593954 玖、發明說明 (發明說明應敘明：發明所屬之技術領域、先前技術、內容、實施方式及圖式簡單說明） 一、 發明所屬之技術領域 本發明係關於一種奈米微粒散熱裝置及散熱裝置用 之流體，尤指一種適用於可增加熱管散熱效率之散熱裝 置及其適用之流體。 二、 先前技術 一般電子產品於運作過程中，常常會產生程度不一 的熱量，而散熱結構則是保證上述電子產品不因溫度過 高過熱而產生運作中斷之主要屏障。 目前使用之散熱結構種類眾多，而熟知的熱管散熱 方式，因為效率高以及所佔用之體積小，其運用於許多 電子元件。然而熱管雖然具有良好之散熱效率，不過依 舊仍有其潛在之缺點。 例如熱管之散熱著重於其内部散熱流體之流動以提 高其熱傳效率，不過當熱管受熱後，於其内部之表面上 非常容易產生氣泡，當氣泡過大時，將增加熱管之熱阻 效應而減低熱傳效率。再者，若熱管内填雜混有粒子時， 尤其於其粒徑較大時，容易受到氣泡之阻擋而無法流 動，因而影響熱傳效率。 三、 發明内容 本發明之主要目的係在提供一種奈米微粒散熱裝 置，以藉由微小之奈米微粒而可順暢流動於散熱用之密 6 593954 封合器内，俾避免密封容器表面氣泡之阻擋而可提埶 傳效率。 本發*明之另一目的係在提供一種奈米微粒散熱裝 置俾月匕藉由擾動流動之奈米冑粒以擊破密封容器内之 氣泡’俾減少熱阻以提高熱傳效率。 本發明之再-目的係在提供一種奈米微粒散埶裝 置，俾能藉由奈米微粒表面受熱產生之氣泡以增加散熱 流體之擾動而提高熱傳效率。 、 本毛月之又一目的係在提供一種奈米微粒散熱裝 置’俾能藉由奈米微粒之使用以增加毛細力' 熱傳效率。 捉回 為達成上述之目的，本發明奈米微粒散熱裝置，係 :各·-密封容器；以及一散熱流體’係填充於該密封 谷益，且於該散熱流體内混合有複數個奈米微粒， 該奈米微粒可隨該散熱流體於該密封容器内流動。，、 係配ί發^提供—用於散熱裝置中之奈米粒子流體， :二：封容器，包含：一流體；以及複數個奈米微 體於=於_體中；其中該奈米微粒可隨該散孰流 體於该岔封容器内流動。 …、 本發明之密封容器可為一熱管、或是 用迚之容器，且本發明之散埶流體可 政… 熱用途之液體。 1、视體了為水，或是其它散 合之，ΐ:::散熱流體内混合有複數個奈米微粒，其混 間。Γ 殊之限制，較佳地係介於至㈣之 發明散熱流體内使用之奈米微粒可為任何導熱性 7 593954 佳之奈米微粒，較佳為金屬材料或金屬氧化物奈米微 粒，取佳為金、銀、銅、鉑、鋁、二氧化鈦、三氧化丄 鐵、碳球等等。本發明之散熱流體内奈米微粒之粒徑可 為任何不為氣泡阻擋流動之粒徑，較佳為介於〗奈米至 500奈米之間。本發明之散熱流體内奈米微粒於密封容器 内酼放熱流體而流動時，由於其粒徑較小，係介於1奈^ 至500奈米之間，因此各個奈米微粒可於密封容器内順暢 :流動’即使密封容器之内表面因受熱而產生氣泡時， 奈求微粒亦可避免受氣泡之阻撞，相對提高整體熱傳效 =。此外’當奈米微粒於密封容器内隨散熱流體而流動 時:奈米微粒會因此而產生—擾動速率，若密封容器内 而：其内部表面產生氣泡時，亦可藉由奈米微粒 而辜破上述氣泡，藉此以降低熱阻效應，並提升 ，體之熱傳效率。再者’當奈米微粒本身受熱時，於其 ^面亦會產生氣泡，故當奈米微粒於散熱流體内流動 述^之產生可幫助增加散熱流體之擾動，藉此 時:效率。又於密封容器内使用奈米微粒 熱傳;率子之一可增加其毛細力，相對亦可提升 為使本發明之奈米微粒可有效運作，於密封容器内 聚隼成：：分散劑’藉由分散劑之作用以避免奈米微粒 W成團狀。上述分散劑則可使用—般之四乙氣鹽。 四、實施方式 明之技術内容，特 為能m t審查委員能更瞭解本發 牛二較佳具體實施例說明如下。 8 593954 首先明，閱圖卜其係本發明應用於一般熱管之示意 圖，其中顯不有兩條密封容器j，亦即圖式中之熱管，其 係分別連結'-熱源6及一散熱片7上，當密封容器i接近 熱源6之-端x熱時’其内部之流體會受熱而蒸發成氣 體，此氣體將熱能帶到散熱片7之一端並進行散熱後，原 本之氣體會冷凝成液體，同時此液體藉由毛細現象可再 回流至熱源6之一端，如此形成一散熱循環，亦即一般埶 管之散熱原理。 請同時參閱圖2，其係圖丨擷取部分之剖面示意圖， 於上述之密封容器！内、亦即熱管内填充有一散熱流體 2，且於散熱流體2内混合加入有複數個奈米微粒^，而該 等奈米微粒3可隨散熱流體2而於密封容器丨内流動。於本 實施例中，所使用之散熱流體2係指纟，而奈米微粒说 口加入散熱流體2之濃度為1%，且奈米微粒3之材料係為 金’其平均粒徑小於17奈米。在此需加以說明的是，上 述之散熱流體2並不僅限於水，其它具相同散熱用途之液 體亦可使用。此外，奈米微粒3之粒徑可介於丨奈米至5〇〇 奈米之間，同時奈米微粒3之材質較佳地係為金屬材料， 其可為銀、銅、鉑、鋁、二氧化鈦、三氧化二鐵、碳球 等等’而不僅限於本實施例所使用之金。而奈米微粒3混 合加入散熱流體2之濃度較佳地則是介於〇 〇〇1%至⑺^之 間。 此外，於本實施例中另外加入一分散劑（圖未示） 於岔封容器1内，此分散劑係指一四乙氨鹽，其作用在於 593954 P方止政熱机體2内之奈米微粒3相互聚集成團狀，使奈米 微粒3可保持顆粒狀而不影響其流動。 抑因此，藉由粒徑極小之奈米微粒3，可使其於密封容 d内順暢的流動’即使密封容器1之内表面因受熱而產 生氣泡時，奈米微粒3亦可避免受氣泡之阻播，藉此可提 尚整體熱傳效率。此外，當奈米微粒3於密封容器i内隨 政熱机體2而流動時，奈米微粒3會因此而產生一擾動速 密封容器1内因受熱而於其内部表面產生氣泡時， '、可猎由奈米微粒3之衝擊而擊破上述氣泡，藉此可降低 f應’並提升整體之熱傳效率。再者，當奈米微粒3 、日寺☆其表面亦會產生氣泡，故當奈米微粒3於 月文熱流體2内流動日專，μ、+、yfer 上述乳泡之產生可幫助增加散熱流 之擾動，错此亦可有效提升熱傳效率。又於密封容器工 内使用奈米微粒3時，藉由粒子之混入而可增加其毛細 力’相對亦可提升熱傳效率。 請參閱圖3及圖4應用本發明之另一實施例，其中圖3 顯示-雷射二極體所用之基座4，圖4則為其底座5,而於 =5内二成有一環狀凹槽5卜同時形成有多條直溝Μ， 散熱流體及本發明之奈米微粒於環狀凹槽^内 後玉以上蓋（圖未不）蓋合封閉底座5使其成一穷封 容器’則此密封容器所形成之散熱裝置亦可達成如 例所述之^功效。由此亦可知本發明之密封容器並不 =於熱官’具有相同料之密封容器皆可使用，且散 熱&體之容置方式亦不僅限於管狀，如上述直溝 它形狀亦可。此外，於實際應料，熱源㈣於本發明 10 593954 密封各态之位置並不僅限於本實施例所述之位置，亦即 熱：可不僅限位於密封容器的中心，散熱端也不僅限位 :密封容器的邊緣，當熱源位於密封容器的一端、散熱 端位於密封容器的另—端時，亦同樣可達成本發明所述 之功效，例如使用於中央處理器散熱之熱管等。 上述實施例僅係為了方便說明而舉例而已，本發明 所主張之權利範圍自應以申請專利範圍所述為準，而非 僅限於上述實施例。 五、圖式簡單說明 圖1係本發明應用於熱管之示意圖。 圖2係圖1之熱管之部分剖面圖。 圖3係本發明應用於雷射二極體基座之立體圖 圖4係圖3之基座之底座立體圖。 圖號說明 1 密封容器 4 基座 52 直溝 2 散熱流體 5 底座 6 熱源 3 奈米微粒 51 環狀凹槽 7 散熱片 11593954 发明 Description of the invention (the description of the invention should state: the technical field, prior art, content, embodiments, and drawings of the invention briefly) I. TECHNICAL FIELD TO THE INVENTION The present invention relates to a nano-particle heat sink and a heat sink The fluid used in the device, especially a heat-dissipating device suitable for increasing the heat-dissipating efficiency of a heat pipe and a fluid suitable for the device. 