TW584977B - Structure for the package of organic electro-luminescent device - Google Patents

Abstract

This invention discloses a new structure for the package of organic electro-luminescent device (OEL). In this invention, the package structure comprises: a substrate; an organic electro-luminescent device formed on one surface of the substrate; a hermetic seal with a foot and a base, wherein the foot is located on the surface within the hermetic seal to form a seal space region and another region for containing the organic electro-luminescent device; an adhesive with high flow that can permeate into the seal space by the capillarity, wherein the hermetic seal is adhered to the predetermined place on the substrate with the adhesive.

Description

584977 Five 'invention description (l) 5 -1 Field of the invention: The present invention relates to an organic electro-luminescence element', and more particularly to a packaging structure of an organic electro-luminescence element. 2 Background of the Invention: Pieces, such as Diode inserted into a layer] Machine-cooled light combined with information on highlighting organic materials. Generally speaking, electro-luminescence (EL) elements are like 'organic light-emitting diodes (Organic Light Emitting OLED), or a similar structure is an organic luminescent material layer between a pair of electrodes. When electrons are injected from the cathode electrode and holes are injected from the anode electrode to the material layer, the electrons and holes In the organic cold-light material layer, light will be emitted from each other's electric cold-light elements. This type of electric cold-light element has-^ ^ and the workshop that forms the organic cold-light material layer & φ has the advantage of Yukisugi. Therefore For various industries, the electric cold light element can be applied to the light source assembly. When the obsolete parts and the instrument are stored in the back room, they will still be sealed as a cold finish. The light has the light, the light is cold and the electricity is still so far. The mechanical characteristics of a certain period of time has not been expected to reduce the initial inferiority. The use of large amounts of current. The light. Serves the hair to overcome its current 584977. V. Description of the invention (2 ) Cause this The main cause of the deterioration of the luminous properties is caused by the residual water vapor inside the organic electroluminescent light element and the water vapor invading from the outside of the element. The organic thin film in the organic electroluminescent light element has deliquesced due to the adsorption of water vapor, and the metal electrode is dehydrated by water. The invasion of gas and oxygen generates oxidation and deteriorates. On the other hand, when an external voltage is applied to the electrodes of the organic electroluminescent device to drive the organic electroluminescent device to emit light for a period of time, the organic electroluminescent device generates heat. Accelerating the degradation more rapidly, thus causing dark spots on organic electroluminescent devices. With the progress of oxidation and deliquescence, the dark spots will continue to expand 'and even endanger the entire light emitting device. As mentioned above,' organic electroluminescent devices The packaging process and structure of the components are even more important. The packaging method used today is to arrange a capping structure (hermeticsea 1) containing a water-absorbing agent on the outside of the organic electro-luminescence component to achieve long-term stability and improve life. Refer to the first As shown in the figure, the conventional organic electroluminescent package structure 100 includes a substrate 1 1 0, An organic electric cold light element 120 is connected to the bottom of the substrate 丨 丨; a cover 130, a bottom of the cover structure 13 has a water absorbing agent 140, wherein the cover 130 has a cover = 15〇 ^ Edge 1 50 0 by An adhesive 1 60 is connected to the substrate 11 0. However, there are still some problems with the top cover structure. Since the traditional packaging method uses the dispensing method, it must be in an external field environment (e X ~ situ ) Method to carry out the production process, which leads to complex process steps and process costs plus: the thickness of the glue on the right side of the seal 'in the packaging granulation' is too thick, and the intrusion of water and gas caused by Japanese-dagger Problem; In contrast, if the glue thickness is too thin, 1 ^ force will be insufficient. Based on this, the thickness control of the adhesive at the time of packaging

