TW577995B - An image searching defect detector - Google Patents

An image searching defect detector Download PDF

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Publication number
TW577995B
TW577995B TW91112511A TW91112511A TW577995B TW 577995 B TW577995 B TW 577995B TW 91112511 A TW91112511 A TW 91112511A TW 91112511 A TW91112511 A TW 91112511A TW 577995 B TW577995 B TW 577995B
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Taiwan
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image
defect
images
patent application
electrical circuit
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TW91112511A
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Chinese (zh)
Inventor
Amir Noy
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Orbotech Ltd
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Priority claimed from IL149588A external-priority patent/IL149588A/en
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  • Image Processing (AREA)
  • Image Analysis (AREA)

Abstract

An image of an article to be inspected is divided into image portions, and a search engine makes a comparison with the image portion and a library of reference images. The reference images have predetermined labels that indicate whether each indicates a defect or no defect. The one of the reference images that most closely matches the image portion is determined, and the label associated with the reference image is taken as indicating whether the image portion corresponds to a location with a defect or no defect. Locations indicated as being defective are considered candidate defects and may subsequently be inspected in more detail.

Description

577995 A7 B7 五、發明説明(i ) 相關申請案交互參考 本專利申請主張2001年5月1 1曰提出申請之美國臨時專 利申請案號60/290,010之利益,該專利申請以提及方式整 份併入本文中。 發明領域 本發明與檢查電氣電路方面的缺陷偵測有關’更特定言 之,本發明與使用影像分類及監督學習系統的缺陷偵測有 關。 發明背景 ( 電氣電路檢驗系統已眾所皆知,並且包括(例如)可向以 色列 Yavne Orbotech Ltd·公司購得的 INSPIRE-9060™ 及 SK-75™自動化光學檢驗系統。這些電氣電路檢驗系統採 用多重檢驗通道。 獲得所受檢驗之電氣電路的灰階影像或彩色影像之後, 在第一檢驗通道中從所獲得影像產生電氣電路的增強型解 析度二進位影像,接著進行分析以找出電氣電路中可能的 缺陷。 同時進行,在第二檢驗通道中,直接分析灰階影像,通 常是偵測相當小的缺陷,如小孔、銅斑及細微短路。灰階 影像分析通常係參考影像部份的各種灰階特性來執行。特 性包括沿著影像部份各軸線的灰階值變更,如灰階值上升 及/或下降。通常肉眼不容易看到灰階影像分析所偵測到 的缺陷,不適合人直接檢驗灰階影像。這項難題的原因 為,對肉眼而言灰階值變化可能不顯著,並且代表缺陷或 •4- 本纸張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐) 1 577995 A7 B7 五、發明説明( 無缺陷之灰階值變化排列的可能數量會相當大。 發明概要 本發明企圖提供用於分析灰階影像以偵測如印刷電路板 之類物體中之缺陷的改良系統及方法。 根據本發明具體實施例,一種受檢驗的商品影像被獲 取,並且最好被細分或分割成複數個影像部份。每個影像 部份被供應至一影像搜尋引擎或影像分類器,用以進行搜 尋一代表複數個標記參考影像的資料庫,以決定該影像部 伤疋對應於一缺陷或無缺陷。完成這項作業的一種方式是 尋找該影像部份最相似的參考影像或影像。該等參考影像 的至少一參考影像被標記為對應於一缺陷,並且該等參考 5V像的至y參考影像被標記為對應於一無缺·陷。提供所 發現之最相似於一缺陷參考影像之參考影像部份的報告。 *根據本發明具體實施例,該等參考影像《由複數個典 型特徵表示,每個典型特徵皆具有一定義特性。例如,此 類特徵包括沿著該影像—軸或—軸以上之灰階強度的趨 八土特徵的特性為該等影像部份的特徵,並且將該等 ^部份之典型特徵的特性比較代表缺陷和無缺陷之各種 參考影像部份的典型特徵。 像到之最相似的標記參考影像為基礎來決定-影 像相:疋《表一缺陷或無缺陷,例如,以與每個參考影 像相關《所選特徵的分析為基礎。 派:::拾:定影像部份的典型特徵,並且為每個特徵指 、4驗影像部份相關的值,例如,代表該特徵相對 裝 訂 線 本纸張尺度適碎 -5- 577995 A7 B7 五、發明説明(3 ) 強度的值。此類特徵的值可被視為缺陷偵測值。特徵集合 的可能值構成一特徵空間。特徵空間可能是(且通常是)多 維。與參考影像集合中之特徵相關的值係針對缺陷及無缺 陷的所選影像表示進行分析,並且會在對應於與缺陷相關 的特徵構圖和與無缺陷相關的空間構圖的空間部份之間分 配特徵空間。與所獲取影像相關之特徵的值被標繪在特徵 空間中,並且進行缺陷決策以作為與一所獲得影像相關之 值的位置是否屬於對應於缺陷或對應於無缺陷之特徵之一 部份的函數。 該等影像部份包括(例如)5 X 5像素陣列。單獨估計受檢 驗之商品的每個影像通常有介於1〇9至5><丨〇9個影像部份。 根據本發明具體實施例,影像搜尋引擎或分類器係當作 起始缺陷篩選器,其被操作以選擇對應於所檢驗商品中可 能缺陷部位的候選影像部份,並且藉此減少用於下游影像 處理的資料。可將回報為對應於缺陷的影像部份供應至 (例如)進一步處理器,由該處理器供應一組不同(並且通常 疋更精確)的缺陷偵測演算法。視需要,獲取對應於一候 選缺陷之每個影像部份的額外影像(其解析度通常高於該 等影像部份的解析度)及其周圍影像,並且分析該額外影 像以決定該候選缺陷是否確實是缺陷或是錯誤警示。 根據本發明具體實施例,影像搜尋引擎被建構並且其靈 敏度纟k過校準,例如,使得最初回報約有1〇〇至1〇〇〇影像 部份為候選缺陷,進一步處理之後,仍然回報·僅有約一個 心像部份為候選缺陷。此外,該影像搜尋引擎被建構並且 A4 規格(210) 297公釐)577995 A7 B7 V. Description of the invention (i) Cross-reference to related applications This patent application claims the benefit of US Provisional Patent Application No. 60 / 290,010 filed on May 11, 2001, which is incorporated by reference in its entirety. Incorporated herein. FIELD OF THE INVENTION The present invention relates to defect detection in inspecting electrical circuits. More specifically, the present invention relates to defect detection using an image classification and supervised learning system. BACKGROUND OF THE INVENTION (Electrical circuit inspection systems are well known and include, for example, INSPIRE-9060 ™ and SK-75 ™ automated optical inspection systems available from Yavne Orbotech Ltd., Israel. These electrical circuit inspection systems employ multiple Inspection channel: After obtaining a grayscale image or a color image of the electrical circuit under inspection, an enhanced resolution binary image of the electrical circuit is generated from the obtained image in the first inspection channel, and then analyzed to find out the electrical circuit Possible defects. Simultaneously, in the second inspection channel, the grayscale image is directly analyzed, usually detecting relatively small defects, such as pinholes, copper spots, and small short circuits. Grayscale image analysis is usually based on the reference image. A variety of grayscale characteristics are implemented. Characteristics include changes in grayscale values along various axes of the image part, such as grayscale values rising and / or decreasing. Usually it is not easy to see the defects detected by grayscale image analysis with the naked eye, which is not suitable People directly inspect the grayscale image. The reason for this difficulty is that the grayscale value may not change significantly to the naked eye, and Defects or • 4- This paper size applies Chinese National Standard (CNS) A4 (210 X 297 mm) 1 577995 A7 B7 V. Description of the invention (the number of possible non-defective gray-scale value changes and arrangements may be quite large. Invention SUMMARY The present invention seeks to provide an improved system and method for analyzing grayscale images to detect defects in objects such as printed circuit boards. According to a specific embodiment of the present invention, an image of a commodity under inspection is acquired and preferably is Subdivide or divide into a plurality of image parts. Each image part is supplied to an image search engine or image classifier for searching a database representing a plurality of labeled reference images to determine the corresponding damage of the image part. A defect or no defect. One way to accomplish this is to find the reference image or image that most closely resembles the image portion. At least one reference image of the reference images is marked to correspond to a defect, and the reference 5V The reference image to y of the image is marked as corresponding to a flawless pit. Provides a report of the reference image portion found most similar to a defective reference image * According to a specific embodiment of the present invention, the reference images "are represented by a plurality of typical features, each of which has a defined characteristic. For example, such features include gray levels along the -axis or above the image The characteristics of the intensity-increasing characteristics are the characteristics of these image parts, and the characteristics of the typical features of these parts are compared to represent the typical features of various reference image parts that are defective and non-defective. Based on the reference image of the image to determine-Image phase: 疋 Table 1 is defective or non-defective, for example, based on the analysis of selected features associated with each reference image. Pie ::: Pick: Fixed image part Typical features, and each feature refers to the value associated with the inspection image part. For example, it represents that the feature is relatively small relative to the gutter paper size -5- 577995 A7 B7 5. The value of the strength of the invention (3). The value of such a feature can be considered a defect detection value. The possible values of the feature set constitute a feature space. The feature space may be (and usually is) multi-dimensional. The values related to the features in the reference image collection are analyzed for defective and non-defective selected image representations, and are allocated between the spatial portion corresponding to the feature-related feature composition and the non-defect-related spatial composition. Feature space. The value of the feature related to the acquired image is plotted in the feature space, and a defect decision is made as to whether the position of the value related to an acquired image is part of a feature corresponding to a defect or to a non-defective feature. function. These image parts include, for example, a 5 X 5 pixel array. Individually estimated that each image of the product under test usually has between 10 and 5 < 9 images. According to a specific embodiment of the present invention, the image search engine or classifier is used as an initial defect filter, which is operated to select candidate image portions corresponding to possible defective parts in the inspected product, and thereby reduce the use for downstream images. Data processed. The portion of the image that is reported as corresponding to the defect can be supplied to, for example, a further processor that supplies a different (and often more accurate) set of defect detection algorithms. If necessary, obtain additional images corresponding to each image portion of a candidate defect (the resolution is usually higher than those of the image portions) and surrounding images, and analyze the additional images to determine whether the candidate defect It is indeed a defect or false alarm. According to a specific embodiment of the present invention, the image search engine is constructed and its sensitivity 纟 k is calibrated. For example, about 100 to 1000 image parts are initially reported as candidate defects. After further processing, they still report only There are about one mind image part as candidate defects. In addition, the image search engine is constructed and A4 size (210) 297 mm)

