TW567600B - A package with a heat sink - Google Patents

Abstract

A package with a heat sink, is suited for disposing on a motherboard. The package includes a substrate, a first package module, multiple second package modules, a heat sink and solders. The substrate has a first surface and a second surface, the first package module is disposed on the fist surface and the second package module is disposed on the second surface. The heat sink is disposed on the first package module, and has a first portion and a second portion. The first portion is located on the first package module, and the second portion is vertical to the first portion and trends toward the substrate and some area of the second portion is faced to the sidewalls of the substrate. The solders are disposed on the first surface of the substrate, and the substrate is electrically coupled to the motherboard by the solders.

Description

567600

It is related to a type of packaging structure with a right-handed & a # 1 1 /, a thermal structure of a political component, and a special package industry with a heat dissipation component configured on the bottom packaging module. Circu 1 ts, is mainly divided into three stages: Bare wafer (die) manufacturing, fabrication, fabrication, and packaging of integrated circuit (IC) packages. Chips are produced through wafers and circuits. The design and cutting of the wafer are completed, and each of the bare wafers is cut from the wafer, electrically connected through the bonding pad on the bare wafer, and then the bare wafer is covered with a sealing material. The purpose is to prevent the bare chip from being exposed to moisture, heat, and noise. The dielectric between the bare chip and external circuits, such as the printed circuit board (Ucuit Board, PCB) or other packaging substrates, thus completes the integrated circuit. Package Step The present invention is particularly related to a package structure. Production of semiconductor circuits (1C) in semiconductor (ic). Among them, the photomask is formed by cutting and forming a package with external signals, and provides (Printed C-type media. In order to connect the bare chip and the packaging substrate described above, wires and wires are usually used.) / Or bump (bump) as the bonding medium. Among them, Flip chip Interconnect Technology (Flip chip Interconnect Technology) is to form solder balls in an array arrangement on the pads of the bare wafer, and then use the wafer after flipping the wafer The solder balls on the substrate are correspondingly connected to the contacts on the packaging substrate, so that the chip can be electrically connected to the packaging substrate through the solder balls, and then electrically connected to the external signals through the internal circuit and surface contacts of the packaging substrate. Therefore, with the increase of the accumulation degree of the chip, the package structure of the chip is also becoming more and more diversified.

10037twf1.ptc Page 6 567600-Case No. 91125099_year month day__ V. Description of the invention (2) Chip package structure, which has the advantages of reducing chip package area and shortening signal transmission path, etc., has been widely used in chip packaging Fields, such as Chip Scale Package (CSP), Ball Grid Array (BGA), and Multi-Chip Module (MCM) packages Applications of flip-chip bonding technology. Among them, the multi-chip module package is, for example, a package module of a plurality of chip size packages (CSP), which is configured by flip-chip bonding technology and is integrated on a substrate, and the package modules are separated by the substrate. They are electrically connected to each other to form a packaging structure of a multi-package module with different functions. Taking dynamic random access memory (DRAM) and central processing unit (CPU) as examples, a multi-chip module package (MCM) package structure can be used to integrate multiple DRAMs and central processing units (CPUs). ) Encapsulated on the same substrate, this not only increases the space requirement of the six-state structure, but also reduces the signal delay between the packaging modules ~ and reduces the high-speed processing. Therefore, it is widely used in the Tongwan phenomenon. To sub products. FIG. 1A shows a schematic side view of a conventional package junction motherboard 10 having a multi-package module. Please refer to FIG. 丨 A, which includes a two-side surface of the substrate 100, which is disposed on a 100, a first package module, and a plurality of second-sealed substrates. Each of 4 has a plurality of, 12 and 10, 10 3b, which is used as the input and output medium of the substrate 10 (). In addition, gl03a, module 1 10, and the second package module 丨 2 are respectively arranged on the substrate 10 to the seal surface 102, 104, and the first package module iiq is, for example, one of the central kings.

