經濟部智慧財產局員工消費合作社印製 554404 A7 ________B7_ 五、發明説明（1 ) 【發明之詳細說明】 【發明所屬之技術領域】 本發明，係關於將被使用在彈性印刷基板等上的有機 化合物薄膜、被使用在硬碟的磁頭上之薄薄的金屬薄片等 之容易變形之工件（以下，統稱爲彈性基板）加以吸附、 固定之吸附平台裝置。 特別是，關於上述彈性基板不變形的情況下，用來吸 附·固定平台的真空吸附溝槽的結構。 【以往之技術】 在半導體晶圓上，將電路等的圖形加以曝光的曝光裝 置，通常，具備有可以用來保持半導體晶圓的平台（以下 ，稱之爲曝光平台）。 將半導體晶圓搬運到曝光位置，再載置到曝光平台之 際，爲了使半導體晶圓不會從曝光平台的曝光位置偏移， 且爲了防止半導體晶圓在曝光處理中因曝光處理中的振動 等因素所產生位置偏移，導致曝光不良，所以必須先將半 導體晶圓固定在曝光平台上。 作爲將半導體晶圓固定在曝光平台上的固定手段，一 般所使用的是真空吸附方法。 在此，真空吸附方法，係將半導體晶圓等的工件和平 台之間的空間加以減壓，藉由和大氣壓力之間的壓力差將 工件按壓在平台上，而將工件固定在平台上的方法。 在利用真空吸附方法的曝光平台（以下，稱之爲真空 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） (請先閲讀背面之注意事項再填寫本頁)Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 554404 A7 ________B7_ V. Description of the invention (1) [Detailed description of the invention] [Technical field to which the invention belongs] The present invention relates to organic compounds to be used on flexible printed substrates and the like An adsorption platform device that adsorbs and fixes a workpiece (hereinafter, collectively referred to as an elastic substrate) that is easily deformed, such as a thin film or a thin metal sheet used on a magnetic head of a hard disk. In particular, the structure of a vacuum suction groove for attaching and fixing a platform when the elastic substrate is not deformed. [Conventional Technology] Generally, an exposure device that exposes a pattern of a circuit or the like on a semiconductor wafer is provided with a stage (hereinafter, referred to as an exposure stage) that can hold the semiconductor wafer. When the semiconductor wafer is transferred to the exposure position and then placed on the exposure stage, the semiconductor wafer is not shifted from the exposure position of the exposure stage, and the semiconductor wafer is prevented from being shaken by the exposure process during the exposure process. Position shift caused by factors such as poor exposure, so the semiconductor wafer must first be fixed on the exposure platform. As a fixing means for fixing a semiconductor wafer on an exposure stage, a vacuum suction method is generally used. Here, the vacuum suction method is a method in which a space between a workpiece such as a semiconductor wafer and a stage is decompressed, and the workpiece is pressed against the stage by a pressure difference between atmospheric pressure and the workpiece is fixed on the stage. method. The exposure platform using the vacuum adsorption method (hereinafter referred to as vacuum) This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) (Please read the precautions on the back before filling this page)
、1T -4- 554404 A7 B7 五、發明説明（2 ) 吸附平台）上，在載置半導體晶圓的平台面上，在半導體 晶圓和真空吸附平台之間被裝設有用來形成減壓空間的孔 或溝槽等等。然後，在這些孔或溝槽上，可連接用來供給 真空的真空系。 然而，這樣的真空吸附平台，在特開平 5 - 2 1 8 1 8 3號公報中，揭示有在載置半導體晶圓的 平台面上，裝設多數真空吸附孔的平台。 又，在特開平6 - 3 3 3 7 9 9號公報中，揭示著： 在載置著半導體晶圓的平台面中心的真空吸附孔，以該真 空吸附孔爲中心以同心圓狀設置的真空吸附溝槽，然而， 爲了將前述真空吸附孔和前述真空吸附溝槽加以連通，會 從前述真空吸附孔以放射狀地裝設的連通溝槽的平台。 【發明所欲解決之課題】 近年，不只是半導體晶圓2 0〜1 5 0 //m左右厚度 的有機化合物薄膜或薄形金屬箔片等的容易變形的工件， 也就是彈性基板上，爲求能形成細微的電路圖形，作爲該 電路圖形形成裝置，也可以使用具備前述真空吸附平台的 曝光裝置。 不過，當將前述曝光裝置使用在彈性基板時，會出現 如下的問題。 第6圖中，藉由裝設多數的真空吸附孔的平台，來保 持彈性基板的狀態之示意圖。又，第7圖，係顯示藉由具 有以真空吸附孔爲中心被裝設成同心狀的複數個真空吸附 本紙張尺度適用中國國家標準（CNS ) Α4規格（210><297公釐） (請先閲讀背面之注意事項再填寫本頁) -裝_1T -4- 554404 A7 B7 V. Description of the invention (2) Suction platform) On the platform surface on which the semiconductor wafer is placed, between the semiconductor wafer and the vacuum adsorption platform is installed to form a decompression space. Holes or grooves, etc. Then, to these holes or grooves, a vacuum system for supplying a vacuum can be connected. However, such a vacuum suction stage is disclosed in Japanese Patent Application Laid-Open No. 5-2 1 8 1 8 3, which discloses a stage in which a large number of vacuum suction holes