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577995 A7 B7 五、發明説明(4 ) 其靈敏度經過校準,以便評估約106至101以上影像部份並 且發現無缺陷,只有一個影像部份實際上對應於缺陷,但 是錯誤回報為對應於無缺陷。 根據本發明具體實施例,最好藉由監督學習系統來選取 標記參考影像,該監督學習系統中的運算器(operator)選 取被標記為缺陷或無缺陷的典型缺陷及無缺陷影像部份。 預先決定標記典型特徵的特性及參數被適當的電腦自動離 線擷取並且儲存於資料庫中。代表缺陷影像部份及無缺陷 影像部份的特徵空間分割可經過修訂,以響應新增至資料 庫的影像部份。 圖式之簡單說明 詳讀下文中詳細說明並參考隨附的圖式將可更明白本發 明,其中: 圖1顯示根據本發明具體實施例之用於偵測影像中缺陷 之系統的簡化功能方塊圖, 圖2顯示使用圖1所示之系統檢驗之電氣電路之一部份的 南解析度黑白相片, 圖3顯示根據本發明具體實施例獲得之圖2所.示之電氣電 路一部份的低解析度數位影像; 圖4A及4B顯示根據本發明具體實施例,使用圖3所採用 的影像部份,圖1所示之系統中採用之影像搜尋引擎之運 作的簡化圖式; 圖4C及4D顯示根據本發明另一項具體實施例,使用圖3 所採用的影像部份,圖1所示之系統中採用之影像搜尋引 1 本纸張尺度適用中國國家標準(CNS) A4規格(210X 297公釐)577995 A7 B7 V. Description of the invention (4) The sensitivity has been calibrated so as to evaluate the image portion of about 106 to 101 and find no defects. Only one image portion actually corresponds to the defect, but the error return corresponds to no defect. According to a specific embodiment of the present invention, it is preferable to select a labeled reference image by a supervised learning system, and an operator in the supervised learning system selects typical defective and non-defective image portions marked as defective or non-defective. Pre-determined characteristics and parameters of typical features are automatically taken offline by a suitable computer and stored in a database. The feature space segmentation for defective image parts and non-defective image parts can be revised to respond to the image parts added to the database. Brief description of the drawings The invention will be more clearly understood by reading the following detailed description and referring to the accompanying drawings, wherein: FIG. 1 shows a simplified functional block of a system for detecting defects in an image according to a specific embodiment of the invention Figure 2, Figure 2 shows a South-resolution black and white photo of a portion of an electrical circuit tested using the system shown in Figure 1, and Figure 3 shows a portion of the electrical circuit shown in Figure 2 obtained according to a specific embodiment of the present invention. Low-resolution digital images; Figures 4A and 4B show simplified diagrams of the operation of an image search engine used in the system shown in Figure 1 using the image portion used in Figure 3 and the system shown in Figure 1 according to a specific embodiment of the present invention; Figures 4C and 4D display According to another specific embodiment of the present invention, the image part used in FIG. 3 is used, and the image search used in the system shown in FIG. 1 is used. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X 297 mm)