567600 _Case No. 91125099_year __g___ amendment __ 5. Description of the invention (3) " (CPU) 'It is located on the central area of the lower surface 102 of the substrate 100, and the second package module 1 1 2 is dynamic, for example Random memory (DRAM) is distributed on a region of the upper surface 104 of the substrate 100. In addition, the first and second package modules 1 10 and 1 12 are electrically connected to the substrate 10 and the contacts on the surface 10 2 and 104 by the solder ball 1 06, and each package Modules 丨 〇〇, 丨 丨 2 and the substrate 1 〇 'In addition to the use of solder balls 〇 06 to connect, there are filler materials 1 08 (underfill) filled in the packaging module 10 (), 112' And the substrate 100, and the solder ball 106 is coated to disperse the thermal stress of the solder ball 106 to avoid the thermal expansion coefficient between the package module and the substrate (c oeff 丨 c 丨 ent of Thermal Expansion (CTE) produces different tensile stress, which causes solder ball 106 to produce gaps due to fatigue failure (fat igUe), and affects the signal transmission performance between the package module and the substrate. Please refer to FIG. 1B, which shows a schematic view of the package structure of FIG. 1a. `` The first package module 1 1 of the known package structure, such as a central processing unit (CPU), is electrically connected to the substrate. i 〇〇 the bottom surface 丨 〇2 contact 丨 〇 3 a, and the board 1200 below the surface 〇 02 also has a plurality of array array of contacts 丨 〇 3 b, by the solder bump 1 0 5 is electrically connected to the motherboard 10, and is used as a base board for connecting the input and output media of the motherboard 10. It is worth noting that when the chip inside the first package module 110 is operated at high frequency, a large amount of heat is generated due to the dielectric loss of the chip, which will gradually increase the temperature of the chip itself. When the temperature of the chip itself exceeds its normal operating temperature range, the internal circuit I of the chip may have a calculation error phenomenon, or may temporarily fail. However, the conventional first package module, such as the CPU, only penetrates through its surface and

10037twf1.ptc Page 8 567600 _Case No. 91125099_ Year and Month Revision_ V. Description of the invention (4) The heat is dissipated to the outside through the side wall of the substrate 100, or to the CPU through the motherboard 10. Heat dissipation, but this heat dissipation method cannot provide a larger area of heat dissipation, resulting in the heat generated by the chip cannot be effectively dissipated to the outside world. In view of this, the object of the present invention is to provide a packaging structure having a heat dissipation member, wherein the heat dissipation member has a large heat dissipation area, and the heat generated by the chip inside the package structure can be efficiently conducted by the heat dissipation member. The heat escapes to the outside world. Another object of the present invention is to provide a heat dissipation member suitable for being arranged on a packaging structure of a multi-package module. The heat dissipation member can be connected to the surface of the packaging module and the side wall of the substrate. The surface of the package module and the side wall of the substrate are conducted to the heat dissipation member, and the heat is diffused to the outside through the surface of the heat dissipation member. In order to achieve the above object of the present invention, a packaging structure with a heat dissipation member is provided, which is suitable for being disposed on a motherboard. The packaging structure with the heat dissipation member mainly includes a substrate, a first packaging module, and a plurality of second packages. A module, a heat dissipation member, and a plurality of solder bumps, wherein the substrate has a first surface and a corresponding second surface, the first package module is disposed on the first surface of the substrate, and the second package module is disposed on On the second surface of the substrate. In addition, the heat dissipation member is disposed on the first package module, and the heat dissipation member has a first portion and a second portion, wherein the first portion is located on the first package module and the second portion is perpendicular to the first package module. The extending direction of one part and the second part is toward the substrate, and part of the area of the second part faces the side wall of the substrate. In addition, the solder bumps are arranged on the first surface of the substrate,

