TW587253B - A voltage recovery switch without device breakdown issue in non-volatile memory - Google Patents
A voltage recovery switch without device breakdown issue in non-volatile memory Download PDFInfo
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587253 五、發明說明⑴ ——-------------------------------- 發明所屬之技術領域 本發明提供一種電壓恢復開關 於非揮發性記憶體之盔元件崩 尤‘種適用 路。 …70仵朋,貝問題的電壓恢復開關電 先前技術 憶體向來為其 各種不同的記 性記憶體 (Non-Volati 1 義即指於該記 應切斷而揮發 下長期保存的 (Flash 地應用於各種 發性資料儲存 於目前市面上之各種電子產品中,記 中十分重要而不可或缺的元件之一,而於 憶體當中·,又可大致分為兩大類,即揮發 (V ο 1 a t i 1 e M e m 〇 r y )及非揮發性記憶體 Memory),所謂非揮發性記憶體,顧&名思 憶體中所儲存之資料並不會因為將電源^ 消失,故具有將資料於無電源供應之狀態 特性。也正由於此種特性,如快閃記憶^ Memory)等之此類非揮發性記憶體被^泛 不同之領域,以滿足各種電子產品對^揮 之需求。 習知技術中之非揮發性記憶體多使用一種堆疊問 (Stacked Gate)之技術,其中一記憶單元(Me:〇^y Cell)係形成於一基底(Substrate)上,其包含有一汲 極、一源極、以及一堆疊閘,而該堆疊閘則通常a包含有 587253 五、發明說明(2) ------------------------- 一浮動閘極(Fl〇ating Gate)及—控制 Gate),而該洋動閘極與該基底之間, 極(Control 與該浮動閘極之間則由二氧化層予以隔及5亥控制閘極 堆疊閘技術之非揮發性記憶體的操作原理 而此種使用 加複數個高準位電壓至該控制閘極而利 ♦則是利用外 或熱電子注入效應來改變該浮動閘極中,子牙隨效應 量,進而改變該浮動問極之:;=;斤错存的電子數 性記憶體進行資料寫入(Program)或資到對該非揮發 (Erase)的目的。 ’、删除 如前所述’由於對該 及刪除時均需要利用複數 電壓及一 10V之負電壓) 電路中會包含有一升壓電 準位電壓,以因應該非揮 除之需要。但是當該非揮 料刪除之動作後(例如, 性記憶體會操作於一般之 及0V之接地端之間)下, 該複數個高準位電壓則會 電’然而如果將該複數個 電源供應電壓的話(例如 Vdd,而一 10V之負電壓直 電源供應電壓因過多之電 非f發性記憶體進行資料寫入 個南準位電壓(例如+ l〇V之正 故通常於該非揮發性記憶體之 路(Charge Pump)來產生該高 發性§己憶體進行資料寫入及刪 發性記憶體結束資料寫入或資 進入讀取動作時),該非揮發 電源供應電壓(例如+ 3¥之 此時該升壓電路會被關閉,而 經由該電源供應電壓進行放 高準位電壓之電荷直接流入該 + 1 0 V之正電壓直接連接至 接連接至接地端),則會使該 荷流入而造成其電壓值之抖動587253 V. Description of the invention -------------------------------------- TECHNICAL FIELD TO THE INVENTION The present invention provides a voltage The recovery switch is suitable for helmet elements of non-volatile memory. … 70 仵, the voltage recovery switch of the Bayer problem. The prior art memory has always been its various memory (Non-Volati 1 meaning that the memory is cut off and volatilized under long-term storage (Flash application One of the most important and indispensable components in the storage of various kinds of electronic data in various electronic products on the market today, and in the memory, can be roughly divided into two categories, namely volatile (V ο 1 ati 1 e Mem ry) and non-volatile memory (Memory), the so-called non-volatile memory, the data stored in the Gu & name memory does not disappear because of the power State characteristics without power supply. Because of this characteristic, such non-volatile memories such as flash memory are widely used in different fields to meet the demands of various electronic products. The non-volatile memory in the conventional technology mostly uses a stacked gate technology, in which a memory cell (Me: 0 ^ y Cell) is formed on a substrate, which includes a drain, A source and a stack gate, and the stack gate usually contains a 587253. V. Description of the invention (2) ------------------------ -A floating gate and a gate), and between the oceanic gate and the base, the electrode (the control and the floating gate is separated by a dioxide layer and controlled by the sea gate) The operation principle of the