573305 五、發明說明（1) 本案為提供一種金屬帽式同轴晶片電容器製造方法， 進而能加強電容器整體結構之抗折強度，並能達到高速旦 產規模而降低製造成本，以及能製出品質優良、=祕f 之同軸晶片電容器製成品者。 Λ性南 按目前所常見同轴晶片電容器之製造方式，573305 V. Description of the invention (1) This case is to provide a method for manufacturing a metal cap-type coaxial chip capacitor, which can strengthen the bending strength of the overall structure of the capacitor, and can reach the high-speed production scale, reduce the manufacturing cost, and produce quality. Those who produce excellent coaxial chip capacitors. Λ 性 南 According to the common manufacturing method of coaxial chip capacitors,
材質製成之電容器本體丨，於兩端電極側各以銲錫1 J 結一導線接點2，，再施以外部披覆樹脂4,將電’運 及導線接點2,之銲接處予以包覆保護所製出二 之同軸晶片電容器成品。 卜圖所不 -平： = 電容器製造方式，其導線接點2,是由 千知面之鲜接軸座2丨，銲固一銅導線22，所 點，其導線接點2,之銲接軸座21，與電容 座2tiL古侧作軸向對位銲接時’其平端面之銲接軸 座21並未有可抵靠擋止徑向偏移之設接軸 之電極側相互對應銲接達到有效之軸向對位，二本體j 上之銲接對位技術要求性高，且 在衣私 體1，採直接平面銲接之方4 再導線接點2與電容器本 且作此β Β 接之方式’因銅導線22，長遠3ί) ®半六 易-考曲及不易對位鋒接，製程繁達〇厘未今 向對位銲接精度之偏移，而導^ ::礼失會造成軸 會影=品質之可靠性’故其適用ΐίίί “相對的也 點2,與電容器本體Γ採直接平言，其導線f 本體Γ與導線接點2,形成同等外= 結Π電Π 573305 五、發明說明（2) 外力碰擊時，其導線接點2’銲接處極易造成剝離之現象， 且，體結構強度並未能有效抵抗衝擊力，嚴重的甚至造成 電容器本體1，與銅導線2 2,直接斷裂之意外狀況發生。 有鑑於此，本發明者基於習知同軸晶片電容器採直接 平面銲接導線接點之製造繁項，品質可靠性難以掌控，成 :結構強度脆弱等缺失，乃加以研究，並針對其癥結所 屬俨：始著手加以謀求改善’補其所短 '終而提供-種金 屬h式之同軸晶片電容器製造方法，供產業上利用。 本發明之主要目的，即在於提供一種金屬帽 ^ ϋ容器製造方法，係利用電容器本體之兩端電極侧直 ίI二Ϊ覆樹脂固化處理而成形出軸向接點電極之方Ϊ 製ΐ;能利用金屬帽導體具備有對位精準 兩端電極側銲固接著金屬帽導體之處理，以 規模之效益，完全免除習知製 间、里產 彎曲不易組裝軸向對位銲接=銅達”厘米容易 率，而得以降低製造成本，且在品 效提升生產效 大之穩定特性。 σσ、可罪性上也能獲得最 晶片電方：的复:供-種金屬帽式之同軸 段差套固結對本體形成-獲得倍數之提升，得以承 ^ 體之銲固強度 器具有較佳抗折強度之安：外力衝擊’•整個電容Capacitor body made of material 丨 At both ends of the electrode side, solder 1 J is connected to a wire contact 2, and then an external coating resin 4 is applied to cover the welding place of the electric and wire contact 2. The finished coaxial chip capacitors manufactured by the second cover are protected. What the map does not mean-flat: = capacitor manufacturing method, its wire contact 2 is a freshly-connected shaft seat 2 from the Chichi surface, a copper wire 22 is welded, so the point of its wire contact 2, the welding axis The base 21 is welded axially with the ancient side of the capacitor base 2tiL. The welding shaft base 21 of its flat end face does not have a corresponding welding with the electrode side of the connecting shaft against the radial offset to achieve effective welding. Axial alignment, the welding alignment on the two bodies j is highly demanding, and in the clothing body 1, the square welding directly 4 is used, then the wire contact 2 is connected to the capacitor and this β Β is connected. Copper wire 22, long-term 3ί) ® Semi-Liu Yi-Kao Qu and difficult to align the front, the manufacturing process is undetermined to the deviation of the alignment welding accuracy, and the guide ^ :: etiquette loss will cause shaft shadow = Reliability of quality ', so its application ΐίί "The opposite point 2 is directly verbal with the capacitor body Γ, and the conductor f body Γ and the conductor contact 2 form the same exterior = junction Π Π 573305 V. Description of the invention ( 2) When an external force strikes, the wire joint 2 'welding place is likely to cause peeling, and the strength of the body structure cannot effectively resist The impact resistance severely caused the capacitor body 1 and the copper wire 2 2 to break directly. In view of this, based on the conventional coaxial chip capacitors, the inventors have made complicated manufacturing of direct planar soldered wire contacts. Quality and reliability are difficult to control, and the lack of structural strength and fragility is studied, and the crux of the problem lies in it: