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1 ·本技蟄適用領域 本技*適用於積體電路（Integrated Circuit， 1C)之漁】2 具。特別是用於通訊用積體電路之測試。 ^ /台 2 ·背景說明 圖1 · 先前技藝 顯示先前技藝以電路板基材12上製 3， =應於待測試之IC之金屬m卜這種設計由於測 金屬腳U係剛性接觸，所以容 ：墊U與 短。測試塾”可以是平面狀，也可以是尖出:具f命减 不便是尖端突出狀，尖端突 ，如圖所 靠性。可以k咼接點的接觸可 圖2 ·圖1的頂視圖 說明同上。 3.本技藝的摘要說明 本技藝的目的乃是設計—種具 具，以彈性接點取代剛性接點、妾點的積體電路測4 讶點，以便延長 吩州试治 、長治具壽命。 4 ·較佳實施例1 · Applicable field of this technology This technology * is applicable to 2 integrated circuit (1C) fishing. Especially for testing integrated circuits for communication. ^ / 台 2 · Background Description Figure 1 · The previous technique shows that the previous technique is made on the circuit board substrate 12 = 3, which should be applied to the metal of the IC to be tested. This design is due to the rigid contact of the metal foot U, so the content: Pad U with short. "Test 塾" can be flat or pointed out: the inconvenience of f is the protrusion of the tip, the tip is protruding, as shown in the figure. The contact of the k 咼 contact can be illustrated in Figure 2 · Top view of Figure 1 Ibid. 3. The summary of this technique explains that the purpose of this technique is to design a tool with integrated circuits that replace rigid contacts and puppet points with elastic contacts. Lifetime 4 · Preferred embodiment
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12 ;電路13，安置在前述之電路板基材12上 2，對應於待測試之1(：金屬腳n ;以及橡皮 彈丨生元件1 4，安置於前述之電路測試墊1 7與 材1 2之間，提供彈性接點之功能，用以測試 ，具有_試墊 、塑膠· 等 二述之電路板基 前述之IC10。 圖4·圖3的基材頂視圖 述之電 點之功 路 顯示以橡皮、塑膠..·等彈性元件14,安置於 測試墊17與前述之電路板基材12之間，提供彈性： 能’用以測試前述之I C1 〇。 圖5.本技藝實施例二剖視圖 顯示本技藝可以增加一個金屬 區域中央，電性耦合於前述之 具有電路時，可以提供散熱或 可以依據待測試I C的底部高低 些 〇 墊1 5 ’安置於前述之測試墊J 7 金屬基座’以當前述之1C底面 是接地功能。金屬整1 5的厚度 加以設計，可以厚些也可以薄 圖6 ·圖5的基材頂視圖 說明同前。 圖7 · 本技藝實施例三剖視圖 Γ3ί穴餐'可以增加一個金屬基座16，承載安置前述之電路 反土 用。金屬基座16具有一個金屬凸塊152，功能等同方 圖5中的金屬墊15 ’提供散熱或是接地功能。12; circuit 13, placed on the aforementioned substrate 12 of the circuit board 2, corresponding to 1 (metal feet n; to be tested) and rubber element 1-4, placed on the aforementioned circuit test pad 17 and material 1 Between 2, it provides the function of elastic contact for testing. It has the aforementioned IC10 of the circuit board base such as test pad, plastic, etc. Figure 4 · 3 The top view of the electrical circuit of the base It is shown that elastic elements 14 such as rubber, plastic, etc. are placed between the test pad 17 and the aforementioned circuit board substrate 12 to provide elasticity: can be used to test the aforementioned I C1 〇. Figure 5. Embodiment of this technology Two cross-sectional views show that this technique can add a center of a metal area. When electrically coupled to the aforementioned circuit, it can provide heat dissipation or can be based on the height of the bottom of the IC to be tested. 0 Pad 15 'placed on the aforementioned test pad J 7 metal base. The base is based on the grounding function of the aforementioned 1C. The thickness of the whole metal is designed to be thicker or thinner. Figure 6 · The top view of the base material is the same as described above. Figure 7 · Sectional view of the third embodiment of this technology Γ3ί Cavern meal 'can add a metal Seat 16, the placement of the circuit carrier with the anti-earth metal base 16 having a metal bump 152, a functional equivalent of FIG. 5 square metal pad 15 'to provide cooling or grounding.
1220928 五、發明說明（3) 圖8 . 本技藝實施例四剖視圖 顯示測試墊1 7 1製作成為具有尖端形狀的接點，用以提高測試 接觸的可靠度。1220928 V. Description of the invention (3) Fig. 8. Sectional view of the fourth embodiment of the present technology shows that the test pad 1 7 1 is made into a contact with a pointed shape to improve the reliability of the test contact.
前述描述揭示了本發明之較佳實施例以及設計圖式，惟，較 佳實施例以及設計圖式僅是舉例說明，並非用於限制本發明 技藝之權利範圍於此。凡是以均等之技藝手段實施本發明技 藝者、或是以下述之「申請專利範圍」所涵蓋之權利範圍而 實施者，均不脫離本發明之精神而為申請人之權利範圍。The foregoing description discloses the preferred embodiments and design drawings of the present invention. However, the preferred embodiments and design drawings are merely examples and are not intended to limit the scope of rights of the technology of the present invention. Anyone who implements the technology of the present invention with equal technical means or the scope of rights covered by the “Scope of Patent Application” described below shall not deviate from the spirit of the present invention but be the scope of the applicant's rights.
第6頁 1220928 圖式簡單說明 5 . 圖式的簡單說明 圖1 .先前技藝 圖2 .圖1的頂視圖 圖3 . 本技藝實施例一剖視圖 圖4 .圖3的基材頂視圖 圖5 . 本技藝實施例二剖視圖 圖6 . 圖5的基材頂視圖 圖7 . 本技藝貫施例二剖視圖 圖8 . 本技藝實施例四剖視圖 6.元件編號表 10 積體電路 11 金屬腳 12 電路板基材 13 電路 14 彈性元件 15. 152. 金屬墊 16 金屬基座 17. 171. 測試墊Page 6 1220928 Simple description of the drawing 5. Simple illustration of the drawing Figure 1. Prior art Figure 2. Top view of Figure 1 Figure 3. Sectional view of the first embodiment of the technology Figure 4. Top view of the substrate of Figure 3 Figure 5. Sectional view of the second embodiment of the technology FIG. 6. Top view of the substrate of FIG. 5 FIG. 7. Sectional view of the second embodiment of the technology FIG. 8. Sectional view of the fourth embodiment of the technology 6. Component number table 10 Integrated circuit 11 Metal feet 12 Circuit board Base material 13 Circuit 14 Elastic element 15. 152. Metal pad 16 Metal base 17. 171. Test pad
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