TWI220169B - Testing structure and printed circuit board having the same - Google Patents

Abstract

A testing structure for disposing on a printed circuit board to detect the press condition of the anisotropic conductive film pressed on the testing structure. The testing structure is consisted of a pad and pluralities of leads, wherein the pad is disposed on one side of the printed circuit board, and the leads are disposed on the printed circuit board located at the corresponding two side of the pad.

Description

The present invention relates to a test structure and a circuit board having the test structure, and particularly to an easily attachable structure with anisotropic conductive film (ACF) and easy detection structure and a circuit board having the test structure. '"Prior art 1220169 V. Description of the invention (1) The technology of the invention belongs to GAO ^ The purpose of connecting the circuit board and the crystal panel after the liquid crystal display and the liquid crystal panel are joined. Generally, it is through the contacts of the circuit board. Printed Circui circuit board contacts are crimped, and the connection pins are connected to the connection circuit board. The above-mentioned connection or failure will affect the connection, so the two sides of the alien on the circuit board side must be When an electric film is configured, the board is pressed, and the test of the electric film is also performed. The π% cut chip and method are used to package the driving chip on a circuit board, and the liquid crystal panel is bonded to achieve the bonding of the driving chip. And g where the circuit board and the liquid crystal panel are electrically connected, the anisotropic conductive film is arranged on the top, and then the pins at both ends of the flexible circuit board (Flexible t, FPC) correspond to the panel and = "By the pin, so that the conductive particles in the anisotropic conductive film can ^ point both" to the liquid panel and the circuit board by soft

In the combined method, the pressing of the anisotropic conductive thin film to the liquid crystal panel and the circuit board (driving chip of the non-anisotropic conductive film is tested.): J test structures, and on the circuit board: On the test structure. On the flexible circuit board panel: Press the anisotropic conductive film on the test structure.

1220169

V. Description of the invention (2)

"Trial test" uses a sensor to test the test structure. When the anisotropic conductive film is pressed well, the bond between the flexible circuit board and the circuit board is good. It ’s like #. There are two types of test structures most commonly used today. One = two. As shown in Figure 1, the two ends of the circuit board 〇〇〇 are arranged by a plurality of thin white sentences ί I ΠΑ > Π ί ^ ν The dummy lead constituted by the 2nd-104. The other is as shown in the figure, a dummy pad with a certain area of positive film is arranged at both ends of the circuit board 200 ) 204 〇 Above,: ,,, and 'When using the dummy 1 ead 1 04 in Figure 1 as a test structure for testing, because the lead width and line spacing are small, In addition, the anisotropic conductive film on it will fluctuate with the setting of the pins, which makes the sensor difficult to detect. In addition, if the pseudo-pad 204 of Fig. 2 is used as a test structure for testing ， Because the anisotropic conductive film is not easy to be attached to the pseudo-pad 204, Test the pressed state of the hibiscus to determine whether the circuit board and the flexible circuit board are correctly pressed. SUMMARY OF THE INVENTION Therefore, the present invention aims to test the circuit board of the structure, and the above is to provide a test structure and With the ability to make the anisotropic conductive film total

Another object of the present invention is to provide a circuit board with a test junction structure, which can make the sensor easy to pick up. With this test, the present invention proposes a test structure, which is suitable for being arranged in two or two for detecting the pressure on An anisotropy on this test structure; on a circuit board, in October, this test structure is composed of a gasket and a plurality of chanting films laminated with μ, where

1220169 V. Description of the invention (3) The pads are arranged on the two sides corresponding to the electric pattern. The pins on the long sides will not be easily peelable due to the square conductive liquid crystal surface and the two substrate pins of the two crystal panel. They are placed in the rectangular shape of the substrate, parallel to the upper phase. One side of the board, the side of the board. And the bow and foot are arranged on a general circuit board, which is suitable for using this board for this lightning technology; Ite + flexible circuit board electrical c. The tail circuit board is mainly composed of a trial structure. The basin is connected to at least one end: side and side: the test structure is arranged on the substrate. The lining structure further includes-a pad is arranged on the above side of the substrate, and the pad is on the substrate on both sides. . In the test structure and the circuit board, the pad pattern is included in the test structure and the circuit board described above, in which the pins are marked with and the long sides parallel to the corresponding two sides of the pad. = The test structure is composed of pads and pins, where the anisotropic conductive film after lamination is easy to be attached to it. After passing through the anisotropic conductive film lamination step, the different month b is good enough. Attaches to pads and pins and is not easy to peel

γ 'Because the gasket is a rectangular piece, it is good for the sensor to play Γ'. 'In the case where the anisotropic conductive film on the profile is well attached, the detector will be able to detect it fairly easily. Test whether the anisotropic conductive film on the structure is well pressed. ^ Enable the above and other objects, features, and advantages of the present invention to be more apparent. A preferred embodiment is given below in conjunction with the accompanying drawings for details.