584977 V. Description of the invention (3) Yes. The traditional method to control the thickness of adhesive glue, (spacer). Generally speaking, in the encapsulation process, use; = granules in the adhesive to facilitate the encapsulation process 2: The width of the gap test particle mix controls the thickness of the adhesive during pressing. This is due to the high cost of interstitial particles, and its high price, which results in cost; and: the consumer of interstitial particles' is the packaging structure of traditional organic electrical cold light components; low. It is water-permeable (approximately 0.2%). Therefore, with the use of the agent, the air with humidity and oxygen will still pass through the adhesive 3, increasing in the internal voids. In view of the above-mentioned reasons, the packaging structure of the organic electro-luminescence component is described in order to require a new product yield and service life. Saving electricity and cooling light cells »-3 Purpose and summary of the invention: Structural light element structure cover and in view of the above-mentioned background of the invention, the traditional organic electrical cooling has many disadvantages, the present invention provides a packaging structure One of the goals of organic electric cooling can be used to overcome the problem of traditional structure ^ One of the aims is to provide an organic cooling _ ancient f invention can pass-with a packaging gap]; the space existing between the packaged organic electric cooling light components = Reduce seal __, square stop water and gas Page 7 584977 V. Description of the invention (4) _ Directly penetrate to the seal via the adhesive # 彡 士 package structure can be sealed inside the seal gap H. In addition, the present invention can avoid using the height required by the traditional manufacturing process, thereby reducing the service life of the electromechanical cold light element: The present invention can increase the winning t2 $ The purpose is to provide an organic electric cold light element Sealing the “accounting for production”! Replace the traditionally used two f with a high-flow adhesive, and seal / mount it in an in-situ manner to reduce the process steps and its cost. So the = method can be economically beneficial. Based on these two technologies of optoelectronic and semiconductor components. Not suitable for the purpose described above, the present invention discloses a package] Guangguang 7L package structure. The packaging structure of the present invention is an f-board; an organic electro-luminescence element, the organic electro-luminescence element is a surface = connection; a cap with a foot and a bottom cover, and is located on the inner surface of the bottom cover to form A packaging gap area and: containing = cold light of all parts; a high-flow adhesive, ancient weeping, organic electricity borrowing (capillary phenomenon) penetrated into the cover = the seal can be connected by an adhesive The predetermined connection point on the substrate is y °°, and the detailed description of the invention of 5-4: The direction of the present invention to be discussed here is an organic electric cold light ^ 牛 之 封 JO 竹 //

Broken, choke mouth structure. In order to fully understand the detailed steps. Obviously, it will be mentioned in the following description or the technology of optoelectronic elements: the implementation is not limited to the details of well-known process steps in semiconductors. On the other hand, the flying structure elements of the ^ rr are not described in detail to avoid unnecessary sunsets in the present invention. "The limitations of Ding Yi. The preferred embodiment of the present invention will be detailed" It is described as follows, however, in addition to these flat ,,, and multi-anvil # r 卢 甘 ah — ^ field description, the present invention can also be extensively / inadequately ordered in other embodiments', 1U > The scope of the present invention is not limited, and it is subject to the scope of the following patents.

Φ: ΐ ΐ—Figure A and Figure B: As shown in Figure B ′ In the first embodiment of the present invention, Baixian provides an organic electro-luminescence device packaging structure 200. The packaging structure of the organic electroluminescent device includes a substrate 21Q, where the substrate m is at least a transparent material, such as a glass plate. An organic electric light-emitting element 220 is connected to one surface of the substrate 210. A cover 23 with a bottom cover 240 and a foot 25, which is located on a surface of the bottom 240, and the foot 25 separates the bottom cover 24 into a sealing area 2jOA and a package. The gap region 24oβ, wherein the package gap region 24oβ is a region between the edge of the seal 230 and the seal foot 2 5〇, and the seal region 2 4〇Α is a through seal foot 2 5 The groove structure composed of 0 and the bottom cover 240 accommodates the organic electric cold light element 22 0 therein. In addition, the material of the cover 230 includes at least metal, glass or plastic, and the cover 230 can be made by machining. . The south degree of the foot seal 25 is greater than the thickness of the organic electric cold light element 220, and the foot seal 25 is as close as possible to the organic electric cold light element 220 to reduce unnecessary space. Table of the substrate 21 where the component 2 20 is located

