TW590273U - Improvement of CPU heat dissipation module - Google Patents

Improvement of CPU heat dissipation module

Info

Publication number
TW590273U
TW590273U TW92208358U TW92208358U TW590273U TW 590273 U TW590273 U TW 590273U TW 92208358 U TW92208358 U TW 92208358U TW 92208358 U TW92208358 U TW 92208358U TW 590273 U TW590273 U TW 590273U
Authority
TW
Taiwan
Prior art keywords
improvement
heat dissipation
dissipation module
cpu heat
cpu
Prior art date
Application number
TW92208358U
Other languages
Chinese (zh)
Inventor
Jr-Peng Chen
Shin-Jeng Lin
Original Assignee
Asia Vital Components Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asia Vital Components Co Ltd filed Critical Asia Vital Components Co Ltd
Priority to TW92208358U priority Critical patent/TW590273U/en
Publication of TW590273U publication Critical patent/TW590273U/en

Links

TW92208358U 2003-05-07 2003-05-07 Improvement of CPU heat dissipation module TW590273U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW92208358U TW590273U (en) 2003-05-07 2003-05-07 Improvement of CPU heat dissipation module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW92208358U TW590273U (en) 2003-05-07 2003-05-07 Improvement of CPU heat dissipation module

Publications (1)

Publication Number Publication Date
TW590273U true TW590273U (en) 2004-06-01

Family

ID=34060603

Family Applications (1)

Application Number Title Priority Date Filing Date
TW92208358U TW590273U (en) 2003-05-07 2003-05-07 Improvement of CPU heat dissipation module

Country Status (1)

Country Link
TW (1) TW590273U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7472743B2 (en) 2005-05-07 2009-01-06 Foxconn Technology Co., Ltd. Liquid cooling system suitable for removing heat from electronic components
CN103167780B (en) * 2011-12-16 2016-06-08 台达电子企业管理（上海）有限公司 Power model combined radiator assembly

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7472743B2 (en) 2005-05-07 2009-01-06 Foxconn Technology Co., Ltd. Liquid cooling system suitable for removing heat from electronic components
CN103167780B (en) * 2011-12-16 2016-06-08 台达电子企业管理（上海）有限公司 Power model combined radiator assembly

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Legal Events

Date Code Title Description
MM4K Annulment or lapse of a utility model due to non-payment of fees