TW590169U - Embedded centrifugal cooling device - Google Patents

Embedded centrifugal cooling device

Info

Publication number
TW590169U
TW590169U TW089222512U TW89222512U TW590169U TW 590169 U TW590169 U TW 590169U TW 089222512 U TW089222512 U TW 089222512U TW 89222512 U TW89222512 U TW 89222512U TW 590169 U TW590169 U TW 590169U
Authority
TW
Taiwan
Prior art keywords
cooling device
centrifugal cooling
embedded centrifugal
embedded
cooling
Prior art date
Application number
TW089222512U
Other languages
English (en)
Inventor
Wen-Shi Huang
Guo-Jeng Lin
Tzu-Liang Lin
Tzung-Yu Lei
Original Assignee
Delta Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Delta Electronics Inc filed Critical Delta Electronics Inc
Priority to TW089222512U priority Critical patent/TW590169U/zh
Priority to US09/930,990 priority patent/US20020079086A1/en
Priority to DE20116161U priority patent/DE20116161U1/de
Priority to JP2001007657U priority patent/JP3086228U/ja
Publication of TW590169U publication Critical patent/TW590169U/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Centrifugal Separators (AREA)
  • Structures Of Non-Positive Displacement Pumps (AREA)
TW089222512U 2000-12-27 2000-12-27 Embedded centrifugal cooling device TW590169U (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
TW089222512U TW590169U (en) 2000-12-27 2000-12-27 Embedded centrifugal cooling device
US09/930,990 US20020079086A1 (en) 2000-12-27 2001-08-17 Embedded centrifugal cooling device
DE20116161U DE20116161U1 (de) 2000-12-27 2001-10-02 Integrierte Zentrifugen-Kühlvorrichtung
JP2001007657U JP3086228U (ja) 2000-12-27 2001-11-22 嵌入式遠心冷却装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW089222512U TW590169U (en) 2000-12-27 2000-12-27 Embedded centrifugal cooling device

Publications (1)

Publication Number Publication Date
TW590169U true TW590169U (en) 2004-06-01

Family

ID=21676534

Family Applications (1)

Application Number Title Priority Date Filing Date
TW089222512U TW590169U (en) 2000-12-27 2000-12-27 Embedded centrifugal cooling device

Country Status (4)

Country Link
US (1) US20020079086A1 (zh)
JP (1) JP3086228U (zh)
DE (1) DE20116161U1 (zh)
TW (1) TW590169U (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI681707B (zh) * 2018-12-11 2020-01-01 大陸商深圳興奇宏科技有限公司 散熱單元結合結構

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6698505B2 (en) * 2002-01-22 2004-03-02 Rotys Inc. Cooler for an electronic device
PT1512062E (pt) * 2002-05-31 2008-01-15 J Van Der Werff Holding B V Arrefecimento de componentes eléctricos e/ou electrónicos, especificamente de equipamento de computador.
TWM244508U (en) * 2003-04-16 2004-09-21 Asia Vital Components Co Ltd Improved fan structure
US6981542B2 (en) * 2003-10-29 2006-01-03 Rotys Inc. Multi-heatsink integrated cooler
US7221566B1 (en) * 2004-01-28 2007-05-22 Nvidia Corporation System for cooling a processor while reducing air flow noise
CN101060763B (zh) * 2006-04-19 2011-08-24 鸿富锦精密工业（深圳）有限公司 散热装置
US20070256812A1 (en) * 2006-04-19 2007-11-08 Wen-Chen Wei Multidirectional heat dissipating structure
US20100071877A1 (en) * 2008-09-19 2010-03-25 Nitin Goel Reducing accumulation of dust particles on a heat dissipating arrangement
US20100170657A1 (en) * 2009-01-06 2010-07-08 United Technologies Corporation Integrated blower diffuser-fin heat sink
US10506735B2 (en) 2014-08-25 2019-12-10 Hamilton Sundstrand Corporation Heat exchange device in directed flow system
US20220240413A1 (en) 2019-06-10 2022-07-28 Telefonaktiebolaget Lm Ericsson (Publ) A cooling unit for cooling a heat-generating component and a method therefor
US20230070319A1 (en) * 2021-09-08 2023-03-09 Dell Products L.P. Fan covering with high recycle content and high thermal conductivity

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3573137D1 (en) * 1984-10-03 1989-10-26 Sumitomo Electric Industries Material for a semiconductor device and process for its manufacture
US5309983B1 (en) * 1992-06-23 1997-02-04 Pcubid Computer Tech Low profile integrated heat sink and fan assembly
US5377745A (en) * 1993-11-30 1995-01-03 Hsieh; Hsin M. Cooling device for central processing unit
JP3127821B2 (ja) * 1996-04-04 2001-01-29 松下電器産業株式会社 ヒートシンク装置
JP3206436B2 (ja) * 1996-07-03 2001-09-10 松下電器産業株式会社 ヒートシンク装置
US6244331B1 (en) * 1999-10-22 2001-06-12 Intel Corporation Heatsink with integrated blower for improved heat transfer
US6659169B1 (en) * 1999-12-09 2003-12-09 Advanced Rotary Systems, Llc Cooler for electronic devices

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI681707B (zh) * 2018-12-11 2020-01-01 大陸商深圳興奇宏科技有限公司 散熱單元結合結構

Also Published As

Publication number Publication date
DE20116161U1 (de) 2002-01-31
JP3086228U (ja) 2002-06-14
US20020079086A1 (en) 2002-06-27

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