擎之運作的簡化圖式。 測二像中时顯示根據本發明具时施例之用於\ 圖;:!缺、之系統10的簡化功能方塊圖;請參考圖2 圖中顯不使用圖1所示之手统 疋糸,·无私釦又電氣電路邵份12的^ 醉听度黑白相片;以及詩來去圈 且触 〃 參考圖3,財顯示根據本發曰」 一植貫犯例獲得之圖2所示之 却卩m 數位影像。 路—較的低解析j 根據本發明具體實施例,系統i 〇被操作以檢驗包含(例 :),2所示之電氣電路部份12的電氣電路。雖然係就檢驗 电氣电路身$來解說本發明,但是本文中說明的系統及方 法可適用於檢驗任何適當製造商品影像,尤其是如印制電 路板、球格陣列基板、多晶片模組及平面顯示器之類的電 氣電路。另外,本文中使用的術語「電氣電路」不僅包括 芫整電氣電路及印制電路板,而且還包括可組裝在一起以 構成完整電氣電路的電氣電路層。 如圖1所示,影像產生器丨4產生受檢驗商品的影像 1 6 (圖3 )’例如,電氣電路部份丨2 (圖2 )的影像。用於獲得 數位影像(如影像16)及使用這些影像(包括衍生自這些影 像之電氣電路的已處理代表)來檢驗電氣電路的系統已眾 所皆知。此類市面銷售之印制電路板檢驗系統的實例包括 (例如)可向以色列Yavne之〇rb〇tech Ltd.公司講得的 INSPIRE-9060TM&SK-75TM系統。 根據本發明一項具體實施例,系統1 〇將一串純影像部份 本紙張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐)A simplified diagram of the engine's operation. In the second test, the display according to the embodiment of the present invention is used for \ drawing;:! The simplified functional block diagram of the system 10; please refer to Figure 2. The figure shows that the system shown in Figure 1 is not used, the selfless buckle and the electrical circuit of Shao Fen 12 ^ drunk listening black and white photos; Circle and touch Referring to Figure 3, Cai shows the digital image of "卩 m" shown in Figure 2 obtained according to the "instantaneous offense". Road-lower-resolution j According to a specific embodiment of the present invention, the system i 0 is operated to check the electrical circuit including the electrical circuit portion 12 shown in (example :), 2. Although the present invention has been described in terms of inspecting electrical circuit bodies, the systems and methods described herein can be applied to inspecting any properly manufactured commodity image, especially such as printed circuit boards, ball grid array substrates, multi-chip modules, and An electrical circuit such as a flat display. In addition, the term “electrical circuit” used in this article includes not only trimmed electrical circuits and printed circuit boards, but also electrical circuit layers that can be assembled together to form a complete electrical circuit. As shown in FIG. 1, the image generator 4 generates an image 1 6 (FIG. 3) of an inspected product, for example, an image of an electrical circuit part 2 (FIG. 2). Systems for obtaining digital images (such as image 16) and using these images (including processed representatives of electrical circuits derived from these images) to verify electrical circuits are well known. Examples of such commercially available printed circuit board inspection systems include, for example, the INSPIRE-9060TM & SK-75TM system, which can be addressed to Orbtech Ltd. of Yavne, Israel. According to a specific embodiment of the present invention, the system 10 divides a series of pure image parts. The paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm).

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/799$ /799$/ 799 $ / 799 $

18供應給特徵擷取器20。每個純影像部份18都是藉由㈠列 如)從影像1 6取得的5 X 5像素陣列所定義,雖然可使用較 大或較小陣列。可為受檢驗商品的所選區域來提供純影像 部份18 ,或是可當作影像16中每個像素鄰接周圍的像素來 提供純影像部份18。 ” 根據本發明一項具體實施例,電氣電路的典型影像包含 介於lxlO9與5xl09之間像素。介於大約1χ1〇9與5χΐ〇9: 影像部份18(每個都是由5x5像素陣列所構成)被供應至特 徵擷取器2 0。希望建置系統1 〇,以操作系統以線上方式在 大約3 0至6 0秒内來獲得及分析受檢驗電氣電路的所有影像 部份。 特徵擷取器20最好被提供為專用硬體裝置,其可被操作 以從影像部份18擷取屬於一影像部份特性的一個或一個以 上預先決定典型特徵22,並且以便於進一步處理的預先決 定格式來代表這些特徵,如同影像搜尋及分類技藝中所熟 知。在电氣電路檢驗中採用之影像部份灰階分析背景中, 此類的影像典型特徵可能是(例如)影像部份中沿著一個或 一個以上水平、垂直或對角軸線之灰階值變化的指示。根 據本發明一項具體實施例,會將一值指派給一影像中的每 個特徵或特徵組合。例如,值代表影像中特徵的相對強 度。 本發明特徵為,會將影像18的典型特徵22供應至搜尋引 擎2 4 (如;^像搜尋引擎或景》像分類器),用於從類似於受檢 驗商品之缺陷與無缺陷部位之適當標記影像部份的影像庫18 is supplied to the feature extractor 20. Each pure image portion 18 is defined by a queue such as a 5 x 5 pixel array obtained from image 16 although a larger or smaller array can be used. The pure image portion 18 may be provided for the selected area of the product under test, or the pure image portion 18 may be provided as each pixel in the image 16 adjacent to the surrounding pixels. According to a specific embodiment of the present invention, a typical image of an electrical circuit includes pixels between lxlO9 and 5xl09. Between approximately 1x109 and 5xΐ09: Image portion 18 (each of which is a 5x5 pixel array Composition) is supplied to the feature extractor 20. It is desired to build the system 10 and obtain and analyze all the image parts of the tested electrical circuit in about 30 to 60 seconds by an operating system online. The picker 20 is preferably provided as a dedicated hardware device that is operable to retrieve one or more predetermined characteristic features 22 belonging to the characteristics of an image portion from the image portion 18 and facilitates further determination of the predetermined characteristics. Format to represent these features, as is well known in image search and classification techniques. In the background of grayscale analysis of image parts used in electrical circuit inspection, typical features of such images may be (for example) along the image part An indication of changes in one or more horizontal, vertical, or diagonal axis grayscale values. According to a specific embodiment of the present invention, a value is assigned to each feature in an image or Feature combination. For example, the value represents the relative strength of the features in the image. The feature of the present invention is that the typical feature 22 of the image 18 is supplied to the search engine 2 4 (such as a search engine or scene image classifier) for From an image library of appropriately labeled image parts similar to the defective and non-defective parts of the inspected product

577995 A7577995 A7

28接收一輸入26。顯而易見’搜尋引擎24被操 缺陷與無缺陷資料庫來分㈣獲得影像的特徵表示,並: :立該影像是否是缺陷與無缺陷的表示。根據本發明具體 ,施例,標記影像部份被標記以指示該影像部份是是否電 氣電路的缺陷或無缺陷部份的指示。會在離線處理程序中 準:及處理標記影像部份以擷取典型特徵。根據本發明具 ,實施例’影像庫28包含典型特徵及各種其他比較參數了 權值及特徵值,以便於檢驗處理程序期間決定㈣入影像 部份對儲存於影像庫28中影像部份之—之相似度時運用。 裝 訂28 receives an input 26. Obviously, the search engine 24 is operated on the defect and non-defective database to distinguish the characteristic representation of the image, and determine whether the image is a defect or non-defective representation. According to a specific embodiment of the present invention, the marked image portion is marked to indicate whether the image portion is an indication of whether the electrical circuit is defective or non-defective. It will be used in offline processing: and process the marked image part to capture typical features. According to the present invention, the embodiment of the 'image library 28 contains typical features and various other comparison parameters with weights and characteristic values, in order to facilitate the determination of the input image portion to the image portion stored in the image library 28 during the inspection process— Similarity. Binding

