TW587988B - Electronic substrate and method for manufacturing the same - Google Patents

Abstract

This invention concerns electronic substrates comprising a combination of non-woven glass and non-woven polymeric filler materials and a resin. The present invention also includes electronic products manufactured from the electronic substrates of this invention including, but not limited to prepregs, metal clad laminates, and printed wiring boards with and without lased via holes.

Description

587988 V. Description of the invention (1) Manmin back t (1) Field of the invention The present invention relates to an electronic substrate comprising a nonwoven reinforcement, which includes a nonwoven glass fiber and a mixture of a nonwoven organic fiber and a resin material. . The invention also includes electronic products made from the electronic substrate of the invention, including, but not limited to, prepregs, metal-clad laminates, uncovered dielectric substrates, printed wiring boards, and with and without lightning Microelectronic circuit assembly (interposer) for drilling via holes. (2) Description of this technique It is well known to me that the inorganic base material is combined with the thermosetting or thermoplastic polymer electronic base material and the woven glass fiber reinforced epoxy-based resin system. Such a woven fiber-reinforced substrate forms the basis of a conventional printed circuit board substrate. Although these substrates perform well on conventional circuit systems, they are used in the manufacture of high-density electronic circuit systems (for example, in circuit systems with a line / space structure of less than about 50 micrometers / 50 micrometers' capture 塾When it is less than about 250 microns' or the diameter of the through path is less than about 100 microns, some defects will occur. For example, self-woven glass can make it very difficult to produce extremely thin structures (less than 4 mils) with the necessary mean sentence. This is because the manufacture of long glass (silicon dioxide) fibers below 5 microns in diameter becomes more difficult and costly, and because many fibers are combined into yarns, which are then woven into fabrics. The diameter of the yarn must be much larger than the fiber diameter, and the spacing caused by weaving must be larger than the yarn diameter. It becomes more difficult and expensive to produce narrower yarns and thinner fabrics. In addition, the textured sample body can cause uneven glass fiber distribution. In addition, the control of heat -4- This paper size applies to China National Standard (CNS) A4 specification C210 X 297 mm) ------------------ Order --- *- ----- line (please read the notes on the back before filling out this page) Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs's Consumer Cooperatives 587988 A7 B7 Printed Invention Note (Expansion Coefficient (CTE) Its ability to be affected by ®, testing, a in α, 蜗, 减, and 隹 < properties and glass ^ w ^ C Baizhi Baozi circuit substrate technology has become more difficult to apply to the manufacture of high-density circuit systems. ≪ Ττ 亍 Paper-based substrate 'From the early days of the Ding series of tree moon ... the paper of responsibility to the advanced classic machine-based paper-like substrate, I have been well known to everyone.-In general, the inorganic materials The paper structure based on it is not easy to accept fast and uniform laser iron holes. The organic fiber reinforced base is very good soil < wrapped in I materials, including woven organic fiber reinforced and various cross Layer structure, & is known to me. Electronic substrates based on organic fiber reinforced materials The copper and other materials used in the construction generally have poor processing characteristics due to their low stiffness and high cte. Electronic substrates made from the non-woven structure of liquid crystal polymer fibers such as aromatic polyamide fibers have been previously developed Explained. However, fangxuefang fiber will absorb a high amount of water, and therefore will show a large size movement when the surrounding environment is marginalized. The substrate based on polyester liquid crystal polymer fiber has also been Known in the prior art and used in high-density circuit manufacturing, these generally have poor stiffness and lack of dimensional stability. They will also show C T E that changes with temperature and may cause possible stress in the circuit. Organic film materials-based substrates are known and have been used in the manufacture of high-density circuit systems. Examples include polyimide films and polyester liquid crystal polymer-based films. These films often appear cT E depending on the direction Different, and they generally have poor tear resistance. Polyfluorene imine in particular absorbs a large amount of water. The properties of these liquid crystal polymer films will change with thermal cycles or annealing. At the same time, these films are also difficult sticky The tendency to form multi-layer circuits together. -5 This paper size is applicable to China National Standard (CNS) A4 specification (21 × 297 mm). ^ ----- r --- Order --- * ---- --Line-^^ · (Please read the precautions on the back before filling this page) 587988 A7

