TWD139999S1 - Chip leadframe - Google Patents

Chip leadframe

Info

Publication number
TWD139999S1
TWD139999S1 TW099300670F TW99300670F TWD139999S1 TW D139999 S1 TWD139999 S1 TW D139999S1 TW 099300670 F TW099300670 F TW 099300670F TW 99300670 F TW99300670 F TW 99300670F TW D139999 S1 TWD139999 S1 TW D139999S1
Authority
TW
Taiwan
Prior art keywords
creation
frame
hole
view
depression
Prior art date
Application number
TW099300670F
Other languages
Chinese (zh)
Inventor
Bo Yu Ko
Ya Hsien Chang
Chun Wei Wang
Original Assignee
隆達電子股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 隆達電子股份有限公司 filed Critical 隆達電子股份有限公司
Priority to TW099300670F priority Critical patent/TWD139999S1/en
Priority to US29/367,264 priority patent/USD638378S1/en
Publication of TWD139999S1 publication Critical patent/TWD139999S1/en

Links

Abstract

【物品用途】;本創作為一導線架，尤指一種晶片之導線架，適用於封裝晶片。;【創作特點】;本創作之晶片之導線架具有一承載部與一框體。框體包覆部分的承載部。就前視圖與立體圖而言，框體具有一貫通孔以暴露出部分的承載部。貫通孔的頂部開口的邊緣大致呈現長方形，貫通孔的底部開口的邊緣大致呈現橢圓形。承載部具有一凹陷，凹陷大致位於貫通孔的底部開口的中央部位。凹陷的頂部開口的邊緣大致呈現橢圓形，凹陷的底部的邊緣大致呈現橢圓形。就A-A端面剖視圖與B-B端面剖視圖而言，貫通孔的內表面是一傾斜面，凹陷的內表面是一傾斜面。就俯視圖與仰視圖而言，承載部延伸至框體外以形成兩個彎折的端子。就後視圖而言，被框體所暴露之承載部的區域，其位置置中且大致呈現橢圓形。;以整體觀之，本創作具有獨特的風格，予人圓滑而不突兀的視覺感受。本創作之晶片之導線架是一種創新的創作，符合新式樣專利要件，敬請准予專利保障。[Use of the Article]; This creation is a lead frame, especially a chip lead frame suitable for packaging chips.; [Features of the Creation]; The chip lead frame of this creation has a supporting portion and a frame. The frame covers part of the supporting portion. In the front view and the three-dimensional view, the frame has a through hole to expose part of the supporting portion. The edge of the top opening of the through hole is roughly rectangular, and the edge of the bottom opening of the through hole is roughly elliptical. The supporting portion has a depression, and the depression is roughly located in the center of the bottom opening of the through hole. The edge of the top opening of the depression is roughly elliptical, and the edge of the bottom of the depression is roughly elliptical. In the A-A end face section view and the B-B end face section view, the inner surface of the through hole is an inclined surface, and the inner surface of the recess is an inclined surface. In the top view and the bottom view, the support portion extends outside the frame to form two bent terminals. In the rear view, the area of the support portion exposed by the frame is centered and roughly elliptical. Overall, this creation has a unique style, giving people a smooth and non-obtrusive visual experience. The chip lead frame of this creation is an innovative creation that meets the requirements of a new style patent. Please grant patent protection.

TW099300670F 2010-02-10 2010-02-10 Chip leadframe TWD139999S1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW099300670F TWD139999S1 (en) 2010-02-10 2010-02-10 Chip leadframe
US29/367,264 USD638378S1 (en) 2010-02-10 2010-08-05 Lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW099300670F TWD139999S1 (en) 2010-02-10 2010-02-10 Chip leadframe

Publications (1)

Publication Number Publication Date
TWD139999S1 true TWD139999S1 (en) 2011-04-11

Family

ID=44022588

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099300670F TWD139999S1 (en) 2010-02-10 2010-02-10 Chip leadframe

Country Status (2)

Country Link
US (1) USD638378S1 (en)
TW (1) TWD139999S1 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD143386S1 (en) * 2011-01-07 2011-10-21 隆達電子股份有限公司; LED Package Carrier
USD645425S1 (en) * 2011-02-01 2011-09-20 Silitek Electronic (Guangzhou) Co., Ltd. Light emitting diode carrier
TWD143392S1 (en) * 2011-02-25 2011-10-21 隆達電子股份有限公司; LED Package Carrier
USD689030S1 (en) * 2011-05-24 2013-09-03 Lg Innotek Co., Ltd. Portion of substrate for LED package
USD664110S1 (en) * 2011-05-24 2012-07-24 Lg Innotek Co., Ltd. Substrate for LED package
TWD144570S1 (en) * 2011-05-26 2011-12-21 隆達電子股份有限公司; LED Carrier
TWD144568S1 (en) * 2011-05-26 2011-12-21 隆達電子股份有限公司; LED Carrier
TWD144770S1 (en) * 2011-06-23 2012-01-01 隆達電子股份有限公司; Light emitting diode lead-frame
TWD145128S1 (en) * 2011-07-11 2012-01-21 隆達電子股份有限公司; Light emitting diode lead-frame
USD668624S1 (en) * 2011-07-25 2012-10-09 Lextar Electronics Corp. Light emitting diode package
TWD146858S (en) * 2011-07-25 2012-05-01 隆達電子股份有限公司 Light emitting diode lead-frame
USD668233S1 (en) * 2011-10-24 2012-10-02 Silitek Electronic (Guangzhou) Co., Ltd. LED package
TWD149505S (en) * 2011-12-15 2012-10-01 隆達電子股份有限公司 Light emitting diode lead-frame

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3878579B2 (en) * 2003-06-11 2007-02-07 ローム株式会社 Optical semiconductor device
JP4698259B2 (en) * 2005-03-16 2011-06-08 三洋電機株式会社 Electronic component mounting package and package assembly board
USD562272S1 (en) * 2006-11-17 2008-02-19 Lighthouse Technology Co., Ltd. Light emitting diode (LED)
USD568834S1 (en) * 2007-06-28 2008-05-13 Citizen Electronics Co., Ltd. Light-emitting diode for illuminating an object
TWD133320S (en) * 2008-06-20 2010-02-11 三星電機股份有限公司 Case for light-emitting diode
TWD135648S1 (en) * 2008-12-12 2010-07-01 億光電子工業股份有限公司 Light emitting diode package
USD627310S1 (en) * 2009-11-27 2010-11-16 Lite-On Technology Corp. Package of a light emitting diode
USD622680S1 (en) * 2009-12-04 2010-08-31 Silitek Electronic (Guangzhou) Go., Ltd. Package of a light emitting diode
USD628541S1 (en) * 2010-06-14 2010-12-07 Everlight Electronics Co., Ltd. Light emitting diode

Also Published As

Publication number Publication date
USD638378S1 (en) 2011-05-24

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