TW591067B - Polymers having backbones with reactive groups employed in crosslinking as precursors to nanoporous thin film structures - Google Patents

Polymers having backbones with reactive groups employed in crosslinking as precursors to nanoporous thin film structures Download PDF

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TW591067B
TW591067B TW89106630A TW89106630A TW591067B TW 591067 B TW591067 B TW 591067B TW 89106630 A TW89106630 A TW 89106630A TW 89106630 A TW89106630 A TW 89106630A TW 591067 B TW591067 B TW 591067B
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reactive groups
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Kreisler Lau
Roger Leung
Tian-An Chen
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Honeywell Int Inc
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  • Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)

Abstract

Nanoporous materials are fabricated from polymers having backbones with reactive groups used in crosslinking. In one aspect of preferred methods and compositions, the reactive groups in the backbone comprise a diene and a dienophile. The diene may advantageously comprise a tetracyclone, and the dienophile may advantageously comprise an ethynyl. In another aspect of preferred methods and compositions, the reactive groups in the backbone are included in a conjugated system. Especially preferred polymeric strands comprise a poly(arylene ether) synthesized from a difluoroaromatic portion and an aromatic bisphenolic portion. It is still more preferred that the difluoroaromatic portions of the poly(arylene ether) are modified in such a way that some difluoroaromatic portions carry a thermolabile portion. In still other aspects crosslinking may advantageously occur without reliance on an exogenous crosslinker.

Description

五、發明說明(1) 本申請案聲明1999年4月9 > 6 0/ 1 28, 465之益處,並 八美國臨時申請案 發明之JLg· </、在此全部併入作為參考。 本發明之領域為毫微孔材料。 背景 ,著積體電路中功能元件之 增加。為了適應現代積體電路 度及互接度 層金屬導體線路。ϊ 低介電常數材料中之多 線踗門•“、r申減小電容效應,其經常造成導體 、’、β 之串音及較低之驅動積體電路電壓。 :=在絕緣材/料中得到低介電常數之 電常數之材料。㉟常,近年來已使用兩 二電:數材料—無機氧化物及有機聚合物。無機氧化物具 机▲之介電常數,並且已廣泛地用於具有大於〇.25 a ^计規則之互接。隨著互接尺寸之縮小,具有較低介電 =數之材料變為更希望的。有機聚合物已顯示許多有利性 I ’其包括高熱安定性、易於處理、低應力/TCE、低介電 常數及高抗性’並且因此被視為用於〇· 18 及後代越來 越小尺寸之替代性低介電常數聚合物。 關於其他性質’希望之介電物亦應無水份及出氣問題, 具有適合之磨擦與填隙品質,而且對熱循環、蝕刻、與 591067 五、發明說明(2) CMP製程(即,化學機械拋光)具有適合之尺寸安定力。適 合之介電物亦應具有至少3 〇 〇 〇c,而且較佳為5 〇 〇。〇或更高 之丁g值(玻璃轉移溫度)。 推斷對於0 · 0 7 // m及以下之設計規則之需求浮現對於具 有小於2 · 2之介電常數之材料之強烈需求。其已造成具有 已設計毫微孔度之介電材料之發展。由於空氣具有約1 · 〇 之介電常數,主要目標為降低毫微孔材料之介電常數至低 於1之理論極限。 此技藝已知許多種製造毫微孔材料之方法。在一種方法 中’熱安定聚合物摻合感熱(熱可分解)聚合物。摻合之混 合物然後交聯且感熱部份熱解。實例敘述於Hedrick等人 國專利^ 776’ 990。在另一種方法中,感熱嵌段及熱 安疋嵌段在單嵌段聚合物中交錯。然後將嵌段共聚物加熱 以熱解感熱嵌段。在第三種方法中,載有感熱部份之感熱 嵌段及熱安定嵌段混合及聚合產生共聚物。繼而將共聚物 加熱以熱解感熱嵌段。在第四種方法中,將小型中空玻璃 球引入材料中。實例示於Kamezaki之美國專利5,458"7〇9 及Yokouchi 之美國專利 5, 593, 526。 ’ :論用以引入孔隙之方法為何,在製造毫 常遭遇結構問題。其中,將多孔性増至超過臨界程^(時^ 已知之笔微孔材料通常為約30%)趨於造成多孔性 解。可藉由加入偶合熱安定部份與其他熱之 添加物因而製造較堅硬之網路,而—此丨份之乂聯 通电,在此技藝已知兩種不同之在毫微孔材料中交聯熱V. Description of the invention (1) This application declares the benefits of April 9, 1999 > 60/128, 465, and the eighth US provisional application JLg · < /, which is incorporated herein by reference in its entirety. The field of the invention is nanoporous materials. Background, the increase in functional components in integrated circuits. In order to adapt to the modern integrated circuit circuit and interconnection degree layer metal conductor circuit.多 Multi-wire gates in low-dielectric constant materials • ", r, reduce capacitance effects, which often cause conductors, ', β crosstalk and lower drive integrated circuit voltage.: = Insulation materials / materials Materials with a low dielectric constant and constant dielectric constant. Often, in recent years, two or two materials: inorganic oxides and organic polymers have been used. Inorganic oxides have a dielectric constant of ▲ and have been widely used. For interconnections with greater than 0.25 a ^ rule. As the interconnection size shrinks, materials with lower dielectric = numbers become more desirable. Organic polymers have shown many benefits I 'which include high heat Stability, ease of handling, low stress / TCE, low dielectric constant and high resistance 'and are therefore considered as alternative low dielectric constant polymers for smaller and smaller sizes of 0.18 and future generations. About other properties 'The desired dielectric should also be free of moisture and outgassing problems, have suitable friction and interstitial qualities, and be suitable for thermal cycling, etching, and 591067 V. Description of the invention (2) CMP process (ie, chemical mechanical polishing) has Suitable size stability. Suitable The dielectric should also have a D-g value (glass transition temperature) of at least 3,000, and preferably 50,000 or higher. Inferred design rules for 0 · 0 7 // m and below The demand has emerged for the strong demand for materials with a dielectric constant less than 2.2. It has led to the development of dielectric materials with a designed nanoporosity. Since air has a dielectric constant of about 1.0, the main goal is In order to reduce the dielectric constant of nanoporous materials to a theoretical limit below 1. This technique is known for many methods of manufacturing nanoporous materials. In one method, 'thermostatic polymer blended with thermosensitive (thermally decomposable) polymerization The blended mixture is then crosslinked and the thermosensitive part is pyrolyzed. An example is described in Hedrick et al. Patent 776'990. In another method, the thermostable block and the thermostable block are in a monoblock polymer. Interleaved. Then the block copolymer is heated to pyrolyze the thermal block. In the third method, the thermal block and the thermally stable block carrying the thermal block are mixed and polymerized to produce the copolymer. The copolymer is then heated Sensitive thermal block with pyrolysis. In the fourth method, small hollow glass spheres are introduced into the material. Examples are shown in U.S. Patent 5,458 " 709, Kamezaki, and U.S. Patent 5,593,526, Yokouchi. 'What are the methods for introducing pores? In the manufacture, structural problems are often encountered. Among them, the porosity is increased beyond a critical range ^ (the known pen microporous material is usually about 30%) tends to cause the porosity solution. By adding a coupling thermal stabilizer And other hot additives thus make a harder network, and-this part of the coupling is energized, in this technology two different types of cross-linking heat in nanoporous materials are known

