TWD204701S - Wafer electroplating fixture - Google Patents
Wafer electroplating fixture Download PDFInfo
- Publication number
- TWD204701S TWD204701S TW108304467F TW108304467F TWD204701S TW D204701 S TWD204701 S TW D204701S TW 108304467 F TW108304467 F TW 108304467F TW 108304467 F TW108304467 F TW 108304467F TW D204701 S TWD204701 S TW D204701S
- Authority
- TW
- Taiwan
- Prior art keywords
- wafer electroplating
- electroplating fixture
- fixture
- wafer
- article
- Prior art date
Links
- 238000009713 electroplating Methods 0.000 title description 2
- 235000012431 wafers Nutrition 0.000 abstract description 4
- 238000007747 plating Methods 0.000 abstract 1
Images
Abstract
【物品用途】;本設計物品係用於夾固晶圓用之晶圓電鍍夾具。[Use of article]; This designed article is a wafer plating fixture used to clamp wafers.
Description
本設計物品係用於夾固晶圓用之晶圓電鍍夾具。This design item is used for wafer electroplating fixture for clamping wafers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW108304467F TWD204701S (en) | 2019-07-26 | 2019-07-26 | Wafer electroplating fixture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW108304467F TWD204701S (en) | 2019-07-26 | 2019-07-26 | Wafer electroplating fixture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWD204701S true TWD204701S (en) | 2020-05-11 |
Family
ID=88980261
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW108304467F TWD204701S (en) | 2019-07-26 | 2019-07-26 | Wafer electroplating fixture |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWD204701S (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM564255U (en) | 2018-04-11 | 2018-07-21 | 姜力 | Wafer fixture for electroplating equipment |
-
2019
- 2019-07-26 TW TW108304467F patent/TWD204701S/en unknown
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM564255U (en) | 2018-04-11 | 2018-07-21 | 姜力 | Wafer fixture for electroplating equipment |
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