丄 以 υ 169

Also, 'the substrate 3 02 also has a plurality of driving chip arrangement regions (for example, wafer holders, not shown) and a wiring (not shown) for electrically connecting the driving chip arrangement regions to the bonding region 300, first, A driving chip (not shown) is disposed thereon, and the driving chip is electrically connected to a cloth on the substrate 30

11087twf.ptd Page 8 1220169 V. Description of the Invention (5) ----- The wire, so that the chip's electrical 304 contacts can be driven by wiring. When connecting the circuit board and the liquid-day panel of the circuit board with the test structure of the present invention configured in accordance with the main bonding area, fΪ3 in FIG. 3, firstly, an anisotropic conductive film (Anis〇tr CDndUctlve fnm, ACF) is configured. In the bonding area of the liquid crystal panel, and in the bonding area 300 and the test structure 306 of the substrate 302, two flexible printed circuit (FPC) pins 1 and 2 are respectively arranged in the bonding area of the panel and The bonding region of the substrate 30 is on an anisotropic conductive film. Then, the flexible circuit boards at both ends are pressed, and when the 300 side of the circuit board is pressed, this anisotropic conductive film bonding step also compresses the anisotropic conductive film on the test structure 306. After that, the sensor is used to detect the compression result of the square conductive film on the test structure 306 to detect whether the circuit board 300 and the flexible circuit are correctly pressed.疋 In the above-mentioned circuit board 300 which has undergone the anisotropic conductive film lamination step, since the test structure 306 is composed of the pad 308 and the lead 310, the straight lead 310 will help the pressure After bonding, the anisotropic conductive thin sheet is easy to be attached to it and is not easy to peel off. Therefore, after the pressing step, the anisotropic conductive film can be well attached to the pad 3008 and the lead 3 1〇. It is not easy to peel off. 〇 Furthermore, because the gasket 308 is a whole piece of rectangle, it is convenient for the sensor to detect, and the sensor will be quite easy when the anisotropic conductive film on the gasket 308 is well attached. It is detected whether the anisotropic conductive film on the test structure 3 0 6 is well pressed.

1220169

11087twf.ptd Page 10 1220169 Brief Description of Drawings Figure 1 shows the top view of a conventional configuration of pseudo pins on a circuit board as a test structure. Figure 2 shows a top view of a conventional arrangement of pseudo pads on a circuit board as a test structure. FIG. 3 is a top view of a circuit board configured with a test structure of the present invention according to a preferred embodiment of the present invention. Graphical description: 100, 200, 300: circuit board 1 0 2, 2 0 2, 3 0 4: bonding area 104: pseudo pin 2 0 4: pseudo pad 3 0 2: substrate 3 0 6: test structure A: enlarged part

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Claims (1)

1220169 VI. Scope of patent application1. A test structure suitable for being arranged on a circuit board for detecting one of the two anisotropic conductive films on the test structure. The test structure includes a pad and a configuration On one side of the circuit board; and a plurality of pins arranged on the corresponding sides of the pad. The test structure as described in item 1 of the patent application scope. The pad includes A whole piece of rectangle. ′, ° 3 · The test structure described in item 1 of the scope of patent application, wherein these The pins are parallel to each other with their long sides and parallel to the respective sides of the pad with their long sides. 4. A circuit board adapted to be electrically connected to a liquid crystal panel by a flexible circuit board, the circuit board comprising: a substrate; at least one bonding area disposed on one side of the substrate corresponding to the liquid crystal panel; and The test structure is disposed on two substrate ends of the side of the substrate, each of which includes: a pad disposed on one side of the substrate; and a plurality of pins disposed on the side The pads are corresponding to the substrate on both sides. 5. The circuit board according to item 4 of the patent application scope, wherein the pad includes a whole piece of rectangle. 6 · The circuit board as described in item 4 of the scope of patent application, wherein 11087twf.ptd Race 1220169 VI. Scope of patent application Feet are parallel to each other with their long sides and parallel to the corresponding two sides of the pad with their long sides. 7. The circuit board according to item 4 of the scope of patent application, further comprising a plurality of contacts arranged on the substrate in the bonding area. 8. The circuit board according to item 4 of the scope of patent application, wherein the substrate further includes a plurality of driving chip configuration regions, and the driving chip configuration regions are electrically connected to the bonding region. 11087twf.ptd Page 13