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584977

Face to face. On the other hand, a water-absorbing agent may be placed on the surface of the bottom cover 240 where the foot seal 250 is located in the inner space of the sealing area 240A, where the water-absorbing agent contains a phosphorus oxide, for example, P205 (phos〇h 〇rus Adhesive 260, Adhesive 2 60 is pentox i de placed on bottom cover 24〇

In the packaging gap area 240B, and the cover 230 can be connected to a predetermined connection on the substrate 21 with the bottom cover 240 by an adhesive 26, and the organic electric cold light element 2 2 0 is sealed in the internal space of the sealing area 240A. Among them, the adhesive agent 26 is a high-flow adhesive agent, for example, an adhesive agent of 00cps, and the material of the adhesive agent 2600 includes a UV adhesive or a hot adhesive. The above-mentioned packaging structure 2000 is an in-situ packaging process, and the adhesive 26 ° = rainbow 1 principle or capillary phenomenon is introduced into the packaging gap area μ 底 of the bottom cover 24, and then UV It is fixed by light irradiation or heating. In the third picture of McCaw, the second real city that was invented in the first place is the first one. The package of an organic electric cold light element is cold light: the sealing structure of the part includes a transparent substrate 31. :, ::. An organic electroluminescent device 320, the organic electroluminescent device 3 is connected to one surface of the transparent substrate 310, and

320 contains-with transparent ㈣ 丨. The first phase of the surface phase center ~ the first: For example, the first electrode of indium tin oxide (Indium Tin Oxide; 丨, °, the organic light-emitting layer on the-electrode and a continuous,-connected electrode 'and organic electroluminescence The outer surface of the element 320 has a pass = a layer of ancient ... layered on it.-With a bottom cover 340 and c there-the convex area 350 is located in linen > the cover 330 of the second area 350 is located in the bottom 340 On the center of a surface, and

Page 10 584977 V. Description of the invention (7) The peripheral area from the edge of the 33 to the convex area 350 is related to the transparent base: Cheng :? The gap area 360 ′ and the convex area have the same size. In addition, the material of the cover _ is at least or? The glass and seal 330 can be made by machining. Adhesive with nothing 3 ': Adhesive such as '10 Cps, high-flow adhesive: 370 is placed in the sealing space 36 {) of the bottom 340, and the cover is 33 months high, moving adhesive 370 胄 Its bottom cover 34 is connected to the transparent substrate 31, and the pre-connected portion is used to seal the organic electro-luminescence element 32 ° in the space below the protrusion = 35, and the protrusion of the cover 33 () The other surface of the surface organic electric cold light element 320 in the shape region 35 () is in contact with each other. The material of the high-flow adhesive 370 includes a UV adhesive or a hot adhesive. The Zhishi structure 300 adopts the in-situ packaging process, and the adhesive 370 is introduced into the bottom cover 34 by the principle of siphon or capillary phenomenon. It is installed in the gap area 360, and then irradiated or heated by UV The way to stick to the corpse / T fans

士 4 · », T_ 7 days… 《Duji Tiantian J. Capping structure with wave-sealing gap to reduce capping and organic electric cooling light element 7 Ⅱ This can prevent water vapor from penetrating directly to the sealing through the adhesive 』High height, which can avoid the use of traditional manufacturing process =:! I Ming can increase the life of organic electric cold light components. In addition, the present invention utilizes-high-flow adhesive to take # pass, first used High-viscosity adhesive and

π situ Second copy. So 'this method can of course, this may also be used in spears] using capillary phenomenon, it is a better way to incorporate electromechanical cold light components into the package structure. This invention is suitable for inventions, and it can be used for any high-current internal structure. Packaging process, so that the method can meet the process steps and optoelectronics and semiconductor! * ## 、、、 Economic benefits. According to the technology of 70 pieces of dry V body. Can be used in organic electric contact-optical element sealing structure of the packaging of the adhesive to penetrate: ί 门 =, the present invention reduces costs, so far still prevent water and gas deprivation 丨 also has not been developed for use on someone ί In terms of assembly process. For the industry, the packaging structure and manufacturing process of the organic electro-luminescence component

