TWD164809S - Part of light emitting diode chip - Google Patents

Part of light emitting diode chip

Info

Publication number
TWD164809S
TWD164809S TW103300562F TW103300562F TWD164809S TW D164809 S TWD164809 S TW D164809S TW 103300562 F TW103300562 F TW 103300562F TW 103300562 F TW103300562 F TW 103300562F TW D164809 S TWD164809 S TW D164809S
Authority
TW
Taiwan
Prior art keywords
emitting diode
diode chip
design
light
light emitting
Prior art date
Application number
TW103300562F
Other languages
Chinese (zh)
Inventor
Hui Ching Feng
Original Assignee
璨圓光電股份有限公司
Formosa Epitaxy Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 璨圓光電股份有限公司, Formosa Epitaxy Inc filed Critical 璨圓光電股份有限公司
Priority to TW103300562F priority Critical patent/TWD164809S/en
Priority to US29/489,893 priority patent/USD745475S1/en
Publication of TWD164809S publication Critical patent/TWD164809S/en

Links

Abstract

【物品用途】;本設計所依附的物品是一種發光二極體晶片，用以作為光源。;【設計說明】;本發光二極體晶片之設計特點在發光二極體晶片一面的外觀有一溝槽，該溝槽內並有二孔洞，且該溝槽一邊設有一位於該二孔洞之間的V型標誌，如立體圖所示。;圖式所揭露之虛線部分為本案不主張設計之部分。[Item Usage];The item to which this design is attached is a light-emitting diode chip, which is used as a light source. ;[Design Description];The design feature of this light-emitting diode chip is that there is a groove on the surface of one side of the light-emitting diode chip, and there are two holes in the groove, and a V-shaped mark is set on one side of the groove between the two holes, as shown in the three-dimensional diagram. ;The dotted line part disclosed in the figure is the part that this case does not advocate the design.

TW103300562F 2014-01-28 2014-01-28 Part of light emitting diode chip TWD164809S (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW103300562F TWD164809S (en) 2014-01-28 2014-01-28 Part of light emitting diode chip
US29/489,893 USD745475S1 (en) 2014-01-28 2014-05-05 Light emitting diode chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW103300562F TWD164809S (en) 2014-01-28 2014-01-28 Part of light emitting diode chip

Publications (1)

Publication Number Publication Date
TWD164809S true TWD164809S (en) 2014-12-11

Family

ID=54832366

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103300562F TWD164809S (en) 2014-01-28 2014-01-28 Part of light emitting diode chip

Country Status (2)

Country Link
US (1) USD745475S1 (en)
TW (1) TWD164809S (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD170854S (en) * 2014-08-07 2015-10-01 璨圓光電股份有限公司 Part of light emitting diode filament
TWD174128S (en) * 2014-10-28 2016-03-01 晶元光電股份有限公司 Portions of light-emitting diode unit
TWD180312S (en) * 2014-10-30 2016-12-21 晶元光電股份有限公司 Portions of light-emitting diode unit
TWD180313S (en) * 2014-11-05 2016-12-21 晶元光電股份有限公司 Portions of light-emitting diode unit
TWD180314S (en) * 2014-11-10 2016-12-21 晶元光電股份有限公司 Portions of light-emitting diode unit

