TW586178B - Wafer clamp ring having removable pad and its manufacturing method - Google Patents

Abstract

A kind of wafer clamp ring having removable pad and its manufacturing method are provided in the present invention. The wafer clamp ring includes a wafer clamp ring main-body. Plural removable pads are connected to partial surface of the clamp ring main-body, and each removable pad is fixed on the clamp ring main-body through at least one screw. The removable pads are used to fix one wafer on a base stand.

Description

586178 V. Description of the invention (1) [Technical field to which the invention belongs] The present invention relates to a process device for semiconductor wafers, and more particularly to a wafer clamp ring with a detachable pad and a manufacturing method thereof. [Previous Technology] In a general metal deposition device, for example, in a sputtering (erpu) device, a wafer c ring (wafer c lamp ring) is often used to fix the wafer to facilitate the deposition of a metal film on the wafer. on the surface. Please refer to FIG. 1 for a cross-sectional view showing an arrangement of a conventional wafer clamp ring 10 for holding a wafer. In Figure 1, a circular wafer clamp ring 10 is used to fix a wafer 12 on a base (or wafer carrier) 14. That is, the wafer clamping ring i 〇 prepares and presses the edge of the wafer 12, so that the wafer 12 is fixed on the pedestal 14, where the symbol 13 indicates the wafer clamping ring. 10 is in contact with the contact area of the wafer 12 (contact area). Then, metal atoms / ions M + are deposited on the surface of the wafer 12 via a sputtering process. ^ Since metal deposits will also be deposited on the wafer clamp ring, it is known that after the wafer clamp ring 10 is used, the recycling process must be performed. The circle is called cUmP ring recycling), that is, by sandblasting ( sand, blasting), acid cleaning, and pure water rinsing (dns program will deposit the sediment and dirt on the surface of the wafer clamp ring 10, so as not to change the outline size of the wafer clamp ring (profUe siz) and The shadow effect is a good way to reduce the sputtering process. However, the conventional wafer clamping ring] 0 people push μ, +, y ui clothes 1 仃 When entering the recovery process, it often occurs

0503-8970TW (Nl): TSMC2002-0734; jacky.ptd Page 4 586178 V. Description of the invention (2) The contact surface of the existing wafer clamp ring 1 0 is easy to contend ^. Q ^ ^ n It is inferred that the reason is contact with the friction of circle 12, and it is especially known in the text when the recovery process is performed. When the contact surface 13 is damaged, particles will be released and the wafer 12 will be contaminated during the deplating process. Therefore, the wafer clamping ring 10 with the same cost (about 250,000 yuan) must be replaced entirely. . That is, the lifetime of the conventional wafer clamp ring 10 is shortened because the contact surface 13 is easily damaged, which increases the cost. U.S. Patent No. 54 2 1 40 1 has disclosed a dry insertion, swallowing eight m λ Α β gate inquiry is not suitable for a Japanese yen wafer clamp ring with a flat edge knife (flat Portion), to carry out the recovery process At the same time, there will still be a wafer clamp ring made of materials as described in the above-mentioned subject b. U and U.S. Patent No. 5 4 0 7 0 3, however, n + heart expansion material > 丄 _ 5 Haitian Yen clamps will still have the same problems as before. U.S. Patent No. 6 1 6 2 33 6 has a wafer clamping ring with a spear-chain pulling area to reduce the problem of shrinking the wafer with the wafer. During the recovery process, there will be a wafer clamping ring for the device as described in the former US Patent No. 6 1 76 93 1). The wafer ring has a material order "and -The opening is used to prevent the wafer clamping ring from being overheated during the manufacturing process. However, the wafer clamping ring still has the same problems as described above during the recycling process.