10037twf1.ptc Page 9 567600 _Case No. 91125099_ Year Month Amendment _ V. Description of the invention (5) The substrate can be bonded to the motherboard and electrically connected to the motherboard. According to a preferred embodiment of the present invention, the first package module is, for example, located on a central region of the first surface of the substrate, and the first part of the heat dissipation member is, for example, a strip-shaped member, or is formed by two strip-shaped members. A cross-shaped pattern is formed, and the cross-shaped crossing area is disposed on the first package module. In addition, the second portion of the heat dissipation member is bonded to the side wall of the substrate, for example, by a solder. In order to make the above-mentioned objects, features, and advantages of the present invention more comprehensible, a preferred embodiment is given below in conjunction with the accompanying drawings to make a detailed description as follows: Marking description of the drawings: 1 0: Motherboard 1 0 0, 2 0 0, 3 0 0, 3 0 0 a, 3 0 0 b: substrates 102, 202, 302, 302a > 302b: first surface 1 0 3 a, 1 0 3 b, 2 0 3 a, 2 0 3 b, ... contact 104, 204, 304: second surface 1 0 5: solder bump 1 0 6, 2 0 6: solder ball 1 0 8, 2 0 8: filling material 1 1 0, 2 1 0, 3 1 0, 3 1 0 a, 3 1 0 b ·· First package module 1 1 2, 2 2 0, 3 2 0: Second package module 207: Chip 2 3 0, 3 3 0, 3 3 0 a: heat dissipation members 232, 332: first part

10037twf1.ptc Page 10 567600 Case No. 91125099 Amendment V. Description of Invention (6) 234, 334 236 240 250 252 338 P: ^ 3 3 6:, 3 4 0, > 3 5 0:: channel, 3 3 8 a Second solder at the joint 3 4 0 a Side wall portion 3 4 0 b: Parent fork area of the solder bumps Embodiment 2A illustrates a packaging structure having a heat dissipation member according to the first embodiment of the present invention. A schematic side view of a mother board, and an enlarged view of the joint side. Figure 2B shows the installation of Figure 2A of the present invention. Consider Figure 2A. This package has a heat dissipation component.]: It includes a substrate 2 0 0, a first package module 2 i 〇, r # 2r " ^ ^ 24 ° 5 ^ ^ ϊΐ and η corresponds to one of the second surface 2 0 4 and the first packaging mold—the surface 1 size structure (CSP), is arranged on the substrate 4 0 4th structure f (in CSP), and the second package module 22 is, for example, a wafer chip, f ft Sp), and / or is disposed on the second surface 2 0 4 of the substrate 20 and the area contact 2 0 3 is a soil plate. The first and second surfaces of Γ 丄 have a plurality of contacts 20 =, 203_b on the two surfaces 202 and 204 respectively, which are used as the input and output medium of the substrate 200. 9 η 7 ,,, / / / / the first and second package modules 2 1 0, 2 2 0, for example, has a chip 9 η η φ recognizes a solder ball 2 0, and by the solder ball 2 0 6 The chip 2 07 can be electrically connected to the substrate, and is used to electrically connect the contacts 2 0 3a of the first and second surfaces 0 4 of the substrate 2000, and each package module 21 0, 22 0 and Substrate

In the month of 567600, the emperor 911250 was revised. 5. Description of the invention (7) 2000. In addition to the solder ball 206 for connection, a filler material 208 (UnderfiU) was filled in the wafer 207 and the substrate 2 〇, and covered with solder balls 206. ^ π f Please refer to Figures 2A and 2B at the same time, where the first package module 21 is a CPU and the second package module 2 2 0 is, for example, a dynamic random memory (DRAM). The heat dissipating member 2 3 0 is, for example, configured on the first packaging module 2 1, and it is extended outward from both sides of the first packaging module 2 丨 0, so as to receive the first packaging module 2 1 〇 The heat generated by the central processing unit passes the heat to the outside through the heat dissipation member 230, and the surface of the heat dissipation member 23 and the two sides dissipate the heat to the outside. Because of &, the heat dissipation member 2 3 Q can provide a large heat dissipation area of a package module 2 1 0 and good heat dissipation, so that the heat will not be excessively concentrated on the first package module 2 such as a central processing unit. , And the temperature of the chip exceeds its normal operating temperature range. In addition, the material of the heat dissipating member 230 is, for example, aluminum, steel, or other materials with good heat dissipating properties, so heat can be quickly dissipated from the surface of the heat dissipating member 23o, thereby improving the heat dissipation efficiency of the CPU. Please also refer to FIGS. 2A and 2B. The heat dissipation member 2 3 0 has a first portion 2 3 2 and a second portion 2 3 4. The first portion 232 is, for example, a strip-shaped member. It extends outward from both sides of the first packaging module 2 丨 0 to approximately the width of the substrate 200, and is used to pass the heat generated by the first packaging module 210, such as a central processing unit, through the first section. The surface and ends of part 2 3 2 are scattered. In addition, the second part 2 34 is, for example, perpendicular to the first part 232 and is connected to both ends of the first part 2 3 2, and the second part 2 34 is directed from both ends of the first part 2 3 2 The side wall 25 of the substrate 200 is extended to form a

