TW587409B - A device for transferring and supporting panels - Google Patents

A device for transferring and supporting panels Download PDF

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Publication number
TW587409B
TW587409B TW089123120A TW89123120A TW587409B TW 587409 B TW587409 B TW 587409B TW 089123120 A TW089123120 A TW 089123120A TW 89123120 A TW89123120 A TW 89123120A TW 587409 B TW587409 B TW 587409B
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Taiwan
Prior art keywords
panel
reference surface
horizontal
micro
page
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TW089123120A
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Chinese (zh)
Inventor
Damien Boureau
Xavier Clement
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Automa Tech Sa
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • G03F7/2022Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0073Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0082Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Automobile Manufacture Line, Endless Track Vehicle, Trailer (AREA)
  • Feeding Of Articles By Means Other Than Belts Or Rollers (AREA)
  • Advancing Webs (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

The invention relates to a transfer and support device for a double-sided panel, in particular a printed circuit panel (22). The device comprises a bottom slab (16) having a top reference surface that is plane and horizontal for receiving the bottom face of said panel; a top slab (14) having a bottom reference surface that is plane and horizontal for receiving the top face of said panel; and displacement means (18, 20) for moving said slabs separately in two respective horizontal planes, each of said slabs be provided with controllable non-mechanical holder means (24) for pressing a face of said panel (22) against the reference surface of said slab when the holder means are activated. The device also has controllable means for lifting said panel (22).

