TW556963U - Improved structure of integrated circuit heat dissipation fastener - Google Patents

Improved structure of integrated circuit heat dissipation fastener

Info

Publication number
TW556963U
TW556963U TW91212962U TW91212962U TW556963U TW 556963 U TW556963 U TW 556963U TW 91212962 U TW91212962 U TW 91212962U TW 91212962 U TW91212962 U TW 91212962U TW 556963 U TW556963 U TW 556963U
Authority
TW
Taiwan
Prior art keywords
integrated circuit
heat dissipation
improved structure
circuit heat
fastener
Prior art date
Application number
TW91212962U
Other languages
Chinese (zh)
Inventor
Tsung-Rung Pan
Original Assignee
Tsung-Rung Pan
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tsung-Rung Pan filed Critical Tsung-Rung Pan
Priority to TW91212962U priority Critical patent/TW556963U/en
Publication of TW556963U publication Critical patent/TW556963U/en

Links

TW91212962U 2002-08-21 2002-08-21 Improved structure of integrated circuit heat dissipation fastener TW556963U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW91212962U TW556963U (en) 2002-08-21 2002-08-21 Improved structure of integrated circuit heat dissipation fastener

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW91212962U TW556963U (en) 2002-08-21 2002-08-21 Improved structure of integrated circuit heat dissipation fastener

Publications (1)

Publication Number Publication Date
TW556963U true TW556963U (en) 2003-10-01

Family

ID=32295005

Family Applications (1)

Application Number Title Priority Date Filing Date
TW91212962U TW556963U (en) 2002-08-21 2002-08-21 Improved structure of integrated circuit heat dissipation fastener

Country Status (1)

Country Link
TW (1) TW556963U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9618274B2 (en) 2014-03-11 2017-04-11 Asia Vital Components Co., Ltd. Thermal module with enhanced assembling structure

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9618274B2 (en) 2014-03-11 2017-04-11 Asia Vital Components Co., Ltd. Thermal module with enhanced assembling structure

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees