TWD177216S - Light emitting diode package - Google Patents

Light emitting diode package

Info

Publication number
TWD177216S
TWD177216S TW104300800F TW104300800F TWD177216S TW D177216 S TWD177216 S TW D177216S TW 104300800 F TW104300800 F TW 104300800F TW 104300800 F TW104300800 F TW 104300800F TW D177216 S TWD177216 S TW D177216S
Authority
TW
Taiwan
Prior art keywords
base
design
emitting diode
diode package
light
Prior art date
Application number
TW104300800F
Other languages
Chinese (zh)
Inventor
Hou-Te Lin
Chao-Hsiung Chang
Pin-Chuan Chen
Lung-Hsin Chen
Original Assignee
榮創能源科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 榮創能源科技股份有限公司 filed Critical 榮創能源科技股份有限公司
Publication of TWD177216S publication Critical patent/TWD177216S/en

Links

Abstract

【物品用途】;本設計物品，其應用於顯示或照明領域。;【設計說明】;本創作發光二極體封裝具有其獨特創意表現之造型設計。如圖所示，所述發光二極體封裝之基座的一角形成盲孔，電極嵌入在基座內且底面外露在基座的底部表面，基座之周緣分別設置有可外接的電極接點，該基座的頂部形成有兩個相互間隔的凹陷以成型相互間隔的兩個發光區域。視覺上嵌設連接的設計給予整體平衡的對稱感，同時精巧的佈局給人以豐富的視覺享受，一舉變革傳統習知結構讓人有單調、呆板之外觀設計。【Item Usage】;This design item is used in the field of display or lighting. ;[Design Description];This light-emitting diode package has a unique and creative design. As shown in the figure, a blind hole is formed in one corner of the base of the light-emitting diode package. The electrode is embedded in the base and the bottom surface is exposed on the bottom surface of the base. The periphery of the base is provided with external electrode contacts. , the top of the base is formed with two mutually spaced depressions to form two mutually spaced light-emitting areas. The design of visually embedded connections gives the overall balance of symmetry, while the exquisite layout gives people rich visual enjoyment, changing the monotonous and dull appearance design of traditional structures in one fell swoop.

TW104300800F 2015-02-05 2015-02-12 Light emitting diode package TWD177216S (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201530034760 2015-02-05

Publications (1)

Publication Number Publication Date
TWD177216S true TWD177216S (en) 2016-07-21

Family

ID=56556390

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104300800F TWD177216S (en) 2015-02-05 2015-02-12 Light emitting diode package

Country Status (2)

Country Link
US (1) USD763207S1 (en)
TW (1) TWD177216S (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1531505S (en) * 2015-03-10 2015-08-17
TWD212737S (en) 2020-07-06 2021-07-21 晶元光電股份有限公司 Part of light-emitting device

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6107644A (en) * 1997-01-24 2000-08-22 Rohm Co., Ltd. Semiconductor light emitting device
US6268618B1 (en) * 1997-05-08 2001-07-31 Showa Denko K.K. Electrode for light-emitting semiconductor devices and method of producing the electrode
TWD146468S1 (en) * 2011-05-24 2012-04-11 隆達電子股份有限公司 Chip
US7264378B2 (en) * 2002-09-04 2007-09-04 Cree, Inc. Power surface mount light emitting die package
USD505661S1 (en) * 2003-07-09 2005-05-31 Nichia Corporation Light emitting diode
JP4963807B2 (en) * 2005-08-04 2012-06-27 昭和電工株式会社 Gallium nitride compound semiconductor light emitting device
USD535264S1 (en) * 2005-11-02 2007-01-16 Supernova Optoelectronics Corp. Electrode layer
USD566056S1 (en) * 2006-12-20 2008-04-08 Cree, Inc. LED chip
USD618637S1 (en) * 2009-10-30 2010-06-29 SemiLEDs Optoelectronics Co., Ltd. Light emitting diode device
USD633876S1 (en) * 2009-10-30 2011-03-08 Semi LEDs Optoelectronics Co., Ltd. Light emitting diode device
USD664103S1 (en) * 2009-11-13 2012-07-24 Nichia Corporation Light emitting diode
JP2011119519A (en) * 2009-12-04 2011-06-16 Showa Denko Kk Semiconductor light emitting element and semiconductor light emitting device
USD645421S1 (en) * 2010-07-16 2011-09-20 Harvatek Corporation LED base
JP2012054525A (en) * 2010-08-04 2012-03-15 Toshiba Corp Semiconductor light-emitting device
USD648287S1 (en) * 2011-03-30 2011-11-08 Epistar Corporation Light-emitting diode
USD656908S1 (en) * 2011-07-05 2012-04-03 Epistar Corporation Light emitting device
USD674361S1 (en) * 2012-03-30 2013-01-15 Silitek Electronic (Guangzhou) Co., Ltd. LED package
USD698742S1 (en) * 2012-09-27 2014-02-04 Kabushiki Kaisha Toshiba Light-emitting diode
USD698744S1 (en) * 2012-10-18 2014-02-04 Kabushiki Kaisha Toshiba Light-emitting diode
TWD155116S (en) * 2012-12-27 2013-08-01 隆達電子股份有限公司 Light emitting diode package
USD722578S1 (en) * 2013-05-30 2015-02-17 Kabushiki Kaisha Toshiba Light-emitting diode chip

Also Published As

Publication number Publication date
USD763207S1 (en) 2016-08-09

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