Description

經濟部智慧財產局員工消費合作社印製 587409 A7 ----~---gL-___ 五、發明說明(i ) ' 本發明是關於一種用以傳送以及支撐面板(特別是印 :電路面板)的裝置’以及該褒置在一用以將該等面板暴 路於一輪射能的設備中之使用。 印刷電路的製造特別包括一使用數種技術在一絕緣面 板的一或二面的銅層祕刻的步·驟,以界定該印刷電路的 傳導軌道。 首先,此等面板可以是較大的尺寸,諸如61〇mmX762 mm,且厚度因現在潮流變得更小,因此其等通常可以像是 50 // m小的厚度,以及像是5 # m小的厚度之特殊情況。 因此瞭解到,握持此等面板並不容易。 第二,當印刷電路面板是雙面時,其必須在該等面板 的雙面蝕刻。在將該面板暴露於一光源時,該光源經過一 界定該等傳導軌道形狀的工藝圖,可在該印刷電路面板的 兩面同時完成此操作。 現在變得更受歡迎之用以蝕刻傳導執道的新技術,存 在的該等技術經由一工藝圖曝光之操作,被藉由移動一光 束的處理以使該感光材料層或電阻層層積於該傳導材料薄 膜的技術所取代,藉由該雷射光束的衝擊引起該電阻層局 部變形’ 一旦該電阻層的未變形部分被移開,可以餘刻該 傳導材料層。然而,在此等情況下,該印刷電路雙面不可 能同時完成此雷射光束操作。因此,必須將該面板的蝕刻 面連續顯露在該曝光機械。 在其他的技術中,該雷射光束直接蝕掉該電阻層,或 的確沒有使用電阻層且該雷射光束直接蝕掉該傳導層。 第4頁 本紙張尺度剌巾關家鮮(CNS)A4祕⑵〇 x 297公爱) ^ ^ 裝---------訂----- (請先閱讀背面之注意事項再填寫本頁) MM 麵 587409 A7 五、發明說明(2 ) 也可以瞭解,如此一面板之給定的尺寸及小的厚度, 會使》亥面板翻轉以使該面板的兩面可以連續顯露於該機柏 中,增加極大的ϋ難。再者,可以瞭解,—用以翻轉該面 板的工作站將導致意味著一體積的增加,且因此該曝光機 械的全部體積相當於由須外加結合之該傳送構件所取之整 體的總和,以使該操作完全自動,並且該工作站將會延長 完成該操作所需的時間。 又 本發明的-目的在於提供一種用以傳送以及支撐雙面 面板(特別是印刷電路面板)的裝置,以及該裝置在一用 其可使該等面板的每一面可連續地暴露與安置於一曝光機 械中,而避免翻轉該面板之主要的一機械操作的缺點。 為達成此目的,本發明提供一種用於傳送以及支撐雙 面面板(特別是印刷電路面板)的裝置,該裝置 $ 於其包括: 一底部層板,其具有一頂部參考表面,該頂部參考表 面平整而且水平,以納置該面板的底面; -頂部層板,其具有—底部參考表面,該底部參考表 面平整而且水平,以納置該面板的頂面;以及 用以使該等層板分開地於兩個別的水平平面移動的位 移裝置; 該等層板各設有非機械握持構件,當該握持構件引動 時,可控制地將該面板的一面壓抵於該層板的參考表面; 該裝置更包括用以控制該面板的升高合 高構件於一未引動狀態時,該等升高構件並未自 第5頁 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 587409 A7 ---- ~ --- gL -___ V. Description of the Invention (i) 'The present invention relates to a method for transmitting and supporting panels (especially printed circuit boards) The device and the device are used in a device for blasting the panel to a round of radio energy. The manufacture of printed circuits includes, in particular, the use of several techniques to etch the copper layers on one or both sides of an insulating panel to define the conductive tracks of the printed circuit. First of all, these panels can be larger, such as 61mm × 762 mm, and the thickness has become smaller due to current trends, so they can usually be as small as 50 // m, and as small as 5 # m Special case of thickness. It was learned that it was not easy to hold such panels. Second, when printed circuit panels are double-sided, they must be etched on both sides of the panels. When the panel is exposed to a light source, the light source passes through a process drawing that defines the shape of the conductive tracks, which can be done on both sides of the printed circuit panel at the same time. New technologies that are now becoming more popular for etching conductive instructions. Existing technologies are processed by moving a light beam to expose the photosensitive material layer or resistive layer through the operation of a process chart exposure. The technology of the conductive material film is replaced, and the resistance layer is locally deformed by the impact of the laser beam. Once the non-deformed part of the resistance layer is removed, the conductive material layer can be engraved. However, in these cases, it is not possible for the two sides of the printed circuit to perform the laser beam operation simultaneously. Therefore, it is necessary to continuously expose the etched surface of the panel to the exposure machine. In other technologies, the laser beam directly etches the resistive layer, or indeed a resistive layer is not used and the laser beam directly etches the conductive layer. Page 4 The paper size of the paper towel (CNS) A4 secret 〇〇 297 public love) ^ ^ outfit --------- order ----- (Please read the precautions on the back before (Fill in this page) MM surface 587409 A7 V. Description of the invention (2) It can also be understood that given the size and small thickness of such a panel, the panel will be turned over so that both sides of the panel can be continuously exposed to the machine. Bai Zhong, adding great martyrdom. Furthermore, it can be understood that—the workstation used to flip the panel will result in an increase in volume, and therefore the entire volume of the exposure machine is equivalent to the total of the whole taken by the transport member to be additionally combined so that The operation is completely automatic, and the workstation will extend the time required to complete the operation. Another object of the present invention is to provide a device for conveying and supporting a double-sided panel (especially a printed circuit panel), and a device which can continuously expose and place each side of the panels in a single use. The main disadvantage of a mechanical operation in the exposure mechanism, while avoiding flipping the panel. To achieve this, the present invention provides a device for conveying and supporting a double-sided panel (especially a printed circuit panel). The device includes: a bottom layer board having a top reference surface, the top reference surface Flat and horizontal to accommodate the bottom surface of the panel;-a top laminate having a bottom reference surface that is flat and horizontal to accommodate the top surface of the panel; and to separate the laminates Displacement device that moves on two other horizontal planes; Each of the layers is provided with a non-mechanical holding member. When the holding member is actuated, one side of the panel can be controlled to be pressed against the reference of the layer. Surface; the device further includes a raised and raised member for controlling the panel in an unactuated state, the raised members have not applied the Chinese National Standard (CNS) A4 specification (210 X 297 mm

— ; I---φ. Μ---- C請先閱讀背面之注意事項再填寫本頁) —訂---------^91. 587409 B7 五 部 智 慧 財 員 工 消 費— ; I --- φ. Μ ---- C Please read the notes on the back before filling in this page) —Order --------- ^ 91. 587409 B7 Part 5: Smart and Financial Staff Consumption

