555976 五、發明說明（1) 【發明範圍】 本發明係為「電路板測試機之可變密度的測點設置方 法」，尤指一種可在同一台電路板萬用測試機中，同時具 有多種不同密度之測試功能的測試機具之測點設置方法 者。 【習用背景】 坊間之電路板萬用測試機，請參閱第一圖與第二圖所 示，其中包括有一針板1 1 ，該針板1 1上遍佈有若干穿 孔12 ，各穿孔12中組置有套筒13與探針14 ，該探 針1 4即是所謂之測點。該種電路板萬用測試機，其單一 機台之現有功能都是只能測試單一固定密度測點之用。例 如第三圖所示，其各測點之間距為0. 1英吋，業界稱之為 單密度測點；又如第四圖所示，各測點間距為0 . 0 7 5英吋 者稱之為雙密度測點；至於各測點間距為0. 0 5英吋者則是 四密度測點，即如第五圖所示。現有的電路板萬用測試 機，當欲測試不同密度之測點時，便需購置多台不同密度 之電路板萬用測試機，造成購置成本居高不下，對於廠家 來說是相當沉重的負擔。 發明人有鑑於此，為改善現有缺失，特研發成本案， 期能藉本案之提出，俾提供一種理想、實用且通用性高之 電路板萬用測試機之測點設置方法。 【發明目的】555976 V. Description of the invention (1) [Scope of the invention] The present invention is a "variable density measuring point setting method of a circuit board testing machine", especially a kind of universal testing machine which can have multiple Method for setting test points of test tools with different density test functions. [Practical background] Please refer to the first and second figures for the universal tester for circuit boards in the field, which includes a needle board 1 1, which is perforated with a number of perforations 12, each of which is in 12 groups. A sleeve 13 and a probe 14 are arranged, and the probe 14 is a so-called measuring point. This kind of circuit board universal testing machine has a single machine which can only test a single fixed density measuring point. For example, as shown in the third figure, the distance between each measuring point is 0.1 inches, which is called a single density measuring point in the industry; and as shown in the fourth figure, the distance between each measuring point is 0.075 inches. It is called a double density measuring point; as for the distance between each measuring point of 0.05 inches, it is a four density measuring point, as shown in the fifth figure. Existing universal testers for circuit boards. When testing different density test points, it is necessary to purchase multiple universal testers for circuit boards with different densities, resulting in high purchase costs, which is a heavy burden for manufacturers. . In view of this, in order to improve the existing shortcomings, the inventor specially developed a cost case, and hopes to use this case to provide an ideal, practical, and highly versatile method for setting test points of a circuit board universal tester. [Objective of the invention]
II I Μ 555976 五、發明說明（2) 本案目的在於：提供一種「電路板測試機之可變密度 的測點設置方法」，其可在同一台電路板萬用測試機中， 具有可達成同時測試多種不同密度測點之目的。 前述所稱之多種不同密度，至少包括單密度測點、雙 密度測點與四密度測點，並能依實際需要再變化成更密之 六密度測點、八密度測點......等測試，並可再做 升級之用。 【實施例】 茲謹就本發明「電路板測試機之可變密度的測點設置 方法」之實施方法，及其所產生之功效，配合圖式，舉一 本案之較佳實施例詳細說明如下： 【實施例一】 請參閱第六圖所示，本案「電路板測試機之可變密度 的測點設置方法」，其於針板2上，設置有若干測點2 0 ，各測點2 0可依需要形成不同之密度測點排列設置。 以第六圖所示，其包括有區塊狀之單密度測點2 1 、雙密 度測點2 2與四密度測點2 3之設置，該單密度測點2 1 、雙密度測點2 2與四密度測點2 3之排列位置與形狀 和面積，可依實際需要任意變化調動。 【實施例二】 就現有電路板中，高密度之測點區域，約僅佔總面積II I MU 555976 V. Description of the invention (2) The purpose of this case is to provide a "variable density measuring point setting method for circuit board testing machines", which can be used in the same circuit board universal testing machine. The purpose of testing a variety of different density measurement points. The aforementioned different densities include at least single-density measuring points, double-density measuring points and four-density measuring points, and can be further changed into denser six-density measuring points and eight-density measuring points ..... . Wait for testing, and can be used for upgrading. [Embodiment] The implementation method of the "variable density measuring point setting method of the circuit board testing machine" of the present invention and the effect produced by it are described in detail below with reference to the preferred embodiment of this case. : [Example 1] Please refer to the sixth figure, the "setting method of variable density measuring points for circuit board testing machine" in this case, which is provided on the pin plate 2 with a plurality of measuring points 20, each measuring point 2 0 Different density measurement points can be arranged as required. As shown in the sixth figure, it includes a block-shaped single-density measurement point 2 1, a dual-density measurement point 2 2, and a four-density measurement point 2 3. The single-density measurement point 2 1 and the dual-density measurement point 2 are arranged. The arrangement position, shape and area of 2 and four-density measuring points 2 3 can be arbitrarily changed and adjusted according to actual needs. [Embodiment 2] In the existing circuit board, the high-density measuring point area only accounts for about the total area