are provided on a stage surface on which a semiconductor wafer is placed. Furthermore, Japanese Patent Application Laid-Open No. 6-3 3 3 7 9 9 discloses a vacuum suction hole in the center of a stage surface on which a semiconductor wafer is placed, and a vacuum provided concentrically around the vacuum suction hole as a center. The suction groove, however, is a platform of a communication groove that is radially installed from the vacuum suction hole in order to communicate the vacuum suction hole and the vacuum suction groove. [Problems to be Solved by the Invention] In recent years, not only semiconductor wafers, such as organic compound films or thin metal foils with a thickness of about 20 to 15 0 // m, which are easily deformed, but also on flexible substrates, are It is required to form a fine circuit pattern, and as the circuit pattern forming apparatus, an exposure apparatus provided with the aforementioned vacuum suction stage may be used. However, when the aforementioned exposure device is used on an elastic substrate, the following problems occur. Fig. 6 is a schematic view of a state where the elastic substrate is maintained by a platform provided with a plurality of vacuum suction holes. In addition, FIG. 7 shows a plurality of vacuum suctions which are arranged in a concentric shape with the vacuum suction holes as the center. This paper is sized to the Chinese National Standard (CNS) A4 standard (210 > < 297 mm) ( (Please read the notes on the back before filling out this page)-装 _
、1T 經濟部智慧財產局員工消費合作社印製 -5- 554404 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明（3 ) 溝槽，和在真空吸附孔和真空吸附溝槽之間加以連通的連 通溝槽之吸附平台，所保持基板的狀想之不思圖。 藉由第6、7圖所示的真空吸附平台1，來將彈性基 板4，例如長尺帶狀工件4 a予以保持時，在真空吸附用 孔2 a和孔2 a之間，或者是溝槽2 b和溝槽2 b之間就 會產生氣泡貯留3，有時會使帶狀工件4 a呈部份性地隆 起而變形。 在產生這樣的氣泡貯留3的狀態下，例如就投影曝光 裝置，若是藉由投影透鏡，將在光罩上所形成的電路圖形 投影在帶狀工件4 a上的話，則帶狀工件4 a所產生氣泡 貯留3的部份，因爲會從光罩圖像的結像位置偏離到別的 位置，光罩圖案的投影像就會變得模糊不淸，而發生解像 不佳或配線圖案尺寸變異等的狀況。 又，將被印在光罩和工件上的對準定位記號，藉由使 用畫像處理裝置來加以偵知.處理，當進行將光罩和工件 的位置對準的曝光處理裝置時，被裝設了工件對準定位記 號（工件記號）的部分，若是像上述一般地隆起的話，則 畫像處理裝置所讀取的工件記號圖像就會變形，或變得模 糊不鮮明，而使得畫像處理裝置無法辨識工件記號。因此 ，由於無法偵知工件記號圖像，所以就無法使光罩與工件 的位置對準一致了。 不過，上述氣泡貯留的發生，係利用接下來的機械原 理所思考出來的。 也就是說，在彈性基板上，例如帶狀工件4 a被載置 I— nr (請先閲讀背面之注意事項再填寫本頁) %裝· 本紙張尺度適用中國國家標準（CNS )八4規格（210X297公釐） -6- 554404 A7 B7 五、發明説明（4 ) 於平台面1 a上時，由於帶狀工件既薄且容易變形，所以 無法將平台面1 a和帶狀工件4 a之間的空氣完全地壓出 去，帶狀工件就會被僅以包進空氣的狀態下載置於平台面 1 a上。 然後，將真空供給到真空吸附用孔2 a或是溝槽2 b 的話，在帶狀工件4 a上，位於真空吸附用的孔2 a或是 溝槽2 b上的部份就會產生與大氣壓力之間的壓力差，帶 狀工件4 a就會被按壓在平台面1 a上。 此時，若是在孔2 a或是溝槽2 b所包圍的區域殘留 有空氣的話，由帶狀工件的變形會把這些空氣完全封閉起 來，變成氣泡貯留3。 本發明係基於以上的狀況所作的發明，本發明的目的 ，係提供一種當將彈性基板藉由真空吸附而保持在吸附平 台面上之際，在彈性基板和吸附平台之間不會產生氣泡貯 留之吸附平台裝置。 【解決課題之手段】 本發明者，係於彈性基板和平台面之間，於被裝設在 平台面上的真空吸附用孔或是溝槽所包圍的區域內，確認 到會發生許多氣泡貯留的問題點，而得到以下的考察結果 0 也就是說，爲了將彈性基板保持在平台面上，若是對 真空吸附用的孔或是溝槽供給真空的話，彈性基板將平台 面和彈性基板之間的空氣朝彈性基板的邊緣推壓出去的同 本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） I 1Γ (請先閲讀背面之注意事項再填寫本頁) %裝_ 訂 經濟部智慧財產局員工消費合作社印製 554404 A7 B7 五、發明説明（5 ) 時，會吸附•固定到平台面上。 此時，在平台面上，若是存在著藉由真空吸附用的孔 或是溝槽所圍的區域的話，則當在平台面和彈性基板之間 的空氣完全去除之前，彈性基板就會被真空吸附用的孔或 溝槽完全地吸附住。 然而，這個結果，會使平台面和彈性基板之間所殘留 的空氣逸失，而出現了氣泡貯留。 於是，本發明者藉由上述的考察，爲了不使平台面上 形成真空吸附用的孔或是溝槽所包圍起來的區域，藉由配 置孔或溝槽的位置，發現了可以防止氣泡貯留的發生的方 法，本發明係基於實際觀察所得來完成的。 也就是說，本發明係就藉由真空吸附彈性基板來加以 保持的平台裝置，其特徵爲：在載置了上述吸附平台裝置 上的上述彈性基板之吸附平台面上，裝設有供給真空的孔 ，和從該孔以放射狀延伸出來的複數個溝槽；上述複數個 的溝槽，係相互只在上述的孔上連結。 【本發明之作用】 若根據上述結構的話，就不會形成平台面上被真空吸 附孔或是溝槽所包圍的區域。因此，將彈性基板藉由真空 吸附在平台面而加以保持之際，殘留在平台面與彈性基板 之間的空氣，就會以供給真空的孔爲中心，朝外側也就是 朝向彈性基板的邊緣推壓出去。 本紙張尺度適用中國國家標準（CNS )八4規格（210X297公釐） II 1Γ (請先閲讀背面之注意事項再填寫本頁) 裝· -. 經濟部智慧財產局員工消費合作社印製 -8- 554404 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明（6 ) 【發明的實施形態】 第1圖係顯示關於本發明的實施例之平台裝置之平台 面的構造圖。 針對同一圖，第6和7圖所示的同一物體係以標註同 一符號來表示。 本發明之吸附平台裝置之平台1，係將其表面以非電 解性鍍鎳處理所成的鋁台座所構成，具有比被載置的彈性 基板4的寬度略大的約呈正方形的形狀。 然後，在上述平台的略處中心的一個地方，形成貫通 孔2 a，在載置了上述彈性基板4的平台面1 a上，從該 孔2 a以放射狀地延伸出去，被裝設成8條直線狀的溝槽 2 b。