TWD155116S - Light emitting diode package - Google Patents

Light emitting diode package

Info

Publication number
TWD155116S
TWD155116S TW101307819F TW101307819F TWD155116S TW D155116 S TWD155116 S TW D155116S TW 101307819 F TW101307819 F TW 101307819F TW 101307819 F TW101307819 F TW 101307819F TW D155116 S TWD155116 S TW D155116S
Authority
TW
Taiwan
Prior art keywords
shaped metal
metal brackets
creation
vehicle body
carrier body
Prior art date
Application number
TW101307819F
Other languages
Chinese (zh)
Inventor
pei song Cai
Shing Kuo Chen
Chun Wei Wang
Original Assignee
隆達電子股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 隆達電子股份有限公司 filed Critical 隆達電子股份有限公司
Priority to TW101307819F priority Critical patent/TWD155116S/en
Priority to US29/456,955 priority patent/USD712851S1/en
Publication of TWD155116S publication Critical patent/TWD155116S/en

Links

Abstract

【物品用途】;本創作係為一種可應用於一般照明及背光裝置,用於封裝發光二極體並提供光源效果之發光二極體封裝。;【創作特點】;如各附圖所示,本創作之發光二極體封裝包含有概呈矩形的一載具本體以及結合於載具本體下方之三金屬支架;該載具本體具有上窄下寬且帶有圓弧邊角的梯形上半部,以及厚度較上半部薄的矩形下半部。此外,如立體圖及俯視圖所示,該載具本體頂面上嵌置一圓形窗片,且於一角落上設有一圓形凹槽。;如立體圖2及仰視圖所示,前述的三金屬支架彼此被隔開,並包含有位在載具本體的底部設計有一概成T型的金屬支架,以及輪廓形狀對稱且分別設在載具本體的底部下方左右兩側概成L型的兩金屬支架。其中,T型金屬支架左右兩端以及L型兩金屬支架的外側端分別具有相同的階級狀形狀設計且端緣凸出於該載具本體下半部外側,T型金屬支架的中央具有朝下延伸的一凸出塊,而L型兩金屬支架則分別具有匹配前述凸出塊的缺口設計。;此外,在T型金屬支架的左右側分別設計有兩個孔,而兩L型金屬支架的外側亦分別設有一個孔,四個孔和載具本體底部分別延伸出的底柱相互嵌合。;本創作尚未揭露於申請日前之公開物品,符合新穎性及創作性之新式樣專利要件,爰依法提出新式樣專利申請。[Use of the article]; This creation is a LED package that can be applied to general lighting and backlight devices, used to package LEDs and provide light source effects. ; [Features of the creation]; As shown in the attached figures, the LED package of this creation includes a roughly rectangular carrier body and three metal brackets combined under the carrier body; the carrier body has a trapezoidal upper half that is narrow at the top and wide at the bottom and has rounded corners, and a rectangular lower half that is thinner than the upper half. In addition, as shown in the three-dimensional view and the top view, a circular window is embedded on the top surface of the carrier body, and a circular groove is provided on one corner. ;As shown in the three-dimensional figure 2 and the bottom view, the three metal brackets are separated from each other and include a T-shaped metal bracket located at the bottom of the vehicle body, and two L-shaped metal brackets with symmetrical outlines and located on the left and right sides of the bottom of the vehicle body. The left and right ends of the T-shaped metal bracket and the outer ends of the two L-shaped metal brackets have the same hierarchical shape design and the end edges protrude from the outer side of the lower half of the vehicle body. The center of the T-shaped metal bracket has a protruding block extending downward, and the two L-shaped metal brackets have a notch design matching the protruding block. ;In addition, two holes are designed on the left and right sides of the T-shaped metal bracket, and one hole is also provided on the outer sides of the two L-shaped metal brackets. The four holes are interlocked with the bottom pillars extending from the bottom of the vehicle body. ;This creation has not yet disclosed any public articles before the application date, and meets the new design patent requirements of novelty and creativity, so a new design patent application is filed in accordance with the law.