V. Description of the invention (3) The use of lasers to drill through a path in a high-density circuit system has already been explained in this technique. Therefore, to effectively use lasers to drill through electronic substrate vias, the substrate must be cleaned and ablated to create high-quality through-holes. Laser iron holes and laser ablation for two types of electronic substrates, including woven organic materials and woven inorganic glass and paper materials, are known to me. Generally speaking, the level of laser power required to ablate inorganic glass fibers (more accurately, the laser fluence is higher than that required for organic materials. It is important that the size of the electronic substrate when subjected to environmental stresses is dimensional Must be uniform, equal to or smaller than the minimum size of the circuit system. Furthermore, dimensional uniformity is required to ensure that no bending or bending will occur after processing and circuit fabrication and assembly. Generally speaking, fiber reinforcement is known Materials can be used to moderate the rather high thermal expansion coefficient of polymeric materials. Fiber reinforcements can also provide mechanical stiffness, and reinforcements can help to toughen composite materials. However, reinforced substrates from previous techniques are generally not sufficient Uniform to prevent bending and bending. Although the quality of the reinforced electronic substrate has progressed, it still needs to be improved. To be clear, there is still a need for clean ablation during laser drilling to produce high-quality through holes Or via reinforced electronic substrate. At the same time, there is also a need for reinforced electronic substrates with improved form stability and strength. SUMMARY OF THE INVENTION An object of the present invention To provide a CTE with a coefficient of thermal expansion (CTE) that is very close to the circuit system associated with it, resists water absorption and maintains its properties to a higher temperature. Another object of the present invention is to provide a material that withstands changing environmental conditions. Such as temperature-6- This paper size is applicable to China National Standard (CNS) A4 specification (210 X 297 public love) (Please read the precautions on the back before filling this page) -f Order—— · ------ Line 1 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs printed 587988 A7 ------_______ B7_____ V. Description of the invention (5) Partially hardened to form a prepreg. In a further aspect of the present invention, the prepreg is further processed, that is, the prepreg is heated and pressurized to harden the resin, and then a metal coating is deposited on both sides of the dielectric substrate by true two percent. In another aspect of the present invention, the prepreg is further processed, that is, the prepreg is heated and pressurized to harden the resin. Then, the laser is used to drill through the path of the hardened resin, and the opposite of the film Build first on both sides and The two circuit systems, the first filling layer and the first circuit layer are remotely connected via a laser iron via. In yet another aspect of the present invention, the prepreg can be placed between two copper laps and pressed. Hardened. Various copper drops can be used to provide a suitably roughened hardened surface. This copper foil can then be removed by etching or stripping of the hardened material to produce a freestanding dielectric substrate, or the copper foil can be left on it and used for manufacturing Circuit system. ^ J Description of specific examples The present invention relates to an electronic substrate containing a nonwoven reinforcement material and a resin material. The present invention also includes electronic products made from the electronic substrate of the present invention, including, but not Limited to prepregs, metal-clad laminates, non-laminated laminates and printed wiring boards. The electronic substrate of the present invention includes resin-impregnated reinforcing materials, which are glass microfibers and non-woven organic fibers, and organic short fibers. , Non-woven combination of organic pulp fiber and its mixture. The term `` glass fiber '' refers here to glass fibers having a nominal diameter greater than about 5 microns. Microglass fibers refer to having an average diameter of less than about 5 microns, preferably less than about 2.0 microns, and more preferably less than Glass fiber of about 10 microns. Π is basically all " as used herein means at least 80%. -8- This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 1 pack- --- r --- Order ---------- Line · (Please read the notes on the back before filling this page) 587988 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention (6) The reinforcing material may be selected from any non-woven fibrous material. Useful non-woven fibrous materials include glass fibers, glass microfibers, polymer fibers, = porcelain fibers, silica fibers, organic fibers such as liquid crystal polymer fibers , Natural fibers, polymer fibers, organic pulp fibers and mixtures thereof. Non-woven organic pulp fibers are generally made from short fibers. The reinforcing material is preferably made of micro glass fibers, organic fibers, organic short fibers, and organic pulp. Fibers and their blends Non-woven mixture of nonwovens. The amount of non-woven reinforcing material present in the electronic substrate of the present invention may be from about 10 to about 90% by weight. The amount of reinforcing material present in the electronic substrate of the present invention is preferably sufficient to make the electronic substrate The CTE in close proximity to the metal layer associated with the substrate. The CTE & of the electronic substrate can be adjusted using reinforcing materials to minimize stress in the product formed from the substrate. The electronic substrate of the present invention preferably includes The amount of reinforcing material from about 15 to about 60% by weight, and preferably from about 30 to about 55% by weight. If the reinforcing material includes a mixture of glass microfibers and organic fibers, the reinforcing material preferably includes about 2 0 to about 95% by weight of organic fibers and about 5 to about 80% by weight of non-woven glass microfibers. The reinforcing material preferably includes about 30 to about 75% by weight ❶ /. Organic fibers and about 25 to about 70% by weight % Glass microfibers. The organic fibers used in the reinforcing material can be organic pulp fibers, organic short fibers, and mixtures thereof, and mixtures are preferred. Microfiber glass can be made from any type of glass. The term "glass fiber" is used in this The fibers used are silicon dioxide-containing fibers, including E_glass, B-glass, D_glass, m_glass and mixtures thereof. Non-woven microiron glass will generally have an average diameter of less than about 5 microns, and preferably less than about 5 microns. 2 microns. Useful This paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) -4. Packing -------- Order --- 1 ------ line (please first Read the notes on the back and fill in this page) 587988 Printed by A7, Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the invention (8) Maintains about 20 to about 40% by weight pulp. Non-woven fabrics, including but not expected Dispersion aids can be used for fiber 1 using known methods for making wet-laid fabrics (,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,), and known methods for making wet-laid fabrics, and used to make nonwoven fabrics with no belts. The pre-impregnated reinforcing material should have a thickness of ^ 0.5 to about 25 mils, preferably from about 4 to about 16 mils. Another round, clever: It is used for the reinforcement of the electronic substrate of the present invention; the material can be formed by the method generally used to make fibrous paper and substrate. If non-woven glass and non-woven organic materials are supplied in bulk, the non-woven fibers in bulk are mixed in a solution and stirred: dropped to form a slurry. Including non-woven reinforced materials (% sub-substrates) made from microfiber glass and non-woven organic fibers, the resulting composite has a lower glass content and a more homogeneous glass content than a substrate reinforced with woven glass And more uniform laser ablation. The electronic substrate made from the non-woven reinforcing material of the present invention has a smooth and uniform hook surface because of the uniformity of the space of the reinforcing material. The better fibrous reinforcing material can be used evenly. Mixture manufacturing, but preferably using a coupling agent. Any coupling agent used in this technique that will adhere to the reinforcing material and promote the adhesion of the polymer to the reinforcing material can be used. The preferred coupling agent for glass fibers is a shibuya-based coupling Mixtures. Examples of usable ishibuchi-based coupling agents include CS718 manufactured by Clark Schwebel. Useful silanes are king. Other examples of coupling agents include CS767 and CS440, both of which are manufactured by Dark-Schwebd. Coupling agents It is usually added to the reinforcing material before the resin is impregnated. The coupling agent should be present on the reinforcing material in an amount sufficient to coat substantially all of the < Dimension. This is usually equivalent to the amount of coupling agent --------- tT ---------- line ^ (Please read the precautions on the back before filling this page} -11 587988 Description of the invention (The Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs is printed as a coupling agent from about 0. 05 to about 16 tongues θ n / 3 16 weight 1%, more preferably about 0125 to about 丨 〇. The fibrous reinforcing material can be manufactured without binder resin. The binder resin used for resin manufacture 4 is a low-absorbent resin that easily adheres to fibers. 1 = plus: no coupling agent is applied. The binder resin can be thermoplastic, ' And it can be a thermoplastic fiber that was incorporated into the non-woven reinforcing material at the time of manufacture. The binder resin is present in the electronic substrate of the present invention in a better amount. The processing point provides the strength for processing the material. This binder resin generally exists I It is 0.25 to 25% by weight, preferably 05 to 10% by weight, and most preferably 1.0 to 10% by weight. The fibrous reinforcing material is impregnated with a resin and used to manufacture a thin electron called a prepreg. Pre-impregnation of reinforced layers by standard methods. Pre-impregnated materials can be used to manufacture circuit boards with or without metal foil. Laminated to make a laminate with a laser-burnable dielectric layer, which can then be used to manufacture circuit boards. Therefore, using the prepreg of the present invention, inexpensive, laser-ablatable, and copper Full-build non-electric or subtractive circuit system plus dielectric substrate that can be used for processing. The electronic substrate of the present invention is particularly useful for manufacturing laser drilled micro-path circuit boards. The electronic substrate of the present invention The material is made from the selected reinforcing material with a suitable resin. The resin will generally consist of at least one polymer and any other material known to the art1 for electronic substrates; any of these other materials can be provided from the resin The required strength, durability, heat resistance, water resistance, etc. of the finished material. Some examples of resin additives include chain extenders, hardener catalysts, reactivity control agents, and the like. Resin that can be used in the manufacture of electronic substrates -12- This paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm). --------- ^ (Please read the notes on the back before filling in this page) 587988 A7 -------- gz______ 5. Description of the invention (11) 7 The amount of fat and the degree of hardening are Adjust to provide the desired resin flow, depending on the end use of the prepreg. There should be enough resin in the prepreg to allow the resin to flow and hold the traces of the circuit system when the prepreg is pressed against the inner core layer of the PWB. If the resin used is thermoplastic rather than thermosetting, it can be laminated to the fabric from one side or preferably both using a hot plate or a belt press. A metal-clad laminate, preferably a copper-clad laminate, can be made from a prepreg. The method is to lay the metal on either side of the prepreg like copper and place the cladding in a hot press. Bonding under sufficient temperature and pressure to cause the prepreg to flow and harden, so that the metal foil is adhered to the dielectric layer. Alternatively, if a metal hafnium-free dielectric layer is required, the prepreg can be compacted on a secondary release film, such as the bare surface of a metal or polyimide. The prepreg of the present invention can also be placed between two pairs of layers and laminated. In a preferred method, the electronic substrate of the present invention is manufactured as an ultra-thin film replacement substrate having at least a very smooth surface. The method of manufacturing an ultra-thin film instead of a substrate is started by impregnating the reinforcing material sheet of the present invention with at least one resin. The reinforcing material is preferably impregnated in a resin amount of about 30 to about 85% by weight, more preferably about 40 to about 65 weight ❶ / ❶, constituting the resin-impregnated reinforcing material. However, it is also within the scope of the present invention to impregnate the reinforcing material with about 75% by weight of resin. After impregnation, the resin-impregnated reinforcing material is the b_ stage to obtain a pre-impregnated material. The prepreg can be used immediately as an intermediate in multilayer wiring boards or other electronic devices. The prepreg is preferably compressed at a pressure of about 2000 to about 600 psi for a period of about 1 minute to about 30 minutes or more to reduce the thickness of the prepreg. The thickness of the prepreg is preferably reduced by at least 25%, more preferably by at least 50%, and most preferably by at least 60% to obtain a compressed prepreg. -14-This paper size is in accordance with Chinese National Standard (CNS) A4 (210 X 297 mm) ------------- (Please read the precautions on the back before filling this page) Order- -„------ Line-Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 587988 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (12, then apply the same or different resin solution In the second release film layer, the compressed prepreg is placed between the release film layers, so that the resin layer separates the release film layer from the compressed prepreg. Then, the release film / resin / Compression prepreg / resin / release film / structure is at a temperature of about 150. (: to about 30 (rc) under pressure and hardened to obtain a film replacement product. The release film used in the preferred method of the present invention can be used for this technology. Any material used in the manufacture of dielectric layers and other electronic intermediates. Examples of useful release films include sublime foils, and polymer films such as films made from polypropylene, polyimide, self-fluorinated resins, polyethers A film made of fluorene imine, or a polyphenylene sulfide film. The preferred release film is copper foil. The resin is preferably coated on the copper foil. The copper film can be removed by peeling, or it can be removed from the film by replacing the substrate. The total resin content of the dielectric substrate of the present invention does not include the weight of the released film layer. In the range of about 45 to about 85% by weight, and preferably in the range of about 50 to about 60% by weight / 0. The dielectric substrate of the present invention can be used to manufacture on polyimide films by now Circuits are used to make printed circuit boards. These circuits include packages used to package Shixi ICs, such as plastic-ball-grid-array (PBGA) and tape-ball-grid- array, TBGA) high-density interconnects used for packaging. To be clear, the dielectric substrate of the present invention can be coated with chromium and copper in a vacuum deposition system, and a laser can be used on the metal-plated dielectric substrate. Electroplated vias and further use of photolithography, electroplating, and etching techniques of the printed circuit industry standard to establish additional circuit systems on thin metal layers on circuits; ------------------ -^ (Please read the notes on the back before filling this page) -15-