non-volatile memory of the gate stack gate technology, and the use of a plurality of high-level voltages to the control gate is advantageous. The external or hot electron injection effect is used to change the floating gate. The daughter tooth changes the floating pole with the amount of the effect: =; The wrong digital electronic memory is used for data writing (Program) or for the purpose of the non-volatile (Erase). ', Delete as before The 'because of the complex voltage and a negative voltage of 10V are required for the deletion and deletion) The circuit will include a boost Level voltage to be due to the addition of non-volatile needs. However, after the non-volatile deletion operation (for example, the sexual memory will operate between the normal and 0V ground terminals), the multiple high-level voltages will be charged. However, if the multiple power supply voltages are used, (For example, Vdd, and a negative voltage of 10V, the direct power supply voltage is too high for non-transmitting memory to write data to the South level voltage. (For example, + 10V is usually in the nonvolatile memory. (Charge Pump) to generate the high-incidence § self-memory body for data writing and erasing memory to end data writing or data read operation), the non-volatile power supply voltage (for example, at this time + 3 ¥ The booster circuit will be turned off, and the charge that raises the level voltage through the power supply voltage directly flows into the +10 V positive voltage directly connected to the ground terminal), which will cause the load to flow and cause The jitter of its voltage value
第7頁 587253 五、發明說明(3) (Bounce),而這種抖動現象則會成為該非揮發 體之電路中主要的雜訊來源之一及可能的誤動作 因〇 為了解決上述因直接將該高準位電壓之電荷 電源供應電壓所造成之抖動現象的問題,習知技 使用一電壓恢復開關電路(Voltage Recovery Swi tch),用來於該複數個高準位電壓經由該電 電壓進行放電之前,先於該複數個高準位電壓( 之該正電壓及該負電壓)之間形成一通路,而使 電荷進行電荷中和以使得該複數個高準位電壓之 位逐漸下降,等到該複數個高準位電壓之電壓準 至某一程度後,再將其連接至該電源供應電壓繼 後續之放電,此時由於位於該高準位電壓中之電 已不如先前來得多,因而使得因電荷流入所造成 值的抖動現象被限制於可以接受之範圍之内。 請參閱圖一,圖一中顯示習知技術中之電壓 關電路1 0之示意圖,電壓恢復開關電路1 0包含有 型金屬氧化層半導體電晶體(以下稱NM0S電晶體 其汲極電連接於該正電壓(+ 1 0 V),其閘極電ϋ 第一控制訊號CTRL1 ; — Ρ型金屬氧化層半導體電 (以下稱PM0S電晶體)14,其源極電連接於第一 晶體1 2之源極,其閘極電連接於一固定電壓值( 性記憶 發生原 流入該 術中係 源供應 如前述 其中之 電壓準 位下降 續進行 荷數量 之電壓 恢復開 一第一 Ν )12, L接於一 晶體 NM0S 電 於圖一 587253 五、發明說明(4) 中其係接地);以及一第二NMOS電晶體i 6,其汲極電連 接於P Μ 0 S電晶體1 4之汲極,其閘極電連接於一第二控制 訊號CTRL 2,而其源極則電連接於該負電壓(—1 〇 ν)。 關於電壓恢復開關電路1 0之詳細說明,請參閱以下文 獻:JSSC 2000 Nov.,"A Channel-Erasing 1.8V-Only 32Mb NOR Flash EEPROM with a Bitline DirectPage 7 587253 V. Description of the invention (3) (Bounce), and this jitter phenomenon will become one of the main sources of noise in the circuit of the non-volatile body and possible malfunction reasons. The problem of the jitter phenomenon caused by the charge power supply voltage of the level voltage, the conventional technique uses a voltage recovery switch circuit (Voltage Recovery Swi tch), before the plurality of high level voltages are discharged through the electrical voltage, First, a path is formed between the plurality of high-level voltages (the positive voltage and the negative