Family Cites Families (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2280631A (en) * 1938-06-16 1942-04-21 Burgess Battery Co Facing sheet for sound absorbing material
NL176323C (en) * 1975-03-11 1985-03-18 Philips Nv SEMICONDUCTOR DEVICE FOR GENERATING INCOHERENT RADIATION.
US4189027A (en) * 1976-08-19 1980-02-19 United Technologies Corporation Sound suppressor liners
JP3119193B2 (en) * 1997-03-07 2000-12-18 日産自動車株式会社 Sound insulation board structure
USD410040S (en) * 1998-03-18 1999-05-18 Interlego Ag Toy building element
US6540373B2 (en) * 2001-03-29 2003-04-01 Bendrix L. Bailey Lighting system
JP3774682B2 (en) * 2001-06-29 2006-05-17 キヤノン株式会社 Electron emitting device, electron source, and image forming apparatus
CN100504146C (en) * 2001-08-09 2009-06-24 松下电器产业株式会社 LED illumination source and device
JP2003168820A (en) * 2001-12-03 2003-06-13 Sony Corp Stripping method, laser light irradiating method, and method for fabricating element using these method
USD512384S1 (en) * 2003-07-09 2005-12-06 Nichia Corporation Light emitting diode
USD510912S1 (en) * 2003-09-15 2005-10-25 Nichia Corporation Light emitting diode
KR20050086238A (en) * 2004-02-25 2005-08-30 삼성에스디아이 주식회사 Field emission display device
JP4754850B2 (en) * 2004-03-26 2011-08-24 パナソニック株式会社 Manufacturing method of LED mounting module and manufacturing method of LED module
KR20060011662A (en) * 2004-07-30 2006-02-03 삼성에스디아이 주식회사 Electron emission device and mehtod of manuafacutring the same
KR20060019846A (en) * 2004-08-30 2006-03-06 삼성에스디아이 주식회사 Electron emission device
US7710014B2 (en) * 2005-03-31 2010-05-04 Samsung Sdi Co., Ltd. Electron emission device, electron emission display device using the same and method of manufacturing the same
KR20060119271A (en) * 2005-05-19 2006-11-24 삼성에스디아이 주식회사 Electron emission device and process of the same
KR20070046650A (en) * 2005-10-31 2007-05-03 삼성에스디아이 주식회사 Electron emission device
KR100723393B1 (en) * 2006-02-02 2007-05-30 삼성에스디아이 주식회사 Method of manufacturing field emission device
US7786491B2 (en) * 2006-02-02 2010-08-31 Panasonic Corporation Semiconductor light-emitting device comprising a plurality of semiconductor layers
CN100583350C (en) * 2006-07-19 2010-01-20 清华大学 Mini-field electron transmitting device
KR20080045463A (en) * 2006-11-20 2008-05-23 삼성에스디아이 주식회사 Light emission device and display device
JP5201566B2 (en) * 2006-12-11 2013-06-05 豊田合成株式会社 Compound semiconductor light emitting device and manufacturing method thereof
US8416823B2 (en) * 2007-05-04 2013-04-09 The Board Of Trustees Of The University Of Illinois Quantum well active region with three dimensional barriers and fabrication
TWM342455U (en) * 2007-11-14 2008-10-11 Taiwan Green Energy Co Ltd LED lighting device embedded in ceiling
KR101449035B1 (en) * 2008-04-30 2014-10-08 엘지이노텍 주식회사 Semiconductor light emitting device
CA131373S (en) * 2009-01-27 2010-06-21 Lego As Toy building element
KR101034053B1 (en) * 2010-05-25 2011-05-12 엘지이노텍 주식회사 Light emitting device, method for fabricating the light emitting device and light emitting device package
KR20110132136A (en) * 2010-06-01 2011-12-07 삼성전자주식회사 Light emitting device using connection structure and manufacturing method of the same
USD646647S1 (en) * 2010-07-30 2011-10-11 Everlight Electronics Co., Ltd. Light emitting diode
JP5649878B2 (en) * 2010-08-30 2015-01-07 シャープ株式会社 SEMICONDUCTOR DEVICE, ITS INSPECTION METHOD, AND ELECTRIC DEVICE
JP5204177B2 (en) * 2010-09-06 2013-06-05 株式会社東芝 Semiconductor light emitting device and manufacturing method thereof
WO2012082523A2 (en) * 2010-12-16 2012-06-21 California Institute Of Technology Chemically-etched nanostructures and related devices
KR101239395B1 (en) * 2011-07-11 2013-03-05 고려대학교 산학협력단 field emission source, device adopting the source and fabrication method of the device
JP5720601B2 (en) * 2012-02-14 2015-05-20 豊田合成株式会社 Semiconductor light emitting device
CN103378234B (en) * 2012-04-25 2016-02-17 清华大学 Light-emitting diode
US20130321902A1 (en) * 2012-06-05 2013-12-05 Electronics And Telecommunications Research Institute Low-loss flexible meta-material and method of fabricating the same
KR20140140166A (en) * 2013-05-28 2014-12-09 포항공과대학교 산학협력단 Light emitting diode device
USD725052S1 (en) * 2014-04-30 2015-03-24 Epistar Corporation Light-emitting diode device

Also Published As

Publication number Publication date
USD745475S1 (en) 2015-12-15

Similar Documents

Publication Publication Date Title
TWD178232S (en) Portion of a high bay led device
TWD169104S (en) High bay led light fixture
TWD172283S (en) Portion of lighting module
TWD170851S (en) Portion of light emitting diode (led) package
TWD171133S (en) Round surface mounted led light fixture
TWD171134S (en) Square surface mounted led light fixture
TWD166329S (en) Portion of led chip
TWD164809S (en) Part of light emitting diode chip
TWD168435S (en) Portion of solid state light assembly
TWD170908S (en) Part of light source for illuminating
TWD163754S (en) Part of light emitting diode chip
TWD173887S (en) Part of light emitting diode chip
TWD173883S (en) Part of light emitting diode chip
TWD162119S (en) Portion of a light emitting diode (led) package
TWD172720S (en) Portion of light emitting diode lamp
TWD173888S (en) Part of light emitting diode chip
TWD173886S (en) Part of light emitting diode chip
TWD173885S (en) Part of light emitting diode chip
USD738544S1 (en) Light emitting diode bulb with a light guide
TWD173779S (en) Portion of shoe midsole (2)
TWD170854S (en) Part of light emitting diode filament
TWD170031S (en) Portion of shoe upper (2)
TWD185071S (en) Light emitting diode
TWD181297S (en) Portion of light emitting diode
TWD168810S (en) Part of semiconductor light emitting device