200409895 软、發明Ιίί朗 (發月說明應敘明·發明所屬之技術領域、先前技術、內容、麵方式及圖式簡單說明) 一、發明所屬之技術領域 古本發明係關於一種奈米微粒散熱裝置及散熱裝置用 之流體，尤指一種適用於可增加熱管散熱效率之散熱裝 置及其適用之流體。 二、先前技術200409895 Soft and Invention I (The description of the month should be stated. The technical field to which the invention belongs, the prior art, the content, the surface mode and the drawings are briefly explained.) I. The technical field to which the invention belongs The ancient invention relates to a nano-particle heat sink Fluids for heat sinks and heat sinks, especially a heat sink for heat pipes that can increase the heat dissipation efficiency of the heat pipe and its suitable fluid. Second, the prior art
了般電子產品於運作過程中，常常會產生程度不一 的”、、里1¾月文熱結構則是保證上述電子產品不因溫度過 高過熱而產生運作中斷之主要屏障。 目釗使用之散熱結構種類眾多，而熟知的埶管散埶 方式：因為效率高以及所佔用之體積小，其運用於許;、 電子凡件。然而熱管雖然具有良好之散熱效率，不過依 舊仍有其潛在之缺點。 一例如熱管之散熱著重於其内部散熱流體之流動以4In the course of operation of ordinary electronic products, the thermal structure is often different, and the temperature is the main barrier to ensure that the above-mentioned electronic products are not interrupted due to excessive temperature and overheating. The heat dissipation used by Mu Zhao There are many types of structures, and the well-known tube dispersing method: because of its high efficiency and small volume, it is used for many electronic components. However, although the heat pipe has good heat dissipation efficiency, it still has its potential disadvantages. A heat pipe such as a heat pipe focuses on the flow of the internal heat dissipation fluid.
效率，不過當熱管受熱後’於其内部之表面- 吊合產生氣 >、包，當氣泡過大時，將增加 效^減低熱傳效率。再者，料管内填雜財粒子時- =其粒徑較大時，容易受到氣泡之阻撐而無上 動因而影響熱傳效率。Efficiency, but when the heat pipe is heated ’on its internal surface-hanging to produce gas > bag, when the bubble is too large, it will increase the efficiency ^ and reduce the heat transfer efficiency. In addition, when the particles are filled with miscellaneous particles in the material tube-= when the particle diameter is large, it is easy to be blocked by air bubbles without upward movement, which affects the heat transfer efficiency.
發明内容 主要目㈣在提供—種奈米微粒散熱裝 糟由則、之奈米微粒而可順暢流動於散熱用之密 6 200409895 封容器内 傳效率。 俾避免岔封容器表面氣泡之阻擋而可提高熱 本毛月之另目的係在提供一種奈米微粒散熱穿 置，俾能藉由擾自流動t奈米微粒以擊破密封容器内: 氣泡，俾減少熱阻以提高熱傳效率。 本發明之再一目的係在提供一種奈米微粒散熱裝 置，俾能藉由奈米微粒表面受熱產生之氣泡以增加散熱 流體之擾動而提高熱傳效率。 本發明之又一目的係在提供一種奈米微粒散熱裝 置，俾能藉由奈米微粒之使用以增加毛細力，進而提言 熱傳效率。 ° 為達成上述之目的，本發明奈米微粒散熱裝置，係 包含· 一密封容器；以及一散熱流體，係填充於該密封 容器，且於該散熱流體内混合有複數個奈米微粒，其中 該奈米微粒可隨該散熱流體於該密封容器内流動。 本發明並提供一用於散熱裝置中之奈米粒子流體， 係配合-密封容器，包含：一流體；以及複數個奈米微 粒，係分佈於該流體中；其中該奈米微粒可隨該散熱流 體於該密封容器内流動。 、"* …本^明之密封容器可為一熱管、或是其它相同散熱 用途之容器，且本發明之散熱流體可為水，或是其它散 熱用途之液體。 本發明之散熱流體内混合有複數個奈米微粒，其混 合之濃度無特殊之限制，較佳地係介於〇〇〇1%至1〇%之 間。本發明散熱流體内使用之奈米微粒可為任何導熱性 200409895 P米微粒，較佳為金屬材料或金屬氧化物奈米微 粒，最佳為金、銀、銅、始、銘、二氧化欽、三氧化二 鐵、碳球等等。本發明之散熱流體内奈米微粒之粒徑可 為任何不為氣泡阻擋流動之粒徑，較佳為介於丨奈^至 500奈米之間。本發明之散熱流體内奈米微粒於密封容器 内奴散熱流體而流動時，由於其粒徑較小，係介於1奈米 至500奈米之間，因此各個奈米微粒可於㈣容器内順暢 的机動’即使密封容器之内表面因受熱而產生氣泡時， 奈米微粒亦可避免受氣泡之阻擋，相對提高整體熱傳效 率。此外，當奈米微粒於密封容器内隨散熱流體而流動 時:奈米微粒會因此而產生—擾動速率，若密封容器内 因讀而於其内部表面產生氣泡時，亦可藉由奈米微粒 之衝擊而擊破上述氣泡，藉此以降低熱阻效應，並提升 整體之熱傳效率。再者，當奈錢粒本身受熱時，於其 表面亦會產生氣泡’故當奈米微粒於散熱流體内流動 時，上述氣泡之產生可幫助增加散熱流體之擾動，藉此 :可有效提升熱傳效率。又於密封容器内使用奈米微粒 時，藉由粒子之混入而可增加其毛細力，相對亦可提升 熱傳$文率。 為使本發明之奈米微粒可有效運作，於密封容器内 ::加入一分散劑’藉由分散劑之作用以避免奈米微粒 來集成團狀。上述分散劑則可使用一般之四乙氨鹽。 四、實施方式 之技術内容，特 為能讓貴審查委員能更瞭解本發明 舉二較佳具體實施例說明如下。 200409895 =凊參閱圖卜其係本發明應用於一般熱管之示意 中_示有兩條密封容器i，，亦即圖式中之熱管，其 係分別連結於-熱源6及_散熱片7上，當密封容器 =源6之-端受熱時’其内部之流體會受熱而蒸發成氣 體，Μ㈣減㈣散熱片7之—端並進行散熱後，原 本之氣體會冷凝成液體，同時此液體藉由毛細現象可再 ，流至熱源6之-端，如此形成一散熱循環，亦即一般熱 管之散熱原理。 μ 請同時參閱圖2,其係圖丨擷取部分之剖面示意圖， 於上述之密封容器Μ、亦即熱管内填充有一散熱流體 且於散熱流體2内混合加入有複數個奈米微粒3，而該 等奈米微粒3可隨散熱流體2而於密封容器丨内流動。於本 實施例巾，所使用之散熱流體2係指水，而奈米微粒说 合加入散熱流體2之濃度為1%，且奈米微粒3之材料係為 金，其平均粒徑小於17奈米。在此需加以說明的是，上 述之散熱流體2並不僅限於水，其它具相同散熱用途之液 體亦可使用。此外，奈米微粒3之粒徑可介於丨奈米至5〇〇 奈米之間，同時奈米微粒3之材質較佳地係為金屬材料， 其可為銀、銅、鉑、鋁、二氧化鈦、三氧化二鐵、碳球 等等，而不僅限於本實施例所使用之金。而奈米微粒3混 a加入散熱流體2之濃度較佳地則是介於〇 %至之 間。 ° 此外’於本實施例中另外加入一分散劑（圖未示） 於密封容器1内，此分散劑係指一四乙氨鹽，其作用在於 200409895 防止散熱流體2内之奈米微粒3相互聚集成團狀，使奈米 微粒3可保持顆粒狀而不影響其流動。 力’相對亦可提升熱傳效率 。。因此，藉由粒徑極小之奈米微粒3,可使其於密封容 …内順暢的流動，即使密封容以之内表面因受熱而產 生氣泡時，奈米微粒3亦可避免受氣泡之阻擋，藉此可提 向整體熱傳效率。此外，當奈米微粒3於密封容器i内隨 散熱流體2而流動時，奈米微粒3會因此而產生一擾動速 率1密封容以内因受熱而於其内部表面產生氣泡時， 亦可猎由奈米微粒3之衝擊而擊破上述氣泡，藉此可降低 =效應，並提升整體之熱傳效率。再者，#奈米微粒3 2受熱時’於其表面亦會產生氣泡，故當奈米微粒3於 二内流動時’上述氣泡之產生可幫助增加散熱流 體之擾動’藉此亦可有效提升熱傳效率。又於密封容写】 =使用奈米微粒3時，藉由粒子之混人而可增加其 請參閱圖3及圖4應用本發明之另一實施例，i中圖3 顯示一雷射二極體所用之基座4,圖4則為其底座5,而於 :座5内形成有一環狀凹槽51，同時形成有多條直溝”， 虽加入^散熱流體及本發明之奈米微粒於環狀凹槽训 f並以-上蓋（圖未示）蓋合封閉底座$使其成一密封 谷'，則此密封容器所形成之散熱裝置亦可達成如上一 龙述之各項功效。由此亦可知本發明之密封容器並不 限於熱管’具有相同用途之密封容器皆可使用，且散 =流體之容置方式亦不僅限於管狀，如上述直溝狀或其 亦可此外，於貫際應用時，熱源相對於本發明 200409895 後封谷器之位置並不僅限於本實施例所述之位置，亦即 熱源可不僅限位於密封容器的中心、，散熱端也不僅限位 於密封容器的邊緣，當熱源位於密封容器的—端、散熱 端位於密封容H的另—端時，亦同樣可達成本發明所述 之功效，例如使用於中央處理器散熱之熱管等。 上述貫施例僅係為了方便說明*舉例而已，本發明 所主張之權利範圍自應以中請專利範圍所述為準，㈣ 僅限於上述實施例。 戸 五、圖式簡單說明 圖1係本發明應用於熱管之示意圖。 圖2係圖1之熱管之部分剖面圖。 圖3係本發明應用於雷射二極體基座之立體圖。 圖4係圖3之基座之底座立體圖。 圖號說明 1 密封容器 4 基座 52 直溝 2 散熱流體 5 底座 6 熱源 奈米微粒 51 環狀凹槽 7 散熱片SUMMARY OF THE INVENTION The main objective is to provide a kind of nano-particle heat-dissipating device. The nano-particles can flow smoothly in the heat-dissipating density. 6 200409895 Transmission efficiency in a sealed container.俾 The purpose of avoiding the blocking of air bubbles on the surface of the bifurcated container and improving the thermal efficiency is to provide a nano-particle heat dissipation penetrating device, which can break the sealed container by disturbing self-flowing nano-particles: bubbles, 俾Reduce thermal resistance to improve heat transfer efficiency. Another object of the present invention is to provide a nano-particle heat dissipation device, which can increase the heat transfer efficiency by increasing the disturbance of the heat-dissipating fluid by the bubbles generated by the surface of the nano-particles being heated. Another object of the present invention is to provide a nano-particle heat dissipation device, which can increase the capillary force through the use of nano-particles, and thus, to improve the heat transfer efficiency. ° In order to achieve the above-mentioned object, the nanoparticle heat dissipation device of the present invention includes: a sealed container; and a heat dissipation fluid filled in the sealed container, and a plurality of nanoparticle mixed in the heat dissipation fluid, wherein the Nano particles can flow in the sealed container with the heat-dissipating fluid. The invention also provides a nano-particle fluid used in a heat-dissipating device, which is a matched-sealed container, including: a fluid; and a plurality of nano-particles distributed in the fluid; wherein the nano-particles can be dissipated with the heat. Fluid flows in the sealed container. &Quot; * ... The sealed container of the present invention may be a heat pipe or other container for the same heat dissipation purpose, and the heat dissipation fluid of the present invention may be water or other liquid for heat dissipation purpose. A plurality of nano particles are mixed in the heat-dissipating fluid of the present invention, and the mixing concentration is not particularly limited, and is preferably between 0.001% and 10%. The nano-particles used in the heat-dissipating fluid of the present invention may be any thermally conductive 200,409895 P-meter particles, preferably metal materials or metal oxide nano-particles, most preferably gold, silver, copper, starting, inscription, dioxin, Ferric oxide, carbon balls, etc. The particle size of the nano-particles in the heat-dissipating fluid of the present invention may be any particle size that does not block the flow of the bubbles, and is preferably between 500 nm and 500 nm. When the nano-particles in the heat-dissipating fluid of the present invention flow in the sealed container to dissipate the