在此，舉一例以表示上述孔、以及溝槽的尺寸，孔 徑Φ爲lmm,溝槽寬度W爲0 · 4mm，溝槽深度D爲 0 · 5 m m。可是，並非僅限於此，也可以對應於適當的 彈性基板4的大小、柔軟度、寬度方向上的彎曲狀況等等 來加以決定。 又，在與載置上述彈性基板4的平台面1 a的相反側 的面上，供給真空的真空系（圖中未示），係透過配管軟 管、轉接頭（圖中未示），而被連接在孔2 a上。 其次，由上述的平台將彈性基板加以吸附固定的樣態 ，根據第2圖來加以說明。 另外，在第2圖中，爲了容易瞭解起見，而將彈性基 板的形狀變化以誇張的方式予以顯示。 (1 )厚度達2 0〜1 5 0 # m左右的彈性基板4， (請先閲讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -9 - 554404 A7 B7 五、發明説明（7) 若是被運送到平台面1 a上的話，藉由真空系可對孔2 a 供給真空。然後，使彈性基板4的孔2 a的正上方的部份 一開始就被吸附住。（如第2 ( a )圖） (請先閲讀背面之注意事項再填寫本頁) (2 )接著，彈性基板4上被吸附的上述部份的周邊 部，藉由從真空吸附溝槽2 b所供給的真空而被吸附住， 並且將殘留在平台面1 a和彈性基板4之間的空氣，如第 2 ( b )圖裡的箭頭符號所示，以孔2 a爲中心朝向外側 被推壓出去。 (3 )如此一來，彈性基板4，就會從平台1 a的被 設置孔2 a的部份朝向周邊部依次地被吸附固定在平台面 la上。（如圖2(c)) (4 )然後最後，彈性基板4整體，就以在平台面 1 a和彈性基板4之間沒有殘留空氣的狀態下被吸附•固 定住。 經濟部智慧財產局員工消費合作社印製 接下來，說明第1、2圖所示的本實施例的作用。 本實施例之吸附平台裝置，係將其表面以非電解性鍍 鎳處理所成的鋁台座所構成，具有比被載置的彈性基板4 的寬度略大的約呈正方形的形狀。然後，在上述平台的略 處中心的一個地方，形成貫通孔2 a，在載置了上述彈性 基板4的平台面1 a上，從該孔2 a以放射狀地延伸出去 ，被裝設成8條直線狀的溝槽2 b。 也就是說，在吸附平台裝置的平台面上，被裝設有供 給真空的孔，和從該孔以放射狀地延伸出去的複數個的溝 槽，複數個的溝槽由於係相互只在上述的孔上連結，所以 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -10- 554404 A7 B7 五、發明説明（8 ) 不會形成平台面上被真空吸附孔或是溝槽所包圍的區域。 (請先閲讀背面之注意事項再填寫本頁) 因此，當將彈性基板藉由真空吸附在平台面而加以保 持之際，殘留在平台面與彈性基板之間的空氣，就會以供 給真空的孔爲中心，朝外側也就是朝向彈性基板的邊緣推 壓出去。 藉此，彈性基板和平台面之間就不會殘留空氣，而可 以將彈性基板以不會發生氣泡貯留地吸附•固定在平台面 上。 又，在本實施例中，雖然將被設置在平台面上的溝槽 的條數設爲8條，不過，並非只限定於此，也可以對應於 適當的彈性基板4的大小、柔軟度、寬度方向上的彎曲狀 況等等來加以決定條數。 經濟部智慧財產局員工消費合作社印製 又，本發明之吸附平台裝置之平台，雖然係將其表面 以非電解性鍍鎳處理所成的鋁台座所構成，具有比被載置 的彈性基板4的寬度略大的約呈正方形的形狀，不過，並 非僅限於此。換言之，平台的表面處理，用防蝕鋁處理或 是使用陶磁熔著材料都無妨，平台的材質也可以使用如銅 或鐵之類的金屬。進而，若是言及關於平台的形狀的話， 係相對於長方形的彈性基板所裝設長方形的平台，不過若 是相對於圓形的彈性基板所裝設圓形的平台的話亦無妨。 再者，本發明之吸附平台裝置之平台，雖然係於平台 面的略中心的位置裝設供給供給真空用的孔，不過並非只 限定於此，如第3圖所示，將真空吸附用的孔設置在平台 面的端部，從該孔以放射狀地設置真空吸附溝槽亦無妨。 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -11 - 554404 經濟部智慧財產局員工消費合作社印製 A7 ___ B7五、發明説明（9 ) 第4圖係顯示關於本發明的實施例之平台裝置之平台 面上的其他構造的示意圖。 針對同一圖，第6和7圖所示的同一物體係以標註同 一符號來表示。 本發明之吸附平台裝置之平台1，係對應於吸附的彈 性基板4的面積爲大面積時的平台1。 當彈性基板4的面積很大時，平台面1 a也會對應於 該大小而變大。 此時，將上述實施例中的平台裝置中的平台照著引用 時，被設置在平台面1 a上的複數條的放射狀溝槽2 b， 雖然會和孔2 a的周邊相互接近，不過，平台面1 a的端 部由於係相互分離的，所以平台面1 a的端部被溝槽2 b 所包挾的區域中，吸附力就會變弱，在該區域中就不會產 生吸附不良的狀況。 因此，在實施例之平台裝置之平台面1 a上，在上述 平台1的略處中心的一個地方，被形成了孔2 a，在載置 了上述彈性基板4的平台面1 a上，從該孔2 a以放射狀 地延伸出去，被裝設成8條直線狀的溝槽2 b。 再者，朝對角線方向延伸的上述直線狀的溝槽2 b係 分別地分岔成複數的溝槽2 c。 此時，複數的溝槽2 b，相互地只針對孔2 a連結， 分岔的溝槽2 c則係與線狀的溝槽2 b的其中一條相連結 ，而不會與其他的直線狀溝槽2 b相連結。又，分岔的同 性質的溝槽2 c，雖然是在直線狀的溝槽2 b上相連結， 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐1 (請先閱讀背面之注意事項再填寫本頁) 裝· 訂 -12 - 554404 A7 B7 五、發明説明（1〇) 不過在此之外的區域，則不會互相連結。 因此，在平台面1 a上，就不會形成由溝槽2 b、 (請先閲讀背面之注意事項再填寫本頁) 2 c所圍成的區域。 因此，將彈性基板藉由真空吸附在平台面而加以保持 之際，殘留在平台面與彈性基板之間的空氣，就會以供給 真空的孔爲中心，朝外側也就是朝向彈性基板的邊緣推壓 出去。 藉此，彈性基板和平台面之間就不會殘留空氣，而可 以將彈性基板以不會發生氣泡貯留地吸著.固定在平台面 上。 又，在平台面1 a的端部上，由於溝槽和溝槽之間的 間隔縮窄，可以確保吸附力，所以可以牢牢地吸附•固定 住大面積的彈性基板4。 另外，在上述的兩個實施例中，平台面上雖然設置有 直線狀真空吸附用的溝槽，不過，並不只限於此，如第5 圖所示，也可以用曲線狀的溝槽來構成。 經濟部智慧財產局員工消費合作社印製 又，在上述兩個實施例中，彈性基板的形狀雖然是以 長尺的帶狀工件爲例加以說明，不過，即使是齊備預定大 小的薄片狀薄茱狀工件，也可以得到同樣的作用和效果。 【發明之效果】 如上述之說明，在本發明之吸附平台裝置中，由於在 平台面上並沒有形成用真空吸附用的孔或溝槽所圍起來的 區域，所以可以將彈性基板以不會發生氣泡殘留地加以吸 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -13- 554404 A7 B7__ 五、發明説明（11) 附•固定在平台面上，至於被使用在例如曝光裝置上的情 況，可以將工件確實地保持在光罩圖案的結像位置上。 (請先閱讀背面之注意事項再填寫本頁) 【圖式之簡單說明】 第1圖係顯示關於本發明的實施例之平台裝置之平台 面的構造圖。 第2圖（a )〜（d )係顯示藉由關於本發明的實施例之平 台裝置之平台，彈性基板被吸附•固定的樣子的示意圖。 第3圖係顯示關於被裝設在本發明的實施例之平台裝 置之平台面的真空吸附用的孔係被裝設在平台面端部時的 情況之示意圖。 第4圖係顯示關於本發明的實施例之平台裝置之平台 面上的其他構造的示意圖。 第5圖（a )、（ b )係顯示關於被裝設在本發明的實施例 之平台裝置之平台面上的溝槽係以曲線所構成之示意圖。 第6圖係顯示藉由裝設多數個真空吸附孔的平台，來 保持彈性基板的狀態之示意圖。 經濟部智慧財產局員工消費合作社印製 第7圖係顯示藉由具有以真空吸附孔爲中心被裝設成 同心狀的複數個真空吸附溝槽，和在真空吸附孔和真空吸 附溝槽之間加以連通的連通溝槽之吸附平台，所保持基板 的狀態之示意圖。 第8圖（a )、（ b )係顯示氣泡發生的樣子的槪念圖。 【符號說明】 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐) -14- 554404 A7 B7 五、發明説明（12) a 板 2 基 〇 性 槽彈 溝、 或 4 孔。 、 留 2 貯 。 泡 台氣 平、 附 3 吸。 