第6頁 591067 五、發明說明(3) 安定部份之技術。在一種技術中,已將特定之交聯官能基 加入聚合物中。此官能基一起反應以在感熱部份熱解之前 ^聯聚合物。例如,已知在嵌段共聚物中包括二苯乙炔官 能基及使用乙块官能基以交聯聚醯亞胺聚合物。其圖示於 f行技藝圖1 ’其中兩個不同之獨立聚合束1〇Α,ι〇β載有 父聯官能基X 1與X2作為側接基,及感熱部份L作為側接基 作為骨架之一部份。隨著交聯進行,XI與X2反應以形成 父聯γ,因而將兩束1〇A,1〇β共價地連接成為單一交聯聚 合物1 0 C。 f f種技術中’外來交聯分子用於交聯。然後將交聯 聚合物加熱以熱解感熱部份。例如,在streckle,Jr之 ίΠΓ?:,1 二,使用外加之多官能基醢基-或〒基函 二U 於先行技藝®2,其中兩個獨立聚 度載有交聯官能基χι與χ2作為側接基,及 := Λ側Λ基且作為骨架之-部份。隨著交聯進 ί交聯分子χ3,因而形成交聯γ,並且 毫微农好u: r貝地連接成為單一交聯聚合物2〇c。 中,使用外來交聯分子需要佔一脚:、s Λ $制” 份而不干擾聚合反應。此r 特定地反應熱安定部 物或單體之相同溶劑系統中。;劑:須溶於…聚合 份之化學結構及反應性經ί要=熱安定部份與感熱部 一個限制為在聚合物中使用父聊刀亍灸奉丨生力 聚合物之複雜度,因而=:加軍;1\定交聯官能基增加 二㊉ί曰加早體合成之困難度。加入 591067 五、發明說明(4) 官能基亦干擾聚合反應,而且不利地改變聚 電性質,特別是在使用相當複雜之交聯官能 總之’已知各種交聯毫微孔材料中之聚合 而,目前之方法經常使單體合成複雜化,或 孔材料之聚合反應或物理化學性質。令人驚 力地改良毫微孔材料之各種性質,及大費周 孔材料之交聯,仍無一般方法以交聯而(a ); 聯分子’及(b )不將侧接官能基加入單體。E 過這些限制之方法及組合物之需求。 發明之概要 本發明提供方法及組合物,其中由含具有 及具有用於交聯反應之反應基之骨架之氟化 物製造毫微孔材料。 在較佳具體實施例之一種狀態中,骨架中 二稀及親二烯物。在更佳具體實施例中,二 且親二稀物包含二苯乙炔基形式之乙炔基。 在較佳具體實施例之另一種狀態中,骨架 括於共輕系統中。在特佳具體實施例中,聚 化一氣芳族部份及氟化芳族貳酚部份合成之 ·) 在更佳具體實施例中,聚(芳醚)之二| 些二敦芳族部份載有感熱部份之方式修改 在較佳具體實施例之其他狀態中,發生交 來交聯劑。 本^明之各種目的、特點、狀態及優點由 合物之機械及 基時。 物之方法。然 趨於干擾宅微 奇地,儘管努 章地改良毫微 :依賴外來交 I此,仍有越 撓性結構部份 及非氟化聚合 之反應基包含 埽包含四環酮 中之反應基包 合束包含由氟 氟化聚(芳 匕芳族部份以 〇 聯而不依賴外 以下本發明較 591067 五、發明說明(5) 佳具體實施例之詳細說明及附圖而變為顯而易知的,其中 類似之號碼表示類似之成份。 圖式之簡要說明 圖1為敘述含感熱基聚合束之交聯之先行技藝圖。 圖2為敘述含感熱基聚合束使用外來分子之交聯之先行 技藝圖。 圖3為敘述含感熱基聚合束依照本發明標的之狀態之交 聯之圖。 圖4為敘述含感熱基聚合束依照本發明標的之另一種狀 態之交聯之圖。 圖5為製造聚(芳醚)之一般合成圖。 圖6 A - 6 J為依照本發明標的之意圖二氟芳族化合物之結 構。 圖7為製造含芳醚聚合物之四環酮之合成圖。 圖8為將感熱成份接枝至聚合束之合成圖。 圖9 A與9 B為依照本發明標的造成含四環酮聚(芳醚)之二 氟芳族單體之結構。 圖1 0與1 1為依照本發明標的造成四環酮及乙炔基聚(芳 醚)之二氟芳族單體之結構。 圖1 2 A - 1 2 I為依照本發明標的之聚合束中重複部份之結 構。 詳細說明 在圖3中,兩個聚合束30A,30B載有多個感熱基L。各聚 合束界定骨架,而且各骨架包括反應基\1與义2。束30A與Page 6 591067 V. Description of the invention (3) Technology of the stability part. In one technique, specific cross-linking functional groups have been added to the polymer. This functional group reacts together to cross-link the polymer before pyrolyzing. For example, it is known to include diphenylacetylene functional groups in block copolymers and use ethyl functional groups to cross-link polyfluorene imine polymers. The diagram is shown in Figure 1. Figure 1 'Two of the two independent polymer bundles 10AA, ι〇β carry the parent functional groups X1 and X2 as side groups, and the heat-sensitive part L as side groups as Part of the skeleton. As the cross-linking progresses, XI reacts with X2 to form a parent cross-linking gamma, thus covalently linking two bundles of 10 A, 10 β into a single cross-linked polymer 10 C. In f f techniques, 'foreign cross-linking molecules are used for cross-linking. The crosslinked polymer is then heated to pyrolyze the heat-sensitive portion. For example, in Streckle, Jr's ΓΠΓ?:, 1, two, the use of a multifunctional fluorenyl- or fluorenyl function two U in advanced technology ®2, where two independent polymerizations carry cross-linking functional groups χι and χ2 As a side-linking group, and: = Λ-side Λ-group and as-part of the skeleton. With the cross-linking of the cross-linking molecule χ3, cross-linking γ is formed, and the nano-Non-U: r-Beddi linking into a single cross-linked polymer 20c. In the use of foreign cross-linking molecules, it is necessary to account for one part: s Λ $ system without disturbing the polymerization reaction. This r specifically reacts in the same solvent system as the thermal stabilizer or monomer. The agent: must be dissolved in ... The chemical structure and reactivity of the polymer are: the thermal stability part and the heat sensitive part are limited to the complexity of using bio-polymers in the polymer, so =: Canada; 1 \ Defining cross-linking functional groups to increase the difficulty of early body synthesis. Adding 591067 V. Description of the invention (4) Functional groups also interfere with the polymerization reaction and adversely change the polymerization properties, especially when using relatively complex cross-linking In short, it is known that polymerization in various crosslinked nanoporous materials, and the current methods often complicate monomer synthesis, or the polymerization reaction or physicochemical properties of porous materials. Amazingly improved nanoporous materials Various properties, and the cross-linking of expensive materials, there is still no general method to cross-link (a); cross-linking molecules' and (b) do not add pendant functional groups to the monomer. E. Methods and combinations that pass these restrictions Needs of things. Summary of invention The invention provides a method and a composition, wherein a nanoporous material is produced from a fluoride containing a skeleton having and having a reactive group for a cross-linking reaction. In a state of a preferred embodiment, the skeleton is dilute and hydrophilic. Diene. In a more preferred embodiment, the di- and di-dienes comprise ethynyl in the form of diphenylethynyl. In another state of the preferred embodiment, the backbone is enclosed in a co-light system. In the preferred embodiment, the polymerized mono-aromatic aromatic moiety and the fluorinated aromatic resorcinol moiety are synthesized.) In a more preferred embodiment, the poly (aryl ether) is two | Modification of the method with a heat-sensitive part In other states of the preferred embodiment, cross-linking occurs. Various purposes, characteristics, states, and advantages of the present invention are determined by the mechanism and time of the compound. It tends to interfere with the house, even though it is modified by Nu Zhangdi: it depends on external interactions, but it still has more flexible structural parts and non-fluorinated polymerization. The reactive group contains fluorene, which contains the reactive group in tetracyclone. The bundle contains a polyfluoride The following is a copy of the present invention, which does not rely on the following. The present invention is more obvious than 591067. 5. Detailed description of the invention (5) The detailed description of the specific embodiment and the accompanying drawings are obvious, and similar numbers indicate similar components. Brief description. Figure 1 is a description of the prior art of thermosensor-containing polymer bundles. Figure 2 is a view of the prior art of thermosensor-based polymer bundles using foreign molecules. Figure 3 is a description of thermosensor-based polymer bundles. The cross-linking diagram of the state of the subject of the present invention. Figure 4 is a diagram describing the cross-linking of the thermo-group-containing polymer bundle according to another state of the subject of the invention. A-6 J is the structure of the intended difluoroaromatic compound according to the subject of the present invention. Fig. 7 is a synthesis diagram of a tetracyclic ketone for producing an aromatic ether-containing polymer. Fig. 8 is a synthesis diagram of grafting a thermosensitive component to a polymer bundle. . Figures 9A and 9B show the structure of a difluoroaromatic monomer containing a tetracyclone-containing poly (aryl ether) according to the subject invention. Figures 10 and 11 are structures of difluoroaromatic monomers that make tetracyclone and ethynyl poly (aryl ether) according to the subject invention. Figures 1 2 A-1 2 I show the structure of the repeating portion of the aggregated bundle according to the subject invention. DETAILED DESCRIPTION In Fig. 3, two polymer bundles 30A, 30B carry a plurality of thermosensitive groups L. Each converging bundle defines a skeleton, and each skeleton includes a reactive group \ 1 and Y2. Beam 30A with

