TW578291B - Method of self-latching for adhesion during self-assembly of electronic or optical components - Google Patents

Method of self-latching for adhesion during self-assembly of electronic or optical components Download PDF

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TW578291B
TW578291B TW91121975A TW91121975A TW578291B TW 578291 B TW578291 B TW 578291B TW 91121975 A TW91121975 A TW 91121975A TW 91121975 A TW91121975 A TW 91121975A TW 578291 B TW578291 B TW 578291B
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Taiwan
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substrate
components
initiator
hydrophilic
water
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TW91121975A
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Chinese (zh)
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Andrew T Hunter
Peter D Brewer
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Hrl Lab Llc
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Abstract

A method for assembling components on a substrate including the steps of: (a) selectively coating at least a first receptor site of the substrate with a liquid precursor that forms a solid adhesive upon contact with an initiator; (b) providing each of the components with an adhesion surface that has the initiator; and (c) depositing the components on the substrate in a manner that causes a first of the components to contact the at least first receptor site whereupon contact between the initiator and the liquid precursor causes formation of the adhesive which affixes the first compound to the first receptor site. In a preferred embodiment of the invention, the precursor is a liquid monomer and the initiator initiates a polymerization reaction upon contact with the monomer to form a solid polymer.

Description

578291578291

五、發明說明(l ) 1明範疇 本發明係有關於一種用於自我組合微結構之方法,特 定言之,本發明有關於將組件自我組合及黏合至微結構。 更特定言之,本發明有關於在自我組合步驟期間將組件永 久性附接至微結構。 1明背景 在自我組合程序中,可以組合組件而不需特定以一特 殊構造來放置組件。因為所需要的構造係為系統可取得的 最低能量狀態,組件係以一特殊構造組合。 特佛(Terfort)等人(公厘尺度組件的立體性自我組合, Nature Vol.386,1997年3月13曰第162至164頁)描述一種藉 由生成親水性及斥水性表面來自我組合微結構之程序,斥 水性表面彼此黏合,且一液體作為潤滑劑以讓組件藉由侧 向移動來調整彼此位置,可以一光聚合性黏劑來濕潤組 件。系統趨近均衡之後,系統暴露於紫外光輻射且組件附 接成為永久形式。 美國專利5,824,186號及相關專利案描述利用一共晶 層(金、銀、焊料)在傳送步驟後的一加熱步驟進行接合。 習知技藝亦描述在自我定位式物體中達成鎖定之方 法,譬如包含使用一紫外光聚合性黏劑、使用一金屬焊料 在足以融化焊料的夠尚溫度完成組合、或使用藉由加熱或 冷凍處於位置中的組件來硬化組合用之聚合性塗層。上述 各種方法中,在自我定位組合步驟完成之後,進行另一加 工步驟以將物體永久性鎖定在位置中。對於紫外光聚合性V. Description of the Invention (1) 1 Field of the Invention The present invention relates to a method for self-assembling microstructures. In particular, the present invention relates to self-assembling and adhering components to microstructures. More specifically, the invention relates to the permanent attachment of components to microstructures during the self-assembling step. 1 Bright background In a self-assembling program, components can be combined without placing the components in a special structure. Because the required structure is the lowest energy state available to the system, the components are assembled in a special structure. Terfort et al. (Three-dimensional self-assembly of millimeter-scale components, Nature Vol. 386, March 13, 1997, pages 162-164) describe a self-assembling micro-assembly by generating hydrophilic and water-repellent surfaces. In the structural procedure, the water-repellent surfaces are adhered to each other, and a liquid is used as a lubricant to allow the components to adjust each other's position by lateral movement, and a photopolymerizable adhesive can be used to wet the components. As the system approaches equilibrium, the system is exposed to ultraviolet radiation and the components attach to a permanent form. U.S. Patent No. 5,824,186 and related patents describe the use of a eutectic layer (gold, silver, solder) for bonding in a heating step after the transfer step. Conventional techniques also describe methods for achieving locking in self-positioning objects, such as including the use of a UV-polymerizable adhesive, the use of a metal solder at a temperature sufficient to melt the solder, or the use of heat or freezing The components in place to harden the polymerizable coating used in combination. In each of the above methods, after the self-positioning combination step is completed, another processing step is performed to permanently lock the object in place. For UV photopolymerization

578291 五、發明說明(2 ) 黏劑,系統必須暴露於紫外光一段時間,且組合物體及塗 層必須對於紫外光波長呈現透明。對於使用焊料的系統, 系統必須冷卻至焊料的融化溫度以下。對於熱聚合式系 統’黏劑只在組合完成後才硬化。 發明人未獲悉任何在組合程序期間發生永久性黏合之 自我組合系統,發明人亦不知道任何其他可以在各別的元 件或組件定位在一基材的一適當位置中或上時選擇性硬化 一黏劑之技術。 發明概沭 本發明係有關於一種用於將物體組合在一基材上之方 法’特定言之,此方法有關於藉以將一物體附接至一基材 之自我組合。更特定言之,此方法有關於自我組合以及將 一物體附接至一基材上或中的一插座。本發明之一優點在 於:一旦物體自我定位在基材上或基材上的一插座上或中 時’不需要其他步驟使物體永久性附接至基材或插座。在 本申請案中可交換使用“自我定位,,、“自我組合,,及“自我組 裝”等名稱。 根據本發明提供一種用於將組件組合在一基材上之方 法,此方法包含以下步驟ya)以一前軀物選擇性塗覆基材 的至少一第一受體位址而在與一引發劑接觸時形成一固體 黏劑;⑻各組件設有一包含引發劑的黏合表面;及⑷組件 /儿積在基材上的方式可造成一第一組件接觸至少第一受體 位址,此時引發劑與液體前軀物之間的接觸係使黏劑形成 而將第一化合物附接至第一受體位址。578291 V. Description of the invention (2) Adhesive, the system must be exposed to ultraviolet light for a period of time, and the combined object and coating must be transparent to the wavelength of ultraviolet light. For systems using solder, the system must be cooled below the melting temperature of the solder. In the case of thermally polymerized systems, the adhesive is hardened only after the composition is completed. The inventor is not aware of any self-assembling system that permanently adheres during the assembly process, nor is the inventor aware of any other that can selectively harden when individual components or components are positioned in or on an appropriate position on a substrate. Adhesive technology. SUMMARY OF THE INVENTION The present invention relates, in particular, to a method for combining objects on a substrate, specifically, this method relates to self-assembly by which an object is attached to a substrate. More specifically, this method is about self-assembly and attaching an object to or in a socket on a substrate. One advantage of the present invention is that once an object is self-positioned on or in a socket on or on a substrate ', no additional steps are required to permanently attach the object to the substrate or socket. In this application, the terms "self-localization," "self-assembly," and "self-assembly" are used interchangeably. According to the present invention, a method for assembling a component on a substrate is provided. The method includes the following steps: ya) selectively coating at least a first acceptor address of the substrate with a precursor to initiate a A solid adhesive is formed when the agent is contacted; each component is provided with a bonding surface containing an initiator; and the manner in which the component / child accumulates on the substrate can cause a first component to contact at least the first receptor address. The contact between the initiator and the liquid precursor causes an adhesive to form to attach the first compound to the first acceptor site.

