TW591197B - Thermally conductive interfacial layer - Google Patents

Abstract

A thermally conductive interfacial layer is mounted on the surface of a thermally conductive or dissipative component or in a component, and includes diamond powder particles and a fluid for filling voids. The diamond powder particles have at least one particle size. The diamond powder particles and the fluid are fully mixed to form a thermally conductive interfacial layer. The powder in the interfacial layer is diamond, which has an excellent thermal conductivity. The invented interfacial layer not only can remove air from voids, but also can be used as a thermal dissipative material for an interface while reducing the conductive/diffusive thermal resistance for the interface.

Description

591197 Case No. 91120367 Ά 修 it V. Description of the invention (1) [Technical field to which the invention belongs] The present invention relates to a heat-conducting interface layer, especially a type that can be disposed between a contact interface between two heat-transfer elements, or to provide heat transfer The surface of the heat-dissipating element, or the heat-conducting interface layer (material) at the interface, which can reduce both the contact thermal resistance and the diffusion thermal resistance of the interface at the same time. [Previous technology] The composition of the conventional thermal grease is mostly a mixture of oxidized metal powder and oil, and its synthetic thermal conductivity (about 0.8 ~ 1. 5W / m · ° C) is more than The air (about 0 · 0 2 6 2 W / m · t) is good, but the thermal conductivity is still about one hundred times that of the heat transfer element (such as a heat sink or heating element), so it can only be used as an interface gap filler material , And only improve the problems caused by air in the holes. The reason is that the present inventor feels that the above-mentioned deficiency can be improved, and has devoted himself to research and cooperated with the application of science to finally propose a present invention with a reasonable design and effective improvement of the above-mentioned deficiency. [Summary of the invention] The main object of the present invention is to provide a thermally conductive interface layer, the powder of which is a diamond, and the thermal conductivity coefficient is very good (about 800 ~ 10000) / 'W / m · ° C, It is higher than the heat transfer element by about 4 ~ 1 〇 & ^ Z 1 port 'So' the interface layer of the present invention can not only fill the gap to exhaust air, reduce the contact of the heat group caused by the existence of gas holes ~ When the thermal diffusion material at the interface, the spreading thermal resistance at the interface is reduced at the same time, that is, the conduction thermal resistance and the diffusion thermal resistance at the interface are simultaneously reduced. In order to achieve the above-mentioned object, the present invention provides a thermally conductive interface

591197 _Case No. 91120367_Year Month and Day Amendment_ Five. Description of the invention (2) The layer includes diamond powder particles composed of at least one kind of particle size; and interstitial fluid; the above diamond powder particles and filler The interstitial fluids are fully mixed to form a thermally conductive interface layer. The present invention further provides a thermally conductive interface layer, comprising: diamond powder particles composed of at least one particle size; a second powder having a good thermal conductivity coefficient; and an interstitial fluid; the diamond powder particles and a second thermal conductivity The powder with a good coefficient is sufficiently mixed with the interstitial fluid to form a thermally conductive interface layer. In order to further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention, but the drawings are provided for reference and explanation only, and are not intended to limit the present invention. [Embodiment] Referring to the first figure, the present invention provides a thermally conductive interface layer 10, which includes diamond powder particles 11 and interstitial fluid 12, and the diamond powder particles 11 are composed of at least one The particle size of the diamond powder particles 1 1 refers to natural diamond, artificial diamond, industrial diamond or carbide. The interstitial fluid 12 refers to oils or lipids, the oil refers to mineral oil, stone evening oil, petroleum series ointment or petroleum jelly, and the lipid refers to animal fats or vegetable fats. The interstitial fluid 12 can also refer to glues (g 1 ue) that have adhesive fixing ability and can be cured after being set at the heat transfer interface. The glues refer to epoxy resin (e ροXy resi η) series, Shi Xi Glue (si 1 ic οn eg 1 ue) series, acrylic glue (A cry 1 ic) series or anoxic glue series. The above-mentioned diamond powder particles 11 and the interstitial fluid 12 are thoroughly mixed to form a thermally conductive interface layer (material) 10.

591197 _Case No. 91120367_Amended in January / Year__ 5. Description of the invention (3) Please refer to the second figure. The heat-conducting interface layer 10 can be set on two heat-transfer elements 20 and 30 (such as central processing units and other heating elements) And heat sink, etc.) to reduce thermal resistance. In addition, the heat-conducting interface layer 10 can also be provided with a surface of a heat-transmitting and heat-dissipating element (not shown) to increase the heat diffusivity and increase the surface area for heat dissipation. In addition, the heat-conducting interface layer 10 can also be disposed in the cavity of the heat-conducting element (not shown), and acts as a second type of conductor. Referring to the third figure, the present invention may further be provided with a second powder 13 having a good thermal conductivity to save the cost of diamonds. The second powder having a good thermal conductivity refers to gold, silver, copper, aluminum or an oxide thereof, which is added to diamond powder particles 11 and interstitial fluid 12, and diamond powder particles 11 and interstitials. Fluid 1 2 is thoroughly mixed. The powder of the interface layer of the present invention is diamond, and its thermal conductivity is very good (about 800 ~ 2000 W / m · ° C), and it is about 4 ~ 12 times higher than that of the heat transfer element. As shown in Annex I, the general thermal resistance of commercially available thermal conductive pastes is 0 · 5 6 ~ 0 · 5 7 (° C / wa 11), and the interface layer of the present invention can reduce the total thermal resistance to 0 · 40 ~ 0 · 41 (° C / watt). The interface layer of the present invention can not only fill the gap to discharge air, but also can be used as a thermal diffusion material at the interface, so that the spreading thermal resistance of the contact interface is reduced by 4 degrees from the same date, that is, the contact thermal resistance and diffusion heat of the interface are reduced Resistance. Among them, the volume mixing ratio of the interstitial fluid is best filled with the gap between the diamond particles and the particles to 5 times the volume of the diamond particles. After that, the heat transfer characteristics decrease as the mixing ratio of the interstitial fluid increases. Heat transfer design needs and cost or operating temperature make the appropriate choice. To sum up, the present invention improves the heat conduction coefficient of the conventional heat conductive paste and the heat conduction coefficient of the heat transfer element.

