TW573302B - Impregnating potting compositions and their use, and a process for impregnating ignition coils - Google Patents

Impregnating potting compositions and their use, and a process for impregnating ignition coils Download PDF

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Publication number
TW573302B
TW573302B TW89101894A TW89101894A TW573302B TW 573302 B TW573302 B TW 573302B TW 89101894 A TW89101894 A TW 89101894A TW 89101894 A TW89101894 A TW 89101894A TW 573302 B TW573302 B TW 573302B
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Taiwan
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patent application
impregnating
impregnated
composition according
filler
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TW89101894A
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Chinese (zh)
Inventor
Christoph Scheuer
Friedhelm Foltes
Heinz-Guenter Reichwein
Sandra Reinke
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Bakelite Ag
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24Acids; Salts thereof
    • C08K3/26Carbonates; Bicarbonates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • H01F27/32Insulating of coils, windings, or parts thereof
    • H01F27/327Encapsulating or impregnating
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F38/00Adaptations of transformers or inductances for specific applications or functions
    • H01F38/12Ignition, e.g. for IC engines

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Description

573302 經濟部智慧財產局員工消費合作社印製 A7 -------B7______ 五、發明說明(1 ) 本發明係關於供電器及電子組件含浸用之熱固性灌注組 合物。此等組件係使用此等組合物灌注。組合物再固化且 保護組件免於機械及化學之作用。 該應用段中較好使用以環氧樹脂爲主之組合物,因爲其 具有鬲機械強度,優良之化學安定性及極佳之電器性質。 茲組合物因此包括一種或多種每分子超過一個環氧基之 環氧樹脂、硬化劑及一般爲2〇至7〇重量%之細微顆粒填 充封I此等填充劑之功旎爲改善硬化組合物之機械及化學 性質,及降低固化過程中所產生之收縮。 。de-C-32 29 558申請以白垄當作理想之填充劑,Ερ·Α·〇 3J^193及DE-C-42 〇6 7U中進一步揭示填充劑係選自包含 氫氧化鋁、氫氧化鎂、紅色磷、白雲石、氧化鋁、二氧化 鈇、石夕_、秒酸銘(灰石)、細研磨之雲母或粉狀玻璃、 玻瑀片、玻纖或玻璃鬚者。 所有此等填充劑均呈現相同之問題,若其粒徑梓細微, 例如當其爲沉殿之白垒或細微顆粒之氧切時,會降低組 合物之含浸能力,若填充劑之粒徑較粗,則其極易沉降, 尤其是因爲所用之環氧化合物爲低黏度者。此會導致含浸 層之不均勻,且在機械或熱應力下龜裂。 曰.。& 因此。本發明之目㈣提供供電器及電子組件用之高品 質含浸灌注組合物,該组合物包括以環氧樹脂當作基㈣ 脂,其會呈現良好的含浸作用,且提供均勻之含浸,且當 用在工業上時會提供優良之保護,免於機械及化;侵害: 亦可提供對溫度改變之高抗性。 -----I---I----------訂--------- (請先閱讀背面之注意事項再填寫本頁) -4-573302 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 ------- B7______ V. Description of the Invention (1) The present invention relates to a thermosetting perfusion composition for impregnation of power supplies and electronic components. These components are infused with these compositions. The composition recurs and protects the component from mechanical and chemical effects. The epoxy resin-based composition is preferably used in this application section because it has high mechanical strength, excellent chemical stability, and excellent electrical properties. The composition thus includes one or more epoxy resins, hardeners and more than 20 to 70% by weight of fine particle filling seals per molecule. The purpose of these fillers is to improve the hardening composition. Mechanical and chemical properties, and reduce shrinkage during curing. . de-C-32 29 558 has applied to use white ridge as an ideal filler. Eρ · Α · 〇3J ^ 193 and DE-C-42 〇6 7U further disclose that the filler is selected from the group consisting of aluminum hydroxide, hydroxide Magnesium, red phosphorus, dolomite, alumina, hafnium dioxide, Shi Xi_, second acid name (gray stone), finely ground mica or powdered glass, glass frit, glass fiber or glass whisker All these fillers present the same problem. If their particle size is very small, for example, when it is the white barrier of Shen Dian or the oxygen cutting of fine particles, the impregnation ability of the composition will be reduced. Thick, it is easy to settle, especially because the epoxy compound used is low viscosity. This can lead to unevenness of the impregnated layer and cracking under mechanical or thermal stress. Said ... & therefore. It is an object of the present invention to provide a high-quality impregnation infusion composition for power supplies and electronic components. The composition includes epoxy resin as the base grease, which will exhibit a good impregnation effect and provide uniform impregnation. When used in industry, it will provide excellent protection from mechanical and chemical. Infringement: It can also provide high resistance to temperature changes. ----- I --- I ---------- Order --------- (Please read the notes on the back before filling this page) -4-

573302 A7573302 A7

經濟部智慧財產局員工消費合作社印— 該目的係藉由依據申請專利範園第1至5項之含浸灌注 組合物達成,藉由依據申請專利範圍第6項,使用組合物 含浸著火線圈達成,亦可藉由以依據申請專利範圍第i至 5項之含浸灌注組合物含浸,含浸著火線圈之方法達成。 經發現具有及優良含浸作用之不沉降、均勻之含浸灌注 組合物係由(若包括)環氧樹脂及硬化劑當作結合劑,及由 一種或多種選自包含碳酸鈣或白雲石及氫氧化鋁之填充劑 組成七混合物當作填充劑製得。 該組合物尚可包括其他傳統添加劑,如硬化加速劑、黏 著促進劑、反應增網劑、改質劑,例如聚醚多元醇或聚石夕 氧烷、潤濕劑及顏料。 此等組合物係依先前已知之方式使用,以含浸電器及電 子組件,特別是著火線圈。一旦組合物已經用作灌注(較 好在興玄下)’則其會在南溫下固化。接著形成具有優良 化學、機械及電器性質,且對溫度改變具高抗性之均質覆 蓋物。 新穎組合物之填充劑含量以個別混合物之總量爲準,在 1 0至7 0重量%之間,較好在5 〇至6 0重量%之間。 依據本發明,此等填充劑爲氫氧化鋁及碳酸鈣或白雲石 之混合物,或碳酸辦及白雲石依任一所需比例之混合物。 此處氫氧化鋁之比例以填充劑之總量爲準,係在5至3 〇, 較好在1 0至2 0重量%之間。 新穎混合物之優點對於定出填充劑細微度之需求並不返 切,且對固化組合物之含浸效能或最終性質不會有負面之 -5- 本紙張g+關家鮮(CNS)A4規格(210 x 297公爱 1 (請先閱讀背面之注咅?事項再填寫本頁} 裝--------訂---- 573302 經濟部智慧財產局員工消費合作社印製 Α7 Β7 五、發明說明(3) 影響。此意指可能可使用平均粒徑約0 · 1至5微米之專屬 極細微顆粒之填充劑,如沉澱或沉澱且疏水性之白堊。此 對組合物之含浸能力不會產生負面之影響。 然而,亦可使用平均粒徑在2至6 0微米間,且在新穎掺 泛物中不會發生沉降之轉屬粗顆粒研磨填充劑。新顆含浸 雇注組合物中之填充劑因而在任一應用上之粒徑均可在 0.01至100微米之間。 新穎含浸灌注組合物之另一優點爲對於所用環氧化合物 之起始黏度並沒有迫切之要求,因此並不需提供特定之樹 脂混合物,只要遵循低起始黏度之基本條件即可。因此可 能使用達到例如特別高的Tg値所需之市售基底樹脂以及 特定之樹脂。決定性因子爲此等化合物每分子平均含有至 少二個環氧基,且25°C下之黏度低於20000 mpas。 基於成本效率之理由,較好使用以雙酚之二縮水甘油醚 爲主之適當市售樹脂,特別是雙酚A或雙酚F,且此等可 不需配合稀釋劑使用。 供環氧樹脂固化用之已知任一種化合物均可用作硬化 劑、。較佳者爲一般不會快速硬化,直到特定之起始溫度爲 止 < 内潛型環氧樹脂硬化劑。此等硬化劑之一般代表例爲 (若需要)可以以咪唑或以經烷基取代之咪唑加速之二羧酸 酐。其他較佳之硬化劑爲酚醛清漆樹脂,特別是在至 50 c又間之溫度下使用之酚醛清漆樹脂液體,如 248 980中揭示者。此等硬化劑可增加固化含浸組合物之 韌性。 口 -6 - 本紙張尺度適用中國國家標準(CNS)A4規格(210x297公釐) « ' I --.---------^--------^--------- (請先閱讀背面之注意事項再填寫本頁)Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs—this objective is achieved by impregnating the infusion composition according to items 1 to 5 of the patent application park, and by impregnating the coil with the composition according to item 6 of the patent application scope It can also be achieved by impregnating the impregnating composition with the impregnating infusion composition according to items i to 5 of the scope of patent application, and impregnating the ignition coil. Non-settling, homogeneous impregnated infusion compositions found to have excellent impregnation and, if included, epoxy resin and hardener as binders, and one or more selected from the group consisting of calcium carbonate or dolomite and hydroxide A filler consisting of seven mixtures of aluminum was prepared as a filler. The composition may also include other conventional additives, such as hardening accelerators, adhesion promoters, reaction net extenders, and modifiers, such as polyether polyols or polyoxanes, wetting agents, and pigments. These compositions are used in a previously known manner to impregnate electrical and electronic components, especially ignition coils. Once the composition has been used for infusion (preferably under Xingxuan) ', it will cure at South temperature. It then forms a homogeneous covering with excellent chemical, mechanical and electrical properties and high resistance to temperature changes. The filler content of the novel composition is based on the total amount of the individual mixtures, and is between 10 and 70% by weight, preferably between 50 and 60% by weight. According