voltage), and the charges are electrically neutralized so that the positions of the plurality of high-level voltages gradually decrease, until the plurality of high-level voltages gradually decrease. After the voltage of the high level voltage reaches a certain level, it is connected to the power supply voltage for subsequent discharge. At this time, because the electricity in the high level voltage is no longer as much as before, the charge flows in. The resulting jitter is limited to an acceptable range. Please refer to FIG. 1. FIG. 1 shows a schematic diagram of the voltage-off circuit 10 in the conventional technology. The voltage recovery switch circuit 10 includes a metal oxide semiconductor transistor (hereinafter referred to as an NM0S transistor whose drain is electrically connected to the transistor). Positive voltage (+ 10 V), its gate voltage is the first control signal CTRL1;-P-type metal oxide semiconductor (hereinafter referred to as PM0S transistor) 14, its source is electrically connected to the source of the first crystal 12 Pole, its gate is electrically connected to a fixed voltage value (the source of sexual memory that flows into the system during the operation and the voltage level drops as described above, and the voltage is restored to a first N) 12, and L is connected to a The crystal NM0S is electrically connected to the ground of the first NMOS transistor i 6 in Figure 5.587253. 5. The description of the invention (4); and a second NMOS transistor i 6 whose drain is electrically connected to the drain of the P MOS transistor 14 and its gate. The electrode is electrically connected to a second control signal CTRL 2, and the source is electrically connected to the negative voltage (−1 0ν). For a detailed description of the voltage recovery switch circuit 10, please refer to the following document: JSSC 2000 Nov., " A Channel-Erasing 1.8V-Only 32Mb NOR Flash EEPROM with a Bitline Direct
Sensing Scheme’’。Sensing Scheme ’’.
當一使用電壓恢復開關電路1 0之記憶體進行資料寫 入或資料刪除時,第一控制訊號CTRL 1及第二控制訊號 CTRL2會分別控制第一 NM0S電晶體12及第二NM0S電晶體16 而使其關閉,以避免該正電壓及該負電壓因電壓恢復開 關電路1 0之導通而中和放電。當該記憶體結束資料寫入 或資料刪除而欲進行資料讀取前,第一控制訊號CTRL 1及 第二控制訊號CTRL2會分別控制第一 NM0S電晶體12及第二 NM0S電晶體16而使其開啟,以使該正電壓及該負電壓因 電壓恢復開關電路1 〇之導通而中和放電。When data is written or deleted using the memory of the voltage recovery switch circuit 10, the first control signal CTRL1 and the second control signal CTRL2 control the first NMOS transistor 12 and the second NMOS transistor 16 respectively. It is turned off to prevent the positive voltage and the negative voltage from being neutralized and discharged due to the conduction of the voltage recovery switch circuit 10. Before the memory finishes writing data or deleting data and reads data, the first control signal CTRL 1 and the second control signal CTRL 2 respectively control the first NMOS transistor 12 and the second NMOS transistor 16 to make them Turn on so that the positive voltage and the negative voltage are neutralized and discharged due to the conduction of the voltage recovery switch circuit 10.
