TW592012B - Stencil printer for forming pre-solder bumps and method for fabricating the pre-solder bumps by employing the same - Google Patents

Abstract

A stencil printer for forming pre-solder bumps and a method for fabricating the pre-solder bumps by employing the same are provided. A plurality of pads is formed on an integrated circuit package substrate. A solder mask is applied on the surface of the substrate. A stencil printer having a stencil body and a sealing portion is stamped on the substrate coating with solder mask, followed by carrying out a reflow soldering processes. After the substrate is removed from the stencil printer, the pre-solder bumps are then formed on the surface of the substrate.

Description

592012 V. Description of the invention (1) ----- [Technical field to which the invention belongs] The present invention relates to a nuclear board printing device for forming a pre-solder bump and a pre-solder bump using the stencil printing device. A manufacturing method, in particular, a manufacturing method suitable for forming a pre-solder bump 2 by printing with a stencil printing technique and printing the pre-solder bump using the stencil printing device. i [Prior art] / ° According to BGA, Flip Chip, chip size package (csp Chi

Size Package) and multi-chip modules (MCM, Multi Chip, etc.) can reduce the IC area and have high density and multi-pin characteristics! Feng Yue has gradually become the mainstream in the packaging market. In order to make these packages lighter and shorter, production Fine-pi tch products with reduced line width and pad size have become the goal of continuous efforts in the industry. Stencil printing technology is to form solder bumps on solder pads. One of the commonly used technologies is to reduce the line width and pad size required to produce thin line pitch products. Therefore, the size of stenci 丄 opening in stencil printing technology is also relatively reduced. A commonly used stencil printing technique is to provide a package substrate 10 with a green paint 20 formed on the surface as shown in FIG. 4 and having a majority defining a formation position of a solder material (not shown) such as a solder paste. = Mat 30 'is a branch f 50 having a plurality of grids 50a on the package substrate 丨 0. After placing solder material on the template 50, for example, a roller 6 is used on the branch board. Roll back and forth over 50, or spray ing, so that the solder material passes through the grid 50A of the template 50, and after removing the template 50

17311 Full Punishment.ptd

592012 V. Description of the invention (2) After the reflow-soldering process is performed at a temperature sufficient to reflow the solder ball (Solder bal 1) (not shown), the solder ball is melted, so that The solder balls are re-soldered to form fresh tin bumps on the solder pads (both are not shown). However, when the size and spacing of the pads are reduced, the openings of the template must be smaller accordingly. Not only is the manufacturing cost of the template increased due to the difficulty of mold opening, but also due to the fine spacing of the openings of the template. It is difficult to let the solder material pass through, which causes a bottleneck in the process technology. Therefore, in addition to increasing the cost of the process, it is also facing process limits. At the same time, when the gap between the pads continues to shrink, the area of the pads will be blocked because of the existence of a protective layer between the pads, which will cause the size of the zinc pads that expose the insulation and protection layer to shrink, not only causing subsequent solder formation. The problem of convex 1 position is caused, and thus the solder ball is not easy to be attached to the solder pad. The yield rate of the printing technology is too low, and the heated and misfired material will also overflow during the glow. Dry solder is sticky. When the solder bumps are formed by Bai Zhi technology ’, because of the solder material Xia tin material (1 order ty), the more times it is printed, the more r, • 4 that sticks to the hole wall. Therefore, in addition to affecting the next printing and soldering ^ ^ etch, the shape of the solder bumps formed is more equal to the shape = Bu. Similarly, if the solder material adheres to ': go to production. Mouth yield and reliability. In addition, U.S. Patent Nos. 5,400,948, 5672,542,