顯而易見’於檢驗期間獲得的影像部份18與影像庫則 任何特定影像不會完全匹H根據本發明具體實施 例’搜尋引擎24被操作以尋找影像庫28中所輸入影像部份 18最相似於的影像部份。如上文所述,可在影像庫28中將 影像儲存為典型特徵集合、用於決定特徵相似度的一組參 數乂及用於心示重要度的加權,該加權係被指派給介於輸 入影像部份之特徵與影像庫中每個影像中對應特徵之間所 確互的相似度。在搜尋影像及缺陷分類技藝中已熟知使用 此類特徵、參數及加權。 針對每個影像部份丨8、影像搜尋引擎2 4搜尋影像庫 2 8 ’並且識別影像庫2 8中影像部份1 8最相似於的影像部 ^ °與影像庫2 8之影像部份相關的標記指示所獲得影像部 份18是否是缺陷或無缺陷。影像搜尋引擎以最好提供最相 似於標記為缺陷之影像庫影像之影像部份的報告3〇。視需 要’提供一加權,以指示影像部份1 8對影像庫影像相似度It is obvious that 'the image portion 18 obtained during the inspection and the image library will not completely match any particular image. According to a specific embodiment of the present invention' the search engine 24 is operated to find the input image portion 18 in the image library 28 which is most similar to Part of the image. As described above, images can be stored in the image library 28 as a set of typical features, a set of parameters used to determine the similarity of features, and a weight for mental importance, which is assigned to the input image. The exact similarity between the features of each part and the corresponding features in each image in the image library. The use of such features, parameters, and weighting is well known in search image and defect classification techniques. For each image part, the image search engine 2 4 searches the image library 2 8 'and identifies the image part 1 8 which is most similar to the image part 2 8 ^ ° is related to the image part of the image library 2 8 The mark indicates whether the obtained image portion 18 is defective or non-defective. The image search engine preferably provides a report of the image portion that most closely resembles the image library image marked as a defect30. If needed ’, a weight is provided to indicate the similarity of the image part to the 18 images in the image library.

577995 A7577995 A7

577995 A7 B7 五、發明説明(9 ) 請注意,市面銷售的各種影像搜尋引擎可接收輸入影 像,並且搜尋影像集合以識別集合中最相似於輸入影像的 影像。例如,還已知針對缺陷類型來分類影像。這些搜尋 引擎及分類器通常採用神經網路、支援向量機器及/或決 策樹狀結構技術。一種市面銷售的一般用途影像搜尋引擎 是可向美國喬治亞州沙凡那港市Attrasoft (www. attrasoft. com)購買。自動化光學檢驗系統中也已採用更專門的系 統,用以檢驗積體電路、半導體晶圓及液晶顯示器,以便 一經上游影像搜尋引擎識別缺陷後,隨即按照缺陷類型來 分類缺陷。一種方式是將搜尋引擎視為影像比較器。 根據本發明具體實施例,影像搜尋引擎被建構並且其靈 敏度經過校準,例如,使得最初回報有100至1000影像部 份為候選缺陷,進一步處理之後,仍然回報僅有約一個影 像部份為候選缺陷。此外,該影像搜尋引擎被建構並且其 靈敏度經過校準,以便評估約106至107以上影像部份並且 發現無缺陷,只有一個影像部份實際上對應於缺陷,但是 錯誤回報為對應於無缺陷。例如,進行校準的‘方式為,調 整指派給代表影像庫28中之影像部份之特徵的各自比較參 數、加權及可信度。 根據本發明具體實施例,影像搜尋引擎24被當作資料簡 化器(data reducer)使用,並且會將報告30供應給下游缺陷 偵測器或缺陷驗證器,這個下游缺陷偵測器或缺陷驗證器 具有偵測搜尋引擎所報告之屬於缺陷之所獲得影像中各影 像部份18之間實際缺陷方面高度精確度。下游缺陷驗證器 -12- 本紙張尺度適用中國國家標準(CNS) A4規格(210X 297公釐) 裝 訂577995 A7 B7 V. Description of the Invention (9) Please note that various image search engines on the market can receive input images and search the image collection to identify the images in the collection that are most similar to the input image. For example, it is also known to classify images for defect types. These search engines and classifiers often use neural networks, support vector machines, and / or decision tree techniques. A commercially available general-purpose image search engine is available from Attrasoft (www. Attrasoft.com) in Port Savannah, Georgia, USA. More specialized systems have also been used in automated optical inspection systems to inspect integrated circuits, semiconductor wafers, and liquid crystal displays, so that once defects are identified by the upstream image search engine, defects are then classified by defect type. One way is to think of search engines as image comparators. According to a specific embodiment of the present invention, the image search engine is constructed and its sensitivity is calibrated. For example, 100 to 1000 image parts are initially reported as candidate defects. After further processing, only about one image part is reported as candidate defects. . In addition, the image search engine is constructed and its sensitivity is calibrated to evaluate image portions of about 106 to 107 and found no defects. Only one image portion actually corresponds to the defect, but the error report corresponds to no defect. For example, the method of performing the calibration is to adjust respective comparison parameters, weights, and reliability of the features assigned to the image portions in the image library 28. According to a specific embodiment of the present invention, the image search engine 24 is used as a data reducer, and the report 30 is supplied to a downstream defect detector or defect verifier, which is a downstream defect detector or defect verifier It has a high degree of accuracy in detecting actual defects between image portions 18 in the acquired images that are reported as defects by the search engine. Downstream Defect Verifier -12- This paper size applies to China National Standard (CNS) A4 (210X 297mm) binding