to the present invention, these fillers are a mixture of aluminum hydroxide and calcium carbonate or dolomite, or a mixture of carbonic acid office and dolomite in any desired ratio. Here, the proportion of aluminum hydroxide is based on the total amount of the filler, and is 5 to 30, preferably 10 to 20% by weight. The advantages of the novel mixture are not to cut back the need to determine the fineness of the filler, and there will be no negative effects on the impregnation performance or final properties of the cured composition. -5- Paper g + Guan Jia Xian (CNS) A4 Specification (210 x 297 公 爱 1 (Please read the note on the back? Matters before filling out this page} Installation -------- Order ---- 573302 Printed by the Intellectual Property Bureau Employee Consumer Cooperatives of the Ministry of Economic Affairs Α7 Β7 V. Invention Explanation (3) Impact. This means that it may be possible to use proprietary extremely fine-grained fillers with an average particle size of about 0.1 to 5 microns, such as precipitated or precipitated and hydrophobic chalk. This impregnation ability to the composition will not It has a negative effect. However, it is also possible to use a coarse-grained abrasive filler that has an average particle size between 2 and 60 microns and does not settle in novel blends. The filler can therefore have a particle size between 0.01 and 100 microns in any application. Another advantage of the novel impregnated infusion composition is that there is no urgent requirement for the initial viscosity of the epoxy compound used, so there is no need to provide Specific resin mixture, just follow Basic conditions of low initial viscosity are sufficient. Therefore, it is possible to use commercially available base resins and specific resins required to achieve, for example, a particularly high Tg 値. The decisive factor is that these compounds contain at least two epoxy groups per molecule on average, Viscosity at 25 ° C is less than 20000 mpas. For reasons of cost efficiency, it is better to use suitable commercially available resins based on diglycidyl ether of bisphenols, especially bisphenol A or bisphenol F, and these Need to be used with a diluent. Any known compound for epoxy resin curing can be used as a hardener. It is preferred that it generally does not harden quickly until a specific starting temperature < internal latent epoxy Resin hardeners. Typical examples of these hardeners are (if required) dicarboxylic anhydrides that can be accelerated with imidazoles or alkyl-substituted imidazoles. Other preferred hardeners are novolac resins, especially at temperatures up to 50 c. Novolac resin liquids used at other temperatures, such as those disclosed in 248 980. These hardeners can increase the toughness of the cured impregnated composition. Mouth-6-This paper size is applicable to Chinese national standards (CNS) A4 specifications (210x297 mm) «'I --.--------- ^ -------- ^ --------- (Please read the first (Please fill in this page again)