555976 五、發明說明（3) 中不到1 0% ，其餘部份可能都是低密度或中密度。然若是 欲以現有單一密度之電路板萬用測試機來測試時，卻必需 使用全部都是高密度測點來做測試。然而測點密度越高之 電路板萬用測試機其單價越貴，因此，若能將測點依待測 試電路板之密度分佈狀況，適當變化調整測點之設置密度 與位置，即可將測點之設置密度與數量設置適當，如此， 不僅可達成測試功能，且能藉由降低測點之設置密度與數 量，避免不必要的測點設置，以間接獲致降低成本至少5 0 %以上之目的。請參閱第七圖，係為本案之另一實施態 樣，其於針板3上，設置有若干測點3 0，各測點3 0可 依需要形成不同之密度排列設置。以第七圖所示，其包括 有單密度測點3 1 、雙密度測點3 2與四密度測點3 3之 設置，該單密度測點3 1 、雙密度測點3 2與四密度測點 3 3之排列位置與形狀和面積，可依實際需要任意變化調 動。本實施例中，雙密度測點3 2與四密度測點3 3之設 置，係採小區塊狀内含於大面積之單密度測點3 1中，該 雙密度測點3 2與四密度測點3 3其可採模組化設計；由 本實施例中可清楚知悉，其僅就特定所需之對應區域設置 模組化之雙密度測點3 2與四密度測點3 3 ，而其餘部份 皆為單密度測點3 1 ，如此將測點之密度依需要設置，可 免除舊有方式測點之不必要設置所產生之浪費與花費。 該模組化之密度變化，可以是2 η之變數，例如2 7、2 8或2 9等，該模組區塊之形狀可依需要設置成正 方形、長方形或任意形狀。555976 V. Invention description (3) Less than 10%, the rest may be low density or medium density. However, if you want to use the existing single-density board universal tester for testing, you must use all high-density test points for testing. However, the higher the test point density of the circuit board universal tester, the more expensive the unit price. Therefore, if the measurement points can be tested according to the density distribution of the circuit board to be tested, and the density and position of the test points are adjusted and adjusted appropriately, the test The setting density and number of points are set appropriately. In this way, not only the test function can be achieved, but also the unnecessary setting of measuring points can be avoided by reducing the setting density and number of measuring points in order to indirectly reduce costs by at least 50%. . Please refer to the seventh figure, which is another embodiment of the present invention. The needle plate 3 is provided with a plurality of measuring points 30, and each measuring point 30 can be arranged in different density arrangements as required. As shown in the seventh figure, it includes the settings of single density measurement point 3 1, double density measurement point 3 2 and quad density measurement point 3 3. The single density measurement point 3 1, dual density measurement point 3 2 and quad density The arrangement position, shape and area of the measuring points 3 3 can be arbitrarily changed and adjusted according to actual needs. In this embodiment, the setting of the dual-density measuring point 32 and the four-density measuring point 33 is a small block contained in a large-area single-density measuring point 31, and the double-density measuring point 32 and the four-density The measurement point 3 3 can adopt a modular design; it can be clearly understood from this embodiment that it only sets a modular double density measurement point 3 2 and a four-density measurement point 3 3 for a specific required corresponding area, and the rest The parts are all single-density measuring points 3 1, so setting the density of the measuring points as needed can avoid the waste and cost caused by unnecessary setting of measuring points in the old way. The density change of this module can be a variable of 2 η, such as 2 7, 28, or 29, etc. The shape of the module block can be set to be square, rectangular or any shape as required.
555976 五、發明說明（4) 綜上所述，本案「電路板測試機之可變密度的測點設 置方法」，其具有突破性之優點，極為實用，已突顯其實 用價值，且其未曾公開或揭露於國内外之文獻與市場上， 確實完全符合發明專利之各要件，爰依法申請專利，懇請 鈞局詳查，並早日賜准，以勵創新，至感德便。555976 V. Description of the invention (4) In summary, the "setting method for measuring points of variable density of circuit board testing machines" in this case has breakthrough advantages, is extremely practical, has highlighted its practical value, and has not been disclosed It may be disclosed in domestic and foreign literature and markets that it is in full compliance with the various elements of an invention patent. It is required to apply for a patent in accordance with the law.
第7頁 555976 圖式簡單說明 【圖式說明】 第一圖：係為電路板測試機之測點結構示意圖。 第二圖：係為第一圖之局部放大圖。 第三圖：係為單密度測點之示意圖。 第四圖：係為雙密度測點之示意圖。 第五圖··係為四密度測點之示意圖。 第六圖：係為本案實施例一之可變密度測點示意圖。 第七圖··係為本案實施例二之模組化可變密度測點示意 圖。 【圖號說明】 1 1 :針板 1 3 :套筒 2 :針板 2 1 :單密度測點 2 3 :四密度測點 3 0 :測點 3 2 :雙密度測點 1 2 穿孔 1 4 探針 2 0 測點 2 2 雙密度測點 3 :針板 3 1 :單密度測點 3 3 :四密度測點Page 7 555976 Simple description of the drawings [Illustration of the drawings] The first picture is a schematic diagram of the test point structure of the circuit board tester. The second picture is a partial enlarged view of the first picture. The third figure is a schematic diagram of a single density measurement point. Figure 4: Schematic diagram of dual density measurement points. The fifth figure ... is a schematic diagram of a four-density measuring point. FIG. 6 is a schematic diagram of a variable density measurement point according to the first embodiment of the present invention. The seventh diagram is a schematic diagram of a modular variable density measuring point in the second embodiment of the present invention. [Illustration of drawing number] 1 1: Needle plate 1 3: Sleeve 2: Needle plate 2 1: Single density measuring point 2 3: Four density measuring point 3 0: Measuring point 3 2: Double density measuring point 1 2 Perforation 1 4 Probe 2 0 Measuring point 2 2 Double density measuring point 3: Needle plate 3 1: Single density measuring point 3 3: Four density measuring point