O:\63\63739.ptd 第9頁 591067 五、發明說明(6) 3 0 B在反應基Xi與X2之間之交聯反應中交聯,而無需外來交 聯分子之加成。交聯反應生成交聯Z,因而共價地連接, 或可進一步連接束30A,30B以形成聚合物30C。在進一步 步驟中(未示),感熱基L熱解,留下孔隙。在孔隙夠小且 夠分散時,生成材料如此變成毫微孔聚合物。 圖4相當類似圖3,除了反應基Xi在束40A中形成骨架之 一部份,而反應基X2在束4 0 B中側接骨架。然而,交聯反 應進行,生成交聯Z及交聯聚合物4 0 C。 圖3及4所述之圖意圖以一般方式觀看。例如,在此使用 之名詞π聚合束π指任何共價地鍵結以界定骨架之單體組合 物,而且可包括經交聯偶合者以外之任何側接基。 在此使用之名詞π單體π指任何可以重複方式與本身或化 學上不同之化合物形成共價鍵之化學化合物。單體間之重 複鍵形成可造成線形、分支、超分支或三維產物。單體可 屬於各種化學種類之分子,其包括無機、有機金屬或無機 分子。有機單體之實例為丙烯醯胺、氯乙烯、苐聯酚或 3,31 -二羥基二苯乙炔。有機矽單體之實例為八甲基環四 矽氧烷、曱基笨基環四矽氧烷等。造成無機Si 02或Α 1 2 03結 構之無機單體之實例包括最常使用之四乙氧基矽烷(TE0S) 及乙氧化鋁。單體之分子量可在約40道爾頓至20000道爾 頓間大為改變。單體亦可包括感熱基或官能基以交聯。例 如,單體可包含聚(環氧丙烷)、聚碳酸酯、聚(曱基丙烯 酸曱酯)、各種苯乙烯聚合物、或乙炔基-或四環酮基。亦 意圖使單體鹵化,而較佳之鹵素為氟。鹵化,特別是氟O: \ 63 \ 63739.ptd Page 9 591067 V. Description of the invention (6) 3 0 B is cross-linked in the cross-linking reaction between the reactive groups Xi and X2 without the addition of external cross-linked molecules. The cross-linking reaction generates cross-linking Z and thus covalently connects, or the bundles 30A, 30B may be further connected to form a polymer 30C. In a further step (not shown), the thermosensitive L is pyrolyzed, leaving voids. When the pores are small enough and dispersed, the resulting material thus becomes a nanoporous polymer. Figure 4 is quite similar to Figure 3, except that the reactive group Xi forms part of the skeleton in the beam 40A, and the reactive group X2 flanks the skeleton in the beam 4 0 B. However, the cross-linking reaction proceeds to generate cross-linked Z and a cross-linked polymer 4 0 C. The diagrams described in FIGS. 3 and 4 are intended to be viewed in a general manner. For example, the term π polymeric bundle π as used herein refers to any monomer composition that is covalently bonded to define a backbone, and may include any pendant groups other than crosslinked couplers. The term π monomer π as used herein refers to any chemical compound that can form a covalent bond with a compound that is different from itself or chemically in a repeatable manner. The formation of multiple bonds between monomers can result in linear, branched, hyperbranched, or three-dimensional products. Monomers can be molecules of various chemical types, including inorganic, organometallic or inorganic molecules. Examples of organic monomers are acrylamide, vinyl chloride, bifenol or 3,31-dihydroxydiphenylacetylene. Examples of organosilicon monomers are octamethylcyclotetrasiloxane, fluorenylbenzylcyclotetrasiloxane and the like. Examples of the inorganic monomer that causes the structure of inorganic Si 02 or A 1 2 03 include tetraethoxysilane (TEOS) and ethoxy aluminum oxide which are most commonly used. The molecular weight of the monomer can vary greatly from about 40 Daltons to 20,000 Daltons. The monomer may also include a thermosensitive group or a functional group for crosslinking. For example, the monomer may include poly (propylene oxide), polycarbonate, poly (fluorenyl acrylate), various styrene polymers, or ethynyl- or tetracyclone groups. It is also intended that the monomer is halogenated, and the preferred halogen is fluorine. Halogenation, especially fluorine

O:\63\63739.ptd 第10頁 591067 五、發明說明(7) ^可有利地降低單體之介電常數,及 聚合物之介電常數。 丨r低笔械孔 分支、超分支、 聚合束可屬於任 有機聚合束之實 有機碎聚合束之 在這些定義下,聚合束因此可為線形 或三維,而且可包括感熱部份及反應基 何化學種類,其包括有機或無機組合物 例為聚醯亞胺、聚酯、或鸯_ 實例為各種經取代聚矽氧产7:】::。有機矽聚合束之 石夕或氧化銘。聚合束亦可:含;泛r 5 :例包括氧化 份,其包括芳族系統,及由^^ 吕能基或結構部 基。聚合束可具有可參與化學;“ = 或-cf3 聚合束之分子量散佈在廣:之額外反應基。意圖之 400 00 0道爾頓之間或更高。之靶圍,一般為400道爾頓至O: \ 63 \ 63739.ptd Page 10 591067 V. Description of the invention (7) ^ The dielectric constant of the monomer and the dielectric constant of the polymer can be advantageously reduced.丨 r Low penetrating pore branching, super branching, and polymeric bundles can belong to any organic polymeric bundle. Under these definitions, the polymeric bundles can therefore be linear or three-dimensional, and they can include heat-sensitive parts and reactive groups Chemical species, including organic or inorganic compositions. Examples are polyimide, polyester, or hydrazone. Examples are various substituted polysiloxanes. 7:] ::. Silica or oxidized inscription of silicone polymer bundles. Polymer bundles can also include: Pan; r 5: Examples include oxides, which include aromatic systems, and by Lunengji or structural group. Polymeric bundles can have chemistry that can participate; "= or -cf3 The molecular weight of the polymeric bundles is spread over a wide range of: additional reactive groups. The intended range is between 400 000 Daltons or higher. The target range is typically 400 Daltons to

特佳聚合束為具有環Z 骨架交聯基者。特佳種類具有包含二烯及親二烯物之 烯酮之束。此束可有利地i含其中二烯為四環酮之環戊二 酮,而且可由氟化或非氣包含,化或非氟化聚二苯乙二 化芳族聯酚化合物製備氣化二氟芳族化合物及氟化或非氟 化合物包含第聯酚,及1^佳具體實施例中,芳族聯酚 甚至更佳具體實施例中丁既f族化合物包含二苯乙炔。在 其他之較佳具體實施例:2族化合物包含四環酮。 伤之修改,或二氟芳族化人徵為芳族聯酚化合物之芳族部 可包括異構化變化,或芳"物之芳族部份之修改。此修改 環素、醯胺、醇方=之加成或去除。例如,可將四 經基二苯乙炔之芳族部腸族或芳族取代基引入3,3,-二 77 對於4, 4’-二氟二苯乙二酮之 591067 五、發明說明(8) 芳族部份亦意圖類似之變化。在另一種變化中,sβ2 ·混成 碳原子可被任何其他適合之原子取代,其包括硫、氧、氮 等。在修改包含鹵素引入時,特別是氟,其意圖使一個或 超過一個氟^原子共價地鍵結芳族碳原子,或使一個或超過 一個氟原子共價地鍵結非芳族碳原子。或者,至少一個氟 原子亦可共價地鍵結非芳族碳原子,同時至少一個氟原子 共價地鍵結芳族碳原子。 在進一步替代具體實施例中,聚合束可完全異於聚二苯 乙二酮。替代之聚合束包括有機、有機金屬或無機聚合 物。意圖之有機聚合束之實例為聚醯亞胺、聚酯與聚三聚 氰酸酯。意圖之有機金屬聚合物之實例為聚(二甲基矽氧 烷)與聚(乙烯基矽氧烷)。意圖之無機聚合物之實例為聚 矽酸酯與聚鋁酸酯。事實上,意圖之聚合束不需要包含單 型之單體,而可包含各種不相同單體之混合物。 在此使用之名詞π骨架”指形成聚合束之原子或部份之連 續鍵共價地鍵結,使得去除任何原子或部份生成鏈之中 斷。較佳之骨架包含芳族環系統,或至少一個共軛基。然 而,亦意圖許多其他之組合。例如,意圖之骨架可包括任 何元素,其特別包括C、Ν、0、S、Ρ、S i、及A1。此外, 意圖之骨架可包括芳族基,其包括苯基-、經取代或未取 代環戊二烯基、感熱基、芳族環系統、及氟化或其他反應 基。 在此使用之名詞π交聯反應”指其中至少兩個分子或長鏈 分子之兩個部份藉化學反應結合在一起之過程。此交互作Particularly preferred polymer bundles are those having a ring Z backbone cross-linking group. A particularly preferred species has a ketene bundle comprising a diene and a dienophile. This bundle may advantageously contain cyclopentanedione in which the diene is a tetracyclone, and a gasified difluoride may be prepared from a fluorinated or non-gas containing, fluorinated or non-fluorinated polydiphenylethylene aromatic biphenol compound. Aromatic compounds and fluorinated or non-fluorinated compounds include biphenyls, and in preferred embodiments, aromatic biphenols are even more preferred. In particular embodiments, the D-group f compounds include diphenylacetylene. In other preferred embodiments: the Group 2 compound comprises tetracyclone. Modifications, or the aromatic portion of a difluoroaromatic compound that is an aromatic biphenol compound, may include isomerization changes, or modification of the aromatic portion of an aromatic compound. This modification is the addition or removal of cycline, amidine, and alcohol. For example, the tetraethenyl diphenylacetylene's aromatic intestinal or aromatic substituents can be introduced into 3,3, -di77. 591067 for 4, 4'-difluorodiphenyldione 5. Description of the invention (8 ) The aromatic part is also intended for similar changes. In another variation, the sβ2 · mixed carbon atom may be replaced by any other suitable atom, including sulfur, oxygen, nitrogen, and the like. In the modification including the introduction of halogens, particularly fluorine, it is intended to covalently bond one or more fluorine atoms to aromatic carbon atoms, or to covalently bond one or more fluorine atoms to non-aromatic carbon atoms. Alternatively, at least one fluorine atom may be covalently bonded to a non-aromatic carbon atom, while at least one fluorine atom is covalently bonded to an aromatic carbon atom. In a further alternative embodiment, the polymeric bundle may be completely different from polydiethylene glycol. Alternative polymeric bundles include organic, organometallic, or inorganic polymers. Examples of intended organic polymeric bundles are polyimide, polyester, and polycyanurate. Examples of intended organometallic polymers are poly (dimethylsiloxane) and poly (vinylsiloxane). Examples of intended inorganic polymers are polysilicates and polyaluminates. In fact, the intended polymerization bundle need not include monomers of a single type, but may include a mixture of various monomers. As used herein, the term "π skeleton" refers to the covalent bonding of consecutive bonds of atoms or moieties forming a polymeric bundle, so that any atom or part of the chain is removed. Preferred skeletons include an aromatic ring system, or at least one Conjugate groups. However, many other combinations are also intended. For example, the intended skeleton may include any element, which specifically includes C, N, 0, S, P, Si, and A1. In addition, the intended skeleton may include aromatic Groups, which include phenyl-, substituted or unsubstituted cyclopentadienyl, thermolyl, aromatic ring systems, and fluorinated or other reactive groups. The term π cross-linking reaction as used herein refers to at least two A process in which two parts of a molecule or a long-chain molecule are bound together by a chemical reaction. This interaction