heat-dissipating fluid, due to its small particle size, it is between 1 and 500 nanometers, so each nano-particle can be contained in a container Smooth maneuvering 'Even when the inner surface of the sealed container is heated to generate bubbles, the nano particles can be prevented from being blocked by the bubbles, and the overall heat transfer efficiency is relatively improved. In addition, when the nano particles flow with the heat-dissipating fluid in the sealed container: the nano particles will be generated as a result of the perturbation rate. If bubbles are generated on the inner surface of the sealed container due to reading, it can also be impacted by the nano particles. The above-mentioned bubbles are broken, thereby reducing the thermal resistance effect and improving the overall heat transfer efficiency. Moreover, when the nano-grains themselves are heated, bubbles will also be generated on their surfaces. Therefore, when the nano particles flow in the heat-dissipating fluid, the generation of the bubbles can help increase the disturbance of the heat-dissipating fluid, thereby effectively increasing the heat. Transmission efficiency. When nano particles are used in a sealed container, the capillary force can be increased by the mixing of particles, and the heat transfer rate can also be relatively increased. In order to make the nanoparticle of the present invention work effectively, a dispersant is added to the sealed container :: to prevent the nanoparticle from being aggregated by the action of the dispersant. As the dispersant, a general tetraethylammonium salt can be used. Fourth, the technical content of the implementation, in order to allow your review members to better understand the present invention The second preferred embodiment is described below. 200409895 = 凊 Refer to Figure B. This is a schematic diagram of the application of the present invention to a general heat pipe. There are two sealed containers i, that is, the heat pipe in the figure, which are connected to-heat source 6 and _ heat sink 7, respectively. When the sealed container = the end of source 6 is heated, its internal fluid will be heated to evaporate into a gas. After reducing the end of fin 7 to heat dissipation, the original gas will condense into a liquid, and the liquid will pass through The capillary phenomenon can flow to the-end of the heat source 6 to form a heat dissipation cycle, which is the principle of heat dissipation of a general heat pipe. μ Please refer to FIG. 2 at the same time, which is a schematic cross-sectional view of the extracted part. The sealed container M, that is, the heat pipe is filled with a heat dissipation fluid, and a plurality of nano particles 3 are mixed in the heat dissipation fluid 2 and The nano particles 3 can flow in the sealed container with the heat-dissipating fluid 2. In this embodiment, the heat-dissipating fluid 2 used is water, and the concentration of the nano-particles added to the heat-dissipating fluid 2 is 1%, and the material of the nano-particles 3 is gold, and the average particle diameter is less than 17 nanometers. Meter. It should be noted here that the heat-dissipating fluid 2 is not limited to water, and other liquids having the same heat-dissipating purpose can also be used. In addition, the particle size of the nano-particles 3 may be between nano-500 nanometers, and the material of the nano-particles 3 is preferably a metal material, which may be silver, copper, platinum, aluminum, Titanium dioxide, ferric oxide, carbon balls and the like are not limited to the gold used in this embodiment. The concentration of the nano-particles 3 mixed with the heat-dissipating fluid 2 is preferably between 0% and 5%. ° In addition, a dispersant (not shown) is added