578291578291

五、發明說明(3 )V. Description of the invention (3)

本發明的一項實施例中,步驟(c)包含將一種含有一載 體流體及複數個組件之漿體沉積在基材上,前軀物及引發 劑係與載體流體不相混合,組件的黏合表面在前軀物中具 有比在載體流體中更低的表面能。第一受體位址可具有一 親水性表面且在第一受體位址周圍具有一斥水性區域,或 者第一受體位址可具有一斥水性表面且在第一受體位址周 圍具有一親水性區域。若第一受體位址的表面為親水性, 各組件的黏合表面係包含吸引至第一受體位址的表面之一 親水性材料;若第一受體位址的表面為斥水性,各組件的 黏合表面係包含吸引至第一受體位址的表面之一斥水性材 料。本發明的一項較佳實施例中,第一受體位址的表面為 親水性且在第一受體位址周圍的區域為斥水性,各組件的 黏合表面包含親水性材料。In an embodiment of the present invention, step (c) includes depositing a slurry containing a carrier fluid and a plurality of components on a substrate, the precursor and the initiator are not mixed with the carrier fluid, and the components are adhered. The surface has a lower surface energy in the precursor than in the carrier fluid. The first acceptor site may have a hydrophilic surface and have a water-repellent region around the first acceptor site, or the first acceptor site may have a water-repellent surface and have a surround around the first acceptor site A hydrophilic region. If the surface of the first acceptor site is hydrophilic, the bonding surface of each component includes a hydrophilic material attracted to the surface of the first acceptor site; if the surface of the first acceptor site is water repellent, each The adhesive surface of the component comprises a water-repellent material that is one of the surfaces attracted to the first acceptor site. In a preferred embodiment of the present invention, the surface of the first acceptor site is hydrophilic and the area around the first acceptor site is water-repellent, and the bonding surface of each component includes a hydrophilic material.

本發明的另一項較佳實施例中,前軀物係為一液體單 體,且引發劑在接觸到單體時引發一聚合反應以形成一固 體聚合物。前軀物譬如可為一種環氧化物單體,且引發劑 可為一種鹼(base)藉以在接觸到單體時引發一聚合反應以 形成固體聚合物。或者,前軀物譬如可為一液體氰基丙烯 酸酯(cyanoarylate)單體,且引發劑包含一弱鹼以在接觸單 體時引發聚合反應形成一固體聚合物,弱鹼可選自包含由 銨、胺、醇或醚所選出的一官能基之分子。一項較佳實施 例中,本發明包含藉由將一金膜沉積在組件上然後將一種 具有化學式HS(CH2)nX(其中X=NH2或〇Hin=5_2〇)的烷基 化合物施加至金膜形成藉由一胺或醇部份加以官能化之一 6 578291 五、發明說明(5 ) 所界定,其可由用於產生親水性或斥水性的局部區域微影 及/或化學技術形成並分別由一斥水性或親水性的基材區 域所圍繞,並可能為一凹部、可能相對於基材大致呈平坦、 或甚至可能從基材凸起。 基材上的插座係由諸如蝕刻遮罩、或選擇性塗覆等此 技藝習知的方法所形成。一旦插座形成之後,基材受到處 理使得插座為親水性且圍繞插座的區域為斥水性;或反之 亦然。“組合流體”或“載體流體,,可交換用來指稱插座周圍 所使用之流體,且可使用其他名稱來指稱這些流體。 本發明的一項較佳實施例中,在插座上及物體的黏合 表面上使用親水性塗層,因此,一物體可能有一表面或側 預疋作為接觸或黏合至受體位址之表面,本文所用的“黏合 表面係4曰此表面,為了確保只有黏合表面黏附至受體,本 發明的一項較佳實施例中,黏合表面應有一親水性塗層, 但非黏合表面應有斥水性塗層(若黏劑使用兩種極性材 料,則位於一非極性組合流體中),這將確使正確的表面黏 合至插座。(在一前軀物組合流體中使用一非極性前軀物及 引發劑之本發明的另一項實施例中,黏合表面應為斥水 性,而物體上的其他表面應為親水性),較佳實施例中,附 接至插座或基材之一物體的黏合表面係塗覆有一親水性材 料,一不同的親水性材料施加至插座,藉由物體自我定位 在正確位置(諸如插座中)而引發將物體附接在位置中之程 序,由於親水性塗層與基材或插座上的親水性材料之間的 介面能降低而發生將物體自我組合至基材的作用。In another preferred embodiment of the present invention, the precursor is a liquid monomer, and the initiator initiates a polymerization reaction to form a solid polymer when it contacts the monomer. The precursor may be, for example, an epoxide monomer, and the initiator may be a base by which a polymerization reaction is initiated upon contact with the monomer to form a solid polymer. Alternatively, the precursor may be, for example, a liquid cyanoarylate monomer, and the initiator includes a weak base to initiate a polymerization reaction when the monomer is contacted to form a solid polymer. The weak base may be selected from the group consisting of ammonium , Amine, alcohol or ether selected monofunctional molecule. In a preferred embodiment, the present invention includes applying an alkyl compound having a chemical formula HS (CH2) nX (where X = NH2 or OHin = 5_2〇) to gold by depositing a gold film on the device. Membrane formation is performed by monofunctionalization of an amine or alcohol moiety. 6 578291 V. As defined in the description of the invention (5), it can be formed by local area lithography and / or chemical techniques used to generate hydrophilicity or water repellency and separate Surrounded by a region of the substrate that is water-repellent or hydrophilic, and may be a recess, may be substantially flat relative to the substrate, or may even protrude from the substrate. The socket on the substrate is formed by a method known in the art such as an etch mask or selective coating. Once the socket is formed, the substrate is treated so that the socket is hydrophilic and the area surrounding the socket is water repellent; or vice versa. "Combined fluid" or "carrier fluid" can be used interchangeably to refer to the fluid used around the socket, and other names can be used to refer to these fluids. In a preferred embodiment of the present invention, the adhesion of the socket and the object A hydrophilic coating is used on the surface. Therefore, an object may have a surface or side that is preliminarily contacted or adhered to the surface of the receptor site. The "adhesive surface" used in this article refers to this surface. In order to ensure that only the adhesive surface adheres to the surface Receptor, in a preferred embodiment of the present invention, the adhesive surface should have a hydrophilic coating, but the non-adhesive surface should have a water-repellent coating (if the adhesive uses two polar materials, it is located in a non-polar combined fluid Middle), this will ensure that the correct surface is glued to the socket. (In another embodiment of the present invention using a non-polar precursor and initiator in a precursor composition fluid, the bonding surface should be water-repellent, and the other surfaces on the object should be hydrophilic). In a preferred embodiment, the adhesive surface of an object attached to a socket or a substrate is coated with a hydrophilic material, and a different hydrophilic material is applied to the socket by positioning the object in the correct position (such as in the socket). The process of attaching the object in place is initiated, and the effect of self-assembling the object to the substrate occurs because the interface between the hydrophilic coating and the hydrophilic material on the substrate or socket can be reduced.