591067 五、發明說明(9) 用可以許多 之形成’疏 外,分子交 多個分子間 明標的之聚 不同之方式 水性、親水 互作用特徵 之至少暫時 合束可與本 發生,其包 性、離子性 亦為至少一 物理連接。 身交聯。 括共價鍵之 或靜電性交 個分子與本 因此,意圖 形成,氫鍵 互作用。此 身或二或更 使依照本發 交聯反應一般由各種反應基傳導,而且可藉許多種機構 發生。如果在兩個反應基之間形成共價鍵,其可藉許多化 子反應機構形成,其包括加成、排除或取代。實例為親核 性或,電子性加成,E卜或E2-型排除,親核性及芳族取 代。父聯反應可為自發過程或需要能量或觸媒。此能量之 戶、例為熱能篁、輻射、機械、電或電磁能量。觸媒之實例 為酸、驗、及塗他活性碳。在進一步替代具體實施例中, 交聯應可或不涉及外延交聯劑,而且任何外延交聯劑可 包含2種分子’交聯分子本身亦可為募聚或甚至聚合。 亦思圖使用於交聯反應之束中之反應基數量可廣泛地變 化。其一般視所需之交聯強度及個別交聯鍵聯之強度而 疋。例如’為了在室溫形成兩個單束核酸間之安定交聯, 需要最少約2 5 - 3 0個氫鍵。相對地,得到具甚至更高安定 性之交聯僅需要一個共價鍵。亦意圖使參與交聯反應之反 應基數量可在廣泛之範圍内變化。例如,交聯反應可涉及 低至反應基之5% ’但是亦可涉及超過聚合束中所有可得反 應基之9 0 % °雖然較佳之反應基彼此不同,亦意圖使所有 之反應基可彼此相同。591067 V. Description of the invention (9) In a way that can be formed in many ways, the molecular crosses multiple molecules, and the intermolecular aggregation is different. The aqueous and hydrophilic interaction characteristics can be combined with this at least temporarily. Its inclusiveness, Ionicity is also at least one physical connection. Body cross-linked. Including covalent bonds or electrostatic interactions between molecules and this, the intention is to form, hydrogen bonds interact. This or two or more cross-linking reactions according to the present invention are generally conducted by various reactive groups, and can occur by many types of mechanisms. If a covalent bond is formed between two reactive groups, it can be formed by many chemical reaction mechanisms, including addition, exclusion, or substitution. Examples are nucleophilic or, electronic addition, Eb or E2-type exclusion, nucleophilicity and aromatic substitution. Paternity reactions can be spontaneous or require energy or catalyst. Examples of this energy are thermal energy, radiation, mechanical, electrical, or electromagnetic energy. Examples of catalysts are acid, test, and paste activated carbon. In further alternative embodiments, the cross-linking may or may not involve an epitaxial cross-linking agent, and any epitaxial cross-linking agent may comprise two molecules. The cross-linking molecules themselves may also be recruited or even polymerized. The number of reactive groups used in the beam of cross-linking reactions can also vary widely. It generally depends on the required crosslinking strength and the strength of the individual crosslinking bonds. For example, 'to form a stable cross-link between two single-stranded nucleic acids at room temperature, a minimum of about 25 to 30 hydrogen bonds are required. In contrast, only one covalent bond is required to obtain a crosslink with even higher stability. It is also intended that the number of reactive groups involved in the cross-linking reaction can be varied within a wide range. For example, the cross-linking reaction can involve as low as 5% of the reactive groups, but can also involve more than 90% of all available reactive groups in the polymer bundle. Although the preferred reactive groups are different from each other, it is also intended that all the reactive groups can the same.

在此使用之名詞”反應基"指任何具有用於與側接基之交The term "reactive group" as used herein refers to any

第13頁 591067 五、發明說明(10) =㈡反應!之元素或元素組合。反應基意圖位 -煤;勺人7 op伤,,、包括終端。在較佳具體實施例中, 體四環酮及親二烯物可包含乙炔基。在其 m代反應基可包括親核性或親電子性中心: 3〇〇t至45(TC之範圍。在較佳且“ = 趨勢,—般為 安定部份包含聚二苯乙二酮';=:=:=物之熱 = ί二氟芳族化合物及芳族戴龄化合物製備,盆中 紛化合物包含第㈣,而且二族武 炔。在進一步較佳具體實施例中,j ‘上二二二上 環_。 一貺方族化合物包含四 - ΐ=Λ名:。感熱”指材料在高於高溫降解之性質, 般為25 0 C至400 C之範圍。應了解, 位於骨架之任何部分,j:包括故 圖3〃 4之感熱基可 環氧丙烧、聚乳交酯、聚碳酸§旨之感熱基包括聚 内之聚二苯乙二,聚合物,並鏈:二=部份 酯)。在更佳具體實施例t,二氟 一知-聚(己内 有平均分子量為30 0。道爾頓之乙二醇:聚(份己之至j5;25%載 感熱基可有利地包括連接部份。而 曰 在此應廣義地解釋為表示可反應聚士名詞"連接部份" 類之化學部份。許多型之反# 了复:物中反應基之任何種 成,可能涉及形成=二例2:取代、排除及加 頁例為酯化、醯胺化、環氧化Page 13 591067 V. Explanation of the invention (10) = ㈡ reaction! Element or combination of elements. Reactive base intent-coal; 7 op injuries, including terminal. In a preferred embodiment, the tetracyclone and the dienophile may include an ethynyl group. In its m-generation reactive group may include a nucleophilic or electrophilic center: in the range of 300t to 45 (TC. In the preferred and "= trend, generally the stable part contains polydiphenylenedione ' ; =: =: = 物 的 热 = ί difluoroaromatic compounds and aromatic ageing compounds are prepared, the compounds in the pot contain thorium, and the second group of wuyne. In a further preferred embodiment, j '上Two-two-two upper ring _. The compound of a tetragonal group contains four-ΐ = Λ name: .Thermal "refers to the property of the material to degrade above high temperature, generally in the range of 25 0 C to 400 C. It should be understood that any Part, j: Including the thermosensitive group of Figure 3 故 4, which can be propylene oxide, polylactide, and polycarbonate. The thermosensitive group includes polydiphenylene, polymer, and chain: two = part ester). In a more specific embodiment t, difluoromono-poly (with an average molecular weight of 300). Dalton's ethylene glycol: poly (parts to j5; 25% heat-sensitive thermal base may advantageously include a linker) It should be interpreted broadly here to mean the chemical part of the reactable nouns " connecting part " class. Many types of anti ## compound: any formation of reactive groups in the matter may involve Formation = Two cases 2: Substitution, exclusion, and addition examples are esterification, amidation, and epoxidation