第一 NM0S電晶體1 2之開啟及關閉係可直接使用一般 之邏輯訊號(即切換於3 V及0 V之間的第一控制訊號 CTRL 1)來加以控制,然而第二NM0S電晶體16卻無法如 此,這是由於第二NM0S電晶體1 6之源極係電連接於一很 大之負電壓(例如一1 0V),因此若欲將第二NM0S電晶體 1 6關閉,第二控制訊號CTRL2則必須輸入一負電壓V糾使The opening and closing of the first NMOS transistor 12 can be directly controlled by using general logic signals (ie, the first control signal CTRL 1 switched between 3 V and 0 V), but the second NMOS transistor 16 is This is not possible because the source of the second NMOS transistor 16 is electrically connected to a large negative voltage (for example, a 10V). Therefore, if the second NMOS transistor 16 is to be turned off, the second control signal is turned off. CTRL2 must input a negative voltage V
第9頁 587253 五、發明說明(5) 第二NMOS電晶體16能夠操作於切斷區(Cut-Off R e g i ο η)。因此,第二控制訊號C T R L 2必須為一切換於3 V 及負電壓V &間之訊號,而為了提供負電壓V Ν,勢必會使 該記憶體之電路設計更加複雜而增加了成本。又當第二 NM0S電晶體1 6開啟時,其閘極及源極之間必須承受一 3V —(—10V) = 13V之電壓差,這將使得第二NM0S電晶體 發生元件崩潰(Device Breakdown)的機會大為增加。 發明内容Page 9 587253 V. Description of the invention (5) The second NMOS transistor 16 can be operated in a cut-off region (Cut-Off R e g i ο η). Therefore, the second control signal C T R L 2 must be a signal that switches between 3 V and the negative voltage V &, and in order to provide the negative voltage V NR, the circuit design of the memory is bound to be more complicated and the cost is increased. When the second NMOS transistor 16 is turned on, a voltage difference of 3V — (-10V) = 13V must be withstood between the gate and the source, which will cause a device breakdown of the second NMOS transistor. Opportunities have greatly increased. Summary of the Invention
因此本發明之主要目的在於提供一種能夠避免元件 崩潰之電壓恢復開關電路,以解決上述習知的問題。 根據本發明之申請專利範圍,係揭露一種電壓恢復 開關電路,用來中和一非揮發性記憶體内之一第一電壓 及一第二電壓,該電壓恢復開關電路包含有一第一 P型金 屬氧化層半導體電晶體,其閘極電連接於一第三電壓,Therefore, the main object of the present invention is to provide a voltage recovery switch circuit capable of preventing the component from crashing, so as to solve the conventional problems. According to the patent application scope of the present invention, a voltage recovery switch circuit is disclosed for neutralizing a first voltage and a second voltage in a non-volatile memory. The voltage recovery switch circuit includes a first P-type metal. An oxide semiconductor transistor, the gate of which is electrically connected to a third voltage,
其源極電連接於該第一電壓;一賭金屬氧化層半導體電 晶體,其閘極電連接於一控制訊號,其汲極電連接於該 第一 P型金屬氧化層半導體電晶體之汲極;以及一第二P 型金屬氧化層半導體電晶體,其閘極電連接於一第四電 壓,其源極電連接於該N型金屬氧化層半導體電晶體之源 極,其汲極電連接於該第二電壓。Its source is electrically connected to the first voltage; a metal oxide semiconductor transistor, its gate is electrically connected to a control signal, and its drain is electrically connected to the drain of the first P-type metal oxide semiconductor transistor. And a second P-type metal oxide semiconductor transistor, its gate is electrically connected to a fourth voltage, its source is electrically connected to the source of the N-type metal oxide semiconductor transistor, and its drain is electrically connected to This second voltage.
第10頁 587253 五、發明說明(6) 根據本發明之申請專利範圍,亦揭露利用上述電壓 恢復開關電路中和該第一電壓及該第二電壓之方法,其 包含有以下步驟:利用該控制訊號關閉該N型金屬氧化層 半導體電晶體,使得該電壓恢復開關電路處於一切斷狀 態;以及利用該控制訊號開啟該N型金屬氧化層半導體電 晶體,使得該電壓恢復開關電路處於一導通狀態,而該 第一電壓及該第二電壓會進行電荷流通而放電。 本發明之電壓恢復開關電路係利用一控制訊號控制 該N型金屬氧化層半導體電晶體之開啟及關閉,由於該控 制訊號係為一般之邏輯訊號,故不會有習知技術中為了 提供負電壓V両使電路設計更加複雜的問題,又由於該N 型金屬氧化層半導體電晶體與該第二電壓之間係插入該 第二P型金屬氧化層半導體電晶體,故該N型金屬氧化層 半導體電晶體不會因為其閘極及源極之間之電壓差過大 而有發生元件崩潰的可能。 實施方式 請參閱圖二,圖二中顯示本發明之電壓恢復開關電 路2 0的示意圖,電壓恢復開關電路2 0係用來中和一非揮 發性記憶體内之一第一電壓V PQ及一第二電壓V NEG。電壓恢 復開關電路20包含有一第一 PMOS電晶體22,其閘極電連 接於一第三電壓VBIAS1,源極電連接於第一電壓VPGS; — 587253 丨五、發明說明(7) NMOS電晶體24,其閘極電連接於一控制訊號CTRL,其汲 極電連接於第一 PMOS電晶體22之汲極;以及一第二PMOS 電晶體2 6,其閘極電連接於一第四電壓v BIAS2,其源極電連 接於NMOS電晶體24之源極,其汲極電連接於第二電壓 V NEG〇 ^ 、請注意,於本實施例中,第一電壓V p◦及第二電壓V NEG 係為前述為了對該非揮發性記憶體進行資料寫入或資料 刪除而經由升壓動作所產生之高準位正電壓(例如+ 10V)及高準位負電壓(例如_ 1〇v),而控制訊號CTRL 則,一般之邏輯訊號(例如切換於3級〇v之間)。