592012 V. Description of the invention (3) 6 '5 5 1,9 1 7 Case also discloses the pre-solder bump manufacturing of related die printing technology ^ p-brush technology and the application of the template to the circuit board is pressed = ^ The national patent No. 5,400,948 has the area where the pads are fixed on the surface Γ Γ layer or multiple layers of solder resist to expose the solder bumps using a template to the US national patent No. 5, 6 72 , No. 542, and other solder bumps still remain on the substrate t ^ f and should be kept below 40 microns when reflowing. 'American Shinji makes the distance between the solder bumps between the board flat A 2 The 1st case No. 6, 5 5 1, 9 1 7 made the molds ten and slightly separated from the substrate, using conductive spheres, and forced your second servants to form a movement through the template. However, these patents mean that the conductive spheres such as §HAI are tightly horizontal ... The two patents failed to solve the problem that the solder material is difficult to pass through the minute openings of the template, and Yifu,, #, and He are quite capable. Stencil printing for forming pre-solder bumps with clothing to reduce process costs. Suggestions for manufacturing and pre-solder bumps using the stencil printing device. Therefore, the various shortcomings created by the above-mentioned conventional technology & how to solve the technical bottleneck that it is difficult for the fresh tin material to pass through the fine openings of the template to avoid the poor alignment of the pre-solder bumps and the overflow of solder material , The dream process p rate is too low, and the increase in manufacturing costs, etc., are really urgent lessons ^. ^ [Summary of the Invention] Accordingly, the main object of the present invention is to provide a stencil printing device for forming a pre-tin solder bump which can make a solder material smoothly pass through a template to form a pre-solder bump, and a stencil printing device using the same. Pre-convex method. 1 ′ Another object of the present invention is to provide a stencil printing device for forming a pre-solder bump, which can reduce the cost of stencils, and apply the stencil printing.

] 73] 1 Full 懋 .ptd

Method for manufacturing pre-soldering bump of device. The use of the device is provided by the Japanese brush. Another object of the present invention is to provide a method for forming a pre-solder bump for forming a pre-solder bump; Clothing and the application of the stencil printing winter invention in the 彡 A box of the day group JL 仏 1々 solder bumps are indeed a method for preparing the pre-solder bumps of the stencil printing device forming the pre-zinc tin bumps. ^ And application To achieve the opening and other purposes, Shizhi's stencil printing device is used to emboss its -m-type stencil printing and mounting package substrate, so that the sealing cup can be worn. The integrated electronic printing device includes a template body: "pre-solder bump." The template has a plurality of controllable solder seal portions, and the template body portion is protruded from the periphery of the template body portion: = ... the sealing portion is a plate In the main body. The template book_ 3 keeps the solder material in the mold. The overflow stoppers are formed in 2 parts respectively to form a plurality of overflow stoppers to prevent the solder material from overflowing to the periphery of the groove. In the embossing process, the printing device is surface-treated and outside the main body. Among them, the template is adhered to each other. A protective layer is provided to avoid contact with the solder material. The present invention also discloses a method in which a convexity of most solder pads is formed on the surface. The manufacturing method of the block includes providing at least a plate coated with fresh tin material and a circuit packaging substrate and embossing the stencil printing device on the packaging substrate of the packaging base solder material. The stencil printing device is coated with the brush device from the sealing substrate. , 2 for Re-soldering; and printing a solder bump on the template. On, a pre-solder is formed on the surface of the sealing substrate.