10037twf1.ptc Page 12 567600 _ Case No. 91125099 Car η pi Correction V. Description of the invention (8) Inverted door type heat dissipation member 2 3 0 can extend the heat dissipation area of the heat dissipation member 2 3 0 so that the heat dissipation member 2 3 0 has better heat dissipation effect. In addition, the solder bump 2 40 is arranged on the first surface 202 of the substrate 200, and the contact 2 0 3b connected to the first surface 202 is connected to the substrate 2 0 by the solder bump 2 4 0. 0 is bonded to the motherboard 10 and electrically connected to the motherboard 10. Furthermore, please refer to the enlarged view of the side wall of the substrate 200 in the joint p in FIG. 2A. The side wall 2 50 of the substrate 200 may be a flat surface or the side wall 2 50 of the substrate 200 has a groove. The second part 2 3 4 of the heat dissipation member 2 3 0 can be connected to the side wall 2 5 0 of the substrate 2 0 through a solder 2 3 6. In the manufacturing process, the solder 2 3 6 is first coated on the surface of the side wall 2 50 and the channel 2 5 2, and then the heat dissipation member 2 3 0 is mounted on the substrate 2 0 and the first packaging module. On 2 10, the second part 2 3 4 of the heat dissipation member 2 3 0 is bonded to the side wall 2 50 of the substrate 200 by the solder 2 3 6. Next, a re-soldering step is performed, so that the second part 2 3 4 of the heat dissipation member 2 30 can be tightly bonded to the side wall 2 50 of the substrate 200 by the solder 2 3 6. However, in a better case, the side wall 250 of the substrate 2000 is provided with a channel 2 52, which can increase the contact area between the solder 2 36 and the side wall 250 of the substrate 200, and The solder 2 3 6 will be filled in the channel 2 5 2, so that the solder 2 3 6 will form a plurality of protrusions (not shown) to be snapped into the channel 2 5 2 'to improve the heat dissipation member. The second part of 2 3 0 2 3 4 ^ United States ^ joint between the side wall 25G. From the above description of the substrate m, it can be known that the first package module 2 丨 〇 can be conducted to the first part 2 3 2 of the heat dissipation member 2 3 0, and read, M * ..., the first of 2 3 0 Part 2 3 2 can be transmitted to the mother board 1 0 and the demon = the thermal component two parts 2 3 4, so that the heat can be dissipated by the heat dissipation member 2330, the 2nd 3rd of the Dan 1 dry WU, the first Part