starting to seek to improve 'compensating for its shortcomings' and finally providing a metal h-type coaxial chip capacitor manufacturing method The main purpose of the present invention is to provide a method for manufacturing a metal cap container, which is formed by using two sides of the capacitor body with electrode sides straight and cured with resin to form an axial contact electrode. Square Ϊ system ΐ; can use metal cap conductor with accurate positioning of both ends of the electrode side welding and metal cap conductor processing, with the benefit of scale, completely eliminate the conventional system, the internal bending is not easy to assemble axial alignment welding = Tongda "cm easy rate, which can reduce the manufacturing cost and improve the stability of the production efficiency. σσ, can also obtain the most chip electrical side: complex: supply-a metal cap-type coaxial segment differential sleeve consolidation to the body formation-to obtain a multiplier increase, can bear the body's welding strength strength has better resistance Breaking strength: external force impact '• the entire capacitor
573305 五、發明說明（3) 明上揭目的所採用技術手段及方 圖式及具體貫施例詳加說明如下： 配5 (A二參I閱/η二圖所示’其為本發明金屬帽式之同軸 (AXIAL LEAD )晶片電容器製造流程圖。其中： 步驟1-金屬帽導體成型處理，係以金 出呈一门形體之金屬帽導體i。 ' , 、 拉成形 步驟2-電容器本體兩端電極側㈣金屬 乃將電容器本體2於兩端電極側採以 =間 接著處理…該電容器本體2係為内部晶片電容-導套體？ 陶€材質包覆’使其兩端具有電極側’而電容器本 兩端電極側與金屬帽導體1於對接面間係以錫膏3作以 銲固（如第三圖所示），且此銲固接著處理可利用加工二 具（JIG )將複數組電容器本體2於兩端電極側一次: 著金屬帽導體1，以達到高速量產規模之效益。 口接 步驟3-金屬帽導體熔接銅導線處理，係將電容器本 2銲固金屬帽導體1外側端予以熔接鋼導線4處理，以完成 如第四圖所示具銅導線4接點之電容器。 步驟4-電容器披覆樹脂固化處理，係將具銅導線4接 點之電容器外部披覆樹脂5能對電容器本體2、金屬帽導體 1及銅導線4之銲接處作以包覆固化定位及保護。 步驟5 _測試及包裝處理，乃將固化處理之電容器進行 測試包裝’即能順利完成金屬帽式之同軸晶片電容器製成 品者。 本發明利用電容器本體2之兩端電極側直接套接銲固573305 V. Description of the invention (3) The technical means, schematic diagrams, and specific implementation examples used for the purpose of disclosure on the Ming Dynasty are explained in detail as follows: Match 5 Manufacturing process of cap-type coaxial (AXIAL LEAD) chip capacitors. Among them: Step 1-metal cap conductor forming process, the metal cap conductor i is formed into a gate-shaped body with gold. ',, Drawing step 2-capacitor body two The terminal electrode side is made of metal. The capacitor body 2 is processed indirectly on both electrode sides. The capacitor body 2 is an internal chip capacitor-conductor body? The ceramic material is coated so that it has electrode sides at both ends. The capacitor electrode 1 and the metal cap conductor 1 between the two ends of the capacitor are soldered with solder paste 3 (as shown in the third figure) between the abutting surfaces, and this soldering can be processed by two pieces (JIG). The capacitor body 2 is once on the electrode sides of both ends: the metal cap conductor 1 is used to achieve the benefits of high-speed mass production. Mating step 3-the metal cap conductor is welded to the copper wire, and the capacitor 2 is welded to the metal cap conductor 1 The outer end is welded with steel wire 4 The capacitor with copper wire 4 contacts is completed as shown in the fourth figure. Step 4-The capacitor coating resin is cured. The capacitor 5 with copper wire 4 contacts is coated with resin 5 to the capacitor body 2 and the metal cap. Conductor 1 and copper wire 4 are welded for covering and positioning and protection. Step 5 _Testing and packaging process is to test and pack the cured capacitors, that is, those who can successfully complete the metal cap-type coaxial chip capacitor products. In the present invention, the two electrode sides of the capacitor body 2 are directly socketed and welded.