591067 五、發明說明(11) 專。連接部份之大小可由約 子量大為改變。相當小連接 核基及親電子基。例如,替 R-C0-R,、R-NH2、R-SH、R一 為四環酮,環戊二烯基或二 1,2 -二胺基苯或1,3 -二苯基 代連接部份不需要具有單型 是替代連接部份亦可為各種 進一步意圖使替代連接部 適合之替代連接劑亦可參與 ―、靜電性-離子性交互作用 白胺酸拉鍵狀結構,高極性 性基,及多牙型基。連接部 聚合束中之各個位置形成, 連接部份亦可位於感熱基之 在此使用之名詞,’降解"指 許多方式發生,其包括不勻 裂不需完全,即,並非所有 一些鍵發生之鍵斷裂比其他 不安定,因此以較快之速率 同之碎片之釋放,其視降解 熱解之能量可包含熱、電磁 射。例如,適合之能量為α 20道爾頓至約50 0道爾頓之分 部分之實例為酸基、鹼基、親 代之小連接部份為R-C〇2H、 鹵素等。較大連接部份之實例 B能基脂族基,其特別包括 丙-2-酮。仍進一步意圖使替 之官能基或單型之取代基,而 不相同連接部份之混合物。 份不需要參與共價鍵之形成。 非共價偶合,其包括疏水性 、錯合物形成或氫鍵。實例為 基’聚陽離子性基或聚陰離子 份及聚合物之間之化學鍵可在 其包括在中間物末端之位置。 任何部份,其包括終端。 共價鍵斷裂。此種鍵斷裂可以 、自由基、及均勻斷裂。鍵斷 可斷裂鍵必須分裂。此外,在 快。例如,酯鍵通常比醯胺鍵 分裂。鍵斷裂亦可生成彼此不 部份之化學組合物而定。涉及 、機械能量、粒化或非粒化輻 -幸δ射、超音波、微波或加591067 V. Description of Invention (11) Special. The size of the connecting part can be greatly changed by the amount of approximation. Quite small links to nuclear and electrophilic groups. For example, R-C0-R ,, R-NH2, R-SH, and R- are tetracyclone, cyclopentadienyl or di1,2-diaminobenzene or 1,3-diphenyl. The part does not need to have a single type to be an alternative connecting part. It can also be a variety of alternative linking agents that are further intended to make the alternative connecting part suitable for participation.-Electrostatic-ionic interaction. Leucine-like structure, high polarity. Base, and multidentate base. The connection part is formed at various positions in the polymerization bundle, and the connection part can also be located on the thermal base. The term used here, 'degradation' refers to many ways, including uneven cracks, which do not need to be complete, that is, not all some bonds occur The bond breakage is more unstable than others, so the same fragments are released at a faster rate. The energy of apparent degradation and pyrolysis can include heat and electromagnetic radiation. For example, examples of suitable energy fractions of? 20 Daltons to about 50 Daltons are acid groups, bases, and the parent's small linking moiety is R-CO2H, halogen, and the like. Examples of larger linking moieties are Benyl aliphatic groups, which specifically include propan-2-one. It is still further intended to substitute functional groups or monomorphic substituents without a mixture of identical linking moieties. Copies do not need to participate in the formation of covalent bonds. Non-covalent coupling, which includes hydrophobicity, complex formation, or hydrogen bonding. An example is the position where the chemical bond between the group's polycationic or polyanionic moiety and the polymer can be included at the end of the intermediate. Any part, including the terminal. The covalent bond is broken. This kind of bond cleavage can be free radical, and even cleavage. Breakable bonds must be broken. Also, in fast. For example, ester bonds are usually more cleaved than amido bonds. Bond cleavage can also result in chemical compositions that are not part of each other. Involved, mechanical energy, granulated or non-granulated radiation-Fortunately, delta radiation, ultrasound, microwave or

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591067 五、發明說明(12) 一'- 因此意圖使在此揭示之方法可有利地用於許多毫微孔材 料之製造-一般方法包括步驟··提供多個聚合束,其中各聚 合束包括感熱部份,並且界定包括多個反應基之架;提 供第一能量以使用至少一個反應基交聯聚合束,·及提供 二能量以至少部份地降解感熱部份。 '、 料藉=方法之聚合束,可製造許多種毫微孔材 科。在此使用之名詞"毫微孔材料,,指任何包 Ζ 1 ΠΠ1至約1 0 0 0 nm範圍之直徑之孔里八有、,勺 之意=合物包括合成聚合物、無機材料4 -微^ 物。二成聚合物之實例為聚醚、 :機::匕合 料之實例包括氧化矽或鋁矽酸 2 。無機材 物之實例包括聚(二甲其访# &、陶是材枓。有機矽化合 (三氟丙基矽氧烷)。土乳、元、聚(乙烯基矽氧烷)及聚591067 V. Description of the invention (12) a'- It is therefore intended that the method disclosed herein can be advantageously used in the manufacture of many nanoporous materials-the general method includes steps ... providing multiple polymeric bundles, each of which includes a thermal Part, and defines a frame comprising a plurality of reactive groups; providing a first energy to cross-link the polymeric beam using at least one reactive group, and providing two energy to at least partially degrade the heat-sensitive portion. ', Material borrowing = method of polymer bundles, can produce many kinds of nanoporous materials. The term " nanoporous material " as used herein refers to any pore with a diameter ranging from Z 1 ΠΠ1 to about 100 nm, and the meaning of the spoon includes synthetic polymers and inorganic materials. 4 -微 ^ 物. Examples of binary polymers are polyethers, and examples of: organic :: silicon compounds include silica or aluminosilicate 2. Examples of inorganic materials include poly (dimethylformaldehyde), pottery materials, organic silicon compounds (trifluoropropylsiloxane), soil emulsion, poly (vinylsiloxane), and poly (vinylsiloxane).

毫微孔材料特徵為暂B 物通常並不嚴dt氣體取代之程度,之組合 混合物。空氣(其主要為^ 軋體包括相當純之氣體及其 材料之”孔隙"中,但是、、、二、2之混合物)常配置於毫微 純氣體。毫微孔材料;氣、氛、氬,或⑶之 般包括球狀孔隙,但是或:2隙之結構。毫微孔材料— 狀、及具有其他形狀之孔$外可包括管狀、片狀、 孔隙可實質上大於或小於此外’毫微孔材料中之一此 多不同之形式,其包括二…毫微孔材料可具-體。毫微孔材料亦;::於薄犋、板、球: 活性劑及塑性劑。3額外之村料,其包括填uNanoporous materials are characterized by the degree to which dt gas substitution is usually not a temporary B, a combination mixture. Air (mainly ^ rolling body includes fairly pure gases and their "pores", but a mixture of ,, 2, and 2) is often configured in nanopure gases. Nanoporous materials; gas, atmosphere, Argon, or ⑶, includes spherical pores, but or: 2 gap structure. Nanoporous materials-shape, and pores with other shapes can include tube, sheet, and pores can be substantially larger or smaller One of the many different forms of nanoporous materials, including two ... nanoporous materials can have a body. Nanoporous materials also; :: in thin slabs, plates, balls: active agents and plasticizers. 3 additional Village materials, which includes filling u

第16頁 591067 五、發明說明(13) 關於提供第一能里之步驟,能量較佳為包旦 :二疋』實施例宁將束加熱至約25〇。。 他之觀點,第一能量較佳為足以 由,、 得反應基之至少20%。然而,加應中涉及所有< 度,其包括150。(:至2 50它之严声。% 丰杜 之 ,,,,^ 之μ度。在進一步替代具體實施 例中,加熱期間可由數秒或更短大為變化至數小時或以 在進一步替代具體實施例中,第一能量不需為熱能 篁,而可涉及任何適合之能量形式,其包括各種電磁輻射 例如,UV-、雷射、X-射線或紅外線照射),機械能量(例 如,超音波或物理壓力),及粒子輻射(例如,α —或輻 射)〇 關於降解步驟,能量再度較佳為熱能量。在特定具體實 施例中,此種加熱可有利地達到約3 5 〇。(;之溫度約2 〇分 鐘。在替代具體實施例中,溫度可大為改變,其視交聯聚 合鏈之感熱及熱安定部份之本性而定。意圖之溫度範圍為 2 〇 〇 °C或更低至約4 5 0 °C或更高。在進一步替代具體實施例 中’降解感熱部份所需之時間意圖由小於數秒大為改變至 至少數小時。再度意圖使使用之能量異於純熱能量。Page 16 591067 V. Description of the invention (13) Regarding the step of providing the first energy, the energy is preferably Baodan: Er'an. The embodiment would heat the beam to about 250. . In his view, the first energy is preferably sufficient to obtain at least 20% of the reactive group. However, plus should cover all < degrees, including 150. (: To 2 50 its strict sound.% Feng Du ,,,,, ^ μ degree. In a further alternative embodiment, the heating period can be changed from a few seconds or less to a few hours or to further replace the specific implementation For example, the first energy need not be thermal energy, but may involve any suitable form of energy, including various electromagnetic radiation such as UV-, laser, X-ray, or infrared radiation, mechanical energy (such as ultrasound or Physical pressure), and particle radiation (for example, α-or radiation). Regarding the degradation step, the energy is again preferably thermal energy. In certain embodiments, such heating may advantageously reach about 3 50. (; The temperature is about 20 minutes. In alternative embodiments, the temperature can be greatly changed, which depends on the nature of the heat-sensitive and heat-stabilizing part of the cross-linked polymer chain. The intended temperature range is 2000 ° C Or lower to about 450 ° C or higher. In a further alternative embodiment, the time required to degrade the heat-sensitive portion is intended to change from less than a few seconds to at least a few hours. It is again intended to make the energy used different from Pure thermal energy.