Revised: According to the description in the above embodiment, the present invention may be rationalized. Therefore, in the scope of the appended claims, in addition to the detailed description above, the present invention can also be implemented in other embodiments. The above is only a preferred embodiment of the present invention and is not intended to be used. To limit the scope of patent application of the present invention; all other equivalent changes or modifications made without departing from the spirit disclosed by the present invention should be included in the scope of patent application described below.

Page 584977 Brief description of the diagram The first diagram is a cross-sectional view of the packaging structure of a conventional organic electroluminescent device; the second diagram A is a schematic view of a cover having a trench in the first preferred embodiment of the present invention. A cross-sectional view of a packaging structure of an electromechanical cold-light component; a second plan B is a top view of a packaging structure of an organic electro-luminescence component with a trench cover in a first preferred embodiment of the present invention; a third plan A is based on In the second preferred embodiment of the present invention, a cross-sectional view of a package structure of an organic electro-luminescence element having a substrate with a groove; and FIG. 3B is a diagram showing a groove having a groove in a second preferred embodiment according to the present invention. Top view of the packaging structure of the organic electro-luminescence element of the substrate. Representative symbols of the main parts: 100 organic electroluminescent device 110 substrate 120 organic electroluminescent device 130 cover

140 Water-absorbing agent 150 Cover edge 160 Adhesive 2 0 0 Package structure of organic electric light-emitting element 210 Substrate 584977 Simple illustration 220 Organic electric light-emitting element 230 Cover 240 Bottom cover 240A Sealing area 240B Sealing gap area 250 Sealing foot 260 Adhesive Agent 300 Package structure of organic electroluminescent device 310 Transparent substrate 32 0 Organic electroluminescent device 330 Cover 340 Bottom cover 350 Convex area 360 Packaging gap area 370 Adhesive

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Claims (1)