五、發明說明(6 ) 當親水性塗層使用於插座上及物體的黏合表面上時, 應使所有非黏合表面皆為斥水性,如此可讓兩份式黏劑使 用極性材料。另一替代性實施例中,對於插座及物體的黏 合表面使用斥水性塗層,在周遭表面上使用親水性塗層, 如此需要使用非極性黏劑。 可由數種技術來形成插座,本發明一項較佳實施例 中,一插座具有親水性的重要屬性而周遭基材則為斥水 性。此性質使得:當基材浸入非極性組合流體時,插座受 到極性黏劑選擇性濕潤。熟悉此技藝者瞭解許多種使表面 成為親水性或斥水性之方式,本發明採用令一區域呈現親 水性之方法,此等方法可與需使相鄰區域呈現斥水性之步 驟相容。其中一種範例為:利用標準技術將8丨上的Au加以 圖案化、利用一種過氧化氫處理來氧化已暴露的Si(使得si 表面成為親水性)、然後將Au表面浸於一硫醇/醇混合物以 使Au表面成為斥水性,經氧化的以區在硫醇/醇處理全程保 持親水性。 使原先斥水性基材上的插座成為親水性之另一種可能 方式係採用Imidex膜,亦即聚醯亞胺熱塑性塑膠(Iniidex為 奇異公司(General Electric Company Corporation)的註冊商 標),此材料在收到時為斥水性並在暴露於氧電漿之後變成 親水性,發明人已使用微影技術以圖案化光阻來保護基材 不受到電漿,所以只有插座受到暴光。發明人已證實電漿 暴光令插座呈現親水性,同時基材的其餘部份仍為斥水性。 具有數種三氯矽烷化合物包含可分別依據終端基團是 9 578291V. Explanation of the invention (6) When the hydrophilic coating is used on the socket and the adhesive surface of the object, all non-adhesive surfaces should be water-repellent, so that the two-part adhesive can use polar materials. In another alternative embodiment, a water-repellent coating is used for the adhesive surface of the socket and the object, and a hydrophilic coating is used on the surrounding surface. This requires the use of a non-polar adhesive. The socket can be formed by several techniques. In a preferred embodiment of the present invention, a socket has the important property of hydrophilicity and the surrounding substrate is water repellent. This property allows the socket to be selectively wetted by a polar adhesive when the substrate is immersed in a non-polar combination fluid. Those skilled in the art understand many ways to make a surface hydrophilic or water-repellent. The present invention adopts methods to make a region hydrophilic, and these methods are compatible with the steps that need to make adjacent regions water-repellent. One example is: patterning Au on 8 丨 using standard techniques, oxidizing exposed Si with a hydrogen peroxide treatment (making the si surface hydrophilic), and immersing the Au surface in a thiol / alcohol The mixture was made to make the Au surface water-repellent, and the oxidized region was kept hydrophilic throughout the thiol / alcohol treatment. Another possible way to make the socket on the original water-repellent substrate hydrophilic is to use Imidex film, which is polyimide thermoplastic (Iniidex is a registered trademark of General Electric Company Corporation). At that time, it was water-repellent and became hydrophilic after being exposed to oxygen plasma. The inventors have used lithography technology to pattern the photoresist to protect the substrate from the plasma, so only the socket is exposed to light. The inventors have confirmed that plasma exposure makes the socket hydrophilic while the rest of the substrate is still water repellent. Has several trichlorosilane compounds containing 9 578291

五、發明說明(7 ) 極性或非極性而使Si或玻璃表面成為親水性或斥水性之有 機性終端基團,熟悉此技藝者可依慣例將此類塗層加以圖 案化以在一基材上生成插座。 在與本申請案同曰申請之共同審查中名稱為“用於組 合具互補形狀的插座位址與元件微結構之方法,,的申請案V. Description of the invention (7) Polar or non-polar makes the surface of Si or glass hydrophilic or water-repellent organic terminal group. Those skilled in the art can pattern such coatings in accordance with conventional practices to form a substrate. On the build socket. In the joint examination of the same application as this application, the application named "Method for Combining Socket Addresses and Component Microstructures with Complementary Shapes,"

------號(此案内容以引用方式併入本文中)中,發明人PD------ (the content of this case is incorporated herein by reference), the inventor PD

布祿爾(Brewer)、Α·Τ·杭特(Hunter)、L M 戴可(Deckard)描 述可用以自我組合之插座且其中物體及插座具有相配合的 幵>/狀該發明藉由立體形狀匹配將物體位置驅迫至插座 上,此方法包含:(a)提供複數個微結構組件,各組件具有 一呈現相同立體形狀的底部;(b) 一模子自一表面形成有至 少一突部,所以此至少一突部具有相同形狀;(勾以模子模 製一可模製基材以形成一模製基材,此模製基材的一表面 中係包含具有相同形狀的至少一凹部;及(d)將複數個微結 構組件中的第一者定位在該至少一凹部内。定位步驟可能 包含:微結構組件與一流體混合以形成一漿體;及漿體沉 積在模製基材的表面上以使複數個微結構組件中的第一者 自我對準於凹部中。雖然本發明不需使用立體形狀的插 座 了口併使用本申請案及共同審查申請案之技術來改善 組合操作的良率。 本發明的一項較佳實施例中使用一種二份式黏劑系 統’其中在一組合或載體流體中將引發劑或硬化劑運送至 小物體或組件上,本發明的較佳實施例中,這些二份式系 統具有下列主要要件:Brewer, Hunter, LM, Deckard describe a socket that can be self-assembled and in which objects and sockets have a matching 幵 > / shape The invention uses a three-dimensional shape The method of driving the object onto the socket by matching includes: (a) providing a plurality of microstructure components, each component having a bottom having the same three-dimensional shape; (b) a mold having at least one protrusion formed from a surface, Therefore, the at least one protrusion has the same shape; (a mold is used to mold a moldable substrate to form a molded substrate, and one surface of the molded substrate includes at least one recess having the same shape; and (D) positioning a first one of the plurality of microstructured components in the at least one recess. The positioning step may include: mixing the microstructured component with a fluid to form a slurry; and depositing the slurry on the molding substrate On the surface, the first of the plurality of microstructured components is self-aligned in the recess. Although the present invention does not need to use a three-dimensional shaped socket and uses the technology of this application and joint examination of applications to improve the combination operation In a preferred embodiment of the present invention, a two-part adhesive system is used in which the initiator or hardener is delivered to a small object or component in a combination or carrier fluid. In the embodiment, these two-part systems have the following main requirements:

10 578291 五、發明說明(8 ) a) 施加至插座的親水性材料以及用於塗覆物體的親水 性材料應該不可溶於組合或載體流體中; b) 施加至插座的親水性材料在組合或載體流體中應該 優先濕潤插座,且塗覆在物體上的親水性材料係必須選擇 性濕潤組合流體中的小組合; c) 較佳藉由使用液體膜時物體易因毛細力相互黏附之 作用使得物體受到塗覆。 本發明的較佳實施例中,基材上的插座係由一種身為 固體聚合物的單體或未聚合化前躺物之物質加以處理,利 用此技藝習知的濕潤技術達成選擇性濕潤以將此未聚合化 前軀物或單體放置在插座位址中或上。固體聚合物的單體 或未聚合化前軀物較佳係為一液體。 附接在插座之物體係塗覆有一種身為聚合反應的引發 劑或為硬化劑之親水性材料,本文的“引發劑,,與“硬化劑” 可交換使用,這些材料係引發聚合反應。當經塗覆的物體 自我定位至插座時係接觸到液體前軀物或單體,物體本身 將對準且藉由毛細力而黏合,經塗覆物體與液體前軀物或 單體之間的接觸係引發聚合反應,未聚合化單體與前軀物 以及引發劑或硬化劑的合併係形成一種黏劑藉以將物體鎖 定或附接在位置中。 插座上的未聚合化前軀物或單體以及塗覆在物體上的 引發劑應該與載體流體不相混合,且聚合反應的引發劑之 表面能在未聚合化前軀物中應該比在載體流體中更低。未 聚合化前軀物或單體較佳為一種極性流體,一較佳前軀物10 578291 V. Description of the invention (8) a) The hydrophilic material applied to the socket and the hydrophilic material used for coating the object should be insoluble in the combination or carrier fluid; b) The hydrophilic material applied to the socket is in the combination or The socket should be preferentially wetted in the carrier fluid, and the hydrophilic material coated on the object must selectively wet the small combination in the combined fluid; c) It is better to make the objects easily adhere to each other due to capillary forces when using a liquid film to make The object is coated. In a preferred embodiment of the present invention, the socket on the substrate is treated by a solid polymer monomer or a material that has not been polymerized before lying. The humidification technique known in this technology is used to achieve selective wetting. Place this unpolymerized precursor or monomer in or on the socket address. The monomer or unpolymerized precursor of the solid polymer is preferably a liquid. The system attached to the socket is coated with a hydrophilic material that is a polymerization initiator or a hardener. The "initiator" herein is used interchangeably with the "hardener", and these materials initiate the polymerization reaction. When the coated object self-locates to the socket, it comes into contact with the liquid precursor or monomer. The object itself will be aligned and adhered by capillary force. The contact system initiates the polymerization reaction, and the combination of the unpolymerized monomer and the precursor and the initiator or hardener forms a kind of adhesive to lock or attach the object in place. The unpolymerized precursor or unit on the socket The initiator and the initiator coated on the object should not be mixed with the carrier fluid, and the surface energy of the polymerization initiator should be lower in the unpolymerized precursor than in the carrier fluid. The unpolymerized precursor Or the monomer is preferably a polar fluid, a preferred precursor

11 五、發明說明(9 ) 為氰基丙稀㈣,料氰基丙稀酉吏m戈氛基丙婦酸乙 酯。氰基丙稀酸酯在出現諸如水等弱鹼情形下進行陰離子 性聚合,所文所用的“0H根”(亦即〇ίΓ)係象徵一弱鹼,弱 鹼的其他範例為銨(ΝΗ3)、胺(R-NH2)、醇戊_〇11)、及醚 (R-0-R ),其中R代表一有機根(譬如甲基、乙基 (C2H5-)等)。通常藉由Si-〇H來處理留在空氣中的玻璃或11 V. Description of the invention (9) It is cyanopropane, and the material is cyanopropionate. Cyanopropionic acid esters undergo anionic polymerization in the presence of weak bases such as water. The "0H" (also known as 〇ΓΓ) used in this article represents a weak base. Other examples of weak bases are ammonium (ΝΗ3) , Amine (R-NH2), pentyl alcohol_11), and ether (R-0-R), where R represents an organic root (such as methyl, ethyl (C2H5-), etc.). Si-OH is usually used to treat glass or

Si〇2表面,此表面為弱鹼性並在本發明的一項實施例中引 發聚合反應。 除氰基丙烯酸酯以外具有可作為單體之其他化合物, 只要此等化合物可在自我組合程序冑間引發聚合反應即 可。基於上述因素,需要諸如紫外線暴光、脈衝式加熱、 或添加一化學引發劑等外部手段或額外步驟之其他途徑並 不理想。氰基丙烯酸酯的一項優點為··受組合的組件表面 上之水或其他弱驗係引發聚合反應。 在身為氰基丙烯酸酯及痕量水實施例的變化之一項實 施例中,受組合的組件表面係特定預先裝有一弱鹼性官能 基,此實施例係如下述方式藉由確保出現一引發劑來改善 黏合程序的可靠度。 使用藉由極弱鹼所聚合的氰基丙烯酸酯作為黏劑需考 慮到·除非採取特殊措施,〇H_或可出現在幾乎任何親 水性表面上。可將水從空氣吸收至這些表面上、或與表面 起反應而留在OH·中終止,這隨後將引發聚合反應。可利 用此性質而不再需妻以一弱驗來塗覆組件,組件可包含從 空氣吸收且在接觸到插座中的氰基丙烯酸酯時足以引發聚 578291 五、發明說明(ίο ) 合反應之ΟΙΓ。但利用此技術的缺點係為:必須小心確保 引發劑不出現在插座表面上;或如果出現的話,則添加引 發劑之前出現在插座表面上的量並不足以硬化氰基丙烯酸The surface of SiO2, which is weakly alkaline and initiates a polymerization reaction in one embodiment of the present invention. In addition to cyanoacrylate, there are other compounds that can be used as monomers, so long as these compounds can initiate polymerization during the self-assembly procedure. Based on the above factors, other means such as UV exposure, pulsed heating, or the addition of a chemical initiator or other steps are not ideal. One of the advantages of cyanoacrylates is that water or other weak systems on the surface of the assembled component initiate polymerization. In an embodiment that is a variation of the cyanoacrylate and trace water embodiment, the surface of the combined component is specifically pre-loaded with a weakly basic functional group. This embodiment is performed by ensuring that a Initiator to improve the reliability of the bonding process. The use of cyanoacrylates polymerized with very weak bases as adhesives requires that, unless special measures are taken, OH may appear on almost any hydrophilic surface. Water can be absorbed from the air onto these surfaces, or reacted with the surface and left in OH · to terminate, which will then initiate a polymerization reaction. This property can be used without the need to coat the component with a weak test. The component can contain cyanoacrylate which is absorbed from the air and is sufficient to trigger the poly when exposed to the cyanoacrylate in the socket. ΟΙΓ. However, the disadvantages of using this technology are: care must be taken to ensure that the initiator does not appear on the surface of the socket; or, if it does, the amount that appears on the surface of the socket before the initiator is added is not sufficient to harden the cyanoacrylic acid