Page 8 592012 V. Description of the invention (5) I This month also provides a pre-solder bump structure made by applying the stencil printing device manufacturing method, and the pre-solder bump is in accordance with the groove of the stencil printing device. Shape, block structure | pre-solder bumps. The wind corresponds to the structure of the groove. It is used before the substrate printing device corresponding to the package substrate | the grooved plate printing device is stamped on the & area to form ^^ and the heating process is detailed. Solder material for road boards or integrated circuit package substrates in the pit area; Sound :; Empty, Depth, and Straight # to control the amount of tin as required :: I of the groove is embossed by a stencil printing device to form pre-fresh tin The bumps are smoothly separated from each other by the bumps. Same as Temple 0, the stencil printing of the present invention = pre-soldering can reduce the manufacturing cost of the stencil. It is easy to open the fork, and because the stencil printing device is used to emboss the reflow, the sealing portion of the stencil printing device is anchored; Completely dense I will not overflow. Therefore, it can not only solve the problem of the conventional w = tin material flow, but also save the process used in the conventional technology to overflow the device with solder material before reflow. u 1 Early stroke production efficiency At the same time, the adhesiveness of each groove coated with a protective layer (Adhesive-free adhesion), that is, the non-adhesion between the mask and the solder material. Therefore, in addition to the shape of the plate printing device, it can save repeated cleaning. Page 9 Π311 Quan 懋 .ptd 592012 V. Description of the invention (6) 俾 Solving conventional techniques In addition, due to the smooth formation of printing Bits are formed around the pre-grooves. Therefore, the pre-fresh tin bumps that can be decomposed are further explained below with their functions and effects, instead of [Embodiment Modes] Figures 1 to 3. It should be understood that The technical features are more basic, because the components are not based on the actual implementation, and the component layout is as shown in the figure. The part 11 and a seal are printed with a mounting substrate, for example. As an example, the structure of the illustration has not been changed, and it is easy to be clear. The disadvantages of the solder bump stoppage of the present invention can be implemented in detail to limit the system. These are only to show the number and status of the implementation. Aspects of the invention 13. The package base of the solder paste is simpler than the diagram because it can be used to make solder blocks, and to control the alignment of various technologies. Ways to cooperate. However, the present invention. High stencil yield. The pressure of the material in the stencil printing device can be selected from the fresh tin material in the groove of the stencil printing device. It is also the bottleneck of the surgery. It also ensures that the drawings are based on the characteristics of the present invention. The drawings are for reference only. This drawing is easy to understand and the shape of the number is possible. Among them, the conventional tinplate on the tin plate is only known, only the invention and the ruler are printed on the board. The seal formed by this material is shown and shown in the examples. Simplified to indicate the shape and size ratio are complicated. The circuit pre-soldering soldered substrate of the invention of the brush device makes the drawing and the drawing drawn by the company. The schematic diagram is to explain the elements of the invention in the present mode, and the displayed and dimensional proportions are drawn. It can be an optional design. 1Including a template body embodiment is applicable to the stencil printing for pressure plates and integrated circuit sealing bumps, and its features and structure are more directly related to the invention.

] 7311 全懋 .ptd Page 10 592012 V. Description of Invention (7) Structure, the rest are omitted. The template body 11 is generally square, and has a plurality of grooves 1 丨 ^ formed therein. The grooves n 丨 are generally semicircular, and can be selected with different depths and diameters (for example, 30 to 2). 〇micron) to control the amount of tin of the solder material to be embossed (to be described later), and the grooves 1 丨 "are surface-treated and coated with, for example, Teflon (p T f E,

Polytetrafluoroethylene (polytetrafluoroethylene) protective layer (not shown), so that the grooves 1 1 1 and other inner walls have a smooth surface. The shape of the main body of the template may have other changes, but is not limited thereto. The body portion 11 can be selected from, for example, any of a general steel plate, a stainless steel plate, an electromagnetic steel (silicon steel plate), a copper and copper alloy plate, an aluminum and aluminum alloy plate, and a titanium 5: and magnesium and magnesium alloy plate. The structure can be made of a material that is 125% warm and not easily deformed. / 、 It should be resistant. In addition, the coating of the protective layer is not limited. For example, you can choose to cover the stencil printing device with the protective layer described in the second, or only in the grooves. The protective layer is coated, but the overflow stop is not coated and is not coated. In the seal 13, it can be changed. Although it is roughly half-bright in this embodiment, it should be noted that the concave groove is not limited to this, and the degree of ice and The juxtaposed diameters and sizes are not limited to this. In addition, note /, miles, configuration bit dragon layer, and other suitable materials, only = You Er is not limited to the Teflon solder material mutual adhesion can be. , U t free such grooves 1 1 1 and