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Summary of the Invention: In view of this, the manufacturing method. An object of the present invention is to provide a wafer clamp ring and a wafer round clamp ring with a detachable pad. A wafer with a detachable pad. Another object of the present invention is to provide a clamp ring and a method for manufacturing the same, which can increase the crystal. According to the above object, the present invention provides a clamp ring including: the clamp ring body wire is fixed to A clamp ring body; and a plurality of removable pads connected to a part of the surface, each of which is attached to the clamp ring body by at least one screw; μ wherein The detachable pad is used to fix a wafer on a base. According to the above object, the present invention also provides a method for manufacturing a detachable circular clamp ring, which includes the following steps: the crystal of the working force provides a cl amp ring body; and connecting a plurality of removable pads ) On a part of the surface of the clamp ring body, each detachable pad is fixed by at least one screw: on the clamp ring body; < wherein the detachable pads are used to fix a wafer on On a pedestal. The following is a detailed description of the present embodiment in conjunction with the drawings and preferred embodiments: The following uses FIG. 2 and FIG. 3 to describe the detachable type of the present invention.

V. Description of the Invention (4) Arrangement and its manufacturing method. Here, the actual figure 2 shows a part of the wafer clamping ring of the present invention as shown in figure 3. The wafer clamp ring of this & Ming is annul ar, such as ^ clamp ring body / 0 household chart, a clamp ring (clamP dng) body 20 is provided, and so on. Made of Meng materials, such as titanium alloy or stainless steel 4 乃 舌 青青 ^ Γ) @

Pads) 22 in this type of product: connect a plurality of detachable pads (removabie surface of the edge of the wafer ^ part of the inside surface of the A body (that corresponds to the proximity device 24 (here, ^, the female The type pad 22 is fixed on at least one by means of an explanation; but it is not limited to the present invention for fixing a wafer body 20 ', wherein the detachable type pads 22 are contact surfaces 2 which are contacted by a circle 12 : On the base f 14, there is also a detachable pad 22 having a crystal material, for example, Γ: 人 it 'The detachable 塾 22 is made of a metal material π, an alloy or stainless steel, etc. Demolition 9 9 9 is from-:;:. L-2r ~ re ;; r :; p :; v /; ^ Different from each Z detachable 塾 22 to form a correspondence with the lost-loop body 20 = 22 Screw hole 26 and second screw hole 28, and then lock the screw 24 into it; so that the removable pad 22 can be fixed to the hole. Among them, the screw 24 is preferably made of titanium Alloy Ϊ;: Γ ° In addition, in order to securely fix each detachable 于 22 to the clamp ring 586178 V. Description of the invention (5) 20 'So two different in each detachable pad 22 Good position, lock with two screws 24 The screw holes 26 and M. Sections and the like can evenly fix the wafer 12 on the base Η, and the detachable pad 22 is arranged on the retaining ring shown in the figure, Stop,-the method of the red book can be as in the third " 稷 several detachable pads 2 2 π β clamp ring body 20 separated by a fixed distance. Here to explain the J detachable 塾 22 on the 9 9 AA ^ z ^ „At the detachable pad τ, which can not be seen in the figure of J 疋 d, three, four, five, six, or more can be used; for this purpose, the wafer 12 is evenly fixed to the substrate. On the seat 14, a detachable pad 22 that is most separated by a fixed distance is on the clamp ring body 20.-Furthermore, the wafer clamp ring 30 with a detachable pad of the present invention described above undergoes a second deposition process. After that, a recycling process must be carried out (the circle% is .clamp ring recycling), that is, the sediment is deposited in a private sequence such as arsenic (“M ^ asUng), acid cleaning, and pure water rinse. The deposits and contaminants on the surface of the wafer clamp ring 30 are removed, so as not to change the outline size (pr0fUe of the wafer clamp ring 30) of the wafer clamp ring 30 to produce a shadow effect and reduce Yield of the integrated manufacturing process. However, since the contact surface 29 of the detachable pad 22 is relatively easy to be damaged (because of friction with the wafer), the present invention uses the clamp ring body 20 and the The detachable pad 22 is separately subjected to a reccycng process, that is, a first recovery process is performed on the clamp ring body 20, and a second recovery process is performed on the detachable pads 22. Since the removable pad 22 is less affected by the deposition system than the clip-mounted body 20, the pickling concentration used in the second recovery process can be lower than the first recovery process, and the blasting strength of the second recovery process can also be reduced. Lower than the first recovery procedure, even the second recovery procedure can be simplified to