2. Prior Technology Generally, electronic products often generate different degrees of heat during operation, and the heat dissipation structure is the main barrier to ensure that the above electronic products are not interrupted due to excessive temperature and overheating. There are many types of heat dissipation structures currently used, and the well-known heat pipe heat dissipation method is applied to many electronic components because of its high efficiency and small volume occupied. Although the heat pipe has good heat dissipation efficiency, it still has its potential disadvantages. For example, the heat dissipation of the heat pipe focuses on the flow of the internal heat dissipation fluid to improve its heat transfer efficiency. However, when the heat pipe is heated, bubbles are very easy to be generated on the inner surface. When the bubbles are too large, the heat resistance effect of the heat pipe is increased and reduced. Heat transfer efficiency. Furthermore, when particles are mixed in the heat pipe, especially when the particle diameter is large, the heat pipe is easily blocked by air bubbles and cannot flow, thereby affecting the heat transfer efficiency. 3. Summary of the Invention The main purpose of the present invention is to provide a nano-particle heat sink device, which can flow smoothly through heat-dissipating denses through tiny nano-particles. 6 593954 Sealer, to avoid air bubbles on the surface of the sealed container Blocking can increase transmission efficiency. Another object of the present invention is to provide a nano-particle heat sink device that breaks the flowing nano-particles to break the air bubbles in the sealed container, and reduces the thermal resistance to improve the heat transfer efficiency. Another object of the present invention is to provide a nano particle dispersing device which can increase the heat transfer efficiency by increasing the disturbance of the heat-dissipating fluid by the bubbles generated by the surface of the nano particles being heated. Another purpose of this month is to provide a nano-particle heat sink device, which can increase the capillary force through the use of nano-particles and increase the heat transfer efficiency. In order to achieve the above-mentioned object, the nano-particle heat dissipation device of the present invention is: each sealed container; and a heat-dissipating fluid is filled in the sealed valley, and a plurality of nano-particles are mixed in the heat-dissipating fluid. The nano particles can flow in the sealed container with the heat-dissipating fluid. The system is provided with nano-particle fluids used in heat-dissipating devices: two: sealed containers, including: a fluid; and a plurality of nano-micro bodies in the body; wherein the nano-particles It can flow with the scattered fluid in the forked container. ..., the sealed container of the present invention may be a heat pipe, or a container using tritium, and the bulk fluid of the present invention may be a liquid for thermal use. 1. Seeing the body as water, or other disintegration, ΐ ::: A plurality of nano particles are mixed in the heat dissipation fluid, and the mixture is mixed. Γ The special limitation is that the nano-particles used in the heat-dissipating fluid of the invention can be any thermally conductive nano-particles, preferably metal materials or metal oxide nano-particles. For gold, silver, copper, platinum, aluminum, titanium dioxide, hafnium oxide, carbon balls and so on. The particle size of the nano-particles in the heat-dissipating fluid of the present invention may be any particle size that does not block the flow of the bubbles, and is preferably between 500 nm and 500 nm. When the nano-particles in the heat-dissipating fluid of the present invention flow in a sealed container while exothermic fluid flows, the particle size is small, ranging from 1 nanometer to 500 nanometers, so each nano-particle can be