第三 ,壓v BIAS及第四電壓v bias係為固定之偏壓電壓值,第三電 f v bias用來提供第一 PM〇s電晶體22所需之偏壓以決定電壓 ^復,關電路20對第一電壓Vp〇及第二電壓行中和放 所^^度’而第四電壓Vbias則用來提供第二PM0S電晶體26 而之偏壓,以使NM0S電晶體24因第二PMOS電晶體26之 而不會發生前述之元件崩潰的問題,於圖二中第四 雷聖V BIAS縣為接地。接下來將利用圖二中之電壓恢復開關 η,20說明本發明之電壓恢復開關電路中和第一電壓V哪 及弟二電壓VNE式方法。Page 10 587253 V. Description of the invention (6) According to the patent application scope of the present invention, a method for neutralizing the first voltage and the second voltage by using the voltage recovery switch circuit described above includes the following steps: using the control A signal to turn off the N-type metal oxide semiconductor transistor, so that the voltage recovery switch circuit is in an off state; and using the control signal to turn on the N-type metal oxide semiconductor transistor, so that the voltage recovery switch circuit is in an on state, The first voltage and the second voltage are charged and discharged. The voltage recovery switch circuit of the present invention uses a control signal to control the opening and closing of the N-type metal oxide semiconductor transistor. Since the control signal is a general logic signal, there is no conventional technology for providing a negative voltage. V 両 makes the circuit design more complicated, and because the second P-type metal oxide semiconductor transistor is interposed between the N-type metal oxide semiconductor transistor and the second voltage, the N-type metal oxide semiconductor Transistors do not have the possibility of component breakdown due to the large voltage difference between their gate and source. Please refer to FIG. 2 for an embodiment. FIG. 2 shows a schematic diagram of the voltage recovery switch circuit 20 of the present invention. The voltage recovery switch circuit 20 is used to neutralize a first voltage V PQ and a voltage in a non-volatile memory. Second voltage V NEG. The voltage recovery switch circuit 20 includes a first PMOS transistor 22, the gate of which is electrically connected to a third voltage VBIAS1, and the source of which is electrically connected to the first voltage VPGS; 587253 丨 V. Description of the invention (7) NMOS transistor 24 Its gate is electrically connected to a control signal CTRL, its drain is electrically connected to the drain of the first PMOS transistor 22; and a second PMOS transistor 26, its gate is electrically connected to a fourth voltage v BIAS2 Its source is electrically connected to the source of the NMOS transistor 24, and its drain is electrically connected to the second voltage V NEG〇 ^ Please note that in this embodiment, the first voltage V p◦ and the second voltage V NEG It is the high-level positive voltage (such as + 10V) and the high-level negative voltage (such as _ 10v) generated by the boosting operation in order to write or delete data to the non-volatile memory. The control signal CTRL is a general logic signal (for example, switching between 3 levels of 0v). Third, the voltage v BIAS and the fourth voltage v bias are fixed bias voltage values. The third voltage fv bias is used to provide the bias voltage required by the first PM transistor 22 to determine the voltage. The circuit is closed. Twenty pairs of the first voltage Vp0 and the second voltage are neutralized and the fourth voltage Vbias is used to provide a bias voltage for the second PMOS transistor 26, so that the NMOS transistor 24 due to the second PMOS Transistor 26 does not cause the aforementioned component collapse problem, and it is grounded in the fourth Leisheng V BIAS county in FIG. Next, the voltage recovery switch η, 20 in FIG. 2 will be used to explain the method of neutralizing the first voltage V and the second voltage VNE in the voltage recovery switch circuit of the present invention.