I

I »〇503-8970TW (Nl); TSMC2002-0734; jacky.ptd Page 8 586178 V. Description of the invention (6) Only pure water flushing is required, so the contact surface of the removable pad 22 is“ less likely It is damaged in the recovery process, thus reducing the problem of particle contamination, and improving the conventional process yield. In addition, the present invention makes the clamp ring body 20 not in contact with the wafer 12, so it greatly improves the process. The service life of the clamp ring body 〇. The inventor will take an example here, under the same process conditions = the service life and cost of the wafer clamp ring of the present invention and the conventional technology. The comparison results are shown in the following table: Consumable cost per year

It can be known from the above examples that the cost of the present invention can be greatly reduced by having a circular sandwich. That is to say, it is enough to have a detachable pad, and it is not necessary to know that the wafer clamp ring = a new one. Therefore, the present invention is related to reducing the cost of consumables. [Features and Effects of the Case] The effect is as follows: the wafer has a missing ring with a detachable pad, including: a caring ring body; and a plurality of detachable pads (removaMe pads) connected to the clip On the surface of Qiu Babu's mouth knife of Huanbenjing, each detachable pad is fixed to the clamp ring body by at least one screw. Page 9 0503-8970TW (Nl); TSMC2002-0734; jacky.Ptd 586178 V. Description of the invention (7) Therefore, the clamp ring body and the detachable pad can be separated to perform reccyc ing procedures for different conditions. Therefore, the contact surface between the removable pad and the wafer is less likely to be damaged during the recovery process, thereby reducing the problem of particle contamination, and improving the conventional process yield. "With the present invention, because the clamped body does not contact the wafer", the service life of the clamp ring body can be greatly improved, and the cost of consumables can be reduced. Although the present invention has been disclosed as above with preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make changes and retouches without departing from the spirit and scope of the present invention. The scope of protection shall be determined by the scope of the attached patent application.

0503-8970rnV (Nl); TSMC2002-0734; jacky.ptcl Page 10 586178 Brief description of the drawings Figure 1 is a sectional view showing the arrangement of a conventional wafer clamp ring; Figure 2 is a diagram of a removable pad according to the present invention. A cross-sectional view of the arrangement of the wafer clamp ring; and FIG. 3 is a bottom view showing an example of a wafer clamp ring with a detachable pad according to the present invention, and is used to show the disposition position of the detachable pad. [Description of symbols] Conventional section (Fig. 1) 1 0 ~ Conventional wafer clamp ring 1 3 ~ Contact surface; M + ~ Metal atom / ion part of the case (Figs. 2 and 3) 1 2 ~ Wafer; 2 0 ~ Clip Ring body; 2 4 ~ screws; 2 8 ~ second screw holes; 30 ~ of the present invention has 1 2 ~ wafers; 1 4 ~ base; 1 4 ~ base; 2 2 ~ detachable pad; 2 6 ~ first screw hole; 2 9 ~ contact surface; detachable wafer is bad.

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Claims (1)