Printed by the Consumer Property Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs of the People's Republic of China, 587988, invention description (13 basic-important features are that they have the name of a laser drilled hole, which can be manufactured in the book using a consistent laser intensity, that is, the IA sub-substrate Numerous extremely small materials have made progress. The disadvantage of woven fiber reinforced materials is arsenic, so the laser time required to make the path = the degree of "the substrate can vary greatly, depending on the path is woven fabric fiber gap laser It depends on whether the laser burr or the via is drilled into the woven fabric. ^ The important feature of the dielectric substrate of the present invention is that it can even align laser performance holes to produce a diameter of about 6 mils to as small as about 05 mil ability. The prepreg and electronic substrate of the present invention have many unique properties. One important property is the laser drillability of the substrate. The substrate of the present invention will include a number of Micro-channels made by laser with power setting. One section of the channel will be very uniform. The diameter of the JL channel will be about 4 mils or less, preferably ^ mils or less. Furthermore, the laser drill of the present invention Porous substrates include pathways with a nominal 1 mil diameter. The diameter of the substrate exposed on the first surface of the laser beam must not exceed 30 microns and not less than 20 microns. On the second surface of the dielectric film where the laser beam passes through the laser drilled hole, the straight Z of the path must not be Less than 15 microns, preferably not less than 18 microns. Furthermore, the thermal damage around the hole must be minimal, characterized by the fact that the damage around the hole is substantially less than the i-micron ring. This damage can be eliminated by short plasma treatment. Removal. &Amp; The fibers in the strong must be cleared from the inside of the hole wall to a sufficient degree so that the path can be electrically charged, sputtered or filled with conductive glue or ink under pressure to make from the film to the surface to another table-16-