為了避免來自空氣的水在組件組合之前造成插座中的 氰基丙烯酸酯產生硬化之可能性,本發明的一項較佳實施 例係包含一項處理黏合表面及插座(而非仰賴表面與出現 在空氣中的痕量水之反應)以提供具有所需要性質的表面 之分離步驟。此較佳實施例係使用氰基丙烯酸酯作為黏 劑,但刻意使得組合物體的黏合表面受到處理以附接極性 引發劑,並處理此等插座確實成為極性,但在組合物體上 添加引發劑之前並未引發聚合反應。製備組合物體的黏合 表面時可能使用一 All層,此Au層係載有以弱鹼終止的烷基 硫醇分子。插座的形成係可能使用一種具有以酯終止的烷 基硫醇分子之類似程序。此較佳實施例所使用之弱鹼性引 發劑範例係包括結束於胺(R_NH2)或醇基團之分 子。此實施例的一種實行方式係將金(Au)膜沉積在組件底 側(約100〇A)、然後使烷基硫醇化合物(HS(CH2)n-X,其中 X - NH2或OH且n=5-20)與金表面起反應。烷基硫醇可能藉 由與諸如乙醇或甲醇等醇混合而以稀釋形式(<1%)施加至 金表面,烷基硫醇與金的反應可在室溫進行並可花費約24 小時以完成表面的單層覆蓋,此程序生成藉由胺或醇引發 劑加以官能化的一金表面,胺或醇引發劑係構成附接至八以 表面之硫醇分子的終端基團。藉由組件的塗覆可在組合時 13 578291 五、發明說明(11 ) 確實進行氰基丙烯酸酯聚合。 製備親水性插座時,這些插座的表面可塗覆有不引發 亦不抑制聚合反應之物質,其中一項範例係使用一 Au表面 來界定插座,然後使用一酯終止式烷基硫醇分子來塗覆插 座。此表面應為親水性(由於終端基團的極性本質),但其 鹼性不足以引發聚合反應。 環氧化物為可使用於本發明中的單體化合物之另一範 例,這些分子亦經歷藉由添加諸如胺(R-NH2)或甲醇鈉 (NaOCH3)等溫和強度的鹼化合物所引發的陰離子性聚合 反應。此實施例中,環氧樹脂化合物可選擇性塗覆在插座 位址的表面上,且組件可塗覆有胺引發劑化合物。此情形 中所採用的環氧樹脂化合物可為低分子量聚合物,所以可 使製成的環氧樹脂化合物具有低黏度,此實施例很像氰基 丙烯酸酯實施例,但需要更強的鹼來引發聚合反應(此實施 例的一優點為··插座表面較不易因為具有〇Η·的表面與空 氣中痕量水起反應造成意外污染而引發聚合反應)。低分子 量環氧化物可使薄塗層施加至插座表面,可利用由一溫和 強度的鹼所組成之一種硬化劑加以進一步聚合,此鹼係化 學式吸附至組合物體的黏合表面。 可在室溫(亦即約15至25。〇進行具有OH·作為引發劑 使用氰基丙烯酸酯之實施例,但特定情形中對於此實施例 與其他實施例可能有利地以室溫以外的溫度操作。反應速 率通常為溫度之函數,人們可能欲藉由控制溫度來控制反 應速率,譬如可能欲用溫度來減慢或加快反應速率,但對In order to avoid the possibility of water from the air causing hardening of the cyanoacrylate in the socket before the components are assembled, a preferred embodiment of the present invention includes a method for treating the bonding surface and the socket (rather than relying on the surface and Reaction of trace amounts of water in the air) to provide a surface separation step with the desired properties. This preferred embodiment uses cyanoacrylate as the adhesive, but the bonding surface of the combined object is deliberately treated to attach a polar initiator, and these sockets do become polar, but before the initiator is added to the combined object No polymerization was initiated. It is possible to use an All layer when preparing the bonded surface of a composite object. This Au layer is loaded with alkylthiol molecules terminated with a weak base. The formation of the socket may use a similar procedure with an ester-terminated alkyl mercaptan molecule. Examples of weakly basic initiators used in this preferred embodiment include molecules ending with amine (R_NH2) or alcohol groups. One implementation of this embodiment is to deposit a gold (Au) film on the bottom side of the module (about 100 OA), and then make an alkyl mercaptan compound (HS (CH2) nX, where X-NH2 or OH and n = 5 -20) Reacts with gold surface. Alkyl mercaptans may be applied to the gold surface in a diluted form (< 1%) by mixing with alcohols such as ethanol or methanol. The reaction of alkyl mercaptan with gold can take place at room temperature and can take about 24 hours to Finishing the single-layer covering of the surface, this procedure generates a gold surface that is functionalized with an amine or alcohol initiator, which constitutes a terminal group of thiol molecules attached to the surface. By coating the components, it can be combined 13 578291 V. Description of the invention (11) The cyanoacrylate polymerization is indeed carried out. In the preparation of hydrophilic sockets, the surfaces of these sockets may be coated with a substance that does not initiate or inhibit polymerization. One example is the use of an Au surface to define the socket, followed by the use of an ester-terminated alkylthiol molecule. Cover the socket. This surface should be hydrophilic (due to the polar nature of the terminal groups), but not sufficiently basic to initiate polymerization. Epoxides are another example of a monomeric compound that can be used in the present invention. These molecules also undergo anionicity induced by the addition of a base compound of moderate strength such as amine (R-NH2) or sodium methoxide (NaOCH3). Polymerization. In this embodiment, the epoxy compound may be selectively coated on the surface of the socket site, and the component may be coated with an amine initiator compound. The epoxy resin compound used in this case can be a low molecular weight polymer, so the epoxy resin compound can be made to have a low viscosity. This embodiment is very similar to the cyanoacrylate embodiment, but requires a stronger base to Initiate the polymerization reaction (an advantage of this embodiment is that the surface of the socket is less prone to initiating the polymerization reaction due to the accidental contamination caused by the surface having a 0Η reaction with trace amounts of water in the air). The low molecular weight epoxide allows a thin coating to be applied to the socket surface, which can be further polymerized with a hardener consisting of a mildly strong base, which is chemically adsorbed to the bonding surface of the combined object. The embodiment with OH · using an cyanoacrylate as an initiator can be performed at room temperature (ie, about 15 to 25 °), but in certain cases it may be advantageous for this and other embodiments to use a temperature other than room temperature Operation. The reaction rate is usually a function of temperature. One may want to control the reaction rate by controlling the temperature. For example, one may want to use the temperature to slow down or speed up the reaction rate.