contained in the sealed container. Smooth: Flowing 'Even if the inner surface of the sealed container generates bubbles due to heat, the microparticles can avoid being blocked by the bubbles, and relatively improve the overall heat transfer efficiency =. In addition, when the nano particles flow with the heat-dissipating fluid in the sealed container: the nano particles will be generated as a result of the perturbation rate. If the inside of the sealed container: when bubbles are generated on the internal surface, it can also be broken by the nano particles. The above-mentioned air bubbles thereby reduce the thermal resistance effect and improve the heat transfer efficiency of the body. Moreover, when the nano particles themselves are heated, bubbles will also be generated on their surfaces, so when the nano particles flow in the heat-dissipating fluid, the generation of the particles can help increase the disturbance of the heat-dissipating fluid, thereby: efficiency. In the sealed container, nano particles are used for heat transfer; one of the prime factors can increase its capillary force, and can also be relatively increased to enable the nano particles of the present invention to operate effectively, and aggregated in the sealed container into :: dispersant ' By the action of the dispersant, the nano particles W are prevented from agglomerating. The above dispersant can be used-ordinary tetraethyl gas salt. Fourth, the implementation of the technical content of the Ming, specifically to enable the review committee to better understand the present invention. 8 593954 First of all, see Figure 1. It is a schematic diagram of the present invention applied to a general heat pipe. There are no two sealed containers j, that is, the heat pipe in the figure, which are connected to '-heat source 6 and a heat sink 7 respectively. On the other hand, when the sealed container i is close to the-end x of the heat source 6, the fluid inside it will be heated to evaporate into a gas. This gas will bring the heat energy to one end of the heat sink 7 and dissipate the heat. At the same time, the liquid can return to one end of the heat source 6 through the capillary phenomenon, thus forming a heat dissipation cycle, that is, the principle of heat dissipation of a general tube. Please refer to FIG. 2 at the same time, which is a schematic cross-sectional view of the extracted part in the sealed container described above! Inside, that is, the heat pipe is filled with a heat-dissipating fluid 2 and a plurality of nano particles ^ are mixed into the heat-dissipating fluid 2, and the nano-particles 3 can flow in the sealed container with the heat-dissipating fluid 2. In this embodiment, the heat-dissipating fluid 2 used is 纟, and the concentration of the nano-particles added to the heat-dissipating fluid 2 is 1%, and the material of the nano-particles 3 is gold, and its average particle size is less than 17 nanometers. Meter. It should be noted here that the heat-dissipating fluid 2 is not limited to water, and other liquids having the same heat-dissipating purpose can also be used. In addition, the particle size of the nano-particles 3 may be between nano-500 nanometers, and the material of the nano-particles 3 is preferably a metal material, which may be silver, copper, platinum, aluminum, Titanium dioxide, ferric oxide, carbon spheres, etc. are not limited to the gold used in this embodiment. The concentration of the nano-particles 3 added to the heat-dissipating fluid 2 is preferably between 0.001% and ⑺ ^. In addition, in this embodiment, a dispersant (not shown in the figure) is additionally added in the forked container 1. This dispersant refers to a tetraethylammonium salt, and its role lies in the 593954 