10037twf1.ptc Page 13 567600 V. Description of the invention (9) The surface of 32, the surface of the second part 234, and the motherboard 10 are dissipated to the other, and the first and second packaging modules 210 and 22 are conducted To the side of the heat of 2 50 'can also be transmitted to the second part of the stream, and ^ across the surface of the first part 234 to dissipate the heat to the outside world. Second Embodiment ′ FIG. 3A is a schematic side view of a second embodiment of the present invention with a gyroscope. Drawing 3B: J Niu Tukoudi, this ... Package module 3 2 0, loose soil concrete member 33. And, / module 310, a plurality of second 0Πη θ.... Is called u and a plurality of solder pads 3 4 0, where the US packaging package group 310 is, for example, the chip size of the Yangtze 300th- The central area of the surface 3 0 2 is mounted on the substrate. If the substrate is mounted on a substrate (c /), the second package module 3 2 is the area of the case 3 0 4. This is on the substrate 3 0. 〇 the second surface 3, if there is a first part; "2 for example, a part of 3 3 2 for example by the two chromium this building this a first injury 3 34, of which type, and the cross-shaped crossing 〃 The area j is formed like a cross shape and the first heat dissipation member 3 3 0 is located on the first packaging module 310, and the four sides extend outward to about 15 mm from the first packaging module 3 The amount of soil generated by the first package module 310 of 10 is equivalent to the width of 300, which is used to dissipate and the outer end of the cross shape...., Through the surface of the first part 3 3 2 ^ In addition, The second part 3 3 4 For example 番 古 ## The first part 3 3 2 is cross-shaped ^ in the first part-3 3 2 and is connected to the magic Bu ^ and the second part 3 3 4 is made by the first-

567600 Case No. 91125099, Rev. 15th, Description of the Invention (10) The outer end of the part 3 3 2 extends to the side wall of the substrate 3 0 0, which can further extend the heat dissipation area of the heat dissipation member 2 3 0, so that the heat dissipation member 3 30 has better heat dissipation effect. In addition, the second part 3 3 4 can be joined with the side wall 3 50 of the substrate 3 0 through a solder 3 3 6, and the second part 3 3 4 can be joined with the side wall 3 5 0 of the substrate 3 0 0 The structure is as described in the first embodiment, and will not be repeated here. In this way, the heat transmitted to the side wall of the substrate 300 by the first package module 310 and the second package module 320 can dissipate the heat to the outside through the surface of the second portion 34. In addition, the solder bump 340 is arranged on the first surface 302 of the substrate 300, and is connected to the contact point 303 outside the first surface 302. The solder bump 340 can join the substrate 300 and the mother board 100. Electrically connected to the motherboard. Please refer to Figures 4 A. and 4 B, which show the bottom diagram of another package structure with heat dissipation components in green. The first package modules 3 丨 〇a, 3 丨 〇b can be arranged on the first surfaces of the substrates 300a, 300b as shown in Figures 4A and 4B /, 3002a, 300b On the edge of the middle area or corner area, so the first part 3 3 2 a of heat dissipation 3 3 0 a is in shape, for example, to shape or [shape, and the stripe structure of the first part 3 3 2 a will be joined In a crossing area 3 3 8 a, 3 corresponds to the substrates 300a, 30 (^ ϋΐ), and is also located on the first package modules 31〇a, 310b. In addition, the second part 3 34a is, for example, perpendicular to the first part 3 3 2a and 3 34a is outside the first part 3 3 2a: ^, and the first * part is extended, so that the scattered member can be directed to the f-board 300a. The side walls of 3,0013 are scattered too much: the political thermal area of f piece 33〇a is further extended, so that the fu ... member 3 3 0 a has better heat dissipation effect. As mentioned above, this The invention of 1 female μ &. The packaging structure of the moon with a heat dissipation member has at least

567600 _Case No. 91125099_year month__ V. The description of the invention (Π) has the following advantages: 1. The packaging structure of the present invention having a heat dissipation member, wherein the heat dissipation member has a large heat dissipation area and good heat dissipation, and The heat generated by the chip inside the package structure can be conducted by the heat dissipation member to effectively dissipate the heat to the outside. 2. The packaging structure with a heat dissipation component of the present invention, wherein the first and second parts of the heat dissipation component can be connected to the surface of the packaging module and the side wall of the substrate, respectively, so as to extend the heat dissipation area of the packaging module. The generated heat can be transmitted to the first and second parts of the heat dissipation member and the mother board through the surface of the packaging module and the sidewall of the substrate, and the heat can be transmitted through the surfaces of the first and second parts and the mother board. Spill to the outside world. Although the present invention has been disclosed as above with a preferred embodiment, it is not intended to limit the present invention. Any person skilled in the art can make various modifications and decorations without departing from the spirit and scope of the present invention. The scope of protection of the invention shall be determined by the scope of the attached patent application.