Claims (1)

573302 A8 B8573302 A8 B8 第〇89101894號專利申請案 中文申凊專利範圍替換本(92年8月)C8 ----- —— ” no 申4秦利圍 ! 上 )U 、 充劑。 2·根據申請專利範圍第1項之含浸灌注組合物,其特點為 氫氧化銘之比例以填充劑之總量為準,為1 〇至2 〇重量 %。 π~®~壤氧樹脂、硬化劑及填充劑組成之電器組件用 之含浸灌注組合物(其排除細分散之氧化矽),其特點 為包括一種或多種選自包含碳酸鈣或白雲石及以總量 為準’ 5至3 0重量%之氫氧化鋁之填充劑混合物當作填 3·根據申請專利範圍第1至2項中任一項之含浸灌注組合 物’其特點為包括以雙酚之二縮水甘油醚為準之樹脂 當作壤氧樹脂。 4·根據申請專利範圍第1至2項中任一項之含浸灌注組合 物’其特點為包括以下列一般式之金屬錯化物當作硬 化劑 MLXBZ,M[SR]xBy,M[SR]N(N)n,M(PHal)m,或 M(pHal)m(N)n 其中 M 為形成錯合物金屬之陽離子 SR 為有機或無機酸游離基 L 為形成黄合物之配位基 B 為路易士酸 PHal為擬鹵素之離子 N 為氮驗 X 為1至8間之數 O:\62\62591-920801.DOC 5 . 1 -No. 089101894 Chinese Patent Application for Patent Application Replacement (August 1992) C8 ----- —— ”No Application 4 Qin Liwei! 1) U, Charger. 2. According to the scope of patent application The impregnated infusion composition according to item 1, characterized in that the proportion of the hydroxide hydroxide is based on the total amount of the filler, and is 10 to 20% by weight. Π ~ ® ~ an electrical appliance composed of a soil oxygen resin, a hardener, and a filler Impregnated infusion composition for components (which excludes finely divided silica), which is characterized by including one or more selected from the group consisting of calcium carbonate or dolomite and aluminum hydroxide in an amount of 5 to 30% by weight. Filler mixture as filling 3. The impregnated infusion composition according to any one of claims 1 to 2 of the scope of the patent application, which is characterized by including a resin based on the diglycidyl ether of bisphenol as a soil oxygen resin. · The impregnated infusion composition according to any one of claims 1 to 2 is characterized by including a metal complex compound of the following general formula as a hardener MLXBZ, M [SR] xBy, M [SR] N ( N) n, M (PHal) m, or M (pHal) m (N) n, where M is a complex metal Ions SR are organic or inorganic acid free radicals L are flavonoid-forming ligands B are Lewis acid PHal are quasi-halogen ions N are nitrogen tests X are numbers between 1 and 8 O: \ 62 \ 62591-920801 .DOC 5. 1- 家標準(CNS) A4規格(210X297公爱) 本紙張尺度適用中國國 573302 A B c D 申請專利範圍 y z m η 為1至5間之數 為7至8間之數 為2至3間之數 為1至2間之數 5.根據申請專利範圍第1至2項中任一項之含浸灌注組合 物,其係用於含浸著火線圈。 -2- O:\62\62591-920801.DOC5 本紙張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐)Home Standard (CNS) A4 specification (210X297 public love) This paper size applies to China 573302 AB c D Patent application scope yzm η is 1 to 5 number is 7 to 8 number is 2 to 3 number is 1 Number between 2 and 5. The impregnation composition according to any one of items 1 to 2 of the scope of patent application, which is used for impregnating the ignition coil. -2- O: \ 62 \ 62591-920801.DOC5 This paper size applies to China National Standard (CNS) A4 (210 X 297 mm)
TW89101894A 1999-03-10 2000-02-03 Impregnating potting compositions and their use, and a process for impregnating ignition coils TW573302B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE1999110711 DE19910711A1 (en) 1999-03-10 1999-03-10 Impregnating casting compounds, their use and a method for impregnating ignition coils

Publications (1)

Publication Number Publication Date
TW573302B true TW573302B (en) 2004-01-21

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EP (1) EP1080474A1 (en)
DE (1) DE19910711A1 (en)
TW (1) TW573302B (en)
WO (1) WO2000054287A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10057111C1 (en) * 2000-11-16 2002-04-11 Bosch Gmbh Robert Casting composition for removing thermal energy from electrical or electronic device, comprises epoxide resin, silicone, filler and initiator and cures by chemical reaction, has specified thermal conductivity

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3317197C1 (en) * 1983-05-11 1984-10-11 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Electrically insulating encapsulating compound for semiconductor components
US4923908A (en) * 1988-10-14 1990-05-08 Zenith Electronics Corporation Epoxy compositions, and method of making same
CA2054212C (en) * 1990-03-09 1997-02-11 Axel Bottcher Method for polymerization of epoxide compounds
EP0544618A1 (en) * 1991-11-27 1993-06-02 Ciba-Geigy Ag Highly filled epoxy casting resin masses
JP3385784B2 (en) * 1994-02-28 2003-03-10 神鋼電機株式会社 Inorganic filler anti-settling type casting resin composition and premix composition
DE69531500T2 (en) * 1994-07-01 2004-04-08 Vantico Ag EPOXIDHARZGIESSMASSE

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