V. Description of the invention (8) The seal part 3 of the 呑 系 is convex and the main body part of the template " the periphery of the body and the periphery of the body can be selected from the right and the right, the code and the person ^ 1, the fork seal is like a groove: In addition, in the sealing part, you can choose: p] 3, the inner wall material companion: Glue or other high-temperature materials, such as a concave 4 to keep in the template body. t ^ Wrong: Solder: Surface treated and coated with, for example, Teflon or; suitable =, the part 13 can also be layered, only | can avoid the inner wall of the seal part 13 and fresh protection, and the seal part 13 also It can be selected as an example. For the structure made of materials, 4 or / and other high temperature resistant materials are -body molders, in other words = body η peripheral edge. In the second place, and other changes and modifications can be made. "In this example. The main body of the stencil 11 is compounded—blocks, tenons, ribs, or other appropriate stop-over junctions ^; columns such as protrusions prevent the solder material from overflowing to the template: in :: the stop-over can also be surface treated during the process And the coating is coated with the 'where the solder material such as solder paste is the material having the inner m; = t material, and the stencil printing device 1 is embossed with the solder material (B0hesl0n), and the solder material is separated from each other. The solder material in the concave groove 111 of the recess 因 will be 111 inches in the bean, which is in each of the grooves m, and can be gathered in each of the grooves, and the solder can be soldered. The material is indeed: molding. Therefore, the present block can be confirmed during the embossing process; The field material trowel is separated from each of the recesses 592012 V. Description of the invention (9) _ Brother 2 A to Brother 2 C and Figure 3 will be detailed ... The plate printing device 1 performs stencil printing method 2 In the present invention, the As shown in FIG. 2A, the mold first provides a package substrate 2 with a large number of bonding pads 21, and the surface of the package has been formed with a green paint-repellent agent 2 2 and the surface of the soil is exposed. The system is formed with a solder material 3 coated thereon, and the solder material ^, = 塾 21. For the package substrate 2, the amount of tin to be coated can be coated by the solder ^ according to the required amount of tin (step S1 shown in FIG. 3). Among them, the thickness of Xi 4 is controlled, which is tin, silver, copper, bismuth, antimony, zinc, nickel. § \ Hot tin material 3 may be selected from a mixture of elements selected from the group consisting of lead, Alloy of magnesium, indium, tellurium, and gallium). Due to the characteristics of the present invention (Paste) of the solder material 3, the method of the present invention is mainly distributed on the packaging substrate 2 and then, as shown in FIG. 2B, the details are described in detail. The solder material is coated with the solder material. 3's Suzaki 'embossed the stencil printing device 1 on the thermal reflow to make the solder material 仏 the circuit packaging substrate 2 and add the molten state, which is the third figure in the temperature gradient of gradually increasing temperature The setting of reaching the σ degree and the temperature and time are shown in step S2. Among them, the temperature ladder gold composition, tin powder particle size, and 糸 are determined by characteristics such as the solder composition of the solder material 3, and the metal contains 虿 and The chemical composition of the solder material 3 is not described here. Since this setting technique is a known person, in addition, when the stencil printing plate 2 is used, the solder material 3 can be imprinted by the charge_1 The package-based Device (CCD) technology is used to automatically align the S elements (Charge Coupled). Therefore, the complex pads 21 and the grooves 1 ij are required to be complicatedly adjusted, that is, May make these # 17311 full 懋 .ptd

Page 13 li 592012 V. Description of the invention (10) ^ '" --- The pad 2 stomach 1 and the grooves i 丨 丨 are indeed aligned with each other, which can greatly improve the production efficiency. Since this CCD automatic alignment technology is known, it will not be described further. Material ΐη In this example, the stencil printing device 1 and the solder can be printed for a period of 7 'after reaching a certain temperature, and then the mold 1 is imprinted on m ί ΐ 枓 3, and the template When printing on the material 3, it is also continuously broken by heating. = The surface tension effect during the melting of Ergan Temple made the solder material 3 into a dream / Xi Er understood that in this embodiment, although the stencil printing f is set to 1 and the solder material 3 is heated at the same time for a while, But this hair = set! Imprint the solder material 3 = a ^^ Λ, and then use the template to print the brushing device 1 and the solder material% gate ^ base f. Then the template shown in the example is a gab period 'instead of After taking the actual example, as shown in Figure 2C, the template substrate 2 is removed, and the & ^ y "clothes 1 1 mesh packing block 在 is sealed in this, which is the third figure ^ Steps s 3 among the plurality of pre-solder bumps are formed on the surface of the substrate 2. As the number of pre-soldering bumps 3 1 can be adjusted according to the desired amount, the amount of tin can be formed by the amount of |, ten & μ, so the required solder material can be calculated according to the need < + / N μ 3 ^ ^ ^ Calculate the depth and straightness of these grooves 1 1 1; ^ In order to imprint a concave # 凹 of the solder material of the tin | control, 俾 get the party I ^, π 刊 竹 I 竹 里The structure of the pre-soldering bump 31 is served. The pre-soldering solder formed in the Langzhong Fen embodiment includes 尨 inflammation +, and is referred to as Yizhong. Although this # 彡 stomach & | μ β, π π / tin bump 31 is a structure of spherical bumps, the shoulder Zuo Si 疋, the shape of the groove 111 of the pre-soldered solder bump is shaped. Due to the + β box Erzhu J's view, the port must be modified. The structure of the tin bump 3 1 is