584977 VI. Application for patent scope 1. A packaging structure of an organic electroluminescent device, the packaging structure of the organic electroluminescent device includes: a substrate; an organic electroluminescent device, the organic electroluminescent device is connected to a surface of the substrate A cover with a bottom cover and a foot, the foot seal is located on a surface of the bottom cover, and the foot seal separates the bottom cover into a sealing area and a packaging gap area, wherein 'the packaging gap The area is the area between the edge of the cover and the foot, and the sealing area is a groove structure composed of the foot and the bottom cover to accommodate the organic electroluminescent device therein; and An adhesive is placed in the packaging gap area of the bottom cover, and the cover can connect the bottom cover to a predetermined connection on the substrate through the adhesive, and cool the organic electricity. The element is sealed in the inner space of the sealed area. 2. The packaging structure of the organic electro-luminescence component described in item 1 of the scope of the patent application, wherein the method of forming the above-mentioned packaging structure is a packaging process of an on-site environment (i η-s i t u). 3. The packaging structure of the organic electroluminescent device according to item 1 of the scope of patent application, wherein the above substrate further comprises a transparent material. 4. The packaging junction of the organic electro-luminescence component as described in item 3 of the scope of patent application Page 15 584977 6. The scope of patent application, in which the above-mentioned transparent material further includes a glass material. 5. The package structure of the organic electroluminescent device according to item 1 of the scope of the patent application, wherein the organic electroluminescent device includes at least: a first electrode 'the first electrode is connected to the surface of the substrate to emit organic light Layer, the organic light-emitting layer is connected to the first electrode: and a second electrode, the second electrode is connected to the organic cold-light material layer 6. The package of the organic electric cold-light element as described in the first patent application scope Structure, wherein the material of the above cover further includes a metal material. 7. The packaging structure of the organic electro-luminescence device described in item 1 of the scope of the patent application, wherein the material of the aforementioned cover further comprises a glass material. (I 8. The packaging structure of the organic electroluminescent device according to item 1 in the scope of the patent application, wherein the height of the above-mentioned sealing foot is greater than the thickness of the organic electroluminescent device. 9. As described in the item 1 of the scope of patent application In the packaging structure of the organic electroluminescent device, the bottom of the above-mentioned sealing pin is approximately in contact with the surface of the substrate on which the organic electroluminescent device is located. Page 16 584977 Sixth, the scope of patent application Fan Li special application, please apply for the seal if the package is suctioned, and the agent will absorb light. The cold-covered electric enveloping machine has an empty cover that covers the item in the bottom of the department. The cover of the foot of the cover should be described in the middle position. 11. If the scope of the patent application is The packaging structure of the organic electroluminescent device according to item 10, wherein the water absorbing agent further includes a moth oxide. 1 2. The encapsulation structure of the organic electro-luminescence component according to item 1 of the scope of the patent application, wherein the above-mentioned adhesive is a high-flow adhesive. 1 3. The packaging structure of the organic electroluminescent device as described in item 12 of the scope of the patent application, wherein the high-flow adhesive further includes an adhesive having a viscosity of about 100 c p s. 1 4. The packaging structure of the organic electro-luminescence device according to item 1 of the scope of the patent application, wherein the above adhesive further comprises a UV adhesive. 1 5. The packaging structure of the organic electro-luminescence element according to item 1 of the scope of the patent application, wherein the above-mentioned adhesive is introduced into the packaging gap region by the principle of siphon. 1 6. The packaging structure of the organic electro-luminescence device described in item 1 of the scope of the patent application, wherein the above-mentioned method for fixing the adhesive further includes a UV light irradiation process Page 17 584977 VI. Scope of patent application 1 7. The packaging structure of the organic electro-luminescence component described in item 1 of the scope of patent application, wherein the above-mentioned method of fixing the adhesive further includes a heating process. 1 8. A packaging structure of an organic electroluminescent device, the packaging structure of the organic electroluminescent device includes: a substrate; an organic electroluminescent device, the organic electroluminescent device is connected to a surface of the substrate; The bottom cover and a cover of a convex area, the convex area is located at the center of one surface of the bottom cover, and the peripheral area between the edge of the cover and the convex area forms a substrate with the substrate. A packaging gap area; and an adhesive, the adhesive is placed in the packaging gap area of the bottom cover, and the cover can connect the bottom cover to a predetermined connection on the substrate through the adhesive, and The organic electro-luminescence element is sealed in a space below the convex region. 19 9. The packaging structure of the organic electro-luminescence component as described in item 18 of the scope of the patent application, wherein the method of forming the above-mentioned packaging structure is a packaging process of an on-site environment (i η-s i t u). 2 0. The package structure of the organic electroluminescent device as described in item 18 of the scope of the patent application, wherein the above-mentioned substrate further includes a transparent material. Page 18 584977 VI. Scope of Patent Application 2 1 · The package structure of the organic electroluminescent device as described in Item 20 of the scope of patent application, wherein the above transparent material further includes a glass material. 