Order ------------- line. (Please read the note on the back is disgraceful true I) 587988 A7 Β7 V. Description of the invention (15) Pulp is made from short fibers by mechanical beating method in water Made in slurry. In the experiment, the king mixes 1/2 cup of water with about 2 grams of chopped short fibers and processes them in a Waring blender for beating. The fabric was made in a commercially available sheet mold using a wet-laid method. Equip a mixture of diluted and well-dispersed components in water. The mixture was poured into a mold and the drain was opened. The mixture was drawn through the screen of the mold and the nonwoven fabric was deposited on the screen. The fabric piece was removed from the screen and dried. 12 125 inch x 12 · 125 12 square fabric samples were made using the typical molds. The fabric weight was about 316 grams and about 3 to 4 mils thick. To prepare this fabric to be filled with resin, the upper edge was sandwiched between thin copper sheets. Place two pieces of thin copper, about 0.032 inches thick, 12 inches long, and half an inch wide, to sandwich about 1/4 to 1/2 inch of one edge of the fabric. The fabric was clamped in the middle by two small clamps. This allows the samples to be wet-treated (after dipping and before solvent evaporation). A piece of FEP (fluorinated ethyl propylene) film was placed on a flat surface. The fabric sandwiched with copper was laid on the FEp film and the edge clamped was furthest from the person who made the sample. A # 12 Meyer rod purchased from Garcjner & Co. was placed on the fabric, near the copper sheet. Place blotting paper on the FEP film, just below the nonwoven, so that it can absorb any excess resin after the Mel bar is dragged across the fabric piece. The prepared resin was poured from a small container on the fabric to produce a small ball of liquid resin solution gathered in front of the Mel bar and touched the Mel bar. Slowly roll the Mel bar toward the person making the sample, roll the resin beads forward, and fill the fabric with resin. Mel rods move slowly until they drag across the fabric, and the resin pile will wet the fabric. When the resin is sucked into the non-woven sheet, the extra resin is poured on the fabric-1β-This paper size applies the Chinese National Standard (CNS) A4 specification (210 χ 297 male «) (Please read the precautions on the back before filling this page)- 1 -------- Order ---'------ Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 587988