14 578291 五、發明說明(l2 ) 於應保持的溫度係具有某些要求:流體應為液態;溫度不 應高到使塗層分解的程度;且組合若使用特定烷烴(具有一 有限的閃急點(flash point)),則應保持低溫以免組合流體 燃燒。具有室溫下為固體亦可作為組合流體之非極性烷烴 及過氟碳化物,但一般更容易使用一種具有更少碳原子數 且有類似行為但室溫下為液態之類似的化合物。 一項較佳實施例中,聚合反應的引發劑或硬化劑不溶 解於載體流體中或起反應,應相對於載體流體提供一高介 面能,應提供優先受插座上液體所濕潤之一表面,此等引 發劑的範例為水或0H基。 組合或載體流體係為一種能夠形成包含待組合部份的 一漿體之流體,組合或載體至少應與黏劑不相混合,組合 或載體流體可能為一種非極性流體,諸如液體烷烴、過氟 化烷烴或過氟碳化物。可使用十五烷或過氟甲基萘烷 (perfluoromethyldecaline)作為組合或載體流體。若表面、 組合流體及引發劑亦有反轉的非極性/極性本質,亦可以一 非極性前軀物進行組合程序。 因為正確定位的物體很緊密地固持在位置中,所以可 使用大力來移除一非選擇性黏合至基材的物體。或者,可 在初始組合步驟之後,藉由抽回組合流體來移除未適當黏 合在插座位址中的物體。 第1圖為組合程序的示意圖,其中Si基材6中的親水性 插座2、4係由一具有一斥水性塗層的Au膜10所圍繞,插座 2、4在一種過氟萘烧(perfluorodecaline)組合下由氰基丙嫦14 578291 V. Description of the invention (l2) There are certain requirements for the temperature to be maintained: the fluid should be liquid; the temperature should not be high enough to decompose the coating; and if the combination uses a specific alkane (with a limited flash Flash point), the temperature should be kept low to prevent the combined fluid from burning. It has non-polar alkanes and perfluorocarbons that are solid at room temperature and can be used as a combined fluid, but it is generally easier to use a similar compound that has fewer carbon atoms and has similar behavior but is liquid at room temperature. In a preferred embodiment, the initiator or hardener of the polymerization reaction does not dissolve or react in the carrier fluid, should provide a high interface energy relative to the carrier fluid, and should provide a surface that is preferentially wetted by the liquid on the socket. Examples of such initiators are water or OH groups. The combination or carrier flow system is a fluid capable of forming a slurry containing the parts to be combined. The combination or carrier should be at least miscible with the adhesive. The combination or carrier fluid may be a non-polar fluid such as liquid alkane, perfluoro Alkanes or perfluorocarbons. Pentadecane or perfluoromethyldecaline can be used as a combination or carrier fluid. If the surface, combined fluid, and initiator also have a reversed non-polar / polar nature, a non-polar precursor can also be used to perform the combined procedure. Because the properly positioned object is held tightly in place, a strong force can be used to remove an object that is not selectively adhered to the substrate. Alternatively, after the initial assembly step, objects that are not properly stuck in the socket address can be removed by withdrawing the assembly fluid. Figure 1 is a schematic diagram of the combined procedure. The hydrophilic sockets 2 and 4 in the Si substrate 6 are surrounded by an Au film 10 with a water-repellent coating. The sockets 2 and 4 are in a perfluorodecaline. Cyanopropane

15 578291 五、發明說明(l3 ) 酸酯黏劑8加以選擇性濕潤,過氟萘烷/氰基丙烯酸酯的高 介面能所造成之毛細力係捕捉住親水性玻璃珠12、14,藉 由珠表面上之一吸收的水薄膜捕捉住玻璃珠之後,黏劑產 生硬化。 利用並未限制本發明範圍之下列範例來示範本發明的 方法。 範例1 充填有氰基丙烯酸酯的插座所捕捉之玻璃珠 一基材設有親水性的插座,且插座由斥水性區域所分 隔。 利用KOH以及電漿蝕刻式氮化矽來形成供KOH蝕刻 步驟用的一遮罩,將約20微米深的插座蝕刻入Si晶圓内。 以氟化氫移除氮化物之後,鉻/金層沉積在晶圓上方,然後 從插座附近蝕刻金屬。隨後以H202來處理基材藉以氧化所 暴露的Si使其成為親水性,然後將基材浸於一種十六烷硫 醇(hexadecane thiol)的乙醇溶液中過夜而在仍受金所覆蓋 的表面上形成一斥水層。 隨後以一氰基丙烯酸酯黏劑來選擇性濕潤插座,將數 滴的氰基丙烯酸乙酯黏劑(S 5cP黏度的樂泰(Loctite)420) 放置在基材上(其他實驗採用一種類似的低黏度氰基丙烯 酸曱酯黏劑樂泰(Loctite)493)。然後以非極性流體過氟曱 基萘烷來覆蓋此基材,其他實驗採用非極性液體十五烷, 過氟甲基萘烷比氰基丙烯酸酯更稠密,十五烷則不如氰基 丙烯酸酯稠密。然後旋攪過氟甲基萘烷以將氰基丙烯酸酯15 578291 V. Description of the invention (l3) The ester adhesive 8 is selectively wetted. The capillary force caused by the high interface energy of perfluorodecalin / cyanoacrylate is to capture the hydrophilic glass beads 12, 14. After a glass film of water absorbed on the bead surface captures the glass beads, the adhesive hardens. The method of the present invention is illustrated by the following examples which do not limit the scope of the present invention. Example 1 Glass beads captured by a socket filled with cyanoacrylate A substrate has hydrophilic sockets and the sockets are separated by a water-repellent area. KOH and plasma-etched silicon nitride are used to form a mask for the KOH etching step, and a socket about 20 microns deep is etched into the Si wafer. After removing the nitride with hydrogen fluoride, a chromium / gold layer is deposited over the wafer, and the metal is etched from near the socket. The substrate was subsequently treated with H202 to oxidize the exposed Si to make it hydrophilic, and then the substrate was immersed in a solution of hexadecane thiol in ethanol overnight on a surface still covered by gold. A water-repellent layer is formed. Subsequently, a socket was selectively wetted with a cyanoacrylate adhesive, and a few drops of ethyl cyanoacrylate adhesive (S 5cP viscosity Loctite 420) were placed on the substrate (other experiments used a similar Loctite 493, a low viscosity cyanoacrylate. Then cover the substrate with non-polar fluid perfluorofluorenyl decalin. Other experiments use non-polar liquid pentadecane. Perfluoromethyl decalin is denser than cyanoacrylate, but pentadecane is not as good as cyanoacrylate. dense. And then swirled through the fluoromethyl decalin to cyanoacrylate

