TW563845U - Power supply housing structure improvement capable of improving internal heat dissipation of computer - Google Patents

Power supply housing structure improvement capable of improving internal heat dissipation of computer

Info

Publication number
TW563845U
TW563845U TW91218221U TW91218221U TW563845U TW 563845 U TW563845 U TW 563845U TW 91218221 U TW91218221 U TW 91218221U TW 91218221 U TW91218221 U TW 91218221U TW 563845 U TW563845 U TW 563845U
Authority
TW
Taiwan
Prior art keywords
computer
power supply
heat dissipation
internal heat
housing structure
Prior art date
Application number
TW91218221U
Other languages
Chinese (zh)
Inventor
Yan-Chi Liou
Original Assignee
Seventeam Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seventeam Electronics Co Ltd filed Critical Seventeam Electronics Co Ltd
Priority to TW91218221U priority Critical patent/TW563845U/en
Publication of TW563845U publication Critical patent/TW563845U/en

Links

TW91218221U 2002-11-13 2002-11-13 Power supply housing structure improvement capable of improving internal heat dissipation of computer TW563845U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW91218221U TW563845U (en) 2002-11-13 2002-11-13 Power supply housing structure improvement capable of improving internal heat dissipation of computer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW91218221U TW563845U (en) 2002-11-13 2002-11-13 Power supply housing structure improvement capable of improving internal heat dissipation of computer

Publications (1)

Publication Number Publication Date
TW563845U true TW563845U (en) 2003-11-21

Family

ID=32503577

Family Applications (1)

Application Number Title Priority Date Filing Date
TW91218221U TW563845U (en) 2002-11-13 2002-11-13 Power supply housing structure improvement capable of improving internal heat dissipation of computer

Country Status (1)

Country Link
TW (1) TW563845U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103376856A (en) * 2012-04-26 2013-10-30 鸿富锦精密工业（深圳）有限公司 Heat dissipation stabilizing structure and server with same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103376856A (en) * 2012-04-26 2013-10-30 鸿富锦精密工业（深圳）有限公司 Heat dissipation stabilizing structure and server with same
CN103376856B (en) * 2012-04-26 2017-02-22 周星星 Heat dissipation stabilizing structure and server with same

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