線 577995 五、發明説明(10 ) 31最將提供不同於影像搜尋引擎2 4的—組缺陷偵測演算 法、。視需要,下游缺陷偵測器獲得一位置的額外影像,其 位於所檢驗的電氣電路上,並且已被影像搜尋引擎24標示 為可能缺陷的位置。例如,額外影像的解析度可高於影像 部份18的解析度。根據本發明具體實施例,額外影像經過 分析,以決定影像搜尋引擎24以分析影像部份18為基礎所 報告的候選缺陷是否確實是缺陷指示,而不是錯誤警示指 示。 視需要,根據本發明另一項具體實施例,缺陷驗證器3i 是操作員驗證報告30中報告的缺陷是否確實是缺陷或是無 缺陷的驗證站。此類系統1〇的組態中,可在搜尋引擎24分 類之後隨即採用人力偵測驗證。視需要,在自動化下游偵 測驗證後執行人力驗證作業,使缺陷驗證器31包括至少兩 項驗證作業,至少一項自動及至少一項人工。 根據本發明具體實施例,可被視為影像相關資料之資料 庫的影像庫2 8係以離線方式收集,並且如上文所述,包含 於影像庫28中的影像經過處理,以於檢驗影像期間以線上 方式高效率使用影像庫2 8中的影像。因此,如圖丨所示, 影像庫2 8包括標記參考影像3 2的集合,這些標記參考影像 係以離線方式收集,並且被標記為對應於受檢驗商品的缺 陷部份及無缺陷部份。參考影像32集合中的每個參考影像 被提供給離線參數建置器34,由參數建置器34從影像庫中 的每個影像擷取與特徵有關的值,例如,對應於缺陷決定 值,這屬於包含於集合中之影像部份的特性。參數建置器 ________ -13· 本紙張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐)Line 577995 V. Invention Description (10) 31 will provide a group defect detection algorithm different from the image search engine 24. If necessary, the downstream defect detector obtains an additional image of a location that is located on the electrical circuit being inspected and has been marked by the image search engine 24 as the location of a possible defect. For example, the resolution of the additional image may be higher than the resolution of the image portion 18. According to a specific embodiment of the present invention, the additional image is analyzed to determine whether the candidate defect reported by the image search engine 24 based on the analysis image portion 18 is indeed a defect indication, rather than an error warning indication. If necessary, according to another specific embodiment of the present invention, the defect verifier 3i is an operator verifying whether the defect reported in the report 30 is indeed a defect or no defect. The configuration of such a system 10 can be verified by human detection immediately after the search engine 24 is classified. If necessary, perform a manual verification operation after the automated downstream detection verification, so that the defect verifier 31 includes at least two verification operations, at least one automatic and at least one manual. According to a specific embodiment of the present invention, the image library 28, which can be regarded as a database of image-related data, is collected offline, and as described above, the images contained in the image library 28 are processed for the purpose of inspecting the images. Efficiently use images from Image Library 28 online. Therefore, as shown in Figure 丨, the image library 28 includes a collection of labeled reference images 32, which are collected offline and marked as corresponding to the defective and non-defective parts of the inspected product. Each reference image in the set of reference images 32 is provided to the offline parameter builder 34, and the parameter builder 34 extracts values related to features from each image in the image library, for example, corresponding to the defect decision value, This is a characteristic of the image portion contained in the collection. Parameter builder ________ -13 · This paper size applies to China National Standard (CNS) A4 (210 X 297 mm)

34指派—個或一個以上參數,用於測量-參考影像部份與 、所獲得影像部份之間的相似度或差異,以及屬於該特徵 之重要性的加權。 如上文所述’參數建置料被操作以定義及分割缺陷影 像邵份與無缺陷影像部份中之特徵之各自強度的特徵空間 表π。特徵空間可能是(且通常是)多維。 請注意,根據本發明具體實施<列,當搜尋最極為匹配輸 入〜像部份18的影像庫影像時,經過參數化及儲存於影像 庫28中的特徵及值對應於可供影像搜尋引擎24很容易且高 效f使用的特徵。在替代組態中,特徵對應於可經過影像 搜咢引擎評估以將受檢驗影像指派給一特徵空間,以從特 徵空間決定缺陷及無缺陷。 例如,在用於檢驗印刷電路板是否有如小孔、銅斑及細 微短路等等足類小缺陷的系統中,此類的特定特徵可包括 一影像中一個或一個以上所選像素灰階值,以及沿著一影 像部份之各軸線灰階值的趨勢及變化。例如,可向以色列34 Assign one or more parameters for measuring the similarity or difference between the reference image part and the obtained image part, and the weighting of the importance belonging to the feature. As described above, the 'parameter building material is operated to define and segment the feature space table π of the respective strengths of the features in the defective image portion and the non-defective image portion. The feature space may be (and usually is) multi-dimensional. Please note that according to the specific implementation of the present invention, when searching for the image library image that most closely matches the input ~ image portion 18, the features and values that have been parameterized and stored in the image library 28 correspond to available image search engines 24 features that are easy and efficient to use. In alternative configurations, features correspond to features that can be evaluated by the image search engine to assign the inspected image to a feature space to determine defects and non-defects from the feature space. For example, in a system for inspecting printed circuit boards for small defects such as pinholes, copper spots, and small short circuits, such specific features may include grayscale values of one or more selected pixels in an image, And the trend and change of the grayscale value along each axis of an image part. For example,

Yavne Orbotech Ltd·公司購得的 iNSPIRE-9060TM&SK-75TM ΑΟΙ機器採用適用於小型缺陷之5χ5影像部份的傳統特 性。以下一份或一份以上美國專利中附帶廣泛討論及說明 小型缺陷的特性,這些美國專利均以提及方式整個併入本 文中·美國專利5,619,429及美國專利5,586,058、但是請注 意,影像分類中使用的特徵實際構圖及參數不屬於本發明 的一部份’並且請注意’任何適用的特徵都可被擷取、儲 存及運用於影像部份18之分類。另外,可採用任何適合的 -14- 本纸張尺度適用中國國家標準(CNS) Α4規格(210X297公釐) 577995The iNSPIRE-9060TM & SK-75TM ΑΙΙ machine purchased by Yavne Orbotech Ltd. uses the traditional characteristics of a 5x5 image portion suitable for small defects. The characteristics of small defects are extensively discussed and illustrated in one or more of the following U.S. patents, which are incorporated herein by reference in their entirety. U.S. Patent 5,619,429 and U.S. Patent 5,586,058, but please note that image classification is used in The actual composition and parameters of the features are not part of the present invention 'and please note that' any applicable feature can be captured, stored and applied to the classification of the image portion 18. In addition, any suitable size can be adopted. -14- This paper size is applicable to China National Standard (CNS) A4 specification (210X297 mm) 577995

影像搜尋方法。 現在叫參考圖2,圖中顯示參考圖丨所示及說明的系統可 檢驗之典型電氣電路一部份的放大相片。圖2所示的電路 部位12包括兩個導體4〇及42。圖中所示的導體糾與^之 間可看到細微短路,並且沿著導體4〇左邊可看到顯著突 出。 現在請參考圖3,圖中顯示電路部位12的數位影像,如 市面銷售之電氣電路檢驗系統中通常可獲得的數位影像。 顯而易見數位影像1 6的解析度極低於放大相片丨2的解析 度,並且很難以直接用肉眼評估數位影像丨6的方式來識別 細微短路或突出。如圖3所示,細微短路或突出的特徵 為,數個像素的灰階值不同於沿著導體4〇與42一邊或導體 40與42足間無缺陷段之像素的預期灰階值。藉由比較對應 於沿著導體40與42之鄰接部位之數位影像16中的像素就 可看出差異。 現在請參考圖4A及4B,並且參考圖4(:及41),圖中顯示 圖1所示之系統中採用之影像搜尋引擎24之運作的簡化圖 式。在圖4A至4D中,會使用圖3所示的影像部份來解說影 像搜尋引擎24的運作。在圖4A至4D中,影像52至64的知 識庫50(如影像庫28)係以離線學習模式所準備,並且被儲 存為一組參數,如前文參考圖丨所說明的參數。顯而易 見,基於簡化因素,將影像5 2至6 4呈現為純影像。另外, 基於簡化圖解目的,影像52至64廣泛被任何標繪在兩維影 像空間中,以將知識庫50視為特徵空間。但是請注意,在 -15- 本紙張尺度適用中國國家標準(CNS) A4規格(210 X 297公爱)Image search method. Reference is now made to Fig. 2, which shows an enlarged photograph of a portion of a typical electrical circuit that can be inspected with reference to the system shown and illustrated in Fig. 丨. The circuit portion 12 shown in FIG. 2 includes two conductors 40 and 42. A slight short circuit can be seen between the conductors and ^ shown in the figure, and a prominent protrusion can be seen along the left side of the conductor 40. Now refer to FIG. 3, which shows a digital image of the circuit portion 12, such as a digital image commonly available in commercially available electrical circuit inspection systems. Obviously, the resolution of the digital image 16 is extremely lower than that of the enlarged photo 丨 2, and it is difficult to identify the slight short circuit or protrusion by directly evaluating the digital image 6 with the naked eye. As shown in FIG. 3, the characteristic of a slight short circuit or protrusion is that the grayscale values of several pixels are different from the expected grayscale values of the pixels along the conductor 40 and 42 side or the defect-free segment between the conductors 40 and 42. The difference can be seen by comparing the pixels in the digital image 16 corresponding to the adjacent parts along the conductors 40 and 42. Referring now to Figs. 4A and 4B, and Figs. 4 (: and 41), the figure shows a simplified diagram of the operation of the image search engine 24 employed in the system shown in Fig. 1. In FIGS. 4A to 4D, the operation of the image search engine 24 will be explained using the image portion shown in FIG. In Figs. 4A to 4D, the knowledge base 50 (such as the image base 28) of the images 52 to 64 is prepared in an offline learning mode and is stored as a set of parameters, such as the parameters described above with reference to Fig. 丨. Obviously, images 5 2 to 6 4 are rendered as pure images based on simplification. In addition, for the purpose of simplifying illustration, the images 52 to 64 are widely plotted in a two-dimensional image space in order to regard the knowledge base 50 as a feature space. However, please note that at -15- this paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 public love)