16 578291 五、發明說明(l4 ) 推到晶圓邊緣使氰基丙稀酸酯從基材表面移位,使用一移 液管來移除大部份多餘的氰基丙烯酸酯,極性氰基丙烯酸 酯係優先濕潤親水性插座而在插座中留下一灘氰基丙烯酸 酯。斥水性區域中,過氟甲基萘烷係使氰基丙烯酸酯移位。 第2圖顯示一大滴後退的氰基丙烯酸乙酯(照片左側) 受到過氟甲基萘烷所移位,位於中心的正方形墊(55微米邊 長)係為氧化的Si並由十六烷硫醇所處理的Au加以圍繞。如 用於連接墊上的流體與後退大滴中的流體之彎液面所顯 示,氰基丙烯酸酯優先濕潤受氧化的Si墊。對於平墊而言, 偶而f留下小滴的氰基丙烯酸酯。但對於大部份的墊,氰 基丙烯酸酯要不就是完全移位、否則即為太薄而無法利用 光學顯微鏡觀察。 具有可觀察到的一小低氰基丙烯酸酯之插座係在墊上 方滾動時捕捉住珠,在基材從組合流體抽回之後,這些珠 穩固地膠接至墊。對於不具有可觀察到的小滴氰基丙烯酸 酯之墊而言,並未觀察到珠的捕捉及黏合。 亦對於組合實驗採用具有平坦插座的基材,並將未經 塗覆且有50微米直徑的玻璃珠落入過氟甲基萘烷中。 為了使更多氰基丙烯酸酯留在插座上,使用上述略凹 的插座,重覆進行施加氰基丙烯酸醋及受到過氣甲基蔡烧 移位時所描述之程序,此情形中有大幅增高比例部份的插 座捕捉到玻璃珠,基材從組合流體抽回,並使用一充填有 過氟甲基萘烧的移液管來沖洗具有多餘珠的基材。插座中 所捕捉的珠在此程序期間係保持穩固地附接,代表具有良16 578291 V. Description of the invention (l4) Push the edge of the wafer to displace the cyanoacrylic acid from the surface of the substrate. Use a pipette to remove most of the excess cyanoacrylate, polar cyanoacrylate The ester system preferentially wets the hydrophilic socket while leaving a pool of cyanoacrylate in the socket. In the water-repellent region, the perfluoromethyl decalin type shifts the cyanoacrylate. Figure 2 shows a large drop of receding ethyl cyanoacrylate (left side of the photo) displaced by perfluoromethyl decalin. The square pad (55 micron side length) in the center is oxidized Si and is composed of hexadecane The thiol-treated Au is surrounded. The cyanoacrylate preferentially wets the oxidized Si pad, as shown by the meniscus of the fluid on the pad and the fluid in the receding large drop. For flat mats, occasionally f leaves small droplets of cyanoacrylate. But for most pads, the cyanoacrylate is either completely displaced or it is too thin to be observed with an optical microscope. An observable socket with a small low cyanoacrylate catches the beads as they roll over the pad. After the substrate is withdrawn from the combined fluid, the beads are firmly glued to the pad. For mats without observable droplets of cyanoacrylate, no capture and adhesion of beads was observed. A substrate with a flat socket was also used for the combination experiment, and uncoated glass beads having a diameter of 50 micrometers were dropped into perfluoromethyl decalin. In order to keep more cyanoacrylate on the socket, using the slightly concave socket described above, the procedure described when applying cyanoacrylate and being subjected to transgassing methyl zeolite is repeated, which is greatly increased in this case. The proportion of the socket captures the glass beads, the substrate is withdrawn from the combined fluid, and a pipette filled with perfluoromethyl naphthalene is used to rinse the substrate with excess beads. The beads captured in the socket remain firmly attached during this procedure, indicating good

578291 五、發明說明(l5 ) 好的黏合。 第3及4圖顯示經組合的玻璃珠之光學顯微鏡影像,第3 圖中,50微米的玻璃珠係充填6個插座中的4個,其中插座 約為50微米寬,左下方的玻璃珠顯然偏離中心,偏離中心 的珠(特別是對於較大插座)一般係黏合至插座的一角。 第4圖顯示50微米直徑的珠被捕捉在較小插座(約30微 米寬)上,如照片右方三個珠的線性配置所顯示,這些珠具 有大幅改善的居中作用,較小物體與插座之較好的形狀匹 配在自我定位程序期間應可產生改善的居中作用 玻璃珠因為尺寸適合插座且具有親水性表面而且容易 取得,所以對於這些實驗採用玻璃珠,所描述的技術並不 限於具有此形狀的物體。 雖然已經顯示及描述本發明的特定實施例,熟悉此技 藝者可作其他修改及改良,因此應瞭解本發明不限於圖中 顯示的特殊形式,且申請專利範圍預定涵蓋不脫離由申請 專利範圍所界定的本發明精神與範圍之所有修改。 元件標號對照 2,4…親水性插座 6...矽基材 8···氰基丙烯酸酯黏劑 10…金膜 12,14.··親水性玻璃珠578291 V. Description of the invention (l5) Good bonding. Figures 3 and 4 show the optical microscope images of the combined glass beads. In Figure 3, 50 micron glass beads fill four of the six sockets, of which the socket is about 50 micrometers wide. The glass beads at the bottom left are obvious. Off-center, off-center beads (especially for larger sockets) are generally glued to one corner of the socket. Figure 4 shows that 50 micron diameter beads are captured on a smaller socket (about 30 microns wide). As shown in the linear configuration of the three beads to the right of the photo, these beads have a greatly improved centering effect, with smaller objects and the socket Better shape matching should result in improved centering effect during the self-positioning procedure. Glass beads are suitable for sockets, have a hydrophilic surface and are easily accessible. For these experiments, glass beads are used, and the described technique is not limited to having this. Shaped objects. Although specific embodiments of the invention have been shown and described, those skilled in the art can make other modifications and improvements, so it should be understood that the invention is not limited to the special form shown in the figure, and the scope of patent application is intended to cover without departing from the scope of patent application All modifications that define the spirit and scope of the invention. Comparison of component numbers 2, 4 ... hydrophilic socket 6 ... silicon substrate 8 ... cyanoacrylate adhesive 10 ... gold film 12, 14 .... hydrophilic glass beads

1818

Claims (1)

