TWD163754S - Part of light emitting diode chip - Google Patents
Part of light emitting diode chipInfo
- Publication number
- TWD163754S TWD163754S TW103300564F TW103300564F TWD163754S TW D163754 S TWD163754 S TW D163754S TW 103300564 F TW103300564 F TW 103300564F TW 103300564 F TW103300564 F TW 103300564F TW D163754 S TWD163754 S TW D163754S
- Authority
- TW
- Taiwan
- Prior art keywords
- emitting diode
- diode chip
- design
- light
- light emitting
- Prior art date
Links
- 238000010586 diagram Methods 0.000 abstract 1
Abstract
【物品用途】;本設計所依附的物品是一種發光二極體晶片,用以作為光源。;【設計說明】;本發光二極體晶片之設計特點在發光二極體晶片一面的外觀有一溝槽,該溝槽內並有一孔洞,且該溝槽一邊設有一位於該孔洞旁的V型標誌,如立體圖所示。;圖式所揭露之虛線部分為本案不主張設計之部分。[Item Usage];The item to which this design is attached is a light-emitting diode chip, which is used as a light source. ;[Design Description];The design feature of this light-emitting diode chip is that there is a groove on the surface of one side of the light-emitting diode chip, and there is a hole in the groove, and a V-shaped mark is set on one side of the groove next to the hole, as shown in the three-dimensional diagram. ;The dotted line part disclosed in the figure is the part that this case does not advocate the design.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW103300564F TWD163754S (en) | 2014-01-28 | 2014-01-28 | Part of light emitting diode chip |
US29/489,895 USD755135S1 (en) | 2014-01-28 | 2014-05-05 | Light emitting diode chip |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW103300564F TWD163754S (en) | 2014-01-28 | 2014-01-28 | Part of light emitting diode chip |
Publications (1)
Publication Number | Publication Date |
---|---|
TWD163754S true TWD163754S (en) | 2014-10-21 |
Family
ID=55807874
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW103300564F TWD163754S (en) | 2014-01-28 | 2014-01-28 | Part of light emitting diode chip |
Country Status (2)
Country | Link |
---|---|
US (1) | USD755135S1 (en) |
TW (1) | TWD163754S (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWD174128S (en) * | 2014-10-28 | 2016-03-01 | 晶元光電股份有限公司 | Portions of light-emitting diode unit |
TWD180312S (en) * | 2014-10-30 | 2016-12-21 | 晶元光電股份有限公司 | Portions of light-emitting diode unit |
TWD180313S (en) * | 2014-11-05 | 2016-12-21 | 晶元光電股份有限公司 | Portions of light-emitting diode unit |
TWD180314S (en) * | 2014-11-10 | 2016-12-21 | 晶元光電股份有限公司 | Portions of light-emitting diode unit |
Family Cites Families (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2280631A (en) * | 1938-06-16 | 1942-04-21 | Burgess Battery Co | Facing sheet for sound absorbing material |
NL176323C (en) * | 1975-03-11 | 1985-03-18 | Philips Nv | SEMICONDUCTOR DEVICE FOR GENERATING INCOHERENT RADIATION. |
US4189027A (en) * | 1976-08-19 | 1980-02-19 | United Technologies Corporation | Sound suppressor liners |
JP3119193B2 (en) * | 1997-03-07 | 2000-12-18 | 日産自動車株式会社 | Sound insulation board structure |
USD410040S (en) * | 1998-03-18 | 1999-05-18 | Interlego Ag | Toy building element |
US6540373B2 (en) * | 2001-03-29 | 2003-04-01 | Bendrix L. Bailey | Lighting system |
JP3774682B2 (en) * | 2001-06-29 | 2006-05-17 | キヤノン株式会社 | Electron emitting device, electron source, and image forming apparatus |
TW567619B (en) * | 2001-08-09 | 2003-12-21 | Matsushita Electric Ind Co Ltd | LED lighting apparatus and card-type LED light source |
JP2003168820A (en) * | 2001-12-03 | 2003-06-13 | Sony Corp | Stripping method, laser light irradiating method, and method for fabricating element using these method |
USD514073S1 (en) * | 2003-07-09 | 2006-01-31 | Nichai Corporation | Light emitting diode |
USD510912S1 (en) * | 2003-09-15 | 2005-10-25 | Nichia Corporation | Light emitting diode |