Inventory (16), to maintain a small pile of resin in front of the rod. When the Mel bar reaches the end of the fabric sheet, it will push the excess resin off the end of the sheet and into the blotting paper. (Please read the precautions on the back before filling this page.) Pick up the non-woven sheet impregnated with resin and solvent by copper sheet and clamp and hold it in a convection oven set at 155 ° C. The wet fabric was hung in the oven for 3.0 minutes. During this 3-minute baking, the solvent evaporated. Remove the fabric piece from the oven and bake it for 5 minutes in a nitrogen-washed oven set at 21 ° C. This second baking is used to further remove residual solvents. After the sample is taken out of this second oven That is, the clamp is removed and the copper sheet is peeled back from the fabric sheet. Then, the sample can be placed in a hot press to be pressed. The material, the release film and the hard pressing plate are stacked to prepare a press. This stack is stacked in the following order: polished core-copper (bare surface facing the center of the stack as a release film) -dry-coated sheet of non-woven reinforced prepreg-copper (bright side facing the center of the stack) )-Polished chrome plate. Heat the air compressor to 330 ° F before placing the sample. Place the sample and evacuate the chamber. Adjust the press to apply 15 tons of force and raise the temperature to 446 ° F. Press After the machine reaches 446T, the sample is hardened for 1.5 hours. The press is cooled and the sample is taken out. The copper foil is peeled and hardened to strengthen the film. This hardened film is a nonwoven reinforced dielectric (NWRD). The total weight is now Approximately 6.87 grams, equivalent to this NWRD resin content is about 56%. Printed by the Bureau ’s Consumer Cooperatives III. Product properties Manufacture of high-density printed circuits with laser ablation paths, especially those used to package silicon integrated circuits. The main characteristics are: plane thermal expansion coefficient, laser drillability, water absorption, Stiffness, tear strength, thickness, uniformity, flatness, and surface smoothness. -19- This paper size applies to China National Standard (CNS) A4 (210 X 297 mm). Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. System 587988 A7--B7 V. Description of the invention (17) A. Laser drilled sample made entirely of woven glass' It is very difficult to make laser burnout pathways. Micro glass fiber and organic fiber components can allow The material was ablated by laser. Typical parameters using a triple Nd: yag laser ablation system purchased from ESI are: 500 mW average power, 25 micron dot size, 100 kHz repetition rate and 100 pulses of holes. This will create a laser drilling path with a diameter of about 1 mil (25 microns). The use of micro-glass can make laser drilling reproducible. B. Planar thermal expansion coefficient NWRD substrate can be used to support copper circuits Systems and silicon integrated circuits. The control of the plane thermal expansion coefficient (CTE) is extremely important. The CTE of NWRI must be at least as low as copper (17 ppm wide C), and depending on the method of silicon attachment, the optimal value can be found in copper and silicon (2-3 PPm / ° C). When the above reinforcement sample was impregnated with 50% resin, the c TE (average from room temperature to 230) was 11.5 ppm. 0 It is ridiculously similar to the reinforcement but in which the organic component is all p B. The samples made from Pueraria pulcherrimii produced higher CT e than the blend of pulp and staple fiber. The strength of a fiber is known to be related to its length divided by its diameter. In the case of beating materials, the diameter is substantially reduced more than the length, and therefore it is expected that when short fibers are replaced with pulp. The C τ E of the dielectric reinforcement will be low. The opposite is also true. Therefore, in addition to the improved tear properties, the addition of staple fibers has unexpected advantages. In contrast, the sample produced using only fine glass (1: 19 ppm / C. PBO staple fiber and pulp are better at controlling the expansion of the applied thermosetting resin. Alternative organic fibers that can have similar effects are Aromatic Polyamine and Liquid-20-