夂'申請專利範圍 1 · 一種用於將組件組合在一基材上之方法,此方法包含以 下步驟·· (a) 以一液體前軀物選擇性塗覆該基材的至少一第 一受體位址而在接觸一引發劑時形成一固體黏劑; (b) 各組件設有一包含該引發劑的黏合表面;及 (c) 該等組件沉積在該基材上的方式可造成一第一 組件接觸該至少第-受體位址’此時該引發劑與該液體 前軀物之間的接觸係使該黏劑形成而將該第一組件附 接至該第一受體位址。 2.如申請專利範圍第1項之方法,其中該步驟⑷包含將一 具有一載體流體及複數個該等組件之漿體沉積在該基 材上,該前軀物及該引發劑係與該载體流體不相混合, 各該等組件的黏合表面在該前躺物中係具有比該載體 流體中更低的一表面能。 3·如申請專利範圍第2項之方法,其中該第一受體位址且 有一親水性表面且該第一受體位址周圍的一區域為斥 水性’或該第-受體位址具有—斥水性表面且該第一受 體位址周圍的區域為親水性,若該第—受體位址的表面 ^親水性,各該等組件的黏合表面係、包含—吸引至該第 -受體位址的表面之親水性材料,若該第—受體位址的 表面為斥水性,各該等組件的黏合表面係包含—吸引至 該第一受體位址的表面之斥水性材料。 4·如申請專利範圍第3項之方法,其中該第-受體位址的 表面為親水性且該第一受體位址周圍的區域為斥水 六、申請專利範圍 性,各該等組件的表面係包含該親水性材料。 5.如申請專利範圍第3項之方法,其中該前軀物為 一液體 單體,且該引發劑在接觸該單體時引發一聚合反應以形 成一固體聚合物。 6·如申請專利範圍第5項之方法,其中該前軀物為一種氰 基丙烯酸酯單體或一種環氧化物單體。 7·如申請專利範圍第5項之方法,其中該第一受體位址的 表面為斥水性且該第一受體位址周圍的區域為親水 I4生,各忒4第一組件的黏合表面係包含該斥水性材料。 8·如申請專利範圍第4項之方法,其包含在該步驟之前 使該基材設有以區域彼此分隔的複數個插座,將該等複 ,數個插座處理成為親水性以及將該等區域處理成為斥 水性。 9·如申請專利範圍第8項之方法,其中該前軀物為 一極性 流體且步驟(a)包含將該極性流體及一組合流體沉積在 該基材的一表面上,使得該極性流體優先濕潤該等親水 性插座,及從該基材的表面移除多餘的極性流體。 10·如申請專利範圍第9項之方法,其中該極性流體包含一 液體氰基丙烯酸酯單體,且該引發劑包含一弱鹼以在接 觸該單體時引發一聚合反應以形成一固體聚合物。 11·如申請專利範圍第1〇項之方法,其中該引發劑係包含從 下列各物的群組所選出之一弱驗:銨、胺、醇及醚等。 12·如申請專利範圍第11項之方法,其中該弱鹼係為化學式 R-OH的醇或化學式r_Nh2的胺。 20 d/ozy丄 ’、申清專利範圍 如申叫專利範圍第9項之方法,其中藉由各該等組件的 1占σ表面與ί辰境空氣中出現的水接觸而使該引發劑形 成於各該等組件的黏合表面上。 t 利範圍第9項之方法,其中各該等組件的黏合 表面包含Si-ΟΗ。 15.如申凊專利範圍第9項之方法,其包含將該引發劑塗覆 在各該等組件的黏合表面上。 •如申喷專利範圍第15項之方法,其包含將-金膜沉積在 各該等組件上然後將—具有化學式HS(CH2)nX且 2或0H而η-5至20的燒基化合物施加至該金膜,以 形成藉由-胺或醇部份加以官能化之一金表面。 如申π專利範圍第9項之方法,其中該極性流體係包含 一液體環氧化物單體,且該引發劑包含-驗藉以在與該 早體接觸時引發一聚合反應以形成一固體聚合物。 18.如申請專利範圍第17項之方法,其中該驗為-種胺或甲 醇鈉。 广如申請專利範圍第9項之方法,其中該基材包含石夕。 如申請專利範圍第19項之方法,其中利用過氧化氮來處 理該等複數_座崎化财成為親水性。 21夂 'Application patent scope 1 · A method for assembling a component on a substrate, the method includes the following steps ... (a) selectively coating at least one first substrate of the substrate with a liquid precursor (B) each component is provided with a bonding surface containing the initiator; and (c) the manner in which the components are deposited on the substrate can cause a first adhesive A component is in contact with the at least -receptor address' at this time the contact between the initiator and the liquid precursor causes the adhesive to form to attach the first component to the first acceptor address. 2. The method of claim 1, wherein the step (i) comprises depositing a slurry having a carrier fluid and a plurality of these components on the substrate, and the precursor and the initiator are related to the The carrier fluids are not mixed, and the bonding surfaces of the components have a lower surface energy in the front lying body than in the carrier fluid. 3. The method according to item 2 of the patent application, wherein the first receptor site has a hydrophilic surface and a region around the first receptor site is water-repellent 'or the first receptor site has -The water-repellent surface and the area around the first acceptor site is hydrophilic, if the surface of the -receptor site is hydrophilic, the bonding surface of each of these components is For the hydrophilic material on the surface of the body site, if the surface of the first receptor site is water-repellent, the bonding surface of each of these components includes a water-repellent material attracted to the surface of the first receptor site. 4. The method of claim 3 in the scope of patent application, wherein the surface of the -receptor site is hydrophilic and the area around the first acceptor site is water repellent 6. The scope of the patent application, each of these components The surface system contains the hydrophilic material. 5. The method of claim 3, wherein the precursor is a liquid monomer, and the initiator initiates a polymerization reaction to form a solid polymer when it contacts the monomer. 6. The method of claim 5 in which the precursor is a cyanoacrylate monomer or an epoxide monomer. 7. The method according to item 5 of the patent application, wherein the surface of the first receptor site is water-repellent and the area around the first receptor site is hydrophilic I4, each bonding surface of the first component The system contains the water-repellent material. 8. The method according to item 4 of the scope of patent application, which comprises, before this step, providing the substrate with a plurality of sockets separated from each other by regions, processing the plurality of sockets to become hydrophilic and treating the regions. The treatment becomes water-repellent. 9. The method according to item 8 of the application, wherein the precursor is a polar fluid and step (a) includes depositing the polar fluid and a combined fluid on a surface of the substrate, so that the polar fluid has priority Wet the hydrophilic sockets and remove excess polar fluid from the surface of the substrate. 10. The method according to item 9 of the application, wherein the polar fluid comprises a liquid cyanoacrylate monomer, and the initiator comprises a weak base to initiate a polymerization reaction to form a solid polymerization when contacting the monomer. Thing. 11. The method of claim 10, wherein the initiator comprises a weak test selected from the group of the following: ammonium, amine, alcohol, and ether. 12. The method of claim 11 in which the weak base is an alcohol of the chemical formula R-OH or an amine of the chemical formula r_Nh2. 20 d / ozy 丄 ', the method of claiming patent scope such as the patent claim No. 9 method, wherein the initiator is formed by contacting the surface of 1 σ of each of these components with water appearing in the air On the bonding surface of each of these components. The method of claim 9 wherein the bonding surface of each of these components includes Si-O. 15. The method of claim 9, which includes coating the initiator on the adhesive surface of each of these components. A method as claimed in claim 15 of the patent scope, which comprises depositing a gold film on each of these components and then applying an alkyl compound having a chemical formula HS (CH2) nX and 2 or 0H and η-5 to 20 To the gold film to form a gold surface that is functionalized with an -amine or alcohol moiety. The method of claim 9 of the patent scope, wherein the polar flow system includes a liquid epoxide monomer, and the initiator includes-check to initiate a polymerization reaction to form a solid polymer when in contact with the early body . 18. The method of claim 17 in the scope of patent application, wherein the test is a amine or sodium methylate. The method as broadly described in claim 9 wherein the substrate comprises Shi Xi. For example, the method of applying for the scope of patent No. 19, wherein the plural number is treated with nitrogen peroxide. twenty one
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