I 、發明說明(3 ) >考表面凸出’且當該等升高構件引動時,適合用以將該 面板壓抵於該頂部層板的參考表面。 可以瞭解,由於該頂部及底部層板顯露,該面板的各 面可伸入該曝光機械,且非常嚴謹地保持該面板在垂直方 ^的定位。因為該等面板僅是以—水平方向位移,因此, 面板的母—面板之參考表面可非常非常嚴謹地以機械 製成,且維持於該垂直方向的地位。 在一較佳實施例中,該握持構件為數個吸入微喷嘴, 該等微喷嘴向外開設於該層板的參考表面,且規則地散佈 於該表面上。 彳驭卻 該升高構件亦較佳為數個微引動器,該等微動裝置規 則地定位於該底部層板的參考表面,每一微引動器具有一 =该參可表面正交的方向移動之移動桿,在該未引動位 置時,該等桿相對該參考表面完全退回。 關於使用吸入微噴嘴及升高微引動器時,第一 該面板非常薄,該面板可以保持平面,且一 —Λ, ^ ^ 一 ’该面板 可自其中一層板傳送至另-層板,不會有任何局部變形被 =予该面板的風險,因而與其接受之不同的處理形式不相 本發明的另―目的,在於提供_種用於使 電路面板暴露在-輕射源的設備,該設定 之該傳送及支撐裝置。 上所界疋 在閱讀以下所述之本發明給定之未限制例實施例 對本發明之其他的特徵及優點有更清楚的瞭解,該敘述請 第6頁 本紙張尺度適用中國國家標準㈣测規格咖x挪公髮厂 裝 經濟部智慧財產局員工消費合作社印製 五、發明說明(4 參考附圖,其中·· 第1A〜1C圖顯示本發明 機械,特別是暖亦乂㊉ J王仵,、破仏至-曝光 J疋曝先在一雷射光束; 固疋層板的參考表面之平面圖; 面圖々;3圖疋由第2圖的m—m線所取之一層板的橫向剖 第4圖是一微引動器的縱向剖面圖; 第5圖疋一微喷嘴的縱向剖面圖。 、首先,參考第1A〜10圖,其整個地描述,該傳送 、及支撐衣置疋使用在關於一用以將該印刷電路面板暴露 至田射光束的設備。該設備具有一底部光學單元丨〇, 用以處理該面板的底面,以及-頂部光學單元12,用以 處理該同一面板的頂面。該底部及頂部單元10及12在一 水平面彼此偏移,佔領以字母A及B識別的區域,在該區 域A及B之間留下一傳送區域c。 用以將印刷電路板暴露至一已知技術的雷射光束成型 部分的設備’其在藉由一雷射光束處理定位於該印刷電路 金屬層的電阻層,且其藉由該雷射光束的衝擊點,改良該 電阻層的狀態,以使其隨後可以自沒有受到該雷射光束打 擊的位置移動。然後,以化學蝕刻步驟,只有將在已曝光 區域的該傳導層移走。 一種曝光設備亦包含以該雷射光束直接作用以侵蝕該 電阻層期望區域的機械,或是該雷射光束直接在沒有使用 該電阻層之該傳導層的期望區域侵蝕的確實機械。 第7頁 本紙張尺度適用中國國家標準(CNS)A4規格(21〇 X 297公爱) ^ 裝----------訂---- (請先閱讀背面之注意事項再填寫本頁) 587409 經濟部智慧財產局員工消費合作社印製 A7 發明說明(5 y 該曝光機械可為習知的一種形式,其中,該面板的該 頂面及該底面是由兩個不同的總成曝光。 該傳送及支撐裝置本身基本上是由兩層板構成,該兩 層板分別是為一頂部層板14及一底部層板16,該等層板 侷限在由頂部水平軌道18及底部水平轨道20所界定^平 行水平平面移動。更確確地,該頂部執道18可使該層板 14移動於該傳送區域c與和該底部光學單元⑺相對應的 區域A之間,且該底部軌道20可使該底部層板16水平移 動於該傳送區域20與和該頂部光學單元12佔領的區域B 之間。 該等層板分別具有參考表面及16a,該等參考表 面14a及l6a精確水平而且呈現一高度的平面度。可以瞭 解’不管是該層板14或是該層板16的位置,維持此等平 面及水平的特徵。該等參考表面14aA⑽是設計以納置 該面板的相對表面,以進行處理。因此該等參考表面的尺 寸大於進行處理之該面板的較大尺寸。 該設備的操作如下。首先,例如為一印刷電路面板22 的面板,該面板是位在一依靠於該底部層板16參考表面 16a的底面22a。此層板移動以面對該頂部光學單元12。 該層板亦作為-支撐件,以支擇該頂面⑽已經曝光的該 印刷電路面板22。 在下-步驟中,該底部層板16移入該傳送區域c, 在此處’該底層面板16面對該頂部面板14。在此位置, 該面板22離開該底部層才反16,而壓抵於該頂部層板μ 第8頁 氏張尺度適用中國國豕標準(CNS)A4規格(210 X 297公羞—) -----------裝-----„----訂--------- (請先閱讀背面之注意事項再填寫本頁) 587409 A7I. Description of the invention (3) > The test surface is protruded ' and is suitable for pressing the panel against the reference surface of the top laminate when the raised members are actuated. It can be understood that, since the top and bottom layers are exposed, all sides of the panel can be extended into the exposure machine, and the positioning of the panel in the vertical direction is very carefully maintained. Because the panels are only displaced in the horizontal direction, the reference surface of the mother-panel of the panel can be made very, very rigorously mechanically, and maintained in the vertical position. In a preferred embodiment, the holding member is a plurality of suction micro-nozzles, and the micro-nozzles are outwardly opened on the reference surface of the layer plate and are regularly distributed on the surface. However, the raised member is also preferably a plurality of micro-actuators. The micro-movement devices are regularly positioned on the reference surface of the bottom plate. Each micro-actuator has a movement that the surface can move in a direction orthogonal to the parameter. The rods, when in the unactuated position, are fully retracted relative to the reference surface. Regarding the use of suction micro-nozzles and raised micro-actuators, the first panel is very thin, the panel can be kept flat, and one-Λ, ^ ^ one 'The panel can be transferred from one layer to the other, not There is a risk that any local deformation will be given to the panel, and therefore it is different from the processing form it accepts. Another object of the present invention is to provide a device for exposing a circuit panel to a light source. The transmission and support device. The upper boundary is that when reading the following unrestricted examples of the present invention, the other features and advantages of the present invention will be more clearly understood. Please refer to page 6 for the description of this paper. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economics, the Ministry of Economics and the Factory. 