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577995 A7 B7 五、發明説明(13 ) 圖4A至4D所示的圖式中,不企圖依據任何特定特徵構圖 以對稱方式組織影像52至64 ,或是企圖呈現特徵空間的多 維性質。 & 圖4C及4D中,圖中所示的分割區66係分割知識庫切中 與對應於缺陷相關之影像的特徵空間部份,及與對應於益 缺陷相關之影像的特徵空間部份。 影像部份5 2至6 4的每個影像部份都代表圖2所示之電路 的一部份。影像部份52至60屬於對應於電氣電路部份 12(圖2)中無缺陷之所獲得影像16的一部份。影像部份u 及64屬於對應於電氣電路部份12中缺陷之所獲得影^ μ 的一部份。請注意,影像52至64是可能缺陷的表示,但不 包含會出現在影像的所有可能影像部份及缺陷。這是因為 影像搜尋引擎28被操作以尋找所獲得之影像部份最極為匹 配的缺陷或無缺陷影像部份,或決定所獲得影像部份是否 位於與缺陷表示或無缺陷表示相關的影像空間中。 顯而易見,因此影像搜尋引擎不需要完全匹配以決定每 個所獲得1影像部份。實際上,知識庫中過量的影像部份 不利於景> 像搜尋引擎2 4的高效率功能。 如圖4A所示(其相當於第_模式運作),將所獲得影像部 份70(例如’藉由影像產生器14所獲得的影像部份)比較影 像5 2至6 4之每個影像❶指示影像部份7 〇是否相似於 :目=影像部份52至64 ’以及指示影像部份7〇最相似於 2識庫50中哪-個影像部份。如圖“的實例所示決定 〜像部份7〇最相似於被標記為缺陷的影像部份Μ。於是, 本紙張尺度咖t國碎規格(21〇 χ 2^γ -16* 577995 Α7 Β7 五、發明説明(Μ ) 將景> 像部份70報告為缺陷,並且會進一步處理之。 如圖4Β所示(其也相當於第一模式運作),將所獲得影像 部份72(例如,藉由影像產生器14所獲得的影像部份)比較 影像52至64之每個影像。指示影像部份72是否相似於或 不相似於影像部份52至64,以及指示影像部份72最相似 於知識庫5 0中哪一個影像部份。如圖4Β的實例所示,決 定影像部份72最相似於被標記為無缺陷的影像部份54。於 疋,將影像部份72報告為無缺陷,所以不需要進一步處理 之0 如圖4C及4D所示(其相當於第二模式運作),知識庫5〇 被提供為影像所在的影像空間中,以當作影像中給定特徵 之相對強度的構圖函數。影像空間被分割區66.分割,以使 缺陷部份的影像位於分割區66第一邊上的影像空間中,而 無缺陷部份的影像位於分割區66另一邊上的影像空間中。 根據本發明具體實施例,每個影像都是藉由各種特徵強 度構圖來表示,並且影像空間中之分割區66的位置係以分 析方式來決定為值函數。 陷 如圖4C所示,影像部份7〇係標繪在知識庫“所表亍之 特徵空間中的位置上。因為影像部份70位於與缺陷相關之 影像空間的邵份中,所以將影像部份7〇報告為對應於缺 如圖4D所示,影像部份72係標繪在知識庫5〇 特徵空間中的位m為影㈣份72位於與▲缺陷= 《影像空間的部份中’所以將影像部份72報告為對應於在 -17-577995 A7 B7 V. Description of the invention (13) In the diagrams shown in FIGS. 4A to 4D, no attempt is made to organize the images 52 to 64 in a symmetrical manner according to any specific feature, or the multidimensional nature of the feature space is attempted. & In Figs. 4C and 4D, the partition area 66 shown in the figure divides the knowledge space into the feature space portion of the image corresponding to the defect and the feature space portion of the image corresponding to the defect. Each of the image parts 5 2 to 6 4 represents a part of the circuit shown in FIG. 2. The image portions 52 to 60 belong to a portion corresponding to the obtained image 16 which is defect-free in the electric circuit portion 12 (Fig. 2). The image parts u and 64 belong to a part of the obtained image corresponding to the defect in the electrical circuit part 12. Please note that images 52 to 64 are indications of possible defects, but do not include all possible image portions and defects that would appear in the image. This is because the image search engine 28 is operated to find the most closely matched defective or non-defective image portion of the obtained image portion, or to determine whether the obtained image portion is located in the image space associated with the defect representation or non-defective representation. . Obviously, therefore, the image search engine does not need an exact match to determine each image part obtained. In fact, the excessive image portion in the knowledge base is not conducive to the scene > high-efficiency functions like the search engine 24. As shown in FIG. 4A (which is equivalent to the _ mode operation), the obtained image portion 70 (for example, 'the image portion obtained by the image generator 14) is compared with each of the images 5 2 to 6 4❶ Indicates whether the image part 70 is similar to: mesh = image parts 52 to 64 'and indicates whether the image part 70 is most similar to which of the two image parts in the image library 50. As shown in the example shown in the example, the image portion 70 is most similar to the image portion M marked as a defect. Therefore, the paper size is divided into two specifications (21〇χ 2 ^ γ -16 * 577995 Α7 Β7 V. Description of the Invention (M) Report the scene > image portion 70 as a defect and further process it. As shown in Figure 4B (which is also equivalent to the first mode operation), the obtained image portion 72 (for example , Using the image portion obtained by the image generator 14) to compare each of the images 52 to 64. Indicate whether the image portion 72 is similar or dissimilar to the image portions 52 to 64, and indicate that the image portion 72 is the most similar. Which image part is similar to the knowledge base 50. As shown in the example of FIG. 4B, the image part 72 is determined to be most similar to the image part 54 marked as non-defective. Yu Xie reports the image part 72 as No defect, so no further processing is needed. As shown in Figures 4C and 4D (which is equivalent to the second mode operation), the knowledge base 50 is provided in the image space where the image is located as a given feature in the image. Composition function of relative intensity. Image space is divided into 66. points So that the image of the defective portion is located in the image space on the first side of the partitioned area 66, and the image of the non-defective portion is located in the image space on the other side of the partitioned area 66. According to a specific embodiment of the present invention, each image All are represented by various feature intensity composition, and the position of the partition 66 in the image space is determined analytically as a value function. As shown in Figure 4C, the image part 70 is plotted in the knowledge base " The position in the feature space is shown. Since the image part 70 is located in the image space of the image space related to the defect, the image part 70 is reported as corresponding to the defect as shown in FIG. 4D and the image part 72 The bit m plotted in the feature space of the knowledge base 50 is the shadow component 72, which is located with ▲ Defect = "the part of the image space ', so the image part 72 is reported as corresponding to -17-

