variety of different tests 3 02 in order to know whether the electrical properties of the product 300 meet the component requirements. Among them, the product 300 provides various properties such as product 300, and the test 302 provides, for example, the contents of various tests 302. Moreover, for each test 300 of each product 300, there is a corresponding required function parameter 3 04, of which each test 300 of each product 3 0 2 requires a functional parameter 3 0 4 including For example, the test functions and equipment required to perform this test 3 02 of this product 3 02. Therefore, 'that is to say, the test functions and equipment of a test machine 3 1 6 must meet the requirements of a certain product 3 0 0 test 3 0 2 function parameter 3 0 4 to be able to use this test machine 3 1 6 Perform this test 302 of this product 300. Various tests 302 of product 300 are performed by the test unit 306. The test unit 306 at least includes, for example, control: transmitting a test signal to the product 300, such as on a wafer. Each chip to be tested is tested for the quality of the product 3000; the response signal returned by each product 300 is received, and the 10 paper sizes are applied to the Chinese National Standard (CNS) A4 specification (210X 297) .............. Change ........., 耵 ......... ^ 0 (Please read the notes on the back before filling in this page) Five I printed the A7 by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs ------- B7 Invention Description () A pair of G-signal and G-pair of the product and the response signal were judged, and the product tested was 300 bets. For example, when performing a pin test on a wafer under test u_testing, 疋 306 will send a corresponding test signal to the wafer under test. The Japanese film received this test signal 3406. u 卩 generates a response signal. When the test unit owes the response signal of the signal to the test chip, it will perform a comparison between the test signal and the response signal, and the σ ^ Α of the chip will judge the test crystal based on the comparison result. Oral quality, and the quality of the wafer is obtained. The test unit 306 synthesizes each of the crystals to be measured on the circle, and the quality parameter 308 of the Japanese-Japanese slice of the whole slice a, to judge the quality of the u-Japanese yen and the possible number 3 〇. 1-pass error, and the quality of the wafer is different. Because of the characteristics of the pin test board, the symbol 14 will affect the selection of the test unit 314 by the test unit 306. The test system of the probe board with the same characteristics will be used to measure the board system 312 'and the probe board group 3 1 2 will be included in the module of the wafer pin: under / manufacturing system. For example, t :, the pin test board includes two types: a single chip, two chips can be tested at a time, or each: a male type can be tested, and the test model of the pin tester 3 1 4 may Including two /, 忐 test one wafer, two wafers, or multiple wafers. Therefore, the same pin test board type needs to choose the corresponding test model 3 丨 4, that is, the test unit 3 06 selects the pin test board group that can only test one chip at a time. 3 1 2 'Test unit 306 You must select a test model that can only test one wafer at a time 3 1 4. Each test model 3 1 4 includes one test machine 3 1 6 or multiple test machines 3 1 6. Moreover, because whether the test machine 3 1 6 is in this paper size or not, the Chinese National Standard (CNS) A4 specification (210X 297 mm) applies ............... I (Please read first Note on the back, write this page again), v'tr 2 9 2 12 A7 _B7_. V. Description of the invention () (Please read the notes on the back before filling this page) On the same test model 3 1 4 Each test machine 3 1 6 may have different functions and equipment. The test function and equipment that each test machine 3 1 6 has is corresponding to the current function parameter 3 1 8. Therefore, the current function parameter 3 1 8 of each test machine 3 1 6 is incorporated into the module of the wafer execution test manufacturing execution system to individually manage the functions of each test machine 3 1 6. Therefore, when performing a certain product 3 00 and one of the tests 3 02, the current functional parameters 3 1 6 of the test machine 3 1 6 selected by the test unit 3 06 must comply with this test of the product 3 00 3 02 requires functional parameter 3 04 in order to use this test machine 3 1 6 to perform this test 302 of this product 3 00. One advantage of the present invention is that the test execution unit, the quality parameters of the wafer, the quality parameters of the wafer, and the properties of the pin test board are built into the module of the wafer execution test execution execution module, which makes the manufacturing execution system more The delay is complete and makes the test formula more clear. Therefore, the quality control ability on the line can be increased, and the reliability of the needle testing process can be greatly improved, thereby achieving the purpose of improving product yield. Another advantage of the invention printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs is that the functions required for each test of the product are established in the product parameters, and the functions of each pin test machine are established in the machine. In the parameters, the functions of individual pin testers are managed. Therefore, the complexity of the manufacturing execution system can be effectively improved, and system maintenance is simpler and easier. As a result, the maintenance burden of the manufacturing execution system can be greatly reduced, thereby achieving the purpose of reducing the human resources and costs of system maintenance ^ 12 This paper standard applies to the Chinese National Standard (CNS) A4 specification (210X297 mm) 1221912 A7 B7 V. Description of the Invention () As understood by those familiar with this technology, the above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the patent application for the present invention; all others without departing from the spirit disclosed by the present invention All equivalent changes or modifications should be included in the scope of patent application described below. (Please read the precautions on the back before filling out this page) Printed by the Employees' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 13 This paper size applies to China National Standard (CNS) A4 (210X297 mm)