TWD191628S - Air supply nozzle for substrate processing apparatus - Google Patents
Air supply nozzle for substrate processing apparatusInfo
- Publication number
- TWD191628S TWD191628S TW106306048F TW106306048F TWD191628S TW D191628 S TWD191628 S TW D191628S TW 106306048 F TW106306048 F TW 106306048F TW 106306048 F TW106306048 F TW 106306048F TW D191628 S TWD191628 S TW D191628S
- Authority
- TW
- Taiwan
- Prior art keywords
- processing apparatus
- gas
- substrate processing
- supply nozzle
- air supply
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title abstract description 7
Abstract
【物品用途】;本設計的物品是基板處理裝置用供氣噴嘴，為一種供給用來處理沿著垂直方向多段地被保持在基板處理裝置中的反應管內部的基板之處理氣體的供給噴嘴。;【設計說明】;本設計，氣體是從：將圓筒形的噴嘴彎折成U字狀後的前端部來供給，而這個氣體是在噴嘴內將壓力、流速、熱氣影響都調整均勻之後才供給到反應管內部。[Use of article] The article of this design is a gas supply nozzle for a substrate processing apparatus. It is a supply nozzle that supplies processing gas for processing substrates held in multiple stages along the vertical direction inside a reaction tube in a substrate processing apparatus. ;[Design Description];In this design, the gas is supplied from the front end of the cylindrical nozzle bent into a U shape, and this gas is adjusted evenly in the nozzle after the pressure, flow rate, and hot gas influence are all evenly adjusted. before being supplied to the inside of the reaction tube.
Description
本設計的物品是基板處理裝置用供氣噴嘴，為一種供給用來處理沿著垂直方向多段地被保持在基板處理裝置中的反應管內部的基板之處理氣體的供給噴嘴。 The article of the present invention is a supply nozzle for a substrate processing apparatus, and is a supply nozzle for supplying a processing gas for processing a substrate which is held inside the reaction tube in a plurality of stages in the substrate processing apparatus in the vertical direction.
本設計，氣體是從：將圓筒形的噴嘴彎折成U字狀後的前端部來供給，而這個氣體是在噴嘴內將壓力、流速、熱氣影響都調整均勻之後才供給到反應管內部。 In this design, the gas is supplied from a front end portion in which a cylindrical nozzle is bent into a U shape, and this gas is supplied to the inside of the reaction tube after the pressure, the flow rate, and the influence of the hot gas are uniformly adjusted in the nozzle. .
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2017-8113F JP1589673S (en) | 2017-04-14 | 2017-04-14 | |
| JP2017-008113 | 2017-04-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWD191628S true TWD191628S (en) | 2018-07-11 |
Family
ID=60162854
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW106306048F TWD191628S (en) | 2017-04-14 | 2017-10-13 | Air supply nozzle for substrate processing apparatus |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | USD847301S1 (en) |
| JP (1) | JP1589673S (en) |
| TW (1) | TWD191628S (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP1605945S (en) | 2017-12-27 | 2018-06-04 | ||
| USD893673S1 (en) * | 2018-05-11 | 2020-08-18 | Tianjin Tianchuang Best Pure Environmental Science And Technology Co., Ltd. | Water filter |
| USD888196S1 (en) * | 2018-07-05 | 2020-06-23 | Kokusai Electric Corporation | Gas nozzle for substrate processing apparatus |
| JP1644261S (en) * | 2019-03-20 | 2019-10-28 | ||
| JP1684258S (en) * | 2020-07-27 | 2021-04-26 | ||
| JP1731676S (en) * | 2022-05-30 | 2022-12-08 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW573562U (en) | 2003-01-03 | 2004-01-21 | Applied Materials Inc | Gas nozzle for substrate processing chamber |
| TWI324806B (en) | 2005-08-05 | 2010-05-11 | Hitachi Int Electric Inc | Substrate processing apparatus, cooling gas feed nozzle and method for manufacturing semiconductor device |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3387877A (en) * | 1967-05-15 | 1968-06-11 | Constantines Christodolu | Retrieving tool |
| FR2871395B1 (en) * | 2004-06-11 | 2006-09-15 | David Weill | SIMPLIFIED CLEANING AND FILLING DEVICE |
| WO2010023306A2 (en) * | 2008-09-01 | 2010-03-04 | Shell Internationale Research Maatschappij B.V. | Self cleaning arrangement |
| US9067246B2 (en) * | 2012-09-14 | 2015-06-30 | R 2 Solutions LLC | Water service line repair |
| JP1520999S (en) * | 2014-09-02 | 2015-04-06 | ||
| JP1521275S (en) * | 2014-09-10 | 2015-04-13 | ||
| JP1534651S (en) * | 2015-01-28 | 2015-10-05 | ||
| USD783785S1 (en) * | 2015-01-30 | 2017-04-11 | Criser, S.A. De C.V. | Drain hose |
-
2017
- 2017-04-14 JP JPD2017-8113F patent/JP1589673S/ja active Active
- 2017-10-12 US US29/621,948 patent/USD847301S1/en active Active
- 2017-10-13 TW TW106306048F patent/TWD191628S/en unknown
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW573562U (en) | 2003-01-03 | 2004-01-21 | Applied Materials Inc | Gas nozzle for substrate processing chamber |
| TWI324806B (en) | 2005-08-05 | 2010-05-11 | Hitachi Int Electric Inc | Substrate processing apparatus, cooling gas feed nozzle and method for manufacturing semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| USD847301S1 (en) | 2019-04-30 |
| JP1589673S (en) | 2017-10-30 |
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