10037twf1.ptc Page 16 567600 _Case No. 91125099_ Year Month Revision _ Brief Description of Drawings Figure 1 A shows a schematic side view of a conventional packaging structure with multiple package modules, and Figure 1 B shows 1 A schematic bottom view of the packaging structure in FIG. A; FIG. 2A illustrates a schematic side view of a packaging structure with a heat dissipating member disposed on a mother board and an enlarged view of a sidewall of the substrate P at the joint P according to the first embodiment of the present invention; 2B is a schematic bottom view of the packaging structure shown in FIG. 2A of the present invention; FIG. 3A is a schematic side view of a packaging structure having a heat dissipation member according to the second embodiment of the present invention; 3A is a schematic bottom view of the packaging structure; and FIGS. 4A and 4B are bottom schematic views of another packaging structure having a heat dissipation member.

10037twf1.ptc Page 17

Claims (1)

567600 _Case No. 9125099_Amended in January / August 6, Application scope 1. A package structure with a heat dissipation member is suitable for being arranged on a motherboard. The package structure with a heat sink includes at least: a substrate with a A first surface; a first package module disposed on the first surface of the substrate; a heat dissipation member disposed on the first package module, the heat dissipation member having a first portion and a second Part, the second part is substantially perpendicular to the first part, the second part extends from the first part to the substrate, and the first part of the heat dissipation member is located in the first part A package module, and the second portion of the heat dissipation member is bonded to the side wall of the substrate; and a plurality of solder bumps are arranged on the first surface of the substrate, and through the solder bumps, the The substrate may be bonded to the motherboard and electrically connected to the motherboard. 2. The package structure with a heat dissipation component as described in item 1 of the scope of the patent application, further comprising at least a second packaging module, and the substrate also has a second surface corresponding to the first surface. Two modules are disposed on the second surface of the substrate. 3. The package structure with a heat dissipation component as described in item 2 of the scope of the patent application, wherein the second package module is in the form of a chip-size package. 4. The packaging structure with a heat dissipation component as described in item 2 of the scope of the patent application, wherein the second packaging module includes: a wafer and a plurality of solder balls, the solder balls are between the wafer and the substrate The 10037twf1.ptc Page 18 567600 _Case No. 91125099_ Month and Day__ VI. Scope of patent application Between the second surface, the chip and the substrate are electrically connected by the solder balls. 5. The package structure with a heat dissipation component as described in item 1 of the scope of the patent application, wherein the first package module is in the form of a chip-size package. 6. The packaging structure with a heat dissipation component as described in item 1 of the scope of the patent application, wherein the first packaging module includes: a wafer and a plurality of solder balls, the solder balls being between the wafer and the substrate Between the first surface, the chip and the substrate are electrically connected by the solder balls. 7. The package structure with a heat dissipation member as described in item 1 of the scope of the patent application, wherein the second portion of the heat dissipation member is bonded to the side wall of the substrate through a solder. 8. The package structure with a heat dissipation member according to item 7 of the scope of the patent application, wherein the side wall has at least one channel, and the solder is received in the channel of the side wall. 9. The packaging structure with a heat dissipation component as described in item 1 of the scope of the patent application, wherein the first portion of the heat dissipation component has two strip-shaped structures, the two strip-shaped structures will cross, and the crossing portion is defined as a The cross region, the cross region of the first part is located on the first package module. 10. The packaging structure with a heat dissipation member as described in item 1 of the scope of the patent application, wherein the first portion of the heat dissipation member is a strip-shaped pattern. 1 1. Seal with heat dissipation component as described in item 1 of the scope of patent application 10037twf1.ptc Page 19 567600 _Case No. 91125099_ year month revision 六 、 Patent application scope The mounting structure, wherein the first package module is located on the middle area of the first surface of the substrate. 12. The package structure with a heat dissipation member as described in item 1 of the scope of patent application, wherein the heat dissipation member is in contact with the motherboard. 10037twf1.ptc Page 20