TW101307819F 2012-12-27 2012-12-27 Light emitting diode package TWD155116S (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW101307819F TWD155116S (en) 2012-12-27 2012-12-27 Light emitting diode package
US29/456,955 USD712851S1 (en) 2012-12-27 2013-06-05 Light emitting diode package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW101307819F TWD155116S (en) 2012-12-27 2012-12-27 Light emitting diode package

Publications (1)

Publication Number Publication Date
TWD155116S true TWD155116S (en) 2013-08-01

Family

ID=51455650

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101307819F TWD155116S (en) 2012-12-27 2012-12-27 Light emitting diode package

Country Status (2)

Country Link
US (1) USD712851S1 (en)
TW (1) TWD155116S (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD729751S1 (en) * 2012-03-29 2015-05-19 Nichia Corporation Light emitting diode
USD727273S1 (en) 2012-09-27 2015-04-21 Nichia Corporation Light emitting diode
USD728491S1 (en) * 2012-12-12 2015-05-05 Nichia Corporation Light emitting diode
USD731987S1 (en) * 2012-12-28 2015-06-16 Nichia Corporation Light emitting diode
TWD161267S (en) * 2013-07-31 2014-06-21 隆達電子股份有限公司 Light emitting diode package
TWD161266S (en) * 2013-07-31 2014-06-21 隆達電子股份有限公司 Light emitting diode package
TWD167977S (en) * 2014-06-27 2015-05-21 隆達電子股份有限公司 Lead frame for light-emitting diode
USD763206S1 (en) * 2015-01-29 2016-08-09 Advanced Optoelectronic Technology, Inc. Light emitting diode package
TWD177216S (en) * 2015-02-05 2016-07-21 榮創能源科技股份有限公司 Light emitting diode package
JP1531505S (en) * 2015-03-10 2015-08-17
TWD193225S (en) * 2016-06-17 2018-10-01 億光電子工業股份有限公司 Light emitting diode
USD899384S1 (en) 2019-11-04 2020-10-20 Putco, Inc. Surface-mount device
USD1052791S1 (en) * 2021-12-31 2024-11-26 Foshan Nationstar Optoelectronics Co., Ltd. Light emitting diode lead-frame
USD1080931S1 (en) * 2022-06-01 2025-06-24 Ligitek Electronics Co., Ltd. Light emitting diode package
JP1740013S (en) * 2022-10-19 2023-03-27 semiconductor light emitting module

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD517025S1 (en) * 2003-03-17 2006-03-14 Nichia Corporation Light emitting diode
USD505397S1 (en) * 2003-09-15 2005-05-24 Nichia Corporation Light emitting diode
USD573113S1 (en) * 2005-12-09 2008-07-15 Nichia Corporation Light emitting diode
USD568261S1 (en) * 2006-10-12 2008-05-06 Samsung Electro-Mechanics Co., Ltd. Light-emitting diode
USD576573S1 (en) * 2007-07-17 2008-09-09 Rohm Co., Ltd. Light emitting diode module
USD633631S1 (en) * 2007-12-14 2011-03-01 Cree Hong Kong Limited Light source of light emitting diode
USD593967S1 (en) * 2008-02-01 2009-06-09 C. I. Kasei Company, Limited Light emitting device
US10431567B2 (en) * 2010-11-03 2019-10-01 Cree, Inc. White ceramic LED package
USD664103S1 (en) * 2009-11-13 2012-07-24 Nichia Corporation Light emitting diode
USD619110S1 (en) * 2009-11-20 2010-07-06 Silitek Electronic (Guangzhou) Co., Ltd. LED package
USD624885S1 (en) * 2010-01-27 2010-10-05 Silitek Electronic (Guangzhou) Co., Ltd. LED package structure
USD674361S1 (en) * 2012-03-30 2013-01-15 Silitek Electronic (Guangzhou) Co., Ltd. LED package
TWD154427S (en) * 2012-07-12 2013-07-01 隆達電子股份有限公司 Light emitting diode package
USD693780S1 (en) * 2012-09-27 2013-11-19 Lextar Electronics Corporation Light emitting diode package
USD698742S1 (en) * 2012-09-27 2014-02-04 Kabushiki Kaisha Toshiba Light-emitting diode

Also Published As

Publication number Publication date
USD712851S1 (en) 2014-09-09

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