:乡閱圖三,圖三中顯示圖二中之電壓恢復開關電 中和第一電壓Vp〇及第二電壓VNE&方法的流程圖。如 圃二所不’於步驟30中,當該非揮發性記憶體進行資料Figure 3 shows the flowchart of the method for neutralizing the first voltage Vp0 and the second voltage VNE & by the voltage recovery switch in Figure 2. If the second place is not used in step 30, when the non-volatile memory performs data
第12頁 587253 i五 '發明說明(8) 〆 丨寫入或資料刪除時,由於其操作需要使用高準位電壓, 故該非揮發性記憶體通常會利用其中所包含之一升壓電 路來產生高準位之第一電壓vP0及第二電1 Vneg,並會將控 制訊號CTRL切換至邏輯值π 0”(例如^入一换地電壓0V) 以關閉NMOS電晶體24而使得電璧恢復開關電絡20處於一 切斷狀態。 #Page 12 587253 I. 5 'Description of the Invention (8) When writing or deleting data, the operation requires a high level voltage, so the non-volatile memory usually uses a boost circuit included in it to generate High-level first voltage vP0 and second voltage 1 Vneg, and will switch the control signal CTRL to a logic value π 0 ”(for example, enter a ground voltage 0V) to turn off the NMOS transistor 24 and restore the voltage switch. Network 20 is in a cut-off state. #
而於步驟3 2中,當該非揮發性記憶體進行資料讀取 時,由於其操作並不需要使用高準位電壓,故該非揮發 性記憶體會使用一般之電源供應電壓(例如3 V)進行資 料讀取之動作且關閉該升壓電路,同時會將控制訊號切 換至邏輯值,,Γ (例如該電源供應電壓3V)以開啟電 晶體24而使得電壓恢復開關電路20處於一導通狀態。此 時由於第一電壓V PG及第二電壓V NE之間產生,電流通路, 第一電壓VP◦及第二電壓VNEdf進行電荷流通而放電’直到 第一電壓VPG之值等於第三電壓VBIAS之值加上第二PM〇st 晶體22之臨界電壓(Threshold Voltage)之值後’第一 PM0S電晶體22會不導通,而使得電壓恢復開關電路>20進 入一切斷狀態。接下來則如同習知技術所述,再將第〜 電壓V P。及第二電壓V NE連接至電源供應電壓繼續進行後續 之放電直到其到達等待(Stand-By)電位,此時由於位 於第一電壓V PQ及第一電壓V NEG中之電荷數量已不如先前來 得多,因而使得因電荷流入所造成之電壓值的抖動現象 被限制於可以接受之範圍之内。In step 32, when the non-volatile memory reads data, since the operation does not need to use a high level voltage, the non-volatile memory uses a general power supply voltage (such as 3 V) for data The reading operation closes the boost circuit, and at the same time, the control signal is switched to a logic value. Γ (for example, the power supply voltage 3V) turns on the transistor 24 so that the voltage recovery switch circuit 20 is in a conducting state. At this time, due to the generation between the first voltage V PG and the second voltage V NE, a current path, the first voltage VP◦ and the second voltage VNEdf conduct electric charge and discharge, until the value of the first voltage VPG is equal to the third voltage VBIAS. After adding the value of the Threshold Voltage of the second PM0st crystal 22 to the value, the 'first PM0S transistor 22 will not be turned on, and the voltage recovery switch circuit> 20 will enter an off state. Next, as described in the prior art, the first to the first voltages V P are again applied. And the second voltage V NE is connected to the power supply voltage and continues to perform subsequent discharges until it reaches the Stand-By potential. At this time, the amount of charge in the first voltage V PQ and the first voltage V NEG is no longer obtained as before. There are many, so that the jitter phenomenon of the voltage value caused by the inflow of charges is limited to an acceptable range.