5.Invention description (4 Refer to the attached drawings, of which: Figures 1A to 1C show the machine of the present invention, especially Nuan Yi 乂 ㊉J Wang 仵 ,, Break through to-exposure J 疋 exposure first in a laser beam; plan view of the reference surface of the solid laminate; plane view々; 3 疋 (transverse section of one laminate taken from the m-m line in Fig. 2) Fig. 4 is a longitudinal sectional view of a micro-actuator; Fig. 5 is a longitudinal sectional view of a micro-nozzle. First, refer to Figs. 1A to 10, which are described in their entirety. An apparatus for exposing the printed circuit panel to a field beam. The apparatus has a bottom optical unit for processing the bottom surface of the panel, and a top optical unit 12 for processing the top surface of the same panel. .The bottom and top single 10 and 12 are offset from each other in a horizontal plane, occupying an area identified by the letters A and B, leaving a transfer area c between the areas A and B. A laser for exposing the printed circuit board to a known technique The device of the beam shaping part is used to process a resistance layer positioned on the metal layer of the printed circuit by a laser beam processing, and it uses the impact point of the laser beam to improve the state of the resistance layer so that it can be subsequently used. Move from a position that was not struck by the laser beam. Then, in a chemical etching step, only the conductive layer in the exposed area is removed. An exposure device also includes the laser beam acting directly to erode the resistive layer. Area machinery, or the actual machinery where the laser beam erodes directly in the desired area of the conductive layer that does not use the resistive layer. Page 7 This paper size applies the Chinese National Standard (CNS) A4 specification (21〇X 297) Love) ^ ---------- Order ---- (Please read the notes on the back before filling out this page) 587409 Printed A7 Invention Note (5 y this Exposure machine It can be a known form, wherein the top surface and the bottom surface of the panel are exposed by two different assemblies. The conveying and supporting device itself is basically composed of two layers of boards, which are respectively A top ply 14 and a bottom ply 16 are confined to a horizontal horizontal plane defined by a top horizontal rail 18 and a bottom horizontal rail 20. More precisely, the top holding rail 18 enables the layer The plate 14 moves between the transmission area c and the area A corresponding to the bottom optical unit ⑺, and the bottom track 20 allows the bottom layer plate 16 to move horizontally between the transmission area 20 and the top optical unit 12 Between regions B. The laminates have reference surfaces and 16a, respectively, and the reference surfaces 14a and 16a are precisely level and present a high degree of flatness. It can be understood that these plane and horizontal features are maintained regardless of the position of the layer 14 or the layer 16. The reference surfaces 14aA⑽ are designed to receive opposing surfaces of the panel for processing. The dimensions of these reference surfaces are therefore larger than the larger dimensions of the panel being processed. The device operates as follows. First, for example, a panel of a printed circuit panel 22, the panel is located on a bottom surface 22a which depends on the reference surface 16a of the bottom layer board 16. This laminate moves to face the top optical unit 12. The laminate also serves as a support member to support the printed circuit panel 22 on which the top surface ⑽ has been exposed. In the down-step, the bottom panel 16 moves into the transfer area c, where the 'bottom panel 16 faces the top panel 14. In this position, the panel 22 leaves the bottom layer and then reverses to 16 and presses against the top layer μ. Page 8 The Zhang scale is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm —)- --------- Installation ----- „---- Order --------- (Please read the precautions on the back before filling this page) 587409 A7