P side of the thermal body 2 The rice particles 3 are clustered with each other, so that the nano particles 3 can remain granular without affecting the flow. Therefore, the nano particles 3 with a very small particle diameter can flow smoothly in the sealed volume d. Even when the inner surface of the sealed container 1 generates bubbles due to heat, the nano particles 3 can avoid being affected by the bubbles. By blocking the broadcast, the overall heat transfer efficiency can be improved. In addition, when the nano-particles 3 flow in the sealed container i following the thermal body 2, the nano-particles 3 will cause a disturbance when the inner-surface of the sealed container 1 is heated due to heat generation. The above-mentioned air bubbles are broken by the impact of the nano-particles 3, thereby reducing the stress and improving the overall heat transfer efficiency. In addition, when the nano particles 3 and Risi ☆ also have bubbles on their surfaces, so when the nano particles 3 flow in the Yuewen thermal fluid 2, the generation of the above-mentioned milk bubbles can help increase heat dissipation. The disturbance of the flow can also effectively improve the heat transfer efficiency. When nanofine particles 3 are used in a sealed container, the capillary force can be increased by mixing the particles, and the heat transfer efficiency can be improved relatively. Please refer to FIG. 3 and FIG. 4 in which another embodiment of the present invention is applied, wherein FIG. 3 shows a base 4 for a laser diode, and FIG. 4 is a base 5 thereof, and a ring is formed within 5 The groove 5 is formed with a plurality of straight grooves M at the same time. The heat-dissipating fluid and the nano particles of the present invention are enclosed in a ring-shaped groove ^ and the top cover (not shown in the figure) is closed to cover the closed base 5 to form a poorly sealed container. The heat dissipation device formed by the sealed container can also achieve the effect as described in the example. It can also be known from this that the sealed container of the present invention is not applicable to any sealed container having the same material as that of the heat official, and that the manner of accommodating the heat dissipation body is not limited to the tubular shape, and the shape of the straight groove as described above may also be used. In addition, in actual application, the position of the heat source in the sealed state of the invention 10 593954 is not limited to the position described in this embodiment, that is, heat: it may not be limited to the center of the sealed container, and the heat dissipation end is not limited to the position: The edge of the sealed container, when the heat source is located at one end of the sealed container and the heat-dissipating end is located at the other end of the sealed container, can also achieve the effect described in the invention, such as a heat pipe used for heat dissipation of a central processing unit. The above embodiments are merely examples for the convenience of description. The scope of the claimed rights of the present invention shall be based on the scope of the patent application, rather than being limited to the above embodiments. V. Brief Description of Drawings Figure 1 is a schematic diagram of the present invention applied to a heat pipe. FIG. 2 is a partial cross-sectional view of the heat pipe of FIG. 1. FIG. FIG. 3 is a perspective view of a laser diode base applied to the present invention. FIG. 4 is a perspective view of a base of the base of FIG. 3. Description of drawing number 1 Sealed container 4 Base 52 Straight groove 2 Heat-dissipating fluid 5 Base 6 Heat source 3 Nano particles 51 Ring-shaped groove 7 Heat sink 11