910531.ptd 第6頁 573305 ---- - 五、發明說明（4) 金屬帽導體1，再於金屬帽 ' 坡覆樹脂5固化處理而體1外端熔接鋼導線4後予以 向對位導接製程上能利用^出轴向接點電極之方式，在軸 速之作用，且-次辉固處^^體1具備有對位精準快 兩端電極側銲固接著金 曰出複數組電容器本體2於 產規模之效益，完全免m1之處理’以達到高速量 易彎曲不易組裝軸向對位°製程因銅導線長達30厘米容 效率，而得以降低製#占士接之製程，不僅有效提升生產 最大之穩定特性，^ 4 s，且在品質可靠性上也能獲得 段差套固結導體1與電容器本體2形成- 獲得倍數之提*，得以承受體之銲固強度 器具有較佳抗折強度之安全mm，·整個電容 汐 女王防遵，極具產業利用性。 p ^ Z, 麻& ^明所提供金屬帽式之同軸晶片電容器 ^:方法’確只此達到預期實用價值及功 用性’顯已充份符合發明專利規定之要 發明專利之申請。 又犮依沄徒出 符號說明： 金屬帽導體---- 電容器本體____ 錫膏.......... 銅導線........ 樹脂.......... 電容器本體 導線接點 銲接軸座.......2 Γ 銅導線.........221 銲錫...........3， 樹脂..........4 ’ 910531.ptd 573305 圖式簡單說明 第一圖所示為習知同軸（AXIAL LEAD )晶片電容器之剖面 示意圖。 第二圖所示為本發明金屬帽式之同軸（AXIAL LEAD )晶片 電容器製造流程圖。 第三圖所示為本發明金屬帽導體與電容器本體銲固處理後 之剖面示意圖。 第四圖所示為本發明成形銅導線接點之電容器外觀示意 圖。 第五圖所示為本發明製出金屬帽式之同軸（AXIAL LEAD ) 或晶片電容器剖面示意圖。910531.ptd Page 6 573305 -----V. Description of the invention (4) The metal cap conductor 1 is then solidified with the metal cap 'slope-covered resin 5 and the outer end of the body 1 is welded with the steel wire 4 and guided to the alignment. In the connection process, the method of using the axial contact electrode can be used to effect the speed of the shaft, and the -secondary solidification place ^^ 1 has the positioning accuracy and fast welding of the two electrode sides, followed by gold capacitors. The benefit of the main body 2 in the production scale is completely free of the processing of m1 'in order to achieve a high speed and easy to bend and difficult to assemble the axial alignment. The process can reduce the manufacturing process of # 占士 接 because of the copper wire's capacity of 30 cm. Effectively improve the maximum stable characteristics of production, ^ 4 s, and can also obtain the formation of stepped sleeve consolidated conductor 1 and capacitor body 2 in quality and reliability-an increase of multiples *, the soldered strength of the bearing body has better The safety of the flexural strength mm, the entire capacitor ti queen is anti-compliance, very industrially usable. p ^ Z, linen & ^ Ming provided metal-cap-type coaxial chip capacitors ^: Method â € “this is the only way to achieve the expected practical value and functionality â €” it has fully met the requirements of invention patent applications for invention patents. Also convert to the symbol description: Metal cap conductor ---- Capacitor body ____ Solder paste ............ Copper wire ...... Resin ...... ... capacitor body wire contact welding shaft seat ......... 2 Γ copper wire ......... 221 solder ......... 3, resin ... ....... 4 '910531.ptd 573305 Brief description of the diagram The first diagram shows a schematic cross-section of a conventional coaxial chip capacitor. The second figure shows a manufacturing flow chart of the metal cap-type coaxial (AXIAL LEAD) chip capacitor of the present invention. The third figure is a schematic cross-sectional view of the metal cap conductor and the capacitor body after welding treatment according to the present invention. The fourth figure is a schematic diagram showing the appearance of a capacitor of the formed copper wire contact of the present invention. The fifth figure is a schematic cross-sectional view of a metal cap-type coaxial (AXIAL LEAD) or chip capacitor manufactured by the present invention.
910531.ptd 第8頁910531.ptd Page 8