Claims (1)

喱用於在電氣電路中偵測缺陷之方法,包括·· 氣所獲得影像,該所獲得影像對應於-受檢驗1 札电路的一部位; —比較該賴得料與參考料,該等參考影像的至少 二參考影像表示-缺陷,而該等參考影像的至少_ 影像表示一無缺陷;以及 依據該比較,提供該所獲得影像對缺陷或無缺 目 似度的指示β 2. 如申請專利㈣第〗項之方法’其中該所 檢驗電氣電路之較大影像的一部份。 ,象疋又 3. 如申請專利範圍第1之方法,其中針對該所獲得影像 擷取一個或一個以上典型特徵。、 4. 如申請專利範圍第2項之方法,其中針對每個參考影像 擷取一個或一個以上典型特徵,並且將該等典型特徵儲 存於一影像庫中。 5. 如申請專利範圍第4項之方法,其中_從該等參考影像 之一擷取的特徵與一用於指示屬於此類特徵之強度的值 相關,並且一影像部份係藉由至少兩個特徵之值的組合 來表示。 6. 如申請專利範圍第5項之方法,其中該進行比較包括在 一特徵空間中標繪一影像的位置,以作為該等值之該組 合的函數。 7·如申請專利範圍第6項之方法,其中該特徵空間包括對 應於缺陷指示之值之組合的部份,以及對應於無缺陷指 •19-A method for detecting defects in electrical circuits by gels, including ... obtaining images corresponding to a part of the circuit under test;-comparing the material and reference materials, such references At least two reference images of the image represent a defect, and at least _ images of the reference images represent a defect-free; and based on the comparison, provide an indication of the similarity of the acquired image to the defect or absence of defects β 2. If a patent is applied ㈣ The method of item 'wherein the part of the larger image of the electrical circuit under test. , 象 疋 又 3. The method according to the first patent application range, in which one or more typical features are captured for the obtained image. 4. The method according to item 2 of the scope of patent application, in which one or more typical features are extracted for each reference image, and the typical features are stored in an image database. 5. The method according to item 4 of the scope of patent application, wherein the feature extracted from one of the reference images is related to a value indicating the intensity belonging to such feature, and an image part is obtained by at least two A combination of the values of the features. 6. The method of claim 5, wherein the comparison includes plotting the position of an image in a feature space as a function of the combination of the values. 7. The method according to item 6 of the scope of patent application, wherein the feature space includes a portion corresponding to a combination of values of defect indications, and corresponding to a non-defective index. 示之值之組合的部份。 8. 如申請專利範圍第1項凌士、+ 、 ^ 、义万法,該方法進一步包括使用 一^不同於該比較的拾給士、4» . 、 ^ ^万法,在一對應於被標示為相當 於一缺陷之影像的位置上,批/ v 从亙上’執行受檢驗電氣電路的後續 檢驗。 9·如申請專利範圍第1項之方法,該方法進-步包括: '針對-對應於該比較所標示為相當於一缺陷之影像的 位置’獲得一額外影像;以及 使用不同於該比較的檢驗方法,檢驗該額外影像。 10. 如申請專利範圍第9項之方法,其中該所獲得影像的解 析度低於該額外影像的解析度。 11. 如申請專利範圍第丨項之方法,其中該所獲得影像的解 析度不足以用肉眼偵測至少部份缺陷。 ’ 12·如申叫專利紅圍第1項之方法,纟中於該偵測該電氣電 路中缺陷期間,會針對至少1〇9個影像來執行該比較。 13· —種電氣電路檢驗系統,包括: 一影像產生器,用於產生一所獲得影像,該所獲得影 像對應於一受檢驗電氣電路的一部位; 一影像比較器,其被操作比較該所獲得影像與至少兩 個參考影像,其中該等至少兩個參考影像的至少一參考 影像表示一電氣電路之一影像中的一缺陷,而該等至少 兩個參考影像的至少一參考影像表示一電氣電路之一影 像中的一無缺陷;以及 一偵測指示器,用於指示該所獲得影像對該電氣電路 -20- 本纸張尺度適用中國國家標準(CNS) A4規格(210X297公釐) 577995 A8 B8 C8 ~ D8 六、申請專利範圍 中一缺陷或一無缺陷的相似度。 14. 一種製造電氣電路之方法,包括: 在一非導電基板上供應電氣導體,以構成τ電氣電路 的部份;以及 檢驗一受檢驗電氣電路的部位,包括: 產生一所獲得影像,該所獲得影像對應於該受檢驗 電氣電路的一部位; 比較該所獲得影像與至少兩個參考影像,其中該等 至少兩個參考影像的至少一參考影像表示一電氣電路 中的一缺陷,而該等至少兩個參考影像的至少一參考 影像表示一電氣電路中的一無缺陷;以及 提供一指示,用於指示該所獲得影像對該受檢驗電 氣電路中一缺陷或一無缺陷的相似度。 15. —種用於在電氣電路中偵測缺陷之方法,包括: 構成該等電氣電路之部份的影像集合,該等部份至少 被分類為對應於一缺陷及一無缺陷之一; 針對該集合中的影像,指派與代表該影像之特徵相關 的缺陷決策值,並且將該缺陷決策值儲存於一記憶體 中; 產生一所獲得影像,該所獲得影像對應於一受檢驗電 氣電路的一部位; 針對該所獲得影像中的該等特徵之一指派一缺陷決策 值; 比對該等所儲存缺陷決策值,以分析與一所獲得影像 -21- 本紙張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐) 577995 A BCD 申請專利範圍 相關的缺陷決策值;以及 依據該分析’提供該所獲得影像對缺陷或無缺陷之相 似度的指示。 16.如申請專利範圍第15項之方法’其中該構成—影像集合 包括將被分類成對應於一缺陷的額外影像選擇性新増至 該集合中。 . ^ Π.如申請專利範圍第16項之方法’其中該構成_影像集合 包括將被分類成對應於一無缺陷的額外影像選擇性新增 至該集合中。 曰 18.如申請專利範圍第15項之方法’其中該構成_影像集合 包括將被分類成對應於一無缺陷的額外影像選擇性新增 至該集合中。 19·如申請專利範圍第15項之方法,其中_電氣電路之一部 份的該影像是一電氣電路的較大影像部份。 20.如申請專利範圍第15項之方法,該方法進一步包括使用 -不同於該比較的檢驗方法,在—對應於被標示為相當 於一缺Fa之影像的位置上,執行受檢驗電氣電路的後續 檢驗。 21·如申請專利範圍第1 5項之方法,該方法進一步包括: 針對一對應於該分析所標示為相當於一缺陷之所獲得 影像的位置,獲得一額外影像;以及 使用一不同於該比較的檢驗方法,檢驗該額外影像。 22·如申請專利範圍第21項之方法,其中該所獲得影像的解 析度低於該額外影像的解析度。 本紙張尺度適用中g g家標準(CNS) A4規格Gl〇X297公釐) -22· 577995 A8The combination of the values shown. 8. If the scope of the patent application is No. 1 Lingshi, +, ^, and Yiwanfa, the method further includes using a Shishi, 4 »., ^^ wanfa that is different from the comparison. At the location marked as an image of a defect, the batch / v performs a subsequent inspection of the inspected electrical circuit from above. 9. The method of claim 1 in the patent application scope, the method further comprising: 'for-corresponding to a position corresponding to the image marked as a defect of the comparison' to obtain an additional image; and using a different image from the comparison; Inspection method to inspect the additional image. 10. The method of claim 9 in which the resolution of the obtained image is lower than the resolution of the additional image. 11. The method according to item 丨 of the patent application, wherein the resolution of the obtained image is insufficient to detect at least some defects with the naked eye. “12. If the method of applying for the first item of the patented red enclosure is applied, Langzhong will perform the comparison for at least 109 images during the detection of defects in the electrical circuit. 13. · An electrical circuit inspection system, comprising: an image generator for generating an acquired image, the acquired image corresponding to a portion of an electrical circuit under inspection; an image comparator, which is operated to compare the office Obtain an image and at least two reference images, wherein at least one reference image of the at least two reference images represents a defect in an image of an electrical circuit, and at least one reference image of the at least two reference images represents an electrical One defect in one of the images of the circuit; and a detection indicator to indicate that the obtained image is for the electrical circuit -20- This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) 577995 A8 B8 C8 ~ D8 6. The similarity of one defect or one defect in the scope of patent application. 