TWD213645S - 內建積體電路卡 - Google Patents

內建積體電路卡 Download PDF

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Publication number
TWD213645S
TWD213645S TW109304779F TW109304779F TWD213645S TW D213645 S TWD213645 S TW D213645S TW 109304779 F TW109304779 F TW 109304779F TW 109304779 F TW109304779 F TW 109304779F TW D213645 S TWD213645 S TW D213645S
Authority
TW
Taiwan
Prior art keywords
integrated circuit
circuit cards
cards
none
item
Prior art date
Application number
TW109304779F
Other languages
English (en)
Chinese (zh)
Inventor
近藤敦志
渡邊勝好
Original Assignee
日商鎧俠股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商鎧俠股份有限公司 filed Critical 日商鎧俠股份有限公司
Publication of TWD213645S publication Critical patent/TWD213645S/zh

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TW109304779F 2020-02-27 2020-08-25 內建積體電路卡 TWD213645S (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-003737 2020-02-27
JPD2020-3737F JP1661378S (ja) 2020-02-27 2020-02-27

Publications (1)

Publication Number Publication Date
TWD213645S true TWD213645S (zh) 2021-09-01

Family

ID=70976143

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109304779F TWD213645S (zh) 2020-02-27 2020-08-25 內建積體電路卡

Country Status (3)

Country Link
US (1) USD980810S1 (ja)
JP (1) JP1661378S (ja)
TW (1) TWD213645S (ja)

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US7830666B2 (en) * 2000-01-06 2010-11-09 Super Talent Electronics, Inc. Manufacturing process for single-chip MMC/SD flash memory device with molded asymmetric circuit board
JP3768761B2 (ja) * 2000-01-31 2006-04-19 株式会社日立製作所 半導体装置およびその製造方法
USD457887S1 (en) * 2001-09-28 2002-05-28 Sony Corporation Recording medium
USD466119S1 (en) * 2001-10-24 2002-11-26 Sony Corporation Machine for identifying fingerprint
JP2006119983A (ja) * 2004-10-22 2006-05-11 Renesas Technology Corp Ｉｃカードおよびその製造方法
JP2006128459A (ja) * 2004-10-29 2006-05-18 Renesas Technology Corp 半導体装置およびその製造方法
KR100674926B1 (ko) * 2004-12-08 2007-01-26 삼성전자주식회사 메모리 카드 및 그 제조 방법
USD552612S1 (en) * 2005-05-24 2007-10-09 Renesas Technology Corporation Memory card
USD552098S1 (en) * 2005-05-24 2007-10-02 Renesas Technology Corporation Memory card
TWI249772B (en) * 2005-06-07 2006-02-21 Siliconware Precision Industries Co Ltd Semiconductor device for accommodating large chip, fabrication method thereof, and carrier used in the semiconductor device
USD588597S1 (en) * 2007-12-17 2009-03-17 Panasonic Corporation IC memory card
USD588599S1 (en) * 2008-04-01 2009-03-17 Panasonic Corporation IC memory card
USD588598S1 (en) * 2008-04-01 2009-03-17 Panasonic Corporation IC memory card
USD643431S1 (en) 2010-05-17 2011-08-16 Panasonic Corporation Memory card
USD639812S1 (en) * 2010-05-17 2011-06-14 Panasonic Corporation Memory card
USD643432S1 (en) 2010-05-17 2011-08-16 Panasonic Corporation Memory card
AP00326S1 (en) * 2010-12-03 2013-02-20 Yoshitaka Aoki Recording media
JP2015005140A (ja) * 2013-06-20 2015-01-08 株式会社東芝 半導体記憶装置及び製造方法
USD729250S1 (en) * 2013-07-30 2015-05-12 Samsung Electronics Co., Ltd. Semiconductor memory device
CN105989403B (zh) * 2015-03-02 2018-12-04 昆山纬绩资通有限公司 存储卡的存取装置及存储卡存取装置的控制方法
USD814473S1 (en) * 2016-01-19 2018-04-03 Sony Corporation Memory card
USD848431S1 (en) * 2016-01-19 2019-05-14 Sony Corporation Memory card
JP1580899S (ja) * 2016-11-15 2017-07-10
USD934868S1 (en) * 2018-02-28 2021-11-02 Sony Corporation Memory card
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USD872033S1 (en) * 2018-09-14 2020-01-07 Telit Communications S.P.A. Connection module
USD902164S1 (en) * 2019-01-24 2020-11-17 Toshiba Memory Corporation Integrated circuit card
USD938925S1 (en) * 2019-10-24 2021-12-21 Nuvoton Technology Corporation Japan Semiconductor device
USD934820S1 (en) * 2019-10-24 2021-11-02 Nuvoton Technology Corporation Japan Semiconductor device

Also Published As

Publication number Publication date
JP1661378S (ja) 2020-06-08
USD980810S1 (en) 2023-03-14

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