空槽 真溝 Λ > ο 1 C 件 2 工 、 狀Printed by 1T Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs -5- 554404 A7 B7 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (3) The groove, and between the vacuum adsorption hole and the vacuum adsorption groove The shape of the substrate held by the communication platform of the connected communication grooves is unexpected. When the elastic substrate 4 such as a long tape-shaped workpiece 4 a is held by the vacuum suction stage 1 shown in FIGS. 6 and 7, it is between the holes 2 a and 2 a for vacuum suction, or a groove. There will be a bubble retention 3 between the groove 2 b and the groove 2 b, which may cause the band-shaped workpiece 4 a to partially swell and deform. In a state where such a bubble storage 3 is generated, for example, in a projection exposure device, if the circuit pattern formed on the photomask is projected on the band-shaped workpiece 4 a by a projection lens, the band-shaped workpiece 4 a The part where the bubble is stored 3 will be deviated from the position of the mask image to another position, and the projected image of the mask pattern will become blurred, resulting in poor resolution or variation in the size of the wiring pattern. And other conditions. In addition, the alignment mark printed on the photomask and the workpiece is detected by using an image processing device. Processing is performed when an exposure processing device is used to align the position of the photomask and the workpiece. If the part alignment mark (work mark) is raised as described above, the image of the work mark read by the image processing device will be distorted or blurred, making the image processing device unable to recognize it. Artifact mark. Therefore, since the mark image of the workpiece cannot be detected, the position of the mask and the workpiece cannot be aligned. However, the occurrence of the above-mentioned bubble retention was thought out using the following mechanical principles. That is to say, I-nr is placed on a flexible substrate, such as a strip-shaped workpiece 4a (please read the precautions on the back before filling this page).% Packing · This paper size applies to China National Standard (CNS) 8-4 specifications (210X297 mm) -6- 554404 A7 B7 V. Description of the Invention (4) When the belt-shaped workpiece is thin and easily deformed on the platform surface 1 a, it is impossible to combine the platform surface 1 a and the belt-shaped workpiece 4 a. The air in the room is completely pressed out, and the strip-shaped workpiece will be downloaded and placed on the platform surface 1 a only in a state of being enclosed with air. Then, if vacuum is supplied to the holes 2 a or the grooves 2 b for vacuum suction, on the strip-shaped workpiece 4 a, the parts located on the holes 2 a or the grooves 2 b for vacuum suction will be generated. The pressure difference between the atmospheric pressure, the strip-shaped workpiece 4 a will be pressed on the platform surface 1 a. At this time, if there is air remaining in the area surrounded by the hole 2a or the groove 2b, the deformation of the band-shaped workpiece will completely seal the air and become a bubble storage3. The present invention is an invention made based on the above circumstances, and an object of the present invention is to provide an air-storage between the elastic substrate and the adsorption platform when the elastic substrate is held on the surface of the adsorption platform by vacuum adsorption. Adsorption platform device. [Means for solving the problem] The present inventor was located between the elastic substrate and the platform surface, and confirmed that many air bubbles would be stored in the area surrounded by the vacuum suction holes or grooves installed on the platform surface In order to keep