TWD236269S - 基板處理裝置用反射板 - Google Patents

基板處理裝置用反射板 Download PDF

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Publication number
TWD236269S
TWD236269S TW110305062D01F TW110305062D01F TWD236269S TW D236269 S TWD236269 S TW D236269S TW 110305062D01 F TW110305062D01 F TW 110305062D01F TW 110305062D01 F TW110305062D01 F TW 110305062D01F TW D236269 S TWD236269 S TW D236269S
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TW
Taiwan
Prior art keywords
design
processing device
substrate processing
difference
view
Prior art date
Application number
TW110305062D01F
Other languages
English (en)
Chinese (zh)
Inventor
佐藤明博
Original Assignee
日商國際電氣股份有限公司 (日本)
日商國際電氣股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 日商國際電氣股份有限公司 (日本), 日商國際電氣股份有限公司 filed Critical 日商國際電氣股份有限公司 (日本)
Publication of TWD236269S publication Critical patent/TWD236269S/zh

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TW110305062D01F 2022-08-10 2023-01-10 基板處理裝置用反射板 TWD236269S (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022017170F JP1733769S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 2022-08-10 2022-08-10
JP2022-017170 2022-08-10

Publications (1)

Publication Number Publication Date
TWD236269S true TWD236269S (zh) 2025-02-11

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Family Applications (1)

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TW110305062D01F TWD236269S (zh) 2022-08-10 2023-01-10 基板處理裝置用反射板

Country Status (3)

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US (1) USD1053157S1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JP1733769S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
TW (1) TWD236269S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1746404S (ja) * 2023-01-11 2023-06-15 サセプタカバーベース

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD197466S (zh) 2018-07-19 2019-05-11 日商國際電氣股份有限公司 基板處理裝置用隔熱板

Family Cites Families (14)

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Publication number Priority date Publication date Assignee Title
US5088006A (en) * 1991-04-25 1992-02-11 International Business Machines Corporation Liquid film interface cooling system for semiconductor wafer processing
US6035100A (en) * 1997-05-16 2000-03-07 Applied Materials, Inc. Reflector cover for a semiconductor processing chamber
US6108491A (en) * 1998-10-30 2000-08-22 Applied Materials, Inc. Dual surface reflector
CN1241731C (zh) * 2001-03-08 2006-02-15 信越半导体株式会社 热射线反射材料和使用热射线反射材料的加热装置
KR100621777B1 (ko) * 2005-05-04 2006-09-15 삼성전자주식회사 기판 열처리 장치
USD654884S1 (en) * 2010-10-21 2012-02-28 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
USD654883S1 (en) * 2010-10-21 2012-02-28 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
TWD174921S (zh) * 2014-12-17 2016-04-11 日本碍子股份有限公司 複合基板之部分
JP1565116S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 2016-02-10 2016-12-12
US10283637B2 (en) * 2016-07-18 2019-05-07 Taiwan Semiconductor Manufacturing Co, Ltd. Individually-tunable heat reflectors in an EPI-growth system
USD804437S1 (en) * 2016-09-30 2017-12-05 Norton (Waterford) Limited Circuit board
US10453713B2 (en) * 2016-11-29 2019-10-22 Taiwan Semiconductor Manufacturing Co., Ltd. Method for controlling temperature of furnace in semiconductor fabrication process
JP1700781S (ja) * 2021-03-22 2021-11-29 基板処理装置用断熱板
JP1706320S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 2021-06-28 2022-01-31

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD197466S (zh) 2018-07-19 2019-05-11 日商國際電氣股份有限公司 基板處理裝置用隔熱板

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JP1733769S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 2023-01-06
USD1053157S1 (en) 2024-12-03

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