Π3Π Full 懋 .ptd

592012

Through the stencil printing device of the present invention and a method for manufacturing a pre-solder bump using the stencil printing device, a stencil printing device with easy mold opening can be provided and the cost of manufacturing a template with fine openings can be saved, and a method for reducing the cost of stencil manufacturing can be provided. Stencil printing device for forming pre-solder bumps and method for manufacturing the pre-solder bumps using the stencil printing device, and can save the cost and time of repeatedly wiping and cleaning the stencil to achieve the requirements of fine line spacing products to reduce the line width and soldering Target for pad size. The stencil printing device for forming a pre-solder bump according to the present invention and the method for manufacturing the pre-solder bump using the stencil printing device can make the solder material smoothly form a pre-solder bump with a uniform shape by embossing of the stencil printing device. Not only can the embossing shape of the stencil printing device be changed according to demand, the process is simplified, and it is easy to implement. It provides a stencil printing device that can improve the stencil printing yield rate and a method for manufacturing pre-solder bumps using the stencil printing device.

] 73] 1 懋 .ptd Page 15 592012 V. Description of the invention (12) It can save the process time and increase the production capacity. The stencil printing device of the present invention can seal the solder material in the area where the pre-solder bumps are to be formed, not only can solve the problem of solder material overflow in the conventional technology, but also can provide a solder bump that can be accurately aligned. The stencil printing device used to form the pre-solder bumps and the method for manufacturing the pre-solder bumps using the stencil printing device can not only help the subsequent processes, but also improve the yield of the product. The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. That is, the present invention can in fact be modified in other ways. Under the defined broad spirit and viewpoint, various equivalent changes or modifications should fall within the scope of the following patents of the present invention.

17311 Quan 懋 .ptd Simple explanation of the drawings on page 16 ^ -_____ [Simplified description of the drawings] The first diagram is a schematic diagram of the stencil printing device from 2A to 2nd month; the 1st edition of the tin bump production method The invention applies the integrated circuit of the pre-soldering material of the stencil printing device. ^ F figure, which =, FIG. 2A shows the provision of solder embossing the thick solder material, and the substrate. FIG. 2B shows the stencil printing device. It is like a bear, 笫 2rm 4 on the integrated circuit package substrate and reflowed ^ Λθ η rA. Then the pre-printing process completed after the release of the stencil printing device is presented, 'FIG. 3 is a flow chart of the manufacturing method of the present invention; FIG. 4 is the pre-soldering projection using the stencil printing device shown in the conventional figure 0 Block and stencil printing structure and its use status 1 Stencil printing device 3 Solder material 13 Sealing section 2 1, 3 0 Pad 31 Pre-tinned solder bump 5 〇 A Grid 111 Groove 2, 1 〇 Integrated circuit Package substrate 11 Stencil body 2 0 Green paint 22 Solder resist 5 0 Stencil 6 0 Roller s 1, S 2 'S 3 Step

Claims (1)