the elastic substrate on the platform surface, if the vacuum suction hole or groove is supplied with a vacuum, the elastic substrate will be between the platform surface and the elastic substrate. The same paper size as the air pushed out towards the edge of the flexible substrate applies the Chinese National Standard (CNS) A4 size (210X 297 mm) I 1Γ (Please read the precautions on the back before filling this page)% 装 _ Order economy Printed by the Consumer Cooperatives of the Ministry of Intellectual Property Bureau 554404 A7 B7 5. When the invention description (5), it will be adsorbed and fixed on the platform surface. At this time, if there is an area surrounded by holes or grooves for vacuum adsorption on the platform surface, the elastic substrate will be vacuumed before the air between the platform surface and the elastic substrate is completely removed. The holes or grooves for adsorption are completely adsorbed. However, as a result, air remaining between the platform surface and the elastic substrate is lost, and air bubbles are retained. Therefore, based on the above-mentioned investigation, in order to prevent the area surrounded by the holes or grooves for vacuum adsorption from being formed on the platform surface, by arranging the positions of the holes or the grooves, they found that the bubbles can be prevented from being stored The method of this invention is completed based on the actual observation. That is, the present invention is a platform device which is held by vacuum suction of an elastic substrate, and is characterized in that: a vacuum supply device is installed on an adsorption platform surface on which the elastic substrate on the suction platform device is placed; The hole and a plurality of grooves extending radially from the hole; the plurality of grooves are connected to each other only in the hole. [Effects of the present invention] According to the above structure, a region surrounded by a vacuum suction hole or a groove on the platform surface will not be formed. Therefore, when the elastic substrate is held on the platform surface by vacuum adsorption, the air remaining between the platform surface and the elastic substrate will be pushed toward the outside, that is, the edge of the elastic substrate, around the hole through which the vacuum is supplied. Press it out. This paper size applies to China National Standard (CNS) 8-4 specification (210X297 mm) II 1Γ (Please read the precautions on the back before filling out this page) Packing--. Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs and Consumer Cooperatives -8- 554404 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the Invention (6) [Implementation Mode of the Invention] Fig. 1 is a structural diagram showing a platform surface of a platform device according to an embodiment of the present invention. For the same figure, the same object system shown in Figures 6 and 7 is denoted by the same symbol. The platform 1 of the adsorption platform device of the present invention is composed of an aluminum pedestal whose surface is treated with non-electrolytic nickel plating, and has an approximately square shape slightly larger than the width of the elastic substrate 4 placed thereon. Then, a through hole 2 a is formed at a position slightly in the center of the platform, and the platform surface 1 a on which the elastic substrate 4 is placed is extended radially from the hole 2 a to be installed as 8 linear grooves 2 b. Here, as an example, the dimensions of the above-mentioned holes and grooves are shown. The hole diameter Φ is 1 mm, the groove width W is 0 · 4 mm, and the groove depth D is 0 · 5 mm. However, it is not limited to this, and it may be determined in accordance