591197 _Case No. 91120367_ Revised Year of the Month _ V. Description of the Invention (4) The use of materials, such as high contact thermal resistance and high diffusion thermal resistance, is a rare new invention product, which has great industrial applicability, The novelty and progress are in full compliance with the requirements for patent application for invention, and the application is made in accordance with the Patent Law. Please check and grant the patent in this case in order to protect the rights of the inventor. However, the above are only the preferred and feasible embodiments of the present invention, and the patent scope of the present invention is not limited by this. Therefore, all equivalent technical changes made by using the description and drawings of the present invention are included in the same reason. Within the scope of the invention, Chen Ming was together.

591197 _Case No. 91120367_ 年月 日 __ Brief Description of the Drawings [Simplified Description of the Drawings] The first drawing is a schematic plan view of the heat conductive interface layer of the present invention. The second figure is a schematic diagram of the use state of the thermally conductive interface layer of the present invention. The third figure is a schematic plan view of another embodiment of the thermally conductive interface layer of the present invention. Attachment 1 is a comparison table of the experimental skills of the conventional technique and the present invention. Explanation of symbols: 10 Thermally conductive interface layer

11 Diamond powder particles 12 Interstitial fluid 13 Second powder with good thermal conductivity 2 0 Heat transfer element 3 0 Heat transfer element

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Claims (1)

591197 _Case No. 91120367_ Modified on __ Month and Day__ Application scope 1 、 A thermally conductive interface layer, which is arranged on the surface of or between heat transfer and heat dissipation elements, including: diamond powder particles, at least one particle size The composition; and the interstitial fluid; the diamond powder particles and the interstitial fluid are fully mixed to form a thermally conductive interface layer. 2. The thermally conductive interface layer as described in item 1 of the scope of the patent application, wherein the diamond powder particles refer to natural diamond, artificial diamond, industrial diamond or silicon carbide. 3. The thermally conductive interface layer as described in item 1 of the scope of the patent application, wherein the interstitial flow system refers to oil. 4. The thermally conductive interface layer as described in item 3 of the scope of the patent application, wherein the oil refers to mineral oil, stone oil, petroleum series ointment or petroleum jelly. 5. The thermally conductive interface layer as described in item 1 of the scope of the patent application, wherein the interstitial flow system refers to lipids. 6. The heat-conducting interface layer as described in item 5 of the scope of patent application, wherein the lipid refers to animal oil or vegetable oil. 7. The heat-conducting interface layer as described in item 1 of the scope of the patent application, wherein the interstitial flow system refers to a glue that can be cured with adhesive fixing ability. 8. The heat-conducting interface layer as described in item 7 of the scope of the patent application, wherein the glue refers to epoxy resin series, silicone rubber series, acrylic rubber series, or anoxic rubber series. 9. A thermally conductive interface layer, which is arranged on the surface of the heat transfer and heat dissipation components Page 10 591197 _Case No. 91120367_Amended Date_ Sixth, the scope of patent application between surfaces or components, including: diamond powder particles, composed of at least one particle size; the second powder with good thermal conductivity; And the interstitial fluid; the diamond powder particles mentioned above and the second powder with a good thermal conductivity are fully mixed with the interstitial fluid to form a thermally conductive interface layer. 10. The heat-conducting interface layer according to item 9 of the scope of patent application, wherein the diamond powder particles refer to natural diamond, artificial diamond, industrial diamond or carbonized diamond. 11. The heat-conducting interface layer according to item 9 of the scope of the patent application, wherein the second powder having a good thermal conductivity means gold, silver, copper, aluminum, or an oxide thereof. 12. The heat-conducting interface layer according to item 9 of the scope of the patent application, wherein the interstitial flow system refers to oil. 13. The heat-conducting interface layer as described in item 12 of the scope of patent application, wherein the oil refers to mineral oil, silicone oil, petroleum series grease or petroleum jelly. 14. The heat-conducting interface layer according to item 9 of the scope of patent application, wherein the interstitial flow system refers to lipids. 15. The heat-conducting interface layer according to item 14 of the scope of patent application, wherein the lipid refers to animal fats or vegetable fats. 16. The heat-conducting interface layer according to item 9 of the scope of the patent application, wherein the interstitial flow system refers to a glue that can be cured with adhesive fixing ability. 17. Thermally conductive interface layer as described in item 16 of the scope of patent application Page 11 591197 Case No. 91120367_Year Month Date Amendment 6. Scope of patent application, where the glue refers to epoxy resin series, silicone rubber series, acrylic rubber series or anoxic rubber series. See ΙϋΒΪ page 12