2 2 · The package structure of the organic electroluminescent device as described in item 18 of the scope of the patent application, wherein the organic electroluminescent device includes at least a first electrode 'the first electrode is in phase relation to the surface of the substrate An organic light emitting layer is connected, the organic light emitting layer is connected to the first electrode, a second electrode is connected to the organic cold light material layer, and a protective layer is covered with the protective layer. Organic electrical cold light elements on the surrounding surface. 2 3. The packaging structure of the organic electro-luminescence device according to item 18 of the scope of the patent application, wherein the material of the aforementioned cover further includes a metal material. 2 4. The packaging structure of the organic electro-luminescence device according to item 18 of the scope of the patent application, wherein the material of the aforementioned cover further comprises a glass material. 25. The package structure of the organic electroluminescent device according to item 18 of the scope of the patent application, wherein the surface of the above-mentioned convex region is approximately in contact with the other surface of the organic electroluminescent device. Page 19 584977 6. Scope of patent application 2 6. The package structure of the organic electroluminescent device as described in item 18 of the patent application scope, wherein the above-mentioned convex area is about the same size as the organic electroluminescent device. 2 7. The packaging structure of the organic electro-luminescence device according to item 18 of the scope of the patent application, wherein the above-mentioned adhesive is a high-flow adhesive. 2 8. The packaging structure of the organic electroluminescent device according to item 27 in the scope of the patent application, wherein the high-flow adhesive further includes an adhesive having a viscosity of about g 1 0 0 c p s. 2 9. The packaging structure of the organic electroluminescent device according to item 18 of the scope of the patent application, wherein the adhesive further includes a UV adhesive. 30. The packaging structure of the organic electro-luminescence device according to item 18 of the scope of the patent application, wherein the adhesive further includes a hot adhesive. 3 1. The package structure of the organic electro-luminescence component as described in item 18 of the scope of patent application, wherein the above-mentioned adhesive is introduced into the package gap region by capillary phenomenon. 3 2. The package structure of the organic electroluminescent device described in item 18 of the scope of patent application, wherein the above-mentioned method of fixing the adhesive further includes a UV light irradiation system 584977 6. The scope of patent application. 3 3. The packaging structure of the organic electro-luminescence device according to item 18 of the scope of the patent application, wherein the above-mentioned method for fixing the adhesive further includes a heating process. 3 4. A capping structure for an organic electric cold light element, the capping structure of the organic electric cold light element includes: a bottom cover; a convex area, the convex area is located at a central position on one surface of the bottom cover And the surface of the convex region is in contact with the surface of the organic electro-luminescence element; and a packaging gap region is a peripheral region between the edge of the cover and the convex region, and the The packaging gap area is used to place an adhesive, and the bottom cover is connected to a predetermined connection on the substrate by the adhesive. 3 5. The cover structure of the organic electric cold light element according to item 34 of the scope of the patent application, wherein the material of the above cover further includes a metal material. 3 6. The cover structure of the organic electro-luminescence element according to item 34 of the scope of the patent application, wherein the material of the above cover further comprises a glass material. 37. The cover structure of the organic electric cold light element according to item 34 of the scope of the patent application, wherein the material of the above cover further comprises a plastic material. Page 21 584977 VI. Scope of patent application 3 8. The cover structure of the organic electroluminescent device as described in item 34 of the patent application scope, wherein the convex area is about the same size as the organic electroluminescent device. 3 9. A capping structure of an organic electric cold light element, the capping structure of the organic electric cold light element includes: a bottom cover; a foot, the foot is located on a surface of the bottom cover; a sealing area, The sealing area is a groove structure composed of the sealing foot and the bottom cover to accommodate the organic electroluminescent light element therein; and a packaging gap area, the packaging gap area is from the edge of the cover to the The area between the sealing feet, wherein the packaging gap area can contain an adhesive therein, and the cover can connect the bottom cover to a predetermined connection place on the substrate by using an adhesive, and seal the organic electric cold light element In the internal space of the sealed area, the cover structure of the organic electro-luminescence element as described in item 39 of the patent application scope, wherein the material of the cover further includes a metal material. 4 1. The cover structure of the organic electro-luminescence element according to item 39 of the scope of patent application, wherein the material of the above cover further comprises a glass material. 4 2. The cover of the organic electric cold light element as described in item 39 of the scope of patent application Page 22 584977 VI. Scope of patent application Structure, in which the material of the above cover includes a plastic material. 4 3. The cover structure of the organic electroluminescent device as described in item 39 of the scope of patent application, wherein the height of the above-mentioned sealing foot is greater than the thickness of the organic electroluminescent device. 4 4. The cover structure of the organic electroluminescent device according to item 39 of the scope of the patent application, wherein the bottom of the above-mentioned sealing foot is approximately in contact with the surface of the substrate on which the organic electroluminescent device is located. 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