TWD148537S - 發光二極體封裝 - Google Patents

發光二極體封裝

Info

Publication number
TWD148537S
TWD148537S TW100303968F TW100303968F TWD148537S TW D148537 S TWD148537 S TW D148537S TW 100303968 F TW100303968 F TW 100303968F TW 100303968 F TW100303968 F TW 100303968F TW D148537 S TWD148537 S TW D148537S
Authority
TW
Taiwan
Prior art keywords
creation
package
light
emitting diode
diode package
Prior art date
Application number
TW100303968F
Other languages
English (en)
Inventor
Peter Scott Andrews
Raymond Rosado
Michael P Laughner
David T Emerson
Amber C Abare
Jeffrey C Britt
Original Assignee
克立公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 克立公司 filed Critical 克立公司
Publication of TWD148537S publication Critical patent/TWD148537S/zh

Links

Abstract

【物品用途】;本創作係關於一種發光二極體封裝。;【創作特點】;本創作係關於一種用於複數個發光二極體之封裝,其中該封裝之安裝座在該發光二極體安裝側上呈現一金屬圖案。該金屬圖案具有若干部分,該等部分之邊緣係配置成彼此緊密靠近。該安裝座之底部的若干特徵亦屬本創作之部分。;本創作係關於一種新穎且獨特的外觀設計,其不僅可達成預期的功能,且亦提供一從未見於任何先前技藝中並具有賞心悅目之視覺效果的獨特外觀。
TW100303968F 2011-01-31 2011-08-01 發光二極體封裝 TWD148537S (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/384,360 USD658139S1 (en) 2011-01-31 2011-01-31 High-density emitter package

Publications (1)

Publication Number Publication Date
TWD148537S true TWD148537S (zh) 2012-08-01

Family

ID=45953850

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100303968F TWD148537S (zh) 2011-01-31 2011-08-01 發光二極體封裝

Country Status (2)

Country Link
US (1) USD658139S1 (zh)
TW (1) TWD148537S (zh)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9484499B2 (en) 2007-04-20 2016-11-01 Cree, Inc. Transparent ohmic contacts on light emitting diodes with carrier substrates
US9172012B2 (en) 2007-10-31 2015-10-27 Cree, Inc. Multi-chip light emitter packages and related methods
US9666762B2 (en) 2007-10-31 2017-05-30 Cree, Inc. Multi-chip light emitter packages and related methods
US9082921B2 (en) 2007-10-31 2015-07-14 Cree, Inc. Multi-die LED package
US8368100B2 (en) 2007-11-14 2013-02-05 Cree, Inc. Semiconductor light emitting diodes having reflective structures and methods of fabricating same
US9515055B2 (en) 2012-05-14 2016-12-06 Cree, Inc. Light emitting devices including multiple anodes and cathodes
USD749051S1 (en) * 2012-05-31 2016-02-09 Cree, Inc. Light emitting diode (LED) package
US10439112B2 (en) 2012-05-31 2019-10-08 Cree, Inc. Light emitter packages, systems, and methods having improved performance
US9349929B2 (en) 2012-05-31 2016-05-24 Cree, Inc. Light emitter packages, systems, and methods
USD753612S1 (en) * 2012-09-07 2016-04-12 Cree, Inc. Light emitter device
US9923132B2 (en) 2013-05-24 2018-03-20 Cree, Inc. Solid state lighting component package with conformal reflective coating
USD741821S1 (en) * 2014-04-10 2015-10-27 Kingbright Electronics Co., Ltd. LED component
USD790486S1 (en) * 2014-09-30 2017-06-27 Cree, Inc. LED package with truncated encapsulant
USD826871S1 (en) * 2014-12-11 2018-08-28 Cree, Inc. Light emitting diode device
USD777122S1 (en) * 2015-02-27 2017-01-24 Cree, Inc. LED package
USD772181S1 (en) * 2015-04-02 2016-11-22 Genesis Photonics Inc. Light emitting diode package substrate
USD783547S1 (en) * 2015-06-04 2017-04-11 Cree, Inc. LED package
USD926714S1 (en) * 2019-10-30 2021-08-03 Creeled, Inc. Light emitting diode package

Also Published As

Publication number Publication date
USD658139S1 (en) 2012-04-24

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