This paper size applies to China National Standard (CNS) A4 specifications (210 X ----- r --- order ---'------ line WV. (Please read the precautions on the back before filling this page ) 587988 A7 B7 18, V. Description of the invention (Crystal polyacetate fiber. However, the aromatic polyamine has a very high water absorption, and the advantages of the LCp material will only be that the resin can adhere to the LCP fiber and LCP is compacted. It appears only when it does not dissolve and reorient. C Water absorption The water absorption of the above samples after exposure to saturation at 85 ° C and 85% relative humidity (R Η) to saturation was 0.6% by weight. Slightly made The surprising result was that this 'water absorption' was only slightly reduced when the PBO short fibers were replaced with more microfiber glass, as the high surface area microfiber glass would provide the compound with almost the same water absorption. Surprising The difference is that PPB pulp absorbs substantially more water than short fibers. Therefore, blends with full PPB pulp have higher water absorption (0.9%). D. Tear properties using ASTM D1922-94a resistance Measured for tear spreading (Elmendrof type tear-proof clothing 4 test machine), The amount is 9gf. This tear resistance is derived from PBO short fibers. The tear resistance of the samples reinforced with all microfiber slopes is only 〇67gf. Cancel all P cypress and increase the amount of short fibers It will further increase the tear resistance of the samples reinforced with 50/50 glass / PB0 staple fiber to 155.2gf. E. Corrugation and flatness: Thermount nonwoven reinforcement of DuPont, a kind of Wang Yao Reinforcement composed of organic aromatic polyamide short fibers, when producing similar and thin (about 50 microns thick) NWRD samples, the ripples of the obtained NWRD are not obvious. The ripples are caused by the heterogeneity of the reinforcement, and The non-uniform ^ 疋 full-staple fiber-based non-woven products, because of pushing through the density limit, so -21 • ----- r --- order --------- thread (please read the back first Please pay attention to this page and fill in this page again) Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 97 2 X 10 (2 Regulations 4) AS) N (C ί Bao if 587988 A7 V. Inventive (19) inherent. F Stiffness Stiffness can be measured by measuring the bending modulus of thin NWRD samples > TAPPI Test T489〇m-92, Tab ^ type = stiffness test method. The above sample shows a flexural modulus of .0733 cm2 and a similar sample made of full microfiber glass reinforced reinforcement is 0585 gcm. 0 (Please read the precautions on the back before filling out this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs-22- This paper size applies to China National Standard (CNS) A4 (210 X 297 mm)

Each note is to be filled by this bureau.) A4 C4 Chinese Manual Correction Page (September 91) 587988, the name of the creator of the mold i. 2. The applicant's patent specification

Wenying's name " ELECTRONIC SUBSTRATE AND METHOD FOR MANUFACTURING THE SAMEn_ Nationality 1. David R. Hertz 3. Kim Meeffen 5. Laura Miller 1.2.4.5 Both are American 2. Muffin McOliver 4. McWagman 3. Chinese residence, residence

U Nationality1 · 527 Summer Carson Road, Nishino, New Jersey, USA 2 · 3412 Stillhill Road, Wassan, Massachusetts, USA 3. Davy Road, Branzberg, New Jersey, USA 7 No. 264, King's Road, Nywalk, Lava, USA 5 5 United States Merchants Sign Company, No. 201 Country Club Road, Monte, North Carolina, USA 丨 Columbia Road, Morristown, New Jersey, USA 丨 〇 Roger I. Chris

Binding wire 587988 Patent Application No. 089112410 Chinese specification replacement page (1993). Dielectric material with high dimensional stability and uniformity in humidity. It is yet another object of the present invention to provide a dielectric material that can be fabricated into a very thin layer to facilitate t k through k k vias. Yet another goal of this month is to provide dielectric materials that are easy to accept for laser path manufacturing. Another aspect of the present invention is to provide a reinforced thin dielectric material having a smooth surface. The present invention (a further object is to provide a dielectric material that is easily incorporated into an electronic product such as a printed wiring board. The present invention includes an electronic substrate comprising a nonwoven reinforcing material and at least one resin, wherein the reinforcing material includes glass fibers and organic fibers. Non-woven combination. The present invention also includes an electronic substrate comprising about 30 to about 85 weight percent resin and about 5 to about 70 weight percent non-woven reinforcing material, wherein the reinforcing material comprises about 30 to about 75. % -P-phenylene-2,6-benzobisoxazole fiber and about 25 to about 70% by weight glass microfibers, wherein the substrate has a thickness of about 0.2 to about 20 mils. 'p-phenylene-2,6-benzobisazazole organic fibers are preferably composed of short fibers and pulp fibers. The present invention further includes a method for manufacturing a dielectric layer. The method includes using a A solution comprising at least one resin is impregnated with a sheet of non-woven reinforcing material to obtain a resin impregnated cloth; the non-woven reinforcing material includes about 9%.) The main organic fiber is about 75% by weight of organic fibers (consisting of short fibers and pulp fibers). Composed of mixtures) From about 25 to about 75% by weight glass microfibers. Resin impregnated < ,,:

Binding

Patent Application No. 08911241〇 Chinese Specification Replacement Page (April 1993)