在所述之毫微孔聚合物有些類似敘述於Burgoyne等人之 美國專利5, 8 74 , 5 1 6 ( 1 99 9年2月)者,其在此併入作為參 考’而且可以如此專利中所述實質上相同之方式使用。例 如,意圖使在此所述之毫微孔聚合物用於製造多晶片模 組,層間介電物,保護塗詹,及在電路板或印刷線路板中 作為基材。此外,在此所述之毫微孔聚合物之膜或塗層可The nanoporous polymers described are somewhat similar to those described in Burgoyne et al., U.S. Patent No. 5, 8 74, 5 1 6 (February, 1999), which is incorporated herein by reference 'and may be so incorporated They are used in substantially the same way. For example, the nanoporous polymers described herein are intended to be used in the manufacture of multi-chip modules, interlayer dielectrics, protective coatings, and as substrates in circuit boards or printed wiring boards. In addition, the films or coatings of nanoporous polymers described herein may be

第17頁 591067Page 591067

五、發明說明(14) -— 藉溶液技術形成,如噴灑、旋塗或鑄造,以旋塗較佳。幹 佳之溶劑為2 -乙氧基乙醚、環己酮、環戊酮、甲苯、二 苯、氯苯、N-甲基吡咯啶酮、N,二曱基甲醯胺、& n一二 曱基乙醯胺、甲基異丁基酮、2 一甲氧基乙醚、卜甲基-己酮、T - 丁内酯、及其混合物。一般而言,塗層厚度為 約〇·1至約15微米。至於介電中間層,膜厚小於2微米。亦 可使用添加物以增強或給予特定之目標性質,如聚合物技 藝所習知,其包括安定劑、阻燃劑、顏料、塑性劑、界面 1性劑等。可摻合相容或不相容聚合物以產生所需之性 夤亦可使用黏附促進劑。此促進劑例示為六甲基二石夕氮 烷,其可用以與暴露之可能存在於表面上可得羥基官能基 交互作用,如二氧化矽,以弄濕或濕潤之。用於微電子^ 用之聚合物希望含低量(通常小於i ppm,較佳為小於1〇〜 ppb )之離子性雜質,特別是用於介電中間 實例 以下之實例證明本發明標的之原理。製造聚(芳醚)聚合 束之=般合成圖敘述於圖5 〇AR及AR,可獨立地包含具有二 要為芳族或熔融芳族部份之任何適合之熱安定結構/,、而且 在圖5之實例中,no-QHrAR-CA-OH為第聯酚,及 AR’ -CA —F為含至少一個二苯乙炔部分之二氟芳族 如第聯酚及4-氟-3, -(4-氟苯甲醯基)二笨乙炔間之反應 所例示之親核性芳族取代之一般合成步驟如下:以化沖洗 裝有磁性授拌器、熱偶、Dean-Stark阱、回流冷凝2器及nV. Description of the invention (14) --- It is formed by solution technology, such as spraying, spin coating or casting. Spin coating is preferred. The best solvents are 2-ethoxyethyl ether, cyclohexanone, cyclopentanone, toluene, diphenyl, chlorobenzene, N-methylpyrrolidone, N, dimethylformamide, & n-dioxine Acetylamine, methyl isobutyl ketone, 2-monomethoxyethyl ether, methyl-hexanone, T-butyrolactone, and mixtures thereof. Generally, the coating thickness is from about 0.1 to about 15 microns. As for the dielectric interlayer, the film thickness is less than 2 microns. Additives can also be used to enhance or impart specific target properties, as known in polymer technology, including stabilizers, flame retardants, pigments, plasticizers, interfacial agents, and the like. Compatible or incompatible polymers can be blended to produce the desired properties. Adhesion promoters can also be used. This accelerator is exemplified by hexamethyldioxazine, which can be used to interact with exposed hydroxyl functional groups that may be present on the surface, such as silica, to wet or wet it. Polymers used in microelectronics are expected to contain low levels of ionic impurities (usually less than i ppm, preferably less than 10 to ppb), especially for dielectric intermediate examples. The following examples demonstrate the principle of the subject matter of the present invention . The general synthetic diagram for the manufacture of poly (aryl ether) polymer bundles is described in Figure 50. AR and AR can independently contain any suitable thermally stable structure with two aromatic or molten aromatic moieties, and In the example of FIG. 5, no-QHrAR-CA-OH is a biphenyl, and AR'-CA-F is a difluoroaromatic such as biphenyl and 4-fluoro-3, which contains at least one diphenylacetylene moiety,- The general synthetic steps of the nucleophilic aromatic substitution as exemplified by the reaction between (4-fluorobenzyl) and dibenzylacetylene are as follows: a magnetic stirrer, thermocouple, Dean-Stark trap, and reflux condensation are installed to wash 2 and n

第18頁 591067 五、發明說明(15) 出口連接之1公升3頸RB燒瓶數小時且進料〇· 2公升之 入口 一 一 〜^ 一一 ,,一------- ^ Λ 7Γ ^ 溫環丁楓。在70-8 0 °C,加入35· 042克(〇· 1〇〇〇莫耳)之第 聯酚(FBP)、31· 8320 克(0· 1 0 0 0 莫耳)之4-氟-3’ -(4-氟笨 » 甲醯基)二苯乙炔(FBZT)及27· 64克(0· 2莫耳)之碳酸卸, 並且以1 6 5毫升之溫環丁楓及1 6 5毫升之甲苯清洗。將反廉 塊加熱至140 °C且在此溫度共沸1-2小時,然後藉由去除^ 苯而將溫度逐漸升至175°C,而且反應在15-20小時持續在 175 °C共沸。溫度降低至165 °C,加入4-氟二苯基酮且封端 持續5小時。反應塊以165毫升之NMp稀釋且靜置過夜。然 後冷反應塊經遽紙過濾,在5 χ μ e Ο Η ( 0 · 〇 3 % Η N 03)中、、尤 澱,再溶於NMP中且在5xMe〇H(〇 〇1% ΗΝ〇3)中^沈澱。 :物使用濾紙過濾,在濾器上清洗3次,各次使用】公升之 e〇H,及在真空烤箱中在6〇。_7〇它乾 實例1 圖6A-6J為二氟芳族化合物之例示結 物因具有建立於未硬化聚Γ娑純。士 / ^二新颖組合 己酮)及良性芳族醚(如甲氧:在爷用/容劑中(如環 以利於溶液配製及旋塗,/、虱基苯)之高溶解度, 第聯酚之均質物理摻合物你 利任何這些化合物與 標表面上,然後熱活化以進〜;土矽【曰圓之表面或其他目 於300 〇c之溫度形成熱安^么仃Α σ及父聯反應,因而在低 如,如圖4述),而且進— 疋中罔·路。如果將感熱基接枝(例 分解,揮發及在網路中# =將生成聚合物加熱,則感熱基 中產生孔隙。生成網路因交聯反應及Page 18591067 V. Description of the invention (15) 1 liter 3-neck RB flask connected to the outlet for several hours and feeding 0.2 liters of inlet one by one ~ ^ one by one, one by one ------- ^ Λ 7Γ ^ Wenhuan Ding Feng. At 70-8 0 ° C, 35.042 g (0.100 mol) of terphenylphenol (FBP) and 31.320 g (0.1 100 mol) of 4-fluoro- 3 '-(4-fluorobenzyl) methylphenyl diphenylacetylene (FBZT) and 27.64 g (0.2 mol) of carbonic acid are unloaded, and cyclamidine and 165 5 ml Wash with ml of toluene. The refractory block was heated to 140 ° C and azeotroped at this temperature for 1-2 hours, and then the temperature was gradually raised to 175 ° C by removing ^ benzene, and the reaction continued at 175 ° C for 15-20 hours . The temperature was reduced to 165 ° C, 4-fluorodiphenyl ketone was added and capped for 5 hours. The reaction mass was diluted with 165 ml of NMp and left overnight. Then the cold reaction block was filtered through squeegee paper, in 5 x μe 〇Η (0 · 〇3% Η N 03), Youdian, redissolved in NMP and in 5xMe0H (〇〇1% ΗΝ〇3). ) Precipitation. The material was filtered with filter paper, washed three times on the filter, each time used] liter of eOH, and in a vacuum oven at 60. 〇70〇 It is dry. Example 1 Figures 6A-6J are exemplary compounds of difluoroaromatic compounds due to the fact that they are based on unhardened poly (pure). // ^ two novel combinations of hexanone) and benign aromatic ethers (such as methoxy: in high-efficiency / capacitors (such as ring to facilitate solution preparation and spin coating, /, phenylbenzene), high solubility A homogeneous physical blend of any of these compounds with the target surface, and then thermally activated to advance ~; soil silicon [said round surface or other objects at a temperature of 300 ℃ to form thermal safety ^ Mo 仃 Ασ and the parent Response, so in low, as described in Figure 4), and into-疋 罔 · Road. If the heat-sensitive group is grafted (eg, decomposition, volatilization, and in the network # = the generated polymer is heated, pores are generated in the heat-sensitive group. The generation network is affected by the crosslinking reaction and