to the sealed container 1 in this embodiment. This dispersant refers to a tetraethylammonium salt, which has the function of 200409895 to prevent nano particles 3 in the heat-dissipating fluid 2 from each other. Agglomerates, so that the nano-particles 3 can remain granular without affecting its flow. Force 'can also increase heat transfer efficiency. . Therefore, with the extremely small particle size of the nanoparticle 3, it can flow smoothly in the sealed volume ... Even if the inner surface of the sealed volume is heated due to bubbles, the nanoparticle 3 can be prevented from being blocked by the air bubbles This can improve the overall heat transfer efficiency. In addition, when the nano-particles 3 flow with the heat-dissipating fluid 2 in the sealed container i, the nano-particles 3 will generate a turbulence rate 1 as a result, when the air bubbles are generated on the inner surface of the inner surface due to heat within the sealed volume, it can also be hunted by Nai The impact of the rice particles 3 breaks the above bubbles, thereby reducing the effect and improving the overall heat transfer efficiency. In addition, #nano particles 3 2 will generate bubbles on their surfaces when heated, so when the nano particles 3 flow in the second, 'the above-mentioned bubbles can help increase the disturbance of the heat-dissipating fluid', which can also effectively improve Heat transfer efficiency. Also written in the seal] = When using nano particles 3, the particles can be increased by mixing them. Please refer to FIG. 3 and FIG. 4. Another embodiment of the present invention is applied. FIG. 3 in i shows a laser diode. The base 4 used in the body, FIG. 4 is its base 5, and a ring groove 51 is formed in the base 5 and a plurality of straight grooves are formed at the same time. Although the cooling fluid and the nano particles of the present invention are added Train the f in the annular groove and cover the closed base with an upper cover (not shown) to make it a sealed valley. Then, the heat dissipation device formed by this sealed container can also achieve the effects described above. It can also be known that the sealed container of the present invention is not limited to the heat pipe. Any sealed container with the same purpose can be used, and the storage method of the fluid is not limited to the tube, such as the above-mentioned straight groove or it can also be used in In application, the position of the heat source relative to the 200409895 rear grain sealer of the present invention is not limited to the position described in this embodiment, that is, the heat source may not be limited to the center of the sealed container, and the heat dissipation end is not limited to the edge of the sealed container. When the heat source is located at the end of the sealed container, heat dissipation When the end is located at the other end of the sealed volume H, the effect described in the invention can also be achieved, for example, a heat pipe used for heat dissipation of a central processing unit, etc. The above-mentioned embodiments are only for convenience of illustration. The scope of the rights should be based on the scope of the Chinese patent, which is only limited to the above embodiments. 戸 V. Brief Description of the Drawings Figure 1 is a schematic diagram of the present invention applied to a heat pipe. Figure 2 is a partial cross-section of the heat pipe of Figure 1. Figure 3. Figure 3 is a perspective view of the base of the laser diode used in the present invention. Figure 4 is a perspective view of the base of the base of Figure 3. Description of the drawing number 1 sealed container 4 base 52 straight groove 2 heat dissipation fluid 5 base 6 heat source Nano particles 51 ring groove 7 heat sink