Examples of mechanical, truncated, and sintered glass include microfiber glass manufactured by Johs Manviiie = 6.08M glass manufactured by Evanite (including 0.8 micron diameter glass fiber and 700B glass manufactured by Evanite ( Including glass fiber with a diameter of 0.3 micron. Glass and polymer nonwoven microfibers are generally made into thin sheets before resin impregnation. The nonwoven reinforcing material of the present invention may also include organic fibers. Organic fibers may be selected from fiber-containing organic materials such as Naturally occurring fibers and artificial polymer fibers. Organic fibers are preferably polymeric fibers, and fibers made using liquid crystal polymers, aromatic polyamides, polyesters, polyamides, and mixtures thereof are preferred. The best organic fibers Poly (p-phenylene-2,6-benzobispyrazole) (pB〇) fiber sold by Toyobo Corporation (Shiga, Japan) as staple fiber Zylon®. Organic fiber can Are short fibers, pulp, microfibers, or any combination thereof. The term "short fibers" refers to virgin spun fibers. Generally, virgin organic fibers have a diameter greater than about 6 microns and usually greater than about 0 microns These fibers All are cut into about 1/8 inch to about 3/4 inch., "Pulp" refers to the product of short fiber fibrillation and breaking into short fibers. Some or all of the cut short fibers can be converted into pulp The meal is prepared by placing a part or all of the short fibers into an aqueous mixture and mechanically inducing the solution to break the fibers into arsenic fibrils. These fibrils or pulp are then mixed with chopped short fibers and glass microfibers. The slurry is formed in a liquid. The organic fibers used in the reinforcing material of the present invention may include a mixture of short fibers and pulp fibers. The mixture may include from about 30 to about 100% short fibers and from about 0 to 70 Wt% pulp glaze, preferably about 20 to 90 wt.% Organic short fibers and 10 to 80 wt% pulp, most preferably about 60 to about 80 wt% staple fibers Applicable to China National Standard (CNS) A4 specification (210X 297 mm) 587988 Patent Application No. 089112410 Chinese Specification Replacement Page (April 1993) 1'4 V. Description of the invention (1. Illustrated in U.S. Patent Nos. 5,508,328, 5,62,789, 5,534,565 and U.S. Provisional Application 6 / 〇19,853, each of which is incorporated; this is for reference. Another example of a resin system has been stated in pcT / Ej > 97/05308, which is also incorporated herein by reference. Other available resin systems include thermosetting polymerization Resin systems such as epoxy resin systems, cyanate resin systems, silicone resins, perylene imine, bismaleimide, thiocyanate, and urethane f systems, and plastic resin systems such as polymer Borne #, benzocyclobutane, poly-p-epoxide and mixtures of cycloaliphatic resins based on it. Further useful materials include thermoplastic polymers such as polyetheretherketone (), polyphenylene & ( PPS), thermoplastic polyimide, indane epoxide and mixtures thereof. The preferred resin system is 408 sold by Allied Signal. The thickness of the electrical substrate can be controlled by adjusting the resin content or strengthening the material thickness. Electrical substrate thickness can vary depending on the end use of the substrate. The electrical substrate of the present invention will preferably have a diameter of about 0.25 to about 12 mils, more preferably about 0.5 to about 40 mils. The wire is to provide a uniform electrical substrate with a preferred thickness of about 0.25 to about 12 mils, preferably about 0.05 to about 4.0 mils. The electronic substrate is manufactured in a thin sheet and is packed with about 85% by weight of resin. . The resin is hardened until the prepreg is subsequently used in the lamination process to produce a copper-clad or non-clad dielectric film 'laminate or to achieve the required flow rate in the manufacture of circuit boards during PWB manufacturing. This first, main, and partial hardening (treatment) step is preferably performed by a roll method, such as the method currently used for PWB prepregs based on woven glass fabric. The degree of resin hardening is generally between 10 and 50. /. between. In the prepreg: The percentage of fat should be no more than about 85% by weight, preferably no more than 60% by weight. 13- The paper size is suitable for household materials (cns) A4 specification (Momo 297 Public Love) 587988 Patent Application No. 089112410

Electrical connection. The t-substrate made by the present invention will have a coefficient of thermal expansion (CTE) substantially equivalent to copper and preferably between copper and crushed CTE or from about 2 to about. In addition, the water absorption of the substrate of the present invention will be less than w% by weight, preferably less than about 0.75% by weight, where the water absorption is 85. 〇 and 85% relative humidity until the substrate is filled with water. Example 1 This example will demonstrate the advantages of microfiber nonwoven glass bonded organic fiber reinforcement for the manufacture of high density interconnect circuits. These reinforcements are coated with resin, which then hardens to form a non-woven reinforced dielectric (NWRD), which can be used to make high density printed circuits. This NWRD will be used as a substrate for manufacturing high-density printed circuits. I. Preparation of prepreg The resin used in this example is a commercial resin from Dow Chemical Company. This resin is called Cyclotene 3022-63. It is in the form of a solution dissolved in a mesitylene solvent. This resin contains 63% by weight of solids. This basic resin mixture was further diluted with vegetables at a ratio of 5.9 grams of resin solution to 12.5 grams of vegetables (17.6% solids). II · Immersion and partial hardening of non-woven fabrics from 50% 608M micro-glass fiber '15% PB 0 packed meal and 35% 3 mm long-cut PB 0 short fibers (percent by weight) . 608M glass is described by Evanite Fibers (Corvaiiis, Oregon). Poly (p-phenylene-2,6-benzobis. PBO) staple fiber 'referred to as Z y 1 ο η' was purchased from Toyobo Corporation (Shiga, Japan) β ρ β〇-17- This paper size applies to China National Standard (CNS) Α4 (210 X 297 mm)

Claims (1)