586178 6. Scope of patent application ^ A wafer clamp ring with detachable pads, including: = clamp ring (clamp ring) body; and: j: removable pads (removable pads on the surface of each detachable pad The body is fixed on the body by at least-fixing; u is fixed Γ Γ is used by detachable pads such as 忒 to fix a wafer to a US at # · α patent application scope item 1 The above mentioned has a detachable seat to sit on. It is a clip-on, stand-up, and it's a two-pronged π-heavy wafer on the wafer. This system is made of metal materials. ® + π. The scope of patent application The wafer ring with removable 4 # lost ring 4 described in item 2, wherein the metal material, titanium alloy or stainless steel dismantleable wafer clip ring: 2 = = 1 Wafers, Ning 3 Temple removable pads are made of metal materials, U 5 · as described in item 4 of the scope of the patent application with a clipable ring, where the addiction is a wafer of # U ^ Τ removable pad /, 〒3 belongs to titanium alloy or stainless steel. Loss of ring, 'The holder is a screw in wafer clothes with removable 所述 as described in the first item of the range. 7. As described in item 6 of the scope of the patent application, each of the detachable pads includes at least the -first-cicada heart W * eleven and the second screw hole to fix the detachable 塾; Wafer clamp ring with detachable pads, "clamped on the body. Clamp ring body; and six removable pads on the surface of each of the conjoined parts, each removable pad By J connection :: the core of the core) a screw and fixed 0503-8970TW (N1); TSMC2002-0734; jacky.ptd page 12 six Wai patent application ^ on the = ring body; 9 · as applied; 1 :: t type 5 is used to fix the -wafer on-the base. Lost ring 'where ^, the wafer with a detachable pad as described in item 8 ... such as Shen / Second' made of metal materials ^ 11 ； ^ ^ 1 # Τ / ιΙ I ί ί J ^ ^ # ^ ^ ^-® Lost / 1 · " Please refer to the steel in item 8 of the patent scope. Wenyi, among which the removable type ， L of wafers with detachable pads 12 · Such as towels, please ^ pads ^ made of metal materials. Round missing ring, B with detachable pads as described in item 11, ", please clip specifically , Each detachable cushion bag To ί = ί The wafer ring body with a removable pad contains a plurality of 7 -brother-screw holes' and the clip -M $-iw ,,, τ, 4 holes, and these screws are made by Xi @ 14_ One has; 1 疋 on the ring body. The following steps: A method for making a "clip" of a pad, including providing a clamp ring body; and connecting a plurality of detachable pads (remove on a part of the surface, each detachable) It is fixed by at least one;; = on the clamp ring body; or fixed therein, these detachable pads are used to fix a wafer on the base. 1 5 · If the scope of patent application is the first The method for manufacturing a wafer clamp ring with a detachable pad according to item 4, wherein the central ring system is made of a metal material. __-— 0503-8970ΤΨ (ΝΙ); TSMC2002-0734; jacky.ptd $ 13 Μ 586178 VI. Application for patent scope If · As described in the patent application scope No. 15 for the method of making wafer clips with removable pads, The metal is a titanium alloy or stainless steel. 〇 · The manufacturing method of the wafer clip mounting with removable pads as described in item 14 of the scope of patent application, wherein the removable pads are made of metal materials. if · The method of crystallizer with a detachable pad as described in item 17 of the scope of the patent application, "^^^", wherein the metal material is titanium alloy or stainless steel. The second specialty of the central ring: item 14 of the scope Households have a removable pad w method, in which the holder is a screw. LU. Female α contender master ^ a system of the circular clip ring 4 described in item 19 of the patent scope is removable ：：： ， where each-detachable $ contains at least-第-螺 系 梦 由 誃 笑 # clothing body contains a plurality of second screw holes, and the screw clips ^ on the body And the second screw hole to fix the detachable pad to the ® 11 ® ^ 14 ^ ^ ^ ^ ^ ^ ^. The method of operation further includes the following steps: and iiiKf-the first recycling Uecycling) procedure; A second recovery procedure is performed with the Λ temple removable pad. Door + · The manufacturing method of the circular clip ring with removable pad as described in item 21 of the scope of patent application 4, the daily order of a wide a , A pickling f & ,,, and the brother's recovery process includes a private sequence of sand blasting process and a pure water rinsing process. Dou 2: 3: system 1 please patent scope 21 The method for making a crystal-jacketed clothes with a detachable pad as described in the item, wherein the second recovery process includes a pure water process. 05Q3-8970TW (N1); TSMC2002-0734; jacky.ptd page 14 The following steps. A method for manufacturing a wafer clamp ring with a detachable pad provides a J. mr lamp ring body; and a part of removable pads on the clamp ring body. ^ 2, each of the detachable pads includes at least one first screw hole, and the body, including a plurality of second screw holes, and the plurality of screws are borrowed from the X temple brother and the second screw hole. The detachable pads are fixed to the clamp ring, wherein the detachable pads are used to fix a wafer on a base. . · The method for manufacturing a wafer ring with a detachable pad as described in item 24 of the patent application scope, further including the following steps: · A first recycling process is performed on the ring body; and Wait for the removable pad to perform a second recovery procedure. 2 6 · The method for manufacturing a wafer clamp ring with a detachable pad as described in item 25 of the scope of patent application, wherein the first co-collection procedure includes a sand blasting procedure, an acid cleaning procedure, and a pure water rinse Sequence. 27. The method for manufacturing a wafer clamp ring with a detachable pad as described in item 25 of the scope of patent application, wherein the second harvesting sequence includes a pure water washing procedure. 〇503-8970TW (Nl) · TSMC2002-0734; jacky.ptd Page 15