KR20050086238A (en) * | 2004-02-25 | 2005-08-30 | 삼성에스디아이 주식회사 | Field emission display device |
JP4754850B2 (en) * | 2004-03-26 | 2011-08-24 | パナソニック株式会社 | Manufacturing method of LED mounting module and manufacturing method of LED module |
KR20060011662A (en) * | 2004-07-30 | 2006-02-03 | 삼성에스디아이 주식회사 | Electron emission device and mehtod of manuafacutring the same |
KR20060019846A (en) * | 2004-08-30 | 2006-03-06 | 삼성에스디아이 주식회사 | Electron emission device |
US7710014B2 (en) * | 2005-03-31 | 2010-05-04 | Samsung Sdi Co., Ltd. | Electron emission device, electron emission display device using the same and method of manufacturing the same |
KR20060119271A (en) * | 2005-05-19 | 2006-11-24 | 삼성에스디아이 주식회사 | Electron emission device and process of the same |
KR20070046650A (en) * | 2005-10-31 | 2007-05-03 | 삼성에스디아이 주식회사 | Electron emission device |
US7786491B2 (en) * | 2006-02-02 | 2010-08-31 | Panasonic Corporation | Semiconductor light-emitting device comprising a plurality of semiconductor layers |
KR100723393B1 (en) * | 2006-02-02 | 2007-05-30 | 삼성에스디아이 주식회사 | Method of manufacturing field emission device |
CN100583350C (en) * | 2006-07-19 | 2010-01-20 | 清华大学 | Mini-field electron transmitting device |
KR20080045463A (en) * | 2006-11-20 | 2008-05-23 | 삼성에스디아이 주식회사 | Light emission device and display device |
JP5201566B2 (en) * | 2006-12-11 | 2013-06-05 | 豊田合成株式会社 | Compound semiconductor light emitting device and manufacturing method thereof |
US8416823B2 (en) * | 2007-05-04 | 2013-04-09 | The Board Of Trustees Of The University Of Illinois | Quantum well active region with three dimensional barriers and fabrication |
TWM342455U (en) * | 2007-11-14 | 2008-10-11 | Taiwan Green Energy Co Ltd | LED lighting device embedded in ceiling |
KR101449035B1 (en) * | 2008-04-30 | 2014-10-08 | 엘지이노텍 주식회사 | Semiconductor light emitting device |
CA131374S (en) * | 2009-01-27 | 2010-02-16 | Lego As | Toy building element |
KR101034053B1 (en) * | 2010-05-25 | 2011-05-12 | 엘지이노텍 주식회사 | Light emitting device, method for fabricating the light emitting device and light emitting device package |
KR20110132136A (en) * | 2010-06-01 | 2011-12-07 | 삼성전자주식회사 | Light emitting device using connection structure and manufacturing method of the same |
TWD141210S1 (en) * | 2010-07-30 | 2011-06-21 | 億光電子工業股份有限公司 | Light emitting diode |
JP5649878B2 (en) * | 2010-08-30 | 2015-01-07 | シャープ株式会社 | SEMICONDUCTOR DEVICE, ITS INSPECTION METHOD, AND ELECTRIC DEVICE |
JP5204177B2 (en) * | 2010-09-06 | 2013-06-05 | 株式会社東芝 | Semiconductor light emitting device and manufacturing method thereof |
US8569739B2 (en) * | 2010-12-16 | 2013-10-29 | California Institute Of Technology | Chemically-etched nanostructures and related devices |
KR101239395B1 (en) * | 2011-07-11 | 2013-03-05 | 고려대학교 산학협력단 | field emission source, device adopting the source and fabrication method of the device |
JP5720601B2 (en) * | 2012-02-14 | 2015-05-20 | 豊田合成株式会社 | Semiconductor light emitting device |
CN103378234B (en) * | 2012-04-25 | 2016-02-17 | 清华大学 | Light-emitting diode |
US20130321902A1 (en) * | 2012-06-05 | 2013-12-05 | Electronics And Telecommunications Research Institute | Low-loss flexible meta-material and method of fabricating the same |
KR20140140166A (en) * | 2013-05-28 | 2014-12-09 | 포항공과대학교 산학협력단 | Light emitting diode device |
USD725052S1 (en) * | 2014-04-30 | 2015-03-24 | Epistar Corporation | Light-emitting diode device |
-
2014
- 2014-01-28 TW TW103300564F patent/TWD163754S/en unknown
- 2014-05-05 US US29/489,895 patent/USD755135S1/en active Active
Also Published As
Publication number | Publication date |
---|---|
USD755135S1 (en) | 2016-05-03 |
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