592012 The scope of the patent application is used to form a pre-solder solder printing device with solder powder = bumps on it. It is used to imprint: ^ tin material integrated circuit package substrate for sealing & substrate There are several pre-resistances on the surface. Β seals a 2, I dry tin bumps. The stencil printing device includes: tin volume: slot, Π concave; there are a plurality of tin materials that can control the solder material to each other; Α 糸 is coated with a protective layer to avoid a seal with the welding part, which is a # ^ 1 during the printing process to prevent the peripheral edge of the template body portion at the end of the template, so as to press 2. If the scope of the patent application = material; Bu // Two of them, _anti-body plate 4 steel steel plate, electromagnetic steel plate (silicon steel plate) 'steel and sodium octopus plate, aluminum and aluminum alloy Jinyou, 4 „~ and copper alloy ^ ^, plate titanium and titanium alloy plate, and Magnesium and magnesium alloy + ^ Seeking group consisting of any one of the group. Wu Ni plate 3 U: the patent handle of the first item for forming a pre-solder bump bump e brush device, in the bean, Xi lift >, made of the material printed on the Nixinju board. + 易 k 形 4 · If you apply for the first brush device in the scope of patent application, straight in ... + Λ is printed on the template forming the pre-red tin bumps, and a plurality of stops ^ are formed in the body portion of the branch plate, and the overflow stops are formed at the periphery of each groove ^ each of the grooves The solder material is used for positioning. To control 5 · As claimed in the patent scope 帛! Item is used to form a pre-solder bump brush device 'wherein the protective layer of the Xiao groove is a Teflon, P Polytetrafluoroethylene) layer. UE, 6 · Stencil printing for the formation of pre-solder bumps as claimed in item 丨 of the patent scope 17311 懋 .ptd Page 18 592012 VI. Scope of patent application The brush device, wherein the sealing portion is a groove and filled with silicone. 7. For example, the stencil printing device for forming pre-solder bumps in the scope of the patent application, wherein the sealing portion is a structure made of silicon rubber. 8. The stencil printing device for forming a pre-solder bump as described in item 1 of the scope of patent application, wherein the sealing portion is a structure made of a high temperature resistant material. 9. For example, the stencil printing device for forming a pre-solder bump in the first patent application scope, wherein the sealing portion and the peripheral edge of the stencil main body portion are integrally formed. 10. The stencil printing device for forming a pre-solder bump as described in item 1 of the patent application scope, wherein the sealing portion is coated with a protective layer to prevent the inner wall of the sealing portion and the solder material from adhering to each other. 11. The stencil printing device for forming a pre-soldering bump according to item 10 of the scope of patent application, wherein the protective layer is a Teflon layer. 1 2. A method for manufacturing a pre-solder bump, comprising: providing an integrated circuit package substrate having at least one surface formed with a plurality of solder pads, and coating a solder material on the integrated circuit package substrate; A stencil printing device for forming a pre-solder bump is embossed on the packaging substrate coated with the solder material, and is re-soldered; and the stencil printing device is removed from the packaging substrate and placed on the surface of the packaging substrate A pre-solder bump is formed on the top. 1 3. According to the method for manufacturing a pre-solder bump in Item 12 of the scope of patent application, wherein the stencil printing device and the solder material are heated at the same time for a period of time. 17311 Quan 懋 .ptd Page 19 592012 6. Apply for 4 patents. After reaching a certain temperature, apply it to the solder material. 1 4 · The pre-solder bumps as described in item 12 of the patent application are stamped on the stencil printing device to heat the solder, and the zinc-tin material is formed into pre-solder bumps when the solder is melted. 1 5 · Pre-solder bumps as described in item 12 of the patent application " Xuan stencil printing device is surface-treated and the solder material is applied to each other. 16. The pre-solder bump as described in item 12 of the patent application. 4 The integrated circuit package substrate is selected from the group consisting of electrical types. 1 7 · The pre-solder bump ft substrate and the stencil printing device according to item 12 of the patent application are in the (Charge Coupled Device, CCD) position. 1 8 · The pre-fresh tin bump as described in item 12 of the patent scope is the amount of tin in the solder material according to the number of pre-solder bumps to be formed. 19 I apply for a pre-soldering bump in item 12 of the patent application. The tin-glow material is any one selected from the group consisting of lead, tin, silver, copper-nickel, copper, magnesium, indium, tellurium, and gallium. 2 0 · A pre-solder bump structure is a method of embossing a block by using a stencil printing device of Shenjing, in which the continuous surface tension effect on the material makes the block, in which a protective layer is applied to avoid contact with the block. Manufacturing method, including the method of manufacturing any one of the circuit board and the substrate, wherein the charge-coupled element alignment technology is used for the manufacturing method of the block, and the manufacturing method of the required block is determined by the size, of which,, surface, antimony, zinc, The mixed range of the elements of the group 17311 Quan 懋 .ptd 592012 VI. Stencil printing device for forming pre-solder bumps in the scope of patent application It is made by the pre-solder bump manufacturing method in item 12 of the scope of patent application, and the structure of the pre-solder bumps corresponds to Formed by the groove structure of the stencil printing device. 2 1. The pre-solder bump structure according to item 20 of the patent application scope, wherein the pre-solder bump is a structure of a spherical bump. 17311 懋 .ptd Page 21