591067 五、發明說明(16) 其高溫聚合物結構特徵而呈現超過4 0 0 °C之高玻璃轉移溫 度。圖6A與6B所述之結構之一般合成圖如下: 圖6C,6E,6F及6G所述之結構之一般合成圖如下:591067 V. Description of the invention (16) Its high-temperature polymer structure has a high glass transition temperature exceeding 400 ° C. The general synthetic diagrams of the structures described in Figures 6A and 6B are as follows: The general synthetic diagrams of the structures described in Figures 6C, 6E, 6F and 6G are as follows:

第20頁 591067Chapter 20591067

第21頁 591067Page 591067

五、發明說明(18) 實例2 圖7敘述製造含四環酮聚(芳謎)之合成圖。成功之聚八 在1 40- 1 60 °C進行24小時,而且聚合物使用如其他聚 醚)之相同步驟加工。含四環酮聚合產物顏色為绛紅色7 呈現最終為3,〇〇〇之Μη,5,6 0 0之Mw,5,20 0之Mp及1.9之^ PD。分子量可藉由直接在160 °C進行聚合24小時而非在 1 40 - 1 6 0 °C 24小時而改良。然而,由於在硬化以形成具 相當低密度之六聯苯結構時,聚合物與FLARE聚合物'之w 能更有效交聯,中間分子量物種較為有利。 $ 實例3 圖8為包括將感熱成份接枝至聚合束之一般反應條件之 合成圖,其中4-氟-4’-羥基二苯基酮在THF (dead, PPh3) 中反應乙二醇-聚(己内酯)以製造4 -氟二苯基酮封端感熱 聚合物。感熱之4-氟二苯基酮封端感熱聚合物然後可與芳 族聯酚化合物一起加入聚(芳醚)。 實例4 圖9A與9B為造成含四環酮聚(芳醚)之二氟芳族單體之意 圖結構。 實例5 在圖10與11中,將意圖之可交聯單位及可感熱單位組合 至單一聚合束中。在合成各來自這些二氟芳族之聚合物之 後,可將上述之感熱單位接枝至聚合物上。或者,聚合可 以4-氟二苯基酮封端感熱單位及可與苐聯酚反應之二氟芳 族單體進行。V. Description of the invention (18) Example 2 FIG. 7 illustrates a synthetic diagram for the production of tetracyclone-containing poly (aromatic mystery). Successful poly-8 is performed at 1 40-1 60 ° C for 24 hours, and the polymer is processed using the same steps as other polyethers). The color of the tetracyclone-containing polymerization product was ochre red 7. It showed a final Mη of 3,000, a Mw of 5,600, a Mp of 5,200, and a PD of 1.9. Molecular weight can be improved by polymerizing directly at 160 ° C for 24 hours instead of 24 hours at 1 40-160 ° C. However, since the polymer and FLARE polymer 'w can be more effectively crosslinked when hardened to form a hexaphenyl structure with a relatively low density, intermediate molecular weight species are more advantageous. Example 3 Figure 8 is a synthesis diagram including general reaction conditions for grafting thermosensitive components to a polymeric bundle, in which 4-fluoro-4'-hydroxydiphenyl ketone is reacted with ethylene glycol-polyethylene in THF (dead, PPh3). (Caprolactone) to make a 4-fluorodiphenylketone terminated thermosensitive polymer. The thermosensitive 4-fluorodiphenyl ketone terminated thermosensitive polymer can then be added to the poly (arylene ether) together with the aromatic biphenol compound. Example 4 Figures 9A and 9B show the intended structure of a difluoroaromatic monomer containing a tetraketone poly (aryl ether). Example 5 In Figs. 10 and 11, the intended cross-linkable units and heat-sensitive units are combined into a single polymerized bundle. After synthesizing each of these difluoroaromatic polymers, the above-mentioned thermosensitive units can be grafted onto the polymers. Alternatively, the polymerization can be carried out with 4-fluorodiphenylketone-terminated thermosensitive units and difluoroaromatic monomers which can be reacted with bifenol.

第22頁 591067 五、發明說明(19) 實例6 在圖1 2 A - 1 2 I中,顯示聚合束中各種氟化重複單位部份 之結構。將氟引入聚合束特別有利,因為介電材料之介電 常數可依照特定應用之特定需求而修改。應了解,氟可藉 由對芳族環系統之共價鍵直接加入骨架以產生氟芳族聚合 束。或者,氟可以可連接芳族或非芳族碳原子之-CF3基之 形式加入骨架。氟通常依照圖5所述之一般協定藉由使用 氟化聯酚化合物及/或高氟化芳族化合物加入聚合束中。 高氟化芳族單體之典型合成 在標準裝置中實行以下之反應。在第一Heck反應中,1 -鹵-3,4,5-三氟苯(R = H,X二Br,1)在鈀催化下在80°C於三 乙胺溶劑中反應乙炔基三曱基矽烷,產生中間產物1 -(三 曱基石夕烧基乙炔基)-3,4,5 -三氟苯,其然後在碳酸鉀存在 下在曱醇中進行逆Favorskii反應而產生1-乙炔基-3,4,5-三氟苯。類似地,1-鹵-2,3,4,5,6 -五氟苯(R = F,Χ = Βγ, I )在鈀催化下在8 0 °C於三乙胺溶劑中反應乙炔基三曱基矽 烷,產生中間產物卜(三曱基矽烷基乙炔基)-2,3,4,5,6-五氟苯,其然後在碳酸鉀存在下在曱醇中進行逆 Favorskii反應而產生1-乙炔基-2,3,4,5,6 -五氟苯。 由3 -溴-4’-氟二苯基酮與1-乙炔基-3, 4, 5 -三氟苯或1 -乙快基-2,3,4,5 ,6 -五氟苯之間之第二Heck反應各合成 3,4,5 -三氟-3’-(4-氟苯曱醯基)二苯乙炔或2, 3, 4, 5 ,6 -五 氟-3’-(4-氟苯曱醯基)二苯乙炔。Page 22 591067 V. Description of the invention (19) Example 6 In Fig. 1 2 A-1 2 I, the structures of various fluorinated repeating unit portions in the polymer bundle are shown. The introduction of fluorine into the polymeric beam is particularly advantageous because the dielectric constant of the dielectric material can be modified according to the specific requirements of a particular application. It should be understood that fluorine can be added directly to the backbone through covalent bonds of the para-aromatic ring system to produce a fluoroaromatic polymeric bundle. Alternatively, fluorine may be added to the skeleton in the form of a -CF3 group to which an aromatic or non-aromatic carbon atom may be attached. Fluorine is usually added to the polymer bundles in accordance with the general agreement described in Figure 5 using fluorinated biphenol compounds and / or highly fluorinated aromatic compounds. Typical Synthesis of Highly Fluorinated Aromatic Monomers The following reactions were performed in a standard unit. In the first Heck reaction, 1-halo-3,4,5-trifluorobenzene (R = H, X diBr, 1) was reacted with ethynyltriamidine in a triethylamine solvent at 80 ° C under palladium catalysis. Silyl, producing the intermediate product 1- (tris (fluorenylethynyl) ethynyl) -3,4,5-trifluorobenzene, which is then subjected to a reverse Favorskii reaction in methanol in the presence of potassium carbonate to produce 1-ethynyl -3,4,5-trifluorobenzene. Similarly, 1-halo-2,3,4,5,6-pentafluorobenzene (R = F, X = Βγ, I) is reacted with ethynyltriphenylamine in triethylamine solvent at 80 ° C under palladium catalysis. Fluorenylsilane to produce intermediate (trimethylsilylethynyl) -2,3,4,5,6-pentafluorobenzene, which is then subjected to a reverse Favorskii reaction in methanol in the presence of potassium carbonate to produce 1 -Ethynyl-2,3,4,5,6-pentafluorobenzene. Between 3-bromo-4'-fluorodiphenyl ketone and 1-ethynyl-3, 4, 5-trifluorobenzene or 1-ethynyl-2,3,4,5,6-pentafluorobenzene The second Heck reaction synthesizes 3,4,5-trifluoro-3 '-(4-fluorophenylfluorenyl) diphenylacetylene or 2,3,4,5,6-pentafluoro-3'-(4 -Fluorophenylfluorenyl) diphenylacetylene.

