USD705957S1

USD705957S1 - Light emitting diode package

Info

Publication number: USD705957S1
Application number: US29/417,255
Authority: US
Inventors: Jung Chiuan Lin
Original assignee: Everlight Electronics Co Ltd
Current assignee: Everlight Electronics Co Ltd
Priority date: 2011-10-21
Filing date: 2012-03-31
Publication date: 2014-05-27
Anticipated expiration: 2028-05-27

Description

FIG. 1 is a first perspective view of a light emitting diode package incorporating a design according to an embodiment of the present disclosure;

FIG. 2 is a second perspective view thereof;

FIG. 3 is a third perspective view thereof;

FIG. 4 is a front elevational view thereof;

FIG. 5 is a rear elevational view thereof;

FIG. 6 is a left side elevational view thereof;

FIG. 7 is a right side elevational view thereof;

FIG. 8 is a top plan view thereof;

FIG. 9 is a bottom plan view thereof; and,

FIG. 10 is a cross-sectional view along a cross section A-A of FIG. 4.

The illustrated embodiment is characterized by the light emitting diode package including a base and a light emitting portion assembled to the base, as shown in FIGS. 1 and 5. In one embodiment, the base is generally rectangular in shape. In one embodiment, a bottom of the base includes two pads. In one embodiment, the light emitting portion is light transmissive and has an arched contour.

Claims

CLAIM

The ornamental design for a light emitting diode package, as shown.