with the size, flexibility, and bending state in the width direction of the appropriate elastic substrate 4. A vacuum system (not shown) for supplying a vacuum to a surface opposite to the platform surface 1 a on which the elastic substrate 4 is placed passes through a piping hose and an adapter (not shown). It is connected to the hole 2a. Next, the state where the elastic substrate is adsorbed and fixed by the aforementioned platform will be described with reference to FIG. 2. In addition, in Fig. 2, the shape of the elastic substrate is exaggerated for easy understanding. (1) Elastic substrate 4 with a thickness of about 20 ~ 1 5 0 # m. (Please read the precautions on the back before filling out this page) This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm)- 9-554404 A7 B7 V. Description of the invention (7) If it is transported to the platform surface 1 a, vacuum can be applied to the hole 2 a by the vacuum system. Then, the portion immediately above the hole 2a of the elastic substrate 4 is initially attracted. (As shown in Figure 2 (a)) (Please read the precautions on the back before filling in this page) (2) Next, the peripheral part of the above part adsorbed on the elastic substrate 4 is sucked from the vacuum groove 2 b The supplied vacuum is sucked, and the air remaining between the platform surface 1 a and the elastic substrate 4 is pushed toward the outside with the hole 2 a as the center as shown by the arrow symbol in FIG. 2 (b). Press it out. (3) In this way, the elastic substrate 4 is sequentially adsorbed and fixed on the platform surface la from the portion where the hole 2a of the platform 1a is provided toward the peripheral portion. (Fig. 2 (c)) (4) Finally, the entire elastic substrate 4 is adsorbed and fixed in a state where there is no residual air between the platform surface 1 a and the elastic substrate 4. Printed by the Consumer Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs Next, the function of this embodiment shown in Figs. 1 and 2 will be described. The adsorption platform device of this embodiment is composed of an aluminum pedestal made of non-electrolytic nickel plating on its surface, and has an approximately square shape slightly larger than the width of the elastic substrate 4 placed thereon. Then, a through hole 2 a is formed at a position slightly in the center of the platform, and the platform surface 1 a on which the elastic substrate 4 is placed is extended radially from the hole 2 a to be installed as 8 linear grooves 2 b. In other words, on the platform surface of the adsorption platform device, a hole for supplying a vacuum and a plurality of grooves extending radially from the hole are installed. The holes on the platform are connected to each other, so this paper size is in accordance with the Chinese National Standard (CNS) A4 (210X297 mm) -10- 554404 A7 B7 V. Description of the invention (8) No vacuum suction holes or grooves will be formed on the platform surface Surrounded by area. (Please read the precautions on the back before filling in this page.) Therefore, when the elastic substrate is held on the platform surface by vacuum adsorption, the air remaining between the platform surface and the elastic substrate will be supplied with vacuum. The hole is centered and pushed out toward the outside, that is, toward the edge of the elastic substrate. Thereby, no air remains between the elastic substrate and the platform surface, and the elastic substrate can be adsorbed and fixed on the platform surface without air bubble storage. In this embodiment, although the number of grooves provided on the platform surface is set to eight, it is not limited to this, and may correspond to an appropriate size, flexibility, and flexibility of the elastic substrate 4. The number of pieces is determined by the bending condition in the width direction and the like. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economy The width is approximately square, but it is not limited to this. In other words, the surface of the platform can be treated with anti-corrosion aluminum or ceramic magnetic fusion materials. The platform can also be made of metals such as copper or iron. Furthermore, when it comes to the shape of the platform, it is a rectangular platform mounted on a rectangular elastic substrate, but it may be a circular platform mounted on a circular elastic substrate. Furthermore, although the platform of the adsorption platform device of the present invention is provided with a hole for supplying and supplying a vacuum at a position approximately at the center of the platform surface, it is not limited to this. As shown in FIG. The hole is provided at the end of the platform surface, and a vacuum suction groove may be provided radially from the hole. This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) -11-554404 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 ___ B7 V. Description of the invention (9) Figure 4 shows the details of the invention Schematic diagram of other structures on the platform surface of the platform device of the embodiment. For the same figure, the same object system shown in Figures 6 and 7 is denoted by the same symbol. The platform 1 of the adsorption platform device of the present invention is a platform 1 when the area of the elastic substrate 4 to be adsorbed is large. When the area of the elastic substrate 4 is large, the platform surface 1 a also becomes larger corresponding to the size. At this time, when the platform in the platform device in the above embodiment is cited as a reference, the plurality of radial grooves 2 b provided on the platform surface 1 a are close to the periphery of the hole 2 a, but Since the ends of the platform surface 1 a are separated from each other, in the area surrounded by the groove 2 b at the ends of the platform surface 1 a, the adsorption force will be weakened, and no adsorption will occur in this area. Bad condition. Therefore, in the platform surface 1 a of the platform device of the embodiment, a hole 2 a is formed at a position slightly in the center of the platform 1, and the platform surface 1 a on which the above-mentioned elastic substrate 4 is placed is formed. The holes 2 a extend radially and are provided as eight linear grooves 2 b. The linear grooves 2 b extending in the diagonal direction are branched into a plurality of grooves 2 c, respectively. At this time, the plurality of grooves 2 b are connected to each other only for the hole 2 a, and the branched grooves 2 c are connected to one of the linear grooves 2 b without being connected to the other linear ones. The trenches 2 b are connected. Also, although the bifurcated grooves 2 c of the same nature are connected on the linear grooves 2 b, this paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm1 (please read the Please fill in this page again for attention) Binding-12-554404 A7 B7 V. Description of the invention (1〇) However, the areas other than this will not be connected to each other. Therefore, on the platform surface 1a, there will be no The area enclosed by the groove 2 b, (please read the precautions on the back before filling in this page) 2 c. Therefore, when the elastic substrate is held on the platform surface by vacuum adsorption, it remains on the platform surface The air between the elastic substrate and the elastic substrate will be pushed out toward the outside, that is, the edge of the elastic substrate. The