O:\63\63739.ptd 第23頁 591067 五、發明說明(20)O: \ 63 \ 63739.ptd Page 23 591067 V. Description of Invention (20)

Χ·Βγ,Ι R-F,HΧΒΒ, Ι R-F, H

1. Pd(?Pfe3)4 ->2· CH3OH, K2CO31. Pd (? Pfe3) 4-> 2 · CH3OH, K2CO3

或者’可在3-/臭〜2,,3,,4,,5,,6,-五氟二苯基酮與1〜乙 快基-3,4,5-二氣二笨基酮或卜乙炔基—2,3,4,5,6—五氟苯 之間實行一組兩個類似所列Heck反應之反應,其各造成 3, 4, 5 -三氟-3 -(2, 3, 4, 5, 6 -五氟苯甲醯基)二苯乙炔或 2, 3, 4, 5, 6-五氣-3’-(2, 3,4, 5,6一五氟苯曱醯基)二苯乙 炔。 修改為可 而易知的 專利範圍 ’所有之 特別地, 絕對性方 之元素、 參考到之 因此,已揭不分層介電 然而,已敘述以外之許多 念,對熟悉此技藝者為顯 標的,除非超出所附申請 說明書及申請專利範圍時 最廣義之可能方式解釋。 丨’包含compr i s i ngn應以非 步驟而解釋,其表示參考 或利用,或組合未明確地 驟。 定具體實施例及應用。 能的而不背離本發明蓋 。因此,不限制本發明 之精神。此外,在解釋 名詞應以與内文一致之 名詞"包含comprise1,及 式參考元素、成份、或 ίΓ!步驟可存在, '、疋’、、成份、或步Or 'may be in 3- / stinky ~ 2,, 3,4,5,, 6, -pentafluorodiphenyl ketone with 1 ~ ethoxy-3,4,5-difluorodiphenyl ketone or A group of two reactions similar to the listed Heck reactions are carried out between ethynyl-2,3,4,5,6-pentafluorobenzene, each of which results in 3, 4, 5 -trifluoro-3-(2, 3 , 4, 5, 6-pentafluorobenzylidene) diphenylacetylene or 2, 3, 4, 5, 6-pentagas-3 '-(2, 3, 4, 5, 6-pentafluorophenylhydrazone) Group) diphenylacetylene. Amended to be easy to understand the scope of the patent 'all in particular, the elements of the absolute side, reference to it has been revealed without layered dielectric. However, many ideas beyond the narrative are obvious to those skilled in the art Unless it is explained in the broadest possible way beyond the scope of the attached application description and patent application. The inclusion of compr i s i ngn should be interpreted as a non-step, which means reference or utilization, or the combination is not explicitly step. Determine specific embodiments and applications. Capable without departing from the invention. Therefore, the spirit of the present invention is not limited. In addition, in the interpretation of the nouns, the nouns should be consistent with the text " comprise1, and reference elements, ingredients, or Γ! Steps can exist, ', 疋', ingredients, or steps

Claims (1)

591067 六、申請專利範圍 、, 1 · 一種製造ΐ徼孔材料2方法,其包含: 提供多個聚合束,其中各聚合束包括感熱部份,並且界 定包括多個反應基之骨架; 提供第一能量以使用至少一個反應基交聯聚合束;及 提供第二能量以至少部份地降解感熱部份。 2. 根據申請專利範圍第1項之方法,其中所有之反應基 彼此相同。 3. 根據申請專利範圍第1項之方法,其中骨架包含共軛 基。 4. 根據申請專利範圍第1項之方法,其中骨架包含芳族 環系統。 5. 根據申請專利範圍第1項之方法,其中骨架被氟化。 6. 根據申請專利範圍第5項之方法,其中至少一個氟原 子共價地鍵結芳族碳原子。 7. 根據申請專利範圍第5項之方法,其中至少一個氟原 子共價地鍵結非芳族碳原子。 8. 根據申請專利範圍第5項之方法,其中至少一個氟原 子共價地鍵結非芳族碳原子,而且至少一個氟原子共價地 鍵結芳族碳原子。 9. 根據申請專利範圍第1項之方法,其中至少一個反應 基包含親核性_心。 10. 根據申請專利範圍第1項之方法,其中至少一個反 應基包含親電子性中心。 11. 根據申請專利範圍第1項之方法,其進一步包含至591067 VI. Scope of Patent Application, 1. A method for manufacturing a countersunk material 2 comprising: providing a plurality of polymeric bundles, wherein each polymeric bundle includes a thermally sensitive portion and defining a skeleton including a plurality of reactive groups; providing a first Energy to cross-link the polymeric beam using at least one reactive group; and providing a second energy to at least partially degrade the heat-sensitive portion. 2. The method according to item 1 of the scope of patent application, wherein all the reactive groups are the same as each other. 3. The method according to item 1 of the patent application, wherein the backbone comprises a conjugated group. 4. The method according to item 1 of the patent application, wherein the backbone comprises an aromatic ring system. 5. The method according to item 1 of the patent application, wherein the skeleton is fluorinated. 6. The method according to item 5 of the patent application, wherein at least one fluorine atom is covalently bonded to the aromatic carbon atom. 7. The method according to item 5 of the patent application, wherein at least one fluorine atom is covalently bonded to a non-aromatic carbon atom. 8. The method according to item 5 of the patent application, wherein at least one fluorine atom is covalently bonded to a non-aromatic carbon atom, and at least one fluorine atom is covalently bonded to an aromatic carbon atom. 9. The method according to item 1 of the scope of patent application, wherein at least one reactive group comprises a nucleophilic_heart. 10. The method according to item 1 of the patent application, wherein at least one of the reactive groups comprises an electrophilic center. 11. The method according to item 1 of the scope of patent application, which further comprises to 第25頁 591067 六、申請專利範圍 少一個聚合束與本身之交聯反應。 12. 根據申請專利範圍第1項之方法,其中發生交聯反 應而無外來交聯劑之加成。 13. 根據申請專利範圍第1項之方法,其中至少一個聚 合束交聯至少一個其他之聚合束而未產生自由基。 14. 根據申請專利範圍第1項之方法,其中至少一個反 應基包含二稀。 15. 根據申請專利範圍第1項之方法,其中至少一個反 應基包含親二烯物。 16. 根據申請專利範圍第1項之方法,其中骨架包含環 系統,而且至少一個反應基包含二烯。 17. 根據申請專利範圍第1項之方法,其中骨架包含環 系統,而且至少一個反應基包含親二烯物。 18. 根據申請專利範圍第1項之方法,其進一步包含使 用苐聯酚及二氟芳族化合物製造骨架,及其中至少一個反 應基包含四環酮。 19. 根據申請專利範圍第1項之方法,其進一步包含使 用苐聯酚及二氟芳族化合物製造骨架,及其中至少一個反 應基包含乙炔基官能基。 20. 根據申請專利範圍第1項之方法,其中骨架由氟化 苐聯酚化合物及氟化二氟芳族化合物製造,及其中多個反 應基包含至少一個四環酮及至少一個乙炔基。Page 25 591067 VI. Scope of patent application One cross-linking reaction between one polymer bundle and itself. 12. The method according to item 1 of the scope of patent application, wherein a crosslinking reaction occurs without the addition of an external crosslinking agent. 13. The method according to item 1 of the scope of patent application, wherein at least one polymer bundle crosslinks at least one other polymer bundle without generating free radicals. 14. The method according to item 1 of the scope of patent application, wherein at least one of the reactive groups comprises dilute. 15. The method according to item 1 of the patent application, wherein at least one of the reactive groups comprises a dienophile. 16. A method according to claim 1 in which the backbone comprises a ring system and at least one reactive group comprises a diene. 17. A method according to claim 1 in which the backbone comprises a ring system and at least one reactive group comprises a dienophile. 18. The method according to item 1 of the scope of patent application, further comprising manufacturing a skeleton using a biphenyl and a difluoroaromatic compound, and at least one of the reactive groups thereof comprises a tetracyclone. 19. The method according to item 1 of the scope of patent application, further comprising manufacturing a skeleton using a biphenyl and a difluoroaromatic compound, and at least one of the reactive groups includes an ethynyl functional group. 20. The method according to item 1 of the scope of patent application, wherein the skeleton is made of a fluorinated terpineol compound and a fluorinated difluoroaromatic compound, and a plurality of the reactive groups thereof include at least one tetracyclone and at least one ethynyl group. O:\63\63739.ptd 第26頁O: \ 63 \ 63739.ptd Page 26
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US9203072B2 (en) 2004-08-30 2015-12-01 Asahi Kasei Chemicals Corporation Microporous polyolefin film and separator for storage cell

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9203072B2 (en) 2004-08-30 2015-12-01 Asahi Kasei Chemicals Corporation Microporous polyolefin film and separator for storage cell

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