A7 五、發明說明(7 ) 示該層板的參考表面16a。在此圖令,可以看到… ==吸入喷嘴24端部。該等吸入喷嘴較佳是如:: 开4被所握持物件的一部份堵住會中斷吸入的 二=圖中,亦可看到該等微引動器28的端部 Π樣疋以平行於該等吸入喷嘴的線,以線形定位。 訂 报重要的’該等吸入喷嘴是規則地分配在該參考表面 上方,該等吸入喷嘴直徑較小的管嘴,且該等吸入喷嘴报 多。亦應瞭解,當該面板升高時,即使該面板非常薄,該 面板被確實平穩地握持,直到該面板被壓抵至該頂部層板 1:的底部參考表面。在此狀況,在作業中放入將用以持 續維持該面板平整度地將該頂部層板14的該等喷嘴,用 以使該面板穩固地抵在該頂部層板的底部參考表面。 第3圖顯示該底部層板16的一較佳實施例。此圖顯 示该等微引動器28及該等入喷嘴24。 在第4圖可以很清楚看到,該層板16具有一延續該 參考表面16a的頂板50,及該等頂板50被對應於該等吸 入噴嘴24的孔52所貫穿。該層板16亦具有一界定有數 個凹處56的底板54,以使該吸入網狀結構定位。 經濟部智慧財產局員工消費合作社印製 此凹處連續有一形成於該底板54的管口 58,且該管 口 58連接至一真空泵60。 以 第5圖顯示一微引動器28,該微引動器28的軸64可 滑動地安裝在該層板頂板的一凹處66中。該軸64較佳 一由聚氣乙烯形成的頭部68終止,以防止該印刷電路面 板損壞。在此圖中,該頭部68是顯示其延伸的狀況。 第10頁 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 587409 A7 五、發明說明(8 ) 經濟部智慧財產局員工消費合作社印製 元件符號對照表 10 底部光學單元 12 頂部光學單元 14 頂部層板 14a 參考表面 16 底部層板 16a 參考表面 18 頂部水平軌道 20 底部水平執道 22 印刷電路面板 22a 底面 22b 頂面 24 喷嘴 26 喷嘴 28 微引動器 50 頂板 52 子L 54 底板 56 凹處 58 管口 60 真空泵。 64 轴 66 凹處 68 頭部 第11頁 (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐)A7 V. Invention description (7) shows the reference surface 16a of the laminate. In this figure, you can see ... == end of suction nozzle 24. The suction nozzles are preferably as follows: Open 4 is blocked by a part of the object being held, which will interrupt the suction. In the figure, the ends of the micro-actuators 28 can also be seen in parallel. The lines on these suction nozzles are positioned in a line. It is important to order that the suction nozzles are regularly distributed above the reference surface, the nozzles with smaller diameters of the suction nozzles, and the number of the suction nozzles is larger. It should also be understood that when the panel is raised, even if the panel is very thin, the panel is surely held smoothly until the panel is pressed against the bottom reference surface of the top layer 1 :. In this case, the nozzles which will continuously maintain the flatness of the panel to the top layer 14 are placed in the operation, so that the panel firmly rests on the bottom reference surface of the top layer. FIG. 3 shows a preferred embodiment of the bottom plate 16. This figure shows the micro-actuators 28 and the inlet nozzles 24. As can be clearly seen in Fig. 4, the layer plate 16 has a top plate 50 extending from the reference surface 16a, and the top plates 50 are penetrated by holes 52 corresponding to the suction nozzles 24. The laminate 16 also has a bottom plate 54 defining a plurality of recesses 56 for positioning the suction mesh structure. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs This recess has a nozzle 58 formed in the bottom plate 54 continuously, and the nozzle 58 is connected to a vacuum pump 60. A micro-actuator 28 is shown in Fig. 5. The shaft 64 of the micro-actuator 28 is slidably mounted in a recess 66 of the top plate of the laminate. The shaft 64 preferably terminates with a head 68 formed of poly vinylene to prevent damage to the printed circuit board. In this figure, the head 68 shows the extended state. Page 10 This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 587409 A7 V. Description of the invention (8) Cross-reference table of printed component symbols for employees' cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 10 Bottom optical unit 12 Top optical unit 14 Top plate 14a Reference surface 16 Bottom plate 16a Reference surface 18 Top horizontal track 20 Bottom horizontal guide 22 Printed circuit panel 22a Bottom surface 22b Top surface 24 Nozzle 26 Nozzle 28 Micro actuator 50 Top plate 52 Sub-L 54 Base plate 56 Recesses 58 Nozzles 60 Vacuum pumps. 64 axis 66 recess 68 head page 11 (Please read the precautions on the back before filling this page) This paper size applies to China National Standard (CNS) A4 (210 X 297 mm)

Claims (1)

587409 部 智 慧 員 工 消 費 合 作 社 印 製 六、申請專利範圍 h板傳送以及支撐雙面面板(特別是印刷電路® 板)的裝置,該裝置的特徵在於其包括: —底部層板,其具有—頂部參考表面 考表面平整而且水平,以納置該面板的底面;^參 -頂部層板,其具有一底部參考表面,該底部來 考表面平整而且水平,以納置該面板的頂面;以及/ 用以使該等層板分開地於兩個別的水平平 的位移裝置; 该等層板各設有非機械握持構件,當該握持構件 動時’可控制地將該面板的—面壓抵於該層板的參 .表^面; ^ °亥凌置更包括用以控制該面板的升高構件,當該 等升高構件於一未引動狀態時,該等升高構件並未自 —層板的參考表面凸出’且當該等升高構件引動時, 適合用以將該面板壓抵於該頂部層板的參考表面。 根據申請專利範圍第丄項的裝置,其特徵在於該握持 構件為數個吸入微噴嘴,該等微噴嘴向外開設於該層 板的參考表面,且規則地散佈於該表面上。 s 根據申請專利範圍第i或2項的震置,其特徵在於該 升高構件為數個微引動器,該等微動裝置規則地定位 於該底部層板的參考表面,每一微引動器具有一以與 該參可表面正交的方向移動之移動桿,在該未引動位 置時’该專桿相對該參考表面完全退回。 一種曝光設備,用以使一雙面印刷電路面板暴露名 _ 第12頁 + ®®ii?〇:NS)A4 ^ (210 X 297 ^ 2. 3. 4. IH 0 Μ--------訂------ (請先閱讀背面之注意事項再填寫本頁) ϋ ϋ I 587409Printed by 587409 smart consumer consumer cooperatives. 6. The scope of patent application. H-board transfer and support for double-sided panels (especially printed circuit® boards). The device is characterized in that it includes: — a bottom layer board, which has — a top reference. The surface test surface is flat and horizontal to receive the bottom surface of the panel; ^ reference-the top layer board has a bottom reference surface, the bottom test surface is flat and horizontal to receive the top surface of the panel; and / use So that the shelves are separated at two other horizontal and horizontal displacement devices; each of the shelves is provided with a non-mechanical holding member, and when the holding member is moved, the face pressure of the panel can be controlled. The reference surface of the layer board; the surface includes: a lifting member for controlling the panel, when the lifting member is in an unactuated state, the lifting member does not automatically —The reference surface of the laminate is convex 'and is suitable for pressing the panel against the reference surface of the top laminate when the raised members are actuated. The device according to item (1) of the patent application scope is characterized in that the holding member is a plurality of suction micro-nozzles, and the micro-nozzles are outwardly opened on the reference surface of the laminate and are regularly distributed on the surface. s The vibration set according to item i or 2 of the scope of the patent application, characterized in that the lifting member is a plurality of micro-actuators, and the micro-movement devices are regularly positioned on the reference surface of the bottom plate. When the moving rod moves in a direction orthogonal to the reference surface, the special rod is completely retracted relative to the reference surface in the unactuated position. An exposure device for exposing a double-sided printed circuit panel to the name _ page 12 + ®®ii? 〇: NS) A4 ^ (210 X 297 ^ 2. 3. 4. IH 0 Μ ------ --Order ------ (Please read the notes on the back before filling this page) ϋ ϋ I 587409 申睛專利範圍 ^射源’該設備㈣徵在於,其包括: 一用以放出輻射的頂部總成; 用以放出輻射的底部總成,且朝一 對該頂部總成偏移;以及 向相 在該頂部與底部之間置有根據申 至3項中任一項的面板傳送裝置, 乾圍第1 移位構件,控制地個別移動在傳送工作站鱼 部f成之間的該底部層板,以及在該傳送工作^該 底部總成之間的該頂部層板。 ----τίτ---MW s--------訂--------- ί請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 第13頁 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐)The scope of Shenyan's patent ^ radiation source 'The equipment is characterized in that it includes: a top assembly for emitting radiation; a bottom assembly for emitting radiation, which is offset toward a pair of the top assemblies; and toward the phase in A panel transfer device according to any one of Shen to 3 is placed between the top and the bottom, the first displacement member of the enclosure surrounds, and the bottom layer plate between the fish parts of the transfer workstation is controlled to be individually moved, and The top shelf between the transfer work and the bottom assembly. ---- τίτ --- MW s -------- Order --------- ίPlease read the notes on the back before filling in this page) Page 13 This paper is sized for China National Standard (CNS) A4 (210 X 297 mm)
TW089123120A 1999-11-03 2000-11-02 A device for transferring and supporting panels TW587409B (en)