14. A method of manufacturing an electrical circuit, comprising: supplying electrical conductors on a non-conductive substrate to form part of a τ electrical circuit; and inspecting a portion of the electrical circuit under inspection, including: generating an acquired image, the laboratory The obtained image corresponds to a part of the electrical circuit under test; comparing the obtained image with at least two reference images, wherein at least one reference image of the at least two reference images represents a defect in an electrical circuit, and the At least one reference image of the at least two reference images indicates a defect-free electrical circuit; and an indication is provided to indicate the similarity of the obtained image to a defect or a defect-free electrical circuit under test. 15. —A method for detecting defects in electrical circuits, including: a collection of images that form parts of the electrical circuits, the parts being classified at least as corresponding to one of a defect and a defect-free one; The images in the set are assigned defect decision values related to the characteristics representing the images, and the defect decision values are stored in a memory; an acquired image is generated, the acquired image corresponding to a A part; assigning a defect decision value to one of the features in the acquired image; comparing the stored defect decision values to an acquired image-21- This paper scale applies Chinese National Standard (CNS ) A4 specification (210 X 297 mm) 577995 A BCD Defect decision value related to the scope of patent application; and based on the analysis' provide an indication of the similarity of the obtained image to defects or no defects. 16. The method according to item 15 of the scope of patent application, wherein the composition-image collection includes selectively adding additional images that are classified as corresponding to a defect into the collection. ^ Π. The method according to item 16 of the patent application scope, wherein the composition_image collection includes selectively adding to the collection additional images that are classified as corresponding to a defect-free. 18. The method according to item 15 of the scope of patent application, wherein the composition_image collection includes selectively adding additional images classified as corresponding to a defect-free to the collection. 19. The method of claim 15 in the scope of patent application, wherein the image of a part of the electrical circuit is a larger image portion of an electrical circuit. 20. The method of claim 15 of the scope of patent application, the method further comprising using-a test method different from the comparison,-at a position corresponding to the image marked as equivalent to a missing Fa, performing the test of the electrical circuit Follow-up inspection. 21. The method of claim 15 in the scope of patent application, the method further comprising: obtaining an additional image for a position corresponding to the acquired image marked as a defect by the analysis; and using a comparison different from the comparison Inspection method to inspect the additional image. 22. The method of claim 21, wherein the resolution of the obtained image is lower than the resolution of the additional image. This paper size is applicable to China Standard (CNS) A4 (G10 × 297mm) -22 · 577995 A8 23·如申請專利範圍第"項之方法,其中該指派缺陷決策值 匕括在特徵空間中指派該等缺陷決策值。 24·^申明專利圍第23項之方法,該方法進一步包括分配 泛特徵工間,以建置屬於缺陷表示之該特徵空間的一部 伤,以及屬於無缺陷表示之該特徵空間的一部份。 25·如申請專利範圍第23項之方法,該方法進-步包括: 將被分類成對應於一缺陷的額外影像選擇性新增至該 集合中;以及 調整孩等特徵空間部份,以響應選擇性新增的影像。 26.如申請專利範圍第24項之方法,其中該分析包括決定與 該特徵空間中之_所獲得影像相關之該等缺陷決策值的 位置® 27·如申請專利範圍第1 5項之方法,其中該等缺陷決策值表 示一影像中之一對應特徵的相對強度。 -23· 本紙張尺度適用中國國家標準(CNS) Α4規格(210 X 297公釐)23. The method according to item " of the scope of patent application, wherein the assignment of the defect decision values is to assign the defect decision values in the feature space. 24. ^ A method for declaring patent No. 23, the method further comprising allocating a pan-feature workshop to build a part of the feature space belonging to the defect representation, and a part of the feature space belonging to the non-defect representation. . 25. If the method according to item 23 of the scope of patent application, the method further comprises: selectively adding additional images classified as corresponding to a defect to the set; and adjusting the feature space portion such as children to respond Selectively added image. 26. If the method of the scope of patent application 24, wherein the analysis includes determining the position of the defect decision values related to the _ obtained image in the feature space ® 27 · If the method of scope 15 of the patent application, The defect decision values represent the relative strength of a corresponding feature in an image. -23 · This paper size applies to China National Standard (CNS) A4 (210 X 297 mm)
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8379965B2 (en) 2008-03-27 2013-02-19 Tokyo Electron Limited Defect classification method, computer storage medium, and defect classification apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8379965B2 (en) 2008-03-27 2013-02-19 Tokyo Electron Limited Defect classification method, computer storage medium, and defect classification apparatus
TWI476847B (en) * 2008-03-27 2015-03-11 Tokyo Electron Ltd Defect classification method and defect classification device

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