587988 A8 Patent No. 08911241 petition patent application Chinese patent application scope replacement (April 1993): k ****:: 1 'Applicable patent scope I An electronic substrate, which includes: Non-woven reinforcing material, wherein the reinforcing material comprises 10 to 90% by weight of broken glass microfibers and 10 to 90% by weight of organic fibers having at least one two shots, ^ 1U field shot drilling < non-woven combination, The hole has a diameter of less than 30 micrometers; and the electronic substrate is a dielectric acoustic device, and is ancient, and the tool has a thermal damage measured from the periphery of the hole of less than 1 micrometer. 2. For example, in the scope of the patent application, the dimension "Ms. One-self Subsidiary Substrate, in which the non-woven glass fiber," is a glass microfiber with a diameter of less than 5 microns. A She gave her brother K's child substrate, in which the non-woven glass microfiber foot diameter is less than 1 micron. 4. For the electronic substrate of the scope of application for item i, it contains 30 to 55 weight = reinforcement material 'which Reinforcing material contains 3 () to 75% by weight of organic 5. As in the patent application scope of the first dimension ",, " substrate which is a non-woven organic fiber, ㈣ from> night and day 4 composite fiber, liquid crystal. Selected from the group consisting of aromatic polyamide fibers, liquid ester fibers and their mixtures. 6. ^ The electronic substrate of the scope of application for patent item i, wherein the non-woven organic fiber is quasi-phenylene-2,6_benzobispyrazole fiber. 7. An electronic substrate with a wide range of patent applications, wherein the organic fibers include 30 to 100% by weight staple fibers and 0 to 70% by weight pulp weaving. 8. Π: The electronic substrate according to the first item of the invention, wherein the organic fiber is a combination of organic meal and organic fiber selected from the group consisting of organic microfiber, organic short fiber, and organic pulp mixture. 9) If the electronic substrate of item i in the scope of patent application ’is used, the resin is selected from heat 587988 A8 B8 Solid polymers, epoxides, high temperature thermoplastic polymer grease systems and mixtures thereof. Thermoplastic trees such as the electronic substrate family of polymers in the scope of patent application item i. Wherein the resin contains cyclolipid 11. The electronic substrate material according to item i of the patent application scope includes one or more coupling agents. Non-woven reinforcing material 12. The electronic substrate of the scope of application for item i, wherein the non-woven reinforcing material includes one or more adhesives. 13. Two electronic substrates comprising 30 to 85% by weight of a resin and 15 to 70% by weight of a non-woven reinforcing material, wherein the reinforcing material contains 30 to 75 wt./P-phenylene-2,6-benzene Bloxazole fiber and 25 to 70% by weight of glass microfibers having a diameter of less than 5 microns, wherein the thickness of the substrate is 0 to 20 mils. · 14 · The electronic substrate according to item 3 of the patent application scope, wherein p_phenylene_2,6-benzobisoxazole fiber contains 30 to 100% by weight of short fibers and 0 to 70% by weight of pulp Meal fiber. & The electronic substrate according to item 13 of the patent application, wherein the resin is partially hardened. 16. —A method for manufacturing a dielectric layer, comprising the following steps: (a) impregnating a nonwoven containing 30 to 75% by weight of organic fibers and 25 to 70% by weight of glass microfibers with a solution including one or more resins Reinforce the material to obtain a resin-impregnated cloth; and (b) partially harden the resin-impregnated cloth to form a prepreg, wherein the prepreg includes 30 to 85 weight percent resin and 15 To 70% by weight of reinforcing material. -2-This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) Loaded tr 17. The method according to item 16 of the scope of patent application, the diameter of the fiber is less than 1 micron. Among them, almost all of the organic fibers in the glass are made of liquid crystal, and the liquid crystal polyester fiber and the organic fiber in the glass are ρ-benzene 18 · = the method of applying for the scope of the patent No. 16, its _ _ material 缄 dimensional, liquid crystal aromatic polymerization It is selected from the group consisting of amine fiber μs. 19. The method according to item 16 of the scope of patent application, which is based on 2,6-benzobisazole fiber. 20. ': Γ! The method of item 16 of the patent scope, wherein the fibers on the P · phenylene phenylene group include 30 to 1000 weight 0 / 〇 short fibers and 0 to 70 weight ° / 〇 osmotic fiber Of combination. 21. The method of claim 16 including the further steps of adding a first separation layer to the first surface of the prepreg and applying a second separation layer to the second surface of the prepreg. 22 · = = The method according to item 16 of the patent, wherein the hardening step (b) reduces the thickness of the pre-crushed material by at least 50% compared with the impregnated sheet. 23. The method according to item 22 of the scope of patent application, wherein the separation layer is a metal foil, which is removed by a method selected from the family name engraving or peeling. 24. The method of claim 21, wherein one or more vias are formed using a laser in a dielectric layer covered with a prepreg. 25. The method of claim 24, wherein the diameter of the passage is from 6 to 0.5 mils. 26 · —An electronic substrate comprising a dielectric layer made by the method of claim 21 in the scope of patent application, wherein the electronic substrate is selected from a single-sided circuit board, a double-sided circuit board, a multilayer printed wiring board and printing Circuit board (PCB). -3- This paper size applies to China National Standard (CNS) A4 (210 X 297 mm)