air will not remain between the elastic substrate and the platform, and the The elastic substrate is adsorbed so that no air bubbles are stored. It is fixed on the platform surface. At the end of the platform surface 1 a, the gap between the groove and the groove is narrowed to ensure the adsorption force, so it can Adhere firmly to a large area的 Flexible substrate 4. In addition, in the two embodiments described above, although a linear vacuum suction groove is provided on the platform surface, it is not limited to this. As shown in FIG. 5, a curved shape may also be used. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. In the above two embodiments, although the shape of the flexible substrate is described using a long strip-shaped workpiece as an example, even if it is fully booked The same effect and effect can also be obtained with thin and thin thin-shaped pieces. [Effects of the Invention] As described above, in the adsorption platform device of the present invention, since the surface for vacuum adsorption is not formed on the platform surface, The area surrounded by holes or grooves, so the elastic substrate can be sucked so that no air bubbles remain. The paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) -13- 554404 A7 B7__ V. Invention Note (11) Attached • Fixed to a flat surface. As for the case where it is used in, for example, an exposure device, the workpiece can be reliably held at the image formation position of the mask pattern. (Please read the precautions on the back before filling this page) [Simplified description of the drawings] Figure 1 shows the structure of the platform surface of the platform device according to the embodiment of the present invention. Figure 2 (a) ~ (D) is a schematic diagram showing a state where the elastic substrate is attracted and fixed by the platform of the platform device of the embodiment of the present invention. FIG. 3 is a diagram showing the platform of the platform device installed in the embodiment of the present invention The schematic diagram of the case where the holes for vacuum suction of the surface are installed at the end of the platform surface. FIG. 4 is a schematic view showing other structures on the platform surface of the platform device according to the embodiment of the present invention. a) and (b) are schematic diagrams showing that the grooves installed on the platform surface of the platform device of the embodiment of the present invention are formed by curves. Fig. 6 is a schematic diagram showing a state where the elastic substrate is maintained by a platform provided with a plurality of vacuum suction holes. Printed in Figure 7 by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, which has a plurality of vacuum suction grooves arranged in a concentric shape with the vacuum suction holes as the center, and between the vacuum suction holes and the vacuum suction grooves. The schematic diagram of the state of the substrate held by the communication platform of the communication grooves. Figures 8 (a) and (b) are thought diagrams showing the appearance of bubbles. [Symbol description] This paper size applies to Chinese National Standard (CNS) A4 specification (210X297 mm) -14-554404 A7 B7 V. Description of the invention (12) a plate 2 basic groove groove or 4 holes. Keep 2 storages. Soak the Taiwan flat, with 3 suction. Empty slot true groove Λ > ο 1 C piece 2 work, shape
b 帶 經濟部智慧財產局員工消費合作社印製 (請先閲讀背面之注意事項再填寫本頁)b Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs (please read the precautions on the back before filling this page)
本紙張尺度適用中國國家標準（CNS ) Α4規格（210Χ：297公釐） -15-This paper size is applicable to China National Standard (CNS) Α4 specifications (210 ×: 297 mm) -15-