第13頁 587253 I五、發明說明(9)Page 13 587253 I. Explanation of the invention (9)
舉例來說,若第一電壓V PG表值為+ 1 〇 V,第三電壓 |VBIASi^值為3V’而第一 PMOS電晶體2 2之臨界電壓之值為 0 · 7 V,則當第一電壓V p◦及第二電壓V NE阅電壓恢復開關電 路2 0處於導通狀態而開始中和放電後,第一電壓v P0及第 二電壓V NEG^絕對值均會因電荷中和而開始下降,直到第 一電壓VPG炙值下降至3· 7V時,由於第一 PMOS電晶體22之 源極與閘極之間之電壓差VSG (等於第一電壓VP〇減去第三 電壓VBIAS々值,3· 7V— 3V = 0· 7V)係與第一 PM0S電晶體22 之臨界電壓之值相等,故第一 PM0S電晶體22會進入切斷 區(Cut-Of f Region)而使得電壓恢復開關電路20進入 一切斷狀態。請注意,此處第三電壓V biasA值可以依據實 際需要而介於0V與第一電壓V 間。如上所述,電壓恢 復開關電路20即可完成中和第一電壓VPQ及第二電壓VneA 動作。For example, if the value of the first voltage V PG is +1 0V, the value of the third voltage | VBIASi ^ is 3V ', and the threshold voltage of the first PMOS transistor 22 is 0 · 7 V, then After the first voltage V p◦ and the second voltage V NE and the voltage recovery switch circuit 20 are in the on state and start to neutralize and discharge, the absolute values of the first voltage v P0 and the second voltage V NEG ^ will start due to charge neutralization. When the value of the first voltage VPG drops to 3.7V, due to the voltage difference VSG between the source and gate of the first PMOS transistor 22 (equal to the first voltage VP0 minus the third voltage VBIAS々) (3 · 7V—3V = 0 · 7V) is equal to the threshold voltage of the first PM0S transistor 22, so the first PM0S transistor 22 will enter the cut-off region and the voltage will be restored. The circuit 20 enters a cut-off state. Please note that the value of the third voltage V biasA can be between 0V and the first voltage V according to actual needs. As described above, the voltage recovery switch circuit 20 can complete the actions of neutralizing the first voltage VPQ and the second voltage VneA.
相較於習知技術之電壓恢復開關電路,本發明之電 壓恢復開關電路係利用一控制訊號控制該NM0S電晶體之 開啟及關閉,由於談控制訊號係為一般之邏輯訊號,故 不會有習知技術中為了提供負電壓V兩使電路設計更加複 雜的問題,又由於該NM0S電晶體與該第二電壓之間係插 入該第二PM0S電晶體,故該NM0S電晶體不會因為其閘極 及源極之間之電壓差過大而有發生元件崩潰的可能。Compared with the voltage recovery switch circuit of the conventional technology, the voltage recovery switch circuit of the present invention uses a control signal to control the opening and closing of the NMOS transistor. Since the control signal is a general logic signal, there is no practice In order to provide a negative voltage V to make the circuit design more complicated in the known technology, and because the second PM0S transistor is inserted between the NMOS transistor and the second voltage, the NMOS transistor will not be affected by its gate. The voltage difference between the source and the source is too large, and there is a possibility of component breakdown.
第14頁 587253Page 14 587253
第15頁Page 15
587253 I _ " ~ ' I圖式簡單說明 I圖示之簡單說明:587253 I _ " ~ 'I diagram brief description I diagram brief description:
II
II
I I圖一為習知技術之電壓恢復開關電路的示意圖。 圖二為本發明之電壓恢復開關電路的示意圖。 圖三為圖二之電壓恢復開關電路操作的流程圖。FIG. 1 is a schematic diagram of a conventional voltage recovery switch circuit. FIG. 2 is a schematic diagram of a voltage recovery switch circuit according to the present invention. FIG. 3 is a flowchart of the operation of the voltage recovery switch circuit of FIG. 2.
I 圖示之符號說明:I Symbol description:
10、20 電壓恢復開關電路 12' 16^ 24 NMOS電晶體 14^ 11、 26 PMOS電晶體 第16頁10, 20 Voltage recovery switch circuit 12 '16 ^ 24 NMOS transistor 14 ^ 11, 26 PMOS transistor Page 16
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