Applications Claiming Priority (1)

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FR9913726A FR2800568B1 (en) 1999-11-03 1999-11-03 DEVICE FOR TRANSFERRING AND SUPPORTING PANELS

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CN1635974A (en) * 2001-05-23 2005-07-06 西门子公司 Manipulation device for displacing objects
US8430229B2 (en) * 2007-09-14 2013-04-30 Flexlink Components Ab Lifting device for a conveyor system a conveyor system and a method
KR101272681B1 (en) 2012-02-23 2013-06-10 제이엠티(주) Fabrication device of dye-sensitized solar cell panel
CN104227570A (en) * 2013-06-17 2014-12-24 株式会社太星技研 Unitary armorplate glass processing system for forming G2-mode touch sensors of cell units
CN114488712B (en) * 2022-02-18 2022-08-30 广东科视光学技术股份有限公司 Full-automatic high-speed exposure equipment and method for circuit board

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US4555630A (en) * 1983-02-28 1985-11-26 Tamarack Scientific Co., Inc. Automatic system for exposing and handling double-sided printed circuit boards
US4749867A (en) * 1985-04-30 1988-06-07 Canon Kabushiki Kaisha Exposure apparatus
EP0722123B1 (en) * 1995-01-12 1999-04-14 Orc Manufacturing Co., Ltd. Apparatus and method for exposing of workpiece

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CN1162311C (en) 2004-08-18
ATE353543T1 (en) 2007-02-15
FR2800568A1 (en) 2001-05-04
EP1098559A1 (en) 2001-05-09
EP1098559B1 (en) 2007-02-07
FR2800568B1 (en) 2002-01-25
JP2001189545A (en) 2001-07-10
ES2281331T3 (en) 2007-10-01
US6646358B1 (en) 2003-11-11
DE60033259T2 (en) 2007-11-22
CA2324893A1 (en) 2001-05-